JPH0316346U - - Google Patents
Info
- Publication number
- JPH0316346U JPH0316346U JP1989077208U JP7720889U JPH0316346U JP H0316346 U JPH0316346 U JP H0316346U JP 1989077208 U JP1989077208 U JP 1989077208U JP 7720889 U JP7720889 U JP 7720889U JP H0316346 U JPH0316346 U JP H0316346U
- Authority
- JP
- Japan
- Prior art keywords
- sealed
- resin
- tip
- mounting part
- front side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989077208U JPH0316346U (enExample) | 1989-06-29 | 1989-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989077208U JPH0316346U (enExample) | 1989-06-29 | 1989-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0316346U true JPH0316346U (enExample) | 1991-02-19 |
Family
ID=31619380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989077208U Pending JPH0316346U (enExample) | 1989-06-29 | 1989-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316346U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014072347A (ja) * | 2012-09-28 | 2014-04-21 | Sanken Electric Co Ltd | 半導体装置の製造方法、および、半導体装置 |
-
1989
- 1989-06-29 JP JP1989077208U patent/JPH0316346U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014072347A (ja) * | 2012-09-28 | 2014-04-21 | Sanken Electric Co Ltd | 半導体装置の製造方法、および、半導体装置 |