JPH04340792A - Manufacture of printed circuit board - Google Patents

Abstract

PURPOSE:To increase a life of a drill in a step of drilling a through hole of a printed circuit board, to suppress a power source impedance to a low value, and to effectively dissipate heat at the time of supplying current to printed circuit. CONSTITUTION:Holes 7 are previously opened at through hole opening positions of a metal plate (copper plate) 6 for forming a power source layer and a ground layer of a printed circuit board 1A, the plate 6 is laminated together with boards 2a, 3a, 3b in a laminating step, and then through holes are opened.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a printed wiring board having a power supply layer and a ground layer.

0002

2. Description of the Related Art FIG. 3 is an exploded perspective view of the structure of a printed wiring board manufactured by a conventional manufacturing method, and FIG. 4 is an explanatory diagram of its main steps.

In FIGS. 3 and 4, 1 is a printed wiring board, 2 is an inner layer substrate with copper foils 4 bonded to both upper and lower surfaces forming a power supply layer and a ground layer, and 3a and 3b are outer layer surfaces with copper foils 4 bonded thereto. The outer layer substrate is bonded, and 5 is a prepreg inserted between the inner layer substrate 2 and the outer layer substrates 3a and 3b to bond the respective substrates together. Further, P1 is a step of laminating the substrates, and P2 is a step of drilling a through hole (not shown).

In the above configuration, the prepreg 5 is inserted between the inner layer substrate 2 and the outer layer substrates 3a, 3b, and is pressurized and heated to form the printed wiring board 1 in the lamination step P1, and then the printed wiring board 1 is formed in the lamination step P1. Through-holes are drilled in the drilling process.

[0005]

[Problem to be Solved by the Invention] Conventional printed wiring boards are manufactured as described above, so in the through-hole drilling process, the copper foil and the board are drilled at the same time, which reduces the wear and tear of the drill. In addition to being faster, there were other problems, such as that it was difficult to lower the power source impedance because the copper foil 5 was thin.

The present invention was made in order to solve the problems of the conventional example as described above, and it reduces the wear and tear of the drilling drill, lowers the power supply impedance, and reduces the power supply impedance when the circuit pattern is energized. The purpose of the present invention is to provide a printed wiring board that can promote heat dissipation.

[0007]

[Means for Solving the Problems] Therefore, the method for manufacturing a printed wiring board according to the present invention includes a signal circuit pattern layer, a signal circuit pattern layer,
A method for manufacturing a printed wiring board in which a board on which a power supply layer and a ground layer are formed is laminated and formed, and circuits are connected through through holes, the copper foil forming the power supply layer and the ground layer being formed on a metal plate. Instead, after drilling holes in this metal plate in advance at the positions where the through holes are to be drilled, insert the drilled metal plate into the predetermined positions of the power supply layer and the ground layer, and then insert the holes together with each of the above-mentioned boards. The above objective is achieved by laminating the substrates and drilling through holes in the laminated substrates.

[0008]

[Function] The method for manufacturing a printed wiring board configured as described above replaces the copper foil forming the power supply layer and the ground layer with a thicker metal plate, and also pre-inserts through holes into this metal plate before laminating the layers. After drilling holes in the positions, we laminated and bonded each board, and then re-drilled through holes in this laminated board, which not only reduced the wear and tear of the drilling drill, but also made it possible to Since the board is thicker than conventional copper foil, power supply impedance can be kept low and heat dissipation against heat generated by energizing the circuit pattern can also be improved.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. (Structure) FIG. 1 is an exploded perspective view of the structure of a printed wiring board showing an embodiment of the present invention, and FIG. 2 is an explanatory diagram of the main steps of the above embodiment. Note that the same or equivalent parts as in the conventional example are represented by the same reference numerals.

In FIGS. 1 and 2, 1A is a printed wiring board, 2a is an inner layer board with no copper foil bonded to its surface, and 6 is a metal having a thickness of 70 μm or more with holes 7 pre-drilled at the through-hole positions. A copper plate is an example of a plate. Further, PA1 is a drilling process in which holes are pre-drilled at the positions of through holes in the copper plate 6, PA2 is a board lamination process corresponding to the conventional P1, and PA3 is a through hole drilling process corresponding to the conventional P2. .

(Operation) The operation will be explained based on the above configuration. First, in a drilling step PA1, a hole 7 is pre-drilled at the through-hole drilling position of the copper plate 6 by press working or the like. Next, this copper plate 6 is inserted between the inner layer substrate 2a and the outer layer substrates 3a and 3b, on which the copper foil is not bonded, and prepreg 5 for adhesion is interposed between each layer, and then processed in the lamination step PA2. Printed wiring board 1A laminated by pressure and heat molding
is formed. This printed wiring board 1A is again subjected to through-hole drilling in a through-hole drilling step PA3.

As described above, since the holes 7 are pre-drilled at the positions of the through-holes in the copper plate 6, in the through-hole drilling step PA3, there is no need to drill into the copper layer when drilling the inner layer. , this not only reduces the wear and tear on the drill, but also reduces the amount of copper plate 6 that forms the power and ground layers.
Since it is thicker than the conventional one, it is possible to lower the power source impedance, and in addition, it is possible to efficiently dissipate heat generated when electricity is applied.

In this embodiment, a copper plate is used as the metal plate forming the power supply layer and the ground layer, but the present invention is not limited to this, and any metal material with good conductivity such as an aluminum plate may be used as appropriate.

[0014] Furthermore, by making the impedances of the power layer and ground layer equivalent to those of a conventional printed circuit board, the required areas for the power layer and ground layer can be reduced, so that signal circuit patterns can be installed on the excess board surface. It also becomes possible to increase wiring efficiency.

[0015]

Effects of the Invention As explained above, according to the present invention, holes are pre-drilled at the through-hole positions of the metal plate instead of the copper foil forming the power supply layer and the ground layer. By laminating and molding the board together with each board, and drilling through-holes in this laminated board, there is no need to drill through the metal layers of the power supply layer and ground layer when drilling the through-holes. Not only can the lifespan of the drill used for use be extended, but in addition, the impedance of the power source can be lowered, and the heat generated when the printed wiring is energized can be efficiently dissipated. This makes it possible to reduce processing costs and improve quality of printed wiring boards.

[Brief explanation of drawings]

FIG. 1 is an exploded perspective view of a printed wiring board showing an embodiment of the present invention.

FIG. 2 is an explanatory diagram of the main steps of the above embodiment.

FIG. 3 is an exploded perspective view of a conventional printed wiring board.

FIG. 4 is an explanatory diagram of the main steps of the conventional example.

[Explanation of symbols]

1A Printed wiring board 6 Metal plate (copper plate) 7 Hole Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (1)

[Claims] 1. A method for manufacturing a printed wiring board, which is formed by laminating and molding a substrate on which a signal circuit pattern layer, a power supply layer, and a ground layer are formed, and connecting circuits through through holes, the method comprising: The copper foil forming the ground layer is replaced with a metal plate, and after drilling holes in each of the positions of the through holes in this metal plate, the drilled metal plate is inserted into the specified positions for the power supply layer and the ground layer. A method of manufacturing a printed wiring board, which comprises inserting the printed wiring board into the position shown in FIG.