JPH04340237A - 樹脂封止形半導体装置の製造方法 - Google Patents

樹脂封止形半導体装置の製造方法

Info

Publication number
JPH04340237A
JPH04340237A JP3187449A JP18744991A JPH04340237A JP H04340237 A JPH04340237 A JP H04340237A JP 3187449 A JP3187449 A JP 3187449A JP 18744991 A JP18744991 A JP 18744991A JP H04340237 A JPH04340237 A JP H04340237A
Authority
JP
Japan
Prior art keywords
resin
strip
small cross
support plate
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3187449A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0563937B2 (https=
Inventor
Takaaki Yokoyama
隆昭 横山
Yoshiharu Tada
多田　吉晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP3187449A priority Critical patent/JPH04340237A/ja
Publication of JPH04340237A publication Critical patent/JPH04340237A/ja
Publication of JPH0563937B2 publication Critical patent/JPH0563937B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP3187449A 1991-07-26 1991-07-26 樹脂封止形半導体装置の製造方法 Granted JPH04340237A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3187449A JPH04340237A (ja) 1991-07-26 1991-07-26 樹脂封止形半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3187449A JPH04340237A (ja) 1991-07-26 1991-07-26 樹脂封止形半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP1086912A Division JPH0249445A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH04340237A true JPH04340237A (ja) 1992-11-26
JPH0563937B2 JPH0563937B2 (https=) 1993-09-13

Family

ID=16206272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3187449A Granted JPH04340237A (ja) 1991-07-26 1991-07-26 樹脂封止形半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH04340237A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277630A (ja) * 2007-05-01 2008-11-13 Mitsubishi Electric Corp 半導体装置
JP2009176825A (ja) * 2008-01-22 2009-08-06 Asmo Co Ltd 樹脂封止型半導体装置
JP2010108954A (ja) * 2008-10-28 2010-05-13 Shindengen Electric Mfg Co Ltd リードフレーム及び半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008277630A (ja) * 2007-05-01 2008-11-13 Mitsubishi Electric Corp 半導体装置
JP2009176825A (ja) * 2008-01-22 2009-08-06 Asmo Co Ltd 樹脂封止型半導体装置
JP2010108954A (ja) * 2008-10-28 2010-05-13 Shindengen Electric Mfg Co Ltd リードフレーム及び半導体装置

Also Published As

Publication number Publication date
JPH0563937B2 (https=) 1993-09-13

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Legal Events

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