JPH0432790Y2 - - Google Patents
Info
- Publication number
- JPH0432790Y2 JPH0432790Y2 JP7446985U JP7446985U JPH0432790Y2 JP H0432790 Y2 JPH0432790 Y2 JP H0432790Y2 JP 7446985 U JP7446985 U JP 7446985U JP 7446985 U JP7446985 U JP 7446985U JP H0432790 Y2 JPH0432790 Y2 JP H0432790Y2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- cover
- component
- discrete
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7446985U JPH0432790Y2 (enExample) | 1985-05-20 | 1985-05-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7446985U JPH0432790Y2 (enExample) | 1985-05-20 | 1985-05-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61190188U JPS61190188U (enExample) | 1986-11-27 |
| JPH0432790Y2 true JPH0432790Y2 (enExample) | 1992-08-06 |
Family
ID=30614798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7446985U Expired JPH0432790Y2 (enExample) | 1985-05-20 | 1985-05-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0432790Y2 (enExample) |
-
1985
- 1985-05-20 JP JP7446985U patent/JPH0432790Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61190188U (enExample) | 1986-11-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH1126919A (ja) | プリント配線板 | |
| EP2339901A1 (en) | BGA footprint pattern for increasing the number of routing channels per PCB layer | |
| JP2006108685A (ja) | 表面実装用ヒートシンク | |
| US20010053070A1 (en) | Electronic unit equipped with electromagnetic shielding plate | |
| JPH0432790Y2 (enExample) | ||
| JPH09199841A (ja) | プリント配線板 | |
| JP2516087Y2 (ja) | 半導体冷却装置 | |
| JP2570821Y2 (ja) | 電子部品の冷却構造 | |
| US7804030B2 (en) | Printed circuit board | |
| JPH11274704A (ja) | プリント配線基板 | |
| JP7672823B2 (ja) | 放熱器及び電子部品モジュール | |
| JPS58166088U (ja) | フレキシブルプリント配線板の取付装置 | |
| JPS6331405Y2 (enExample) | ||
| JPS62189744A (ja) | 半導体冷却フイン | |
| JP5004569B2 (ja) | プリント基板装置 | |
| JPS59155158A (ja) | 半導体装置の冷却構造 | |
| JPH03187296A (ja) | 電子機器 | |
| JPH06268342A (ja) | 回路基板 | |
| JPH08316385A (ja) | ピングリッドアレイ用パッケージの放熱部品 | |
| JPH0249739Y2 (enExample) | ||
| JP2771242B2 (ja) | メモリーモジュール | |
| JPS622787Y2 (enExample) | ||
| JP3102761U (ja) | 回路基板組立体 | |
| JPH0575004A (ja) | Lsiパツケージ | |
| JPH0547497Y2 (enExample) |