JPH04326753A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To simplify a step of adhering a circuit board to a case, to shorten a manufacturing time and to reduce its cost by so inserting the board into a mold M that the board becomes a bottom of the case, injection molding it, integrally connecting the board to the case, and forming a recess for sealing resin simultaneously with the case. CONSTITUTION:A metal base insulating circuit board 1 is engaged within a mold M, so-called insert molded to form a case 5. Thus, since the case 5 is so integrated with the board 1 to be connected as to surround it with the board 1 as a bottom, a vessel recess for sealing resin having an opening at an upper surface is formed. Then, an electronic component 4 including a semiconductor element necessary to constitute an integrated circuit and input/output terminals are placed, and soldered. Thereafter, liquidlike sealing resin 7 is poured from the opening of the upper surface of the formed vessel, heated and cured to associate an integrated-circuit-mounted semiconductor device. Thus, its manufacturing time can be shortened, and its manufacturing cost can be reduced.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention uses a metal-based insulated circuit board to interconnect electronic components including semiconductor elements necessary to construct an integrated circuit, and uses this insulated circuit board as the bottom surface of the insulated circuit. The present invention relates to a method of manufacturing a semiconductor device in which a wall surface is formed around a substrate, and a liquid resin is injected and sealed into the wall surface.

0002

2. Description of the Related Art Conventionally, a method for manufacturing a semiconductor device mounted with an integrated circuit using a metal-based insulating circuit board and finally injecting and sealing with liquid resin is as shown in FIG.
First, after soldering electronic components 4 including semiconductors necessary for constructing an integrated circuit onto a metal-based insulated circuit board 1 (see FIGS. 2(A) to 2(D)), the outer periphery of this insulated circuit board 1 is soldered. Then, the case 5, which will become the wall surface, is fixed with an adhesive 8 such as silicone or epoxy (see FIG. 2(E)).

After that, the input/output terminals 6 are soldered (see FIG. 2(F)), and finally, liquid sealing resin 7 is injected into the case 8 and hardened (see FIG. 2(G)) to improve the strength and We are able to maintain reliability.

The case 8 is made of thermoplastic resin by injection molding, and in the figure, 2 is a copper foil pattern and 3 is solder.

[0005]

[Problems to be Solved by the Invention] However, in the conventional manufacturing method of semiconductor devices, in order to inject and harden liquid resin as a sealing resin, when forming a wall surface that will become a container for injecting the resin, it is necessary to A so-called adhesion process is required to fix the metal-based insulated circuit board that forms the bottom of the container.

[0006] Silicone or epoxy materials are generally used in this bonding process, but bonding operations using these materials are relatively time consuming, and in the case of thermosetting adhesives, equipment such as a heating tank is required. This actually increases manufacturing costs.

In view of the above, the present invention provides a semiconductor device that can shorten manufacturing time and reduce costs by simplifying the bonding process between a circuit board and a case to form a recess for resin sealing. The purpose is to provide a manufacturing method.

[0008]

[Means for Solving the Problem] As shown in FIG. 1, a circuit board 1 is placed inside a mold M for forming a frame-shaped case 5 surrounding a circuit board 1, and a circuit board 1 is placed on the bottom surface of the mold M. The case 5 is formed by injecting resin into the mold M, the case 5 and the circuit board 1 are integrally joined, and an integrated circuit is formed on the circuit board 1. Electronic components 4 including semiconductor elements necessary for this purpose are mounted, and then a sealing resin 7 is injected into the recess formed by the case 5 and the circuit board 1 to seal it.

[0009]

[Operation] In the above problem solving means, when manufacturing the case 5, the circuit board 1 is inserted into the mold M and injection molded so that the circuit board 1 becomes the bottom surface, and the case 5 and the circuit board 1 are integrally joined. By doing so, the recess for resin sealing can be made at the same time as the case 5, which eliminates the need for the conventional bonding process between the circuit board 1 and the case 5, simplifying the manufacturing process of semiconductor devices. can.

0010

[Embodiment] An embodiment of the present invention will be described below with reference to FIG.

FIG. 1 is a schematic diagram showing the manufacturing steps in a method for manufacturing a semiconductor device according to an embodiment of the present invention. Note that the same reference numerals are given to the same functional parts as those of the prior art shown in FIG.

As shown in FIG. 1, a semiconductor device equipped with an integrated circuit generally has a metal-based insulating circuit board 1 inside a case 5.
and an electronic component 4 including a semiconductor element necessary for configuring an integrated circuit mounted on the insulated circuit board 1, with the insulated circuit board 1 as a bottom surface and a case 5 forming a side wall. It is formed by injecting and hardening liquid resin 7 and sealing it. In addition,
In the figure, 2 is a copper foil pattern, 3 is solder, and 6 is an input/output terminal.

[0013] The method for manufacturing the above semiconductor device will now be described in detail.

The metal base insulating circuit board 1 is fitted into a mold M, and a case 5 is formed by so-called insert molding (see FIG. 1(A)).

[0015] As a result, the case 5 is integrally joined to the insulated circuit board 1 so as to surround the insulated circuit board 1 as a bottom surface, so that a container (concavity) for resin sealing having an opening on the top surface is formed. It is completed (see Figure 1(B)). Note that the material of the case 5 is preferably a thermoplastic resin having a heat deformation temperature of 230° C. or higher in order to withstand heat during soldering in a subsequent process.

Next, solder cream 3 is supplied onto the copper foil pattern 2 in the component mounting area on the bottom surface of the insulated circuit board 1 (see FIG. 1(C)). This solder cream 3 may be Sn/Pb eutectic solder having a melting point of 183°C.

Then, predetermined parts, that is, electronic parts 4 including semiconductor elements necessary for constructing an integrated circuit, and input/output terminals 5 are placed on the solder cream 3 (
(See Figure 1(D)). In this state, it is heated to melt the solder and solder (see FIG. 1(E)).

After that, impurity residues on the soldered part are removed (see FIG. 1(F)), and liquid sealing resin 7 is injected from the opening on the top surface of the container formed in FIG. 1(B) and heated and cured. A semiconductor device equipped with an integrated circuit is assembled (Figure 1 (G)).
reference).

In this way, when making the case 5, the insulated circuit board 1 is inserted into the mold M and injection molded so that the metal base insulated circuit board 1 faces the bottom surface, and the case 5 and the insulated circuit board 1 are integrated. Case 5
At the same time, you can make containers for injected resin.
The conventional process of bonding the insulated circuit board 1 and the case 5 is not necessary, and the manufacturing process of the semiconductor device can be simplified. Therefore, manufacturing time can be shortened and manufacturing costs can also be reduced.

It should be noted that the present invention is not limited to the above embodiments, and it goes without saying that many modifications and changes can be made to the above embodiments within the scope of the present invention.

[0021]

[Effects of the Invention] As is clear from the above description, according to the present invention, when manufacturing a case, the circuit board is set in a mold, the case is injection molded, and the case and the insulated circuit board are integrally assembled. By joining, a recess for injecting the sealing resin can be created at the same time as the case, which simplifies the bonding process between the insulated circuit board and the case. This has the advantage of shortening the manufacturing time and reducing the manufacturing cost.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing a manufacturing process in a method for manufacturing a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a schematic diagram showing the manufacturing process of a conventional semiconductor device manufacturing method.

[Explanation of symbols]

1 Circuit board 4 Electronic parts 5 Case 7 Sealing resin M Mold

Claims (1)

[Claims] 1. A case is formed by placing a circuit board with the bottom surface inside a mold for forming a frame-shaped case surrounding a circuit board, and injecting resin into the mold. The case and the circuit board are integrally joined together, electronic components including semiconductor elements necessary to configure an integrated circuit are mounted on the circuit board, and then the case and the circuit board are formed. A method of manufacturing a semiconductor device, the method comprising injecting a sealing resin into a recess for sealing.