TW202143820A - Manufacturing method of electronic device - Google Patents

Abstract

A manufacturing method of an electronic device including steps below is provided. First, a circuit board and a mold are provided. The mold includes a mold body, an accommodating space and an opening. The accommodating space is connected to the opening in a first direction and is located in the mold body. Then, the circuit board is put in the accommodating space of the mold. After that, a potting sealant is filled in the accommodating space of the mold. Finally, the potting sealant is separated from the mold after the potting sealant was cured.

Description

Manufacturing method of electronic device

The present invention relates to a manufacturing method of an electronic device, and particularly relates to a manufacturing method of an electronic device without a plastic casing.

Potting adhesives are widely used in the field of packaging electronic devices, and they usually include thermosetting resins that can be cured at room temperature or after heating. After curing, the potting glue can be used to insulate the internal components or circuits of the electronic device from each other, and has the functions of waterproof, thermal conductivity, or shockproof. In the conventional process of using potting glue to encapsulate electronic devices, it is necessary to first use a plastic shell as a container, and then place electronic devices such as circuit boards and potting glue in sequence, and complete the process after the potting glue is cured. The packaging process, and the plastic shell used in the process is then used as the housing of the electronic device to protect the electronic device.

As mentioned above, since the cured potting glue itself has the functions of waterproof, heat conduction or shockproof and has a certain degree of hardness, if the use of plastic casing can be omitted in the process of packaging electronic devices, the electronic devices can be reduced. The manufacturing cost and the size of the electronic device.

The present invention provides a manufacturing method of an electronic device, which does not need to use a plastic shell in the manufacturing process, so that the manufacturing cost of the electronic device and the size of the electronic device can be reduced.

The manufacturing method of the electronic device of the present invention includes the following steps. First, provide circuit boards and molds. The mold includes a mold body, an accommodating space, and an opening. The accommodating space communicates with the opening in the first direction and is located in the mold body. Next, the circuit board is placed in the accommodating space of the mold. Next, fill the potting glue in the accommodating space of the mold. Finally, after the potting glue is cured, the cured potting glue and the mold are separated.

In an embodiment of the present invention, the above-mentioned electronic device further includes a connector, wherein the connector is electrically connected to the circuit board and the cured potting glue is exposed.

In an embodiment of the present invention, the above-mentioned electronic device further includes a wire, wherein the wire is electrically connected to the circuit board and the cured potting glue extends along the first direction.

In an embodiment of the present invention, the above-mentioned mold body includes at least one protrusion, and the at least one protrusion extends into the accommodating space.

In an embodiment of the present invention, before the step of filling the potting glue in the accommodating space of the mold, it further includes cutting one of the at least one protrusion along a direction opposite to the first direction.

In an embodiment of the present invention, after the step of cutting one of the at least one protrusion in a direction opposite to the first direction, an elastic ring body is provided on the periphery of the mold body to fix the mold.

In an embodiment of the present invention, the material of the above-mentioned mold body includes silicone.

In an embodiment of the present invention, the material of the above-mentioned potting glue includes epoxy resin.

Based on the above, the manufacturing method of the electronic device provided by the present invention does not use a plastic shell during packaging. Therefore, the finished electronic device does not have a plastic shell. In this case, in addition to reducing the manufacturing cost of the electronic device, it can also Reduce the size of electronic devices.

1A to 1D are schematic flowcharts of a manufacturing method of an electronic device according to an embodiment of the invention.

Please refer to FIG. 1A, a circuit board 100 and a mold 200 are provided. In some embodiments, the circuit board 100 is provided with a plurality of electronic components, and the type and quantity of the plurality of electronic components can be changed according to the electronic device to be manufactured. Based on this, the present invention will not be repeated here. In this embodiment, the circuit board 100 is electrically connected to the connector 110 and the plurality of wires 120. In detail, the circuit board 100 may include a plug-in section 100a and a connection section 100b, wherein the plug-in section 100a is electrically connected to the connector 110, and the connection section 100b is electrically connected to a plurality of wires 120, but the present invention does not use this Is limited. The connector 110 may, for example, include an insulating body and a plurality of terminals. The insulating body has, for example, a recess for accommodating a plurality of terminals. The contact part of the terminal is used for mating with a mating connector, and the welding part of the terminal is, for example, soldered to the circuit board 100 to be electrically connected to the circuit board 100. The plurality of wires 120 may, for example, include bare wire portions, wherein the bare wire portions of the plurality of wires 120 can be soldered on the circuit board 100 to be electrically connected to the circuit board 100.

Please continue to refer to FIG. 1A, the mold 200 includes a mold body 210, an accommodating space 220 and an opening 230. The shape of the mold body 210 is designed according to the appearance of the circuit board 100, for example. In this embodiment, the mold body 210 has the shape of a square column, and there is a groove on one side of the square column, but the present invention is not limited to this. In some embodiments, the mold body 210 may have at least one protrusion 212, and the at least one protrusion 212 extends into the accommodating space 220. In this embodiment, the mold body 210 includes two protrusions 212a and 212b, and the protrusion 212a and the protrusion 212b face each other, but the present invention is not limited thereto. Since the mold 200 will be used for the packaging process of the circuit board 100 later, the material included in the mold body 210 is, for example, a material that does not bond with the potting glue. In this embodiment, the material of the mold body 210 includes silicone. The accommodating space 220 communicates with the opening 230 in the first direction D1, and is located in the mold body 210, for example. In some embodiments, the accommodating space 220 and the opening 230 may have a rectangular-like outline in the first direction D1, but the present invention is not limited thereto.

1B, the circuit board 100 is placed in the accommodating space 220 of the mold 200. In this embodiment, the circuit board 100 is placed in the accommodating space 220 through the opening 230. Since the potting glue will be filled into the accommodating space 220 through the opening 230 to perform the packaging process on the circuit board 100, after the circuit board 100 is placed in the mold 200, the insertion section 100a of the circuit board 100 needs to be It is adjacent to the opening 230 so that the connector 110 can perform its functions without being sealed by the potting glue during the subsequent packaging process. In detail, when the circuit board 100 is placed in the accommodating space 220 of the mold 200, the connecting section 100b of the circuit board 100 first passes through the opening 230 of the mold 200 in a direction opposite to the first direction D1, and the circuit board 100 When the connecting section 100b of the circuit board 100 reaches the bottom of the accommodating space 220, the plug-in section 100a of the circuit board 100 enters the interior of the accommodating space 220 and is adjacent to the opening 230. In addition, the plurality of wires 120 welded to the connecting section 100b may extend out of the mold 200 through the opening 230 along the first direction D1.

1C, fill the potting glue 300a in the accommodating space 220 of the mold 200. In this embodiment, the potting glue 300a is filled in the remaining space of the accommodating space 220 to reliably cover the plug-in section 100a and the connection section 100b of the circuit board 100. In detail, the potting glue 300a is in the form of a fluid liquid before being cured, and can be cured after being placed for a period of time or heated. In this embodiment, the material of the potting glue 300a includes epoxy resin. Since epoxy resin and silicon rubber (the material of the mold body 210) do not have bonding characteristics, the packaged circuit board 100 can be taken out quickly after it is cured, and the packaged circuit board 100 can be maintained The appearance. Furthermore, the cost of epoxy resin is low, and therefore, the manufacturing cost of electronic devices can be reduced.

1C, before filling the potting glue 300a in the accommodating space 220 of the mold 200, the at least one protrusion 212 of the mold body 210 can be cut in a direction opposite to the first direction D1. One of them. In this embodiment, the protrusion 212a of the mold body 210 is cut along the direction opposite to the first direction D1 to form a cut line 210L in the protrusion 212a of the mold body 210. Since the mold body 210 of this embodiment has a secant 210L, after the potting glue 300a is cured, the secant 210L can tear part of the mold body 210 in a direction opposite to the first direction D1 to quickly take out the mold body 210. The packaged circuit board 100. Based on this, the cut 210L formed in the protrusion 212a of the mold body 210 of the present embodiment can have the effect of quickly separating the potting glue 300a from the mold 200. In some embodiments, after the potting glue 300a is filled into the accommodating space 220 of the mold 200, it may flow into the cut mold body 210 through the cut line 210L. Based on this, the potting glue 300a may be cured after being cured. The appearance of the packaged circuit board 100 has a gap. In this regard, since the secant line 210L is formed in the convex portion 212a of the mold body 210 in this embodiment, and the potting glue 300a has a depression in the portion corresponding to the convex portion 212a of the mold body 210 after being cured, therefore, The fact that the potting glue 300a flows into the cut raised portion 212a through the cut line 210L can be compensated by the aforementioned depression, so that the packaged circuit board 100 has a more complete appearance.

1C, after cutting one of the at least one protrusion 212 of the mold body 210 along a direction opposite to the first direction D1, an elastic ring body 400 is provided on the periphery of the mold 200 to fix the mold 200 . In detail, the elastic ring body 400 can cover the mold 200 to give a compressive force to the inside thereof, thereby preventing the potting glue 300a from flowing out of the mold 200 through the cut 210L. It is to be explained here that although the elastic ring body 400 is used to fix the mold 200 in this embodiment, the present invention is not limited to this. In other embodiments, the tape may be applied along the extending direction of the secant line 210L. It is attached to the outside of the mold 200 or uses the magnetic force of a magnetic substance to fix the mold 200.

1D, after the potting glue 300a is cured, the cured potting glue 300a and the mold 200 are separated to form the electronic device 10. The potting glue 300a can be, for example, a solid potting body 300 that is cured into a solid after about 24 hours at room temperature, thereby fixing the circuit board 100 and serving as the outer shell of the circuit board 100. The potting body 300 is made of epoxy resin. The resin has the functions of waterproof, dustproof, insulation, heat conduction, shockproof and so on. Based on this, the electronic device 10 formed in this embodiment does not need to have a conventional plastic casing. In addition to reducing the manufacturing cost of the electronic device 10, the size of the electronic device 10 can also be reduced. In addition, since the material of the mold body 210 is silicone and does not adhere to the potting body 300 (the cured potting glue 300a), the mold body 210 and the potting body 300 retain their original appearance when they are separated. Therefore, the mold body 210 of this embodiment can be reused, thereby further reducing the manufacturing cost of the electronic device 10.

Please continue to refer to FIG. 1D. FIG. 1D illustrates a schematic diagram of the electronic device 10 according to an embodiment of the present invention. The electronic device 10 of this embodiment may be, for example, a power converter, a voltage converter or other related electronic devices, and the invention is not limited thereto. In this embodiment, the electronic device 10 includes a circuit board 100, a connector 110, a plurality of wires 120 and a potting body 300. The components of the circuit board 100, the connector 110, and the plurality of wires 120 and their connection relationship are described in the foregoing embodiment in detail, and will not be repeated here. The potting body 300, for example, covers the circuit board 100, and exposes a part of the connector 110 and a plurality of wires 120. For example, the contact part of the terminal of the connector 110 may be disposed in a recess in the connector 110, and the recess of the connector 110 is not covered by the potting body 300. In addition, the plurality of wires 120 extend out of the potting body 300 along the first direction D1.

In summary, the manufacturing method of the electronic device provided by the present invention does not require the use of a plastic shell during packaging. Therefore, the finished electronic device does not have a plastic shell. In this case, in addition to reducing the manufacturing cost of the electronic device , Can also reduce the size of electronic devices. Furthermore, the mold provided by the present invention is not bonded to the potting glue and can be used repeatedly, so that the manufacturing process time of the electronic device can be accelerated and the manufacturing cost of the electronic device can be further reduced.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to those defined by the attached patent scope.

10: Electronic device 100: circuit board 100a: plug-in section 100b: connection segment 110: Connector 120: Wire 200: Mould 210: Mold body 210L: Secant 212, 212a, 212b: protrusions 220: accommodating space 230: opening 300: potting body 300a: potting glue 400: Elastic ring body D1: First direction

1A to 1D are schematic flowcharts of a manufacturing method of an electronic device according to an embodiment of the invention.

10: Electronic device

100: circuit board

110: Connector

120: Wire

300: potting body

D1: First direction

Claims (8)

A manufacturing method of an electronic device includes: A circuit board and a mold are provided, wherein the mold includes a mold body, an accommodating space, and an opening, the accommodating space communicates with the opening in a first direction and is located in the mold body; Placing the circuit board in the accommodating space of the mold; Fill the potting glue in the accommodating space of the mold; and After the potting glue is cured, the cured potting glue and the mold are separated. The method for manufacturing an electronic device according to claim 1, wherein the electronic device further includes a connector, and the connector is electrically connected to the circuit board and exposed to the cured potting glue. The method for manufacturing an electronic device according to claim 1, wherein the electronic device further includes a wire, the wire is electrically connected to the circuit board and extends along the first direction to extend the cured potting glue. The method of manufacturing an electronic device according to claim 1, wherein the mold body includes at least one protrusion, and the at least one protrusion extends into the accommodating space. The method of manufacturing an electronic device according to claim 4, wherein before filling the potting glue in the accommodating space of the mold, it further comprises cutting in a direction opposite to the first direction One of the at least one raised portion. The method of manufacturing an electronic device according to claim 5, wherein after one of the at least one protrusion is cut in a direction opposite to the first direction, elasticity is provided on the periphery of the mold body The ring body is used to fix the mold. The method of manufacturing an electronic device according to claim 1, wherein the material of the mold body includes silicone. The method of manufacturing an electronic device according to claim 1, wherein the material of the potting glue includes epoxy resin.

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