JPH0432166A - soldering terminals - Google Patents
soldering terminalsInfo
- Publication number
- JPH0432166A JPH0432166A JP13465490A JP13465490A JPH0432166A JP H0432166 A JPH0432166 A JP H0432166A JP 13465490 A JP13465490 A JP 13465490A JP 13465490 A JP13465490 A JP 13465490A JP H0432166 A JPH0432166 A JP H0432166A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- soldering
- solder
- soldered
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 49
- 229910000679 solder Inorganic materials 0.000 abstract description 30
- 238000010586 diagram Methods 0.000 description 5
- 238000009736 wetting Methods 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は電気また電子機器の電気的接続方法に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an electrical connection method for electrical or electronic equipment.
［従来の技術］
従来、対向する半田付は端子において、一方の端子の幅
または面積は他の対向する半田付は端子の幅または面積
と等しくなっていた。[Prior Art] Conventionally, opposing solder joints are terminals, and the width or area of one terminal is equal to the width or area of the other opposing solder joint.
第６図は従来の実施例を示す斜視図で、１は対向する一
方の端子であり、２は前記端子１と対向する他方の端子
であり、端子ｌと端子２の幅は等しくなっている。端子
１と端子２は半田３によって半田付けされている。第７
図は第６図におけるＢ−Ｂ’面の断面図である。FIG. 6 is a perspective view showing a conventional embodiment, in which 1 is one terminal facing the terminal, 2 is the other terminal facing the terminal 1, and the widths of the terminal 1 and the terminal 2 are equal. . Terminal 1 and terminal 2 are soldered together with solder 3. 7th
The figure is a sectional view taken along the line BB' in FIG. 6.
［発明が解決しようとする課題］
しかし、前述の従来技術では対向する半田付は端子１と
２の対向する面に半田をぬらすのに、半田のぬれ具合を
確認するのに前記端子１の上面の半田のぬれ具合及び、
前記端子１及び端子２の側面の微小部分の半田のぬれ具
合をみて半田付は作業を行わなければならず、前記半田
付は端子ｌと２の対向する面の半田のぬれ状態の判定は
不確実である。したがって、半田付は作業としては、加
熱時間を長くしたり、半田及びフラックスを多くつぎた
したりするため、作業時間が多くかかったり、半田材料
を多量に使用したりするという問題点があった。また、
半田付けされたものの半田品質を判定するのに前記端子
１と２の側面の微小な部分の半田付は外観で判断せざる
を得す、したがって判定しにくく、確実性に欠け、判定
作業に時間がかかるといった問題点も有していた。[Problem to be Solved by the Invention] However, in the above-mentioned prior art, solder is wetted on the opposing surfaces of terminals 1 and 2 when soldering the opposite sides, but when checking the degree of wetting of the solder, the upper surface of the terminal 1 is wetted with solder. Wetting condition of solder and
The soldering work must be performed by checking the wetness of the solder on the minute parts on the side surfaces of the terminals 1 and 2, and it is not possible to judge the wetness of the solder on the opposing surfaces of the terminals 1 and 2. It is certain. Therefore, soldering requires a long heating time and a large amount of solder and flux, so there are problems in that it takes a lot of time and a large amount of solder material is used. . Also,
In order to judge the solder quality of soldered items, it is necessary to judge the soldering of the small parts on the sides of the terminals 1 and 2 by the appearance. Therefore, it is difficult to judge, lacks certainty, and takes a long time to judge. It also had the problem that it took a long time.
本発明ではかかる問題点を解決し、半田付は作業を容易
にし、作業時間を短縮し、また半田付けの確実性、品質
レベルを向上させ、判定作業時間も短縮することを目的
とする。It is an object of the present invention to solve such problems, to make soldering work easier, to shorten the working time, to improve the reliability and quality level of soldering, and to shorten the judgment work time.
［課題を解決するための手段］
本発明の半田付は端子は、対向する半田付は端子におい
て、一方の半田付は端子の幅または面積を他方の半田付
は端子の幅または面積より、狭くしたことを特徴とする
。[Means for Solving the Problems] The soldering of the present invention is such that the opposing soldering is at the terminal, and the width or area of one soldering is narrower than the width or area of the other terminal. It is characterized by what it did.
［実 施 例〕
第１図は本発明の一実施例の主要部の斜視図であって、
対向する端子１と２が半田３によって半田付けされてい
る。第２図は第１図のＡ−Ａ′の断面図である。第４図
に示すように該端子１は中央部分が狭くなった形状、す
なわち鼓形状となっていて、ベースフィルム７が半田付
は端子部分になりオーバーハング構造となっている。前
記端子１が鼓形状となっていることによって、該端子ｌ
と２の半田のぬれ具合が該端子ｌと２の側面の微小部分
の半田のぬれ具合だけでなく、前記端子１の鼓形状の中
央部が細くなっている部分の半田のぬれ具合及び前記半
田３の裾をひいた形状をみることによって半田付は状態
を容易に判定できるため、半田付は作業が容易になり、
作業時間が短縮される。また、半田付けの確実性、品質
レベルが向上し、検査作業時間も短縮される。さらに前
記端子１の鼓形状のメリットとしては、端子幅が両側部
分から中央部分に向かって徐々に狭くなっているため、
半田付は後の前記端子の強度は、両側部分の端子幅でス
トレートになっている従来形状の端子の強度とほとんど
同じである。したがって、より微細ピッチの半田付は端
子となった場合においても、半田付は強度は充分確保さ
れ、なおかつ、半田付は作業が容易で、短時間に行え、
半田付は品質も充分確保された半田付けが可能である。[Embodiment] FIG. 1 is a perspective view of the main parts of an embodiment of the present invention,
Opposing terminals 1 and 2 are soldered together with solder 3. FIG. 2 is a sectional view taken along line A-A' in FIG. As shown in FIG. 4, the terminal 1 has a narrow central portion, that is, a drum shape, and the base film 7 is soldered to the terminal portion, forming an overhanging structure. Since the terminal 1 is shaped like a drum, the terminal l
The degree of wetting of the solder in terminals 1 and 2 depends not only on the degree of wetting of the solder on the minute parts on the sides of the terminals 1 and 2, but also on the degree of wetting of the solder on the thin center part of the drum shape of the terminal 1 and the solder. You can easily judge the soldering condition by looking at the rounded shape of 3, which makes the soldering work easier.
Work time is reduced. Furthermore, the reliability and quality of soldering are improved, and inspection work time is also shortened. Furthermore, the advantage of the drum-shaped terminal 1 is that the width of the terminal gradually narrows from both sides toward the center.
The strength of the terminal after soldering is almost the same as that of a conventional shaped terminal which is straight across the width of the terminal on both sides. Therefore, even when soldering with a finer pitch becomes a terminal, the soldering strength is ensured sufficiently, and the soldering work is easy and can be done in a short time.
Soldering can be performed with sufficient quality.
第３図は本発明を実施した液晶表示装置の一実施例であ
る。４は液晶駆動用ドライバーを搭載したフレキシブル
基板であり、５はドライバーに信号を入力する実装基板
であり、６は液晶標示体である。FIG. 3 shows an embodiment of a liquid crystal display device embodying the present invention. 4 is a flexible board on which a driver for driving the liquid crystal is mounted, 5 is a mounting board for inputting signals to the driver, and 6 is a liquid crystal display body.
第５図は第３図の前記４のフレキシブル基板の本発明の
他の一実施例の主要部の斜視図であり、端子ｌの形状は
前記第４図の該端子の形状と同様な鼓形状であるが、ベ
ースフィルム７が半田付は端子部分まで前記端子１と同
様な鼓形状となっている。すなわち、半田付は端子の中
央部分の端子幅が狭くなっているため、半田付けすると
前記第１図の実施例と同様に、半田のぬれ具合が端子の
側面だけでな（、中央部の細い部分での半田の裾をひい
た状態をみることによって半田付は状態を容易に判定で
きる。したがって半田付は作業が容易になり作業時間が
短縮される。また半田付けの確実性、品質レベルが向上
し、検査作業時間も短縮される。さらに第４図の実施例
と同様により微細ピッチの半田付は端子としても有効で
ある。FIG. 5 is a perspective view of the main part of another embodiment of the present invention of the flexible substrate 4 in FIG. 3, and the shape of the terminal l is similar to the shape of the terminal in FIG. However, when the base film 7 is soldered, it has the same shape as the terminal 1 up to the terminal portion. In other words, when soldering, the width of the terminal is narrow at the center of the terminal, so when soldering, the solder wetness is not only on the sides of the terminal (but also on the thin center part). The soldering condition can be easily determined by looking at the condition of the solder hem at the part. Therefore, the soldering work becomes easier and the working time is shortened. It also improves the reliability and quality level of the soldering. Furthermore, similar to the embodiment shown in FIG. 4, finer pitch soldering is also effective as a terminal.
なお、上記実施例では、端子１の形状を鼓形状としたが
、この形状に限らず、一対の端子間の半田付は接合する
領域内で、少なくとも一部が狭くなる、又は切り欠いた
ような形状であれば、上記実施例と同様の効果が得られ
る。In the above embodiment, the shape of the terminal 1 is made into a drum shape, but the shape is not limited to this shape. When soldering between a pair of terminals, at least a part of the area to be joined may be narrowed or cut out. If the shape is the same, the same effect as in the above embodiment can be obtained.
また、端子間の接合部材としては、上記実施例では、半
田を使用したが、半田以外にも接着剤や粘着剤等に対し
ても本発明は適用可能である。Further, although solder was used in the above embodiment as the joining member between the terminals, the present invention is also applicable to adhesives, pressure-sensitive adhesives, etc. other than solder.
［発明の効果］
以上述べたように本発明によれば、対向する半田付は端
子において、一方の半田付は端子の幅または面積を他方
の半田付は端子の幅または面積より狭くしたことにより
、対向する半田付は端子の半田のぬれ具合が該両端子の
側面の微小部分の半田のぬれ具合だけでなく、該半田付
は端子の幅または面積が狭くなっている部分の半田のぬ
れ具合及び半田の裾をひいた形状をみることによって半
田付は状態を容易に判定できるため、半田付は作業が容
易になり、作業時間が短縮される。また、半田付けの確
実性、品質レベルが向上し、検査作業時間も短縮される
。さらに微細ピッチの半田付は端子となった場合におい
ても、半田付は強度が確保され、半田付は作業が容易で
短時間に行え、半田付は品質も確保された半田付けがで
きる。[Effects of the Invention] As described above, according to the present invention, the opposing solders are made in the terminals, and the width or area of the terminal in one solder is made narrower than the width or area of the terminal in the other solder. For soldering on opposite sides, the solder wetness of the terminals is determined not only by the solder wettability of the minute parts on the sides of both terminals, but also by the solder wettability of the parts where the width or area of the terminal is narrow. The state of soldering can be easily determined by looking at the curved shape of the solder, making the soldering work easier and reducing the working time. Furthermore, the reliability and quality of soldering are improved, and inspection work time is also shortened. Furthermore, even when soldering with a fine pitch becomes a terminal, the strength of the soldering is ensured, the soldering work is easy and can be done in a short time, and the quality of soldering can be ensured.
第１図は本発明の半田付は端子の一実施例を示す図。
第２図は第１図のＡ−Ａ′面の断面図。
第３図は本発明の半田付は端子を用いた液晶標示装置の
一実施例を示す図。
第４図は本発明の第１図の実施例に使われた半田付は端
子の主要部を示す図。
第５図は本発明の他の実施例の半田付は端子の主要部を
示す図。
第６図は従来の半田付は端子の半田付は状態を示す図。
第７図は第６図のｃ−ｃ′面の断面図。
ドライバ搭載フレキシブル基板
実装基板
液晶標示体
ベースフィルム
出願人 セイコーエプソン株式会社
代理人 弁理士 鈴 木 喜三部（化１名）１・・・対
向する一方の端子
２・・・対向する他方の端子
３・・・半田
耶４図FIG. 1 is a diagram showing an embodiment of the soldering terminal of the present invention. FIG. 2 is a sectional view taken along line A-A' in FIG. FIG. 3 is a diagram showing an embodiment of a liquid crystal display device using soldered terminals of the present invention. FIG. 4 is a diagram showing the main parts of the soldering terminal used in the embodiment of FIG. 1 of the present invention. FIG. 5 is a diagram showing the main parts of a soldering terminal according to another embodiment of the present invention. FIG. 6 is a diagram showing the state of conventional soldering of terminals. FIG. 7 is a sectional view taken along line c-c' in FIG. 6. Flexible printed circuit board mounting board with driver LCD display base film Applicant: Seiko Epson Co., Ltd. Agent Patent attorney: Kizobe Suzuki (1 person in chemical engineering) 1... One opposing terminal 2... The other opposing terminal 3 ...Handaya figure 4
Claims (1)
幅または面積を他方の半田付け端子の幅または面積より
、狭くしたことを特徴とする半田付け端子。A soldering terminal characterized in that, among opposing soldering terminals, the width or area of one soldering terminal is narrower than the width or area of the other soldering terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13465490A JPH0432166A (en) | 1990-05-24 | 1990-05-24 | soldering terminals |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13465490A JPH0432166A (en) | 1990-05-24 | 1990-05-24 | soldering terminals |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19439699A Division JP3183285B2 (en) | 1999-07-08 | 1999-07-08 | Terminal connection structure and liquid crystal display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0432166A true JPH0432166A (en) | 1992-02-04 |
Family
ID=15133430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13465490A Pending JPH0432166A (en) | 1990-05-24 | 1990-05-24 | soldering terminals |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0432166A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6411351B1 (en) | 1996-02-13 | 2002-06-25 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix type display device comprising a discharge pattern or a short ring and method of manufacturing the same |
| JP2012069599A (en) * | 2010-09-21 | 2012-04-05 | Seiko Instruments Inc | Electronic apparatus, and manufacturing method therefor |
| JP2013033570A (en) * | 2011-08-02 | 2013-02-14 | Dainippon Printing Co Ltd | Substrate for suspension, suspension, suspension with element, hard disk drive, and method for manufacturing substrate for suspension |
-
1990
- 1990-05-24 JP JP13465490A patent/JPH0432166A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6411351B1 (en) | 1996-02-13 | 2002-06-25 | Semiconductor Energy Laboratory Co., Ltd. | Active matrix type display device comprising a discharge pattern or a short ring and method of manufacturing the same |
| JP2012069599A (en) * | 2010-09-21 | 2012-04-05 | Seiko Instruments Inc | Electronic apparatus, and manufacturing method therefor |
| JP2013033570A (en) * | 2011-08-02 | 2013-02-14 | Dainippon Printing Co Ltd | Substrate for suspension, suspension, suspension with element, hard disk drive, and method for manufacturing substrate for suspension |
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