JPH0115121Y2 - - Google Patents

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Publication number
JPH0115121Y2
JPH0115121Y2 JP15789882U JP15789882U JPH0115121Y2 JP H0115121 Y2 JPH0115121 Y2 JP H0115121Y2 JP 15789882 U JP15789882 U JP 15789882U JP 15789882 U JP15789882 U JP 15789882U JP H0115121 Y2 JPH0115121 Y2 JP H0115121Y2
Authority
JP
Japan
Prior art keywords
upper electrode
electrode
chip resistor
resistor
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15789882U
Other languages
Japanese (ja)
Other versions
JPS5961503U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15789882U priority Critical patent/JPS5961503U/en
Publication of JPS5961503U publication Critical patent/JPS5961503U/en
Application granted granted Critical
Publication of JPH0115121Y2 publication Critical patent/JPH0115121Y2/ja
Granted legal-status Critical Current

Links

Description

【考案の詳細な説明】 本考案はチツプ抵抗器の改良に関する。[Detailed explanation of the idea] The present invention relates to improvements in chip resistors.

第1図は従来のチツプ抵抗器の構成を示す側断
面図である。図において1は例えばアルミナ等よ
りなる直方体状の支持基体、2は支持基体1の上
表面に被着した例えばタンタルよりなる抵抗体、
21,21は抵抗体2の両端部に形成した上部電
極である。
FIG. 1 is a side sectional view showing the structure of a conventional chip resistor. In the figure, 1 is a rectangular support base made of, for example, alumina, and 2 is a resistor made of, for example, tantalum, which is adhered to the upper surface of the support base 1.
21, 21 are upper electrodes formed at both ends of the resistor 2.

第2図は従来のチツプ抵抗器を例えばプリント
基板に所謂フエイスダウン方式で取付けた状態を
示す側断面図である。従来のチツプ抵抗器は、抵
抗体2をプリント基板5側に向けた状態で上部電
極21,21とプリント基板5の電極(ランド)
51,52とがリフロー式半田付けにより固着さ
れている。
FIG. 2 is a side sectional view showing a state in which a conventional chip resistor is mounted, for example, on a printed circuit board in a so-called face-down manner. In the conventional chip resistor, the upper electrodes 21 and 21 and the electrode (land) of the printed circuit board 5 are connected with the resistor 2 facing the printed circuit board 5 side.
51 and 52 are fixed by reflow soldering.

而して、従来のチツプ抵抗器は、プリント基板
に上述のように取付けると、支持基体1が上側に
位置しているので上部電極21,21と電極5
1,52とが確実に半田付けされているか否かを
目視で判別し難いという欠点があつた。
When the conventional chip resistor is mounted on a printed circuit board as described above, since the supporting base 1 is located on the upper side, the upper electrodes 21, 21 and the electrode 5 are connected to each other.
There was a drawback in that it was difficult to visually determine whether or not 1 and 52 were reliably soldered.

また、プリント基板に取付けた一つの前記抵抗
器が不良であつてこの抵抗器を取替える必要があ
る場合であつても、フエイスダウン方式で半田付
されているため抵抗器の交換補修が極めて困難で
あるという欠点があつた。
Furthermore, even if one of the resistors installed on the printed circuit board is defective and needs to be replaced, it is extremely difficult to replace or repair the resistor because it is soldered face-down. There was a drawback.

一方、厚膜チツプ抵抗器では上記欠点を解消す
るために支持基体の端部側面に横電極を厚膜形成
する方法もとられている。しかしながら、薄膜チ
ツプ抵抗器では、前記横電極を形成しようとすれ
ば、焼成時に薄膜抵抗体の酸化・消失をきたすた
めに前記横電極を設けることができなかつた。
On the other hand, in order to eliminate the above-mentioned drawbacks in thick film chip resistors, a method has been adopted in which horizontal electrodes are formed as a thick film on the side surfaces of the end portions of the support base. However, in thin film chip resistors, if the horizontal electrodes were to be formed, the thin film resistor would oxidize and disappear during firing, so it was impossible to provide the horizontal electrodes.

本考案は斯かる事情に鑑みてなされたものであ
つて、支持基体の端部側面に横電極を形成したチ
ツプ抵抗器を提供することを目的とする。
The present invention was developed in view of the above circumstances, and it is an object of the present invention to provide a chip resistor in which a horizontal electrode is formed on the end side surface of a support base.

そして、そのために本考案に係るチツプ抵抗器
は、支持基体の表面に設けた抵抗体の端部に上部
電極を形成し、上電極に切り欠きを形成したクリ
ツプを、前記上電極が上部電極に当接するよう、
支持基体の端部に取り付けることにより、支持基
体の端部に横電極を形成したことを特徴としてい
る。
For this purpose, in the chip resistor according to the present invention, an upper electrode is formed at the end of the resistor provided on the surface of the support base, and a clip with a notch formed in the upper electrode is inserted into the upper electrode. so that it comes into contact with
It is characterized in that a horizontal electrode is formed at the end of the support base by attaching it to the end of the support base.

以下、本考案に係るチツプ抵抗器の一実施例に
ついて図面とともに説明する。
An embodiment of the chip resistor according to the present invention will be described below with reference to the drawings.

第3図は本考案を薄膜チツプ抵抗器について実
施した例の外観を示す拡大斜視図である。図にお
いて1′は例えばアルミナ等よりなる直方体状の
支持基体であつて、支持基体1′の上表面に例え
ばタンタル等よりなる薄膜抵抗体2′が適宜の方
法により被着されている。そして薄膜抵抗体2′
の両端部の表面に多層膜状の上部電極21′,2
1′が形成されている。また支持基体1′の両端部
から、適宜の表面処理が施された例えば黄銅等よ
りなるクリツプ3を嵌め込んで、クリツプ3の後
述する上電極31と、上部電極21′とが半田付
け接続されることにより、支持基板1′の端部側
面に横電極33が形成される。
FIG. 3 is an enlarged perspective view showing the external appearance of a thin film chip resistor in which the present invention is applied. In the figure, reference numeral 1' denotes a rectangular parallelepiped supporting base made of, for example, alumina, and a thin film resistor 2' made of, for example, tantalum is adhered to the upper surface of the supporting base 1' by an appropriate method. and thin film resistor 2'
A multilayer film-like upper electrode 21', 2 is formed on the surface of both ends of the
1' is formed. Further, clips 3 made of, for example, brass, which have been subjected to an appropriate surface treatment, are inserted into both ends of the support base 1', and an upper electrode 31, which will be described later, of the clip 3 is connected to the upper electrode 21' by soldering. By doing so, horizontal electrodes 33 are formed on the side surfaces of the end portions of the support substrate 1'.

第4図はクリツプの外観を示す拡大斜視図であ
る。クリツプ3は横電極33の上側及び下側に上
電極31及び下電極32を備えており、上電極3
1及び下電極32間で支持基板1′を挾持し得る
ように全体として例えば断面略U字状に形成され
ている。そして、クリツプ3は、上電極31及び
下電極32の中央部に切欠き31a及び32aが
形成されている。
FIG. 4 is an enlarged perspective view showing the appearance of the clip. The clip 3 includes an upper electrode 31 and a lower electrode 32 on the upper and lower sides of the horizontal electrode 33.
1 and the lower electrode 32 so that the support substrate 1' can be held between the support substrate 1' and the lower electrode 32. In the clip 3, notches 31a and 32a are formed at the center of the upper electrode 31 and the lower electrode 32.

上述の如く構成された本考案に係るチツプ抵抗
器は以下のように使用される。即ち、第5図は本
考案に係るチツプ抵抗器をプリント基板5′に取
付けた状態を示す側断面図である。第5図に示す
ように、本考案に係るチツプ抵抗器は、抵抗体
2′を上方に向けた状態でクリツプ3,3の例え
ば下電極32,32がプリント基板5′の電極5
1′,52′に例えばリフロー式半田付けにより接
続される。41,42は下電極32,32と電極
51′,52′の接続に与る半田である。
The chip resistor according to the present invention constructed as described above is used as follows. That is, FIG. 5 is a side sectional view showing a state in which the chip resistor according to the present invention is attached to a printed circuit board 5'. As shown in FIG. 5, in the chip resistor according to the present invention, for example, the lower electrodes 32, 32 of the clips 3, 3 are connected to the electrodes 5' of the printed circuit board 5' with the resistor 2' facing upward.
1' and 52', for example, by reflow soldering. 41 and 42 are solders for connecting the lower electrodes 32 and 32 to the electrodes 51' and 52'.

而して、本考案に係るチツプ抵抗器では下電極
32,32が電極51′,52′に確実に半田付け
されると、第5図に示す如く、半田41,42の
一部が下電極32,32の周囲及び横電極33の
外側に若干はみ出した状態になることが普通であ
る。そして、半田41,42の上述のようにはみ
出した部分は目視により十分認識し得るので、こ
れにより下電極32,32と電極51′,52′と
が確実に半田付け接続されたことを認識できる。
In the chip resistor according to the present invention, when the lower electrodes 32, 32 are reliably soldered to the electrodes 51', 52', a part of the solder 41, 42 is soldered to the lower electrodes, as shown in FIG. 32, 32 and the outside of the horizontal electrode 33. Since the protruding portions of the solder 41, 42 as described above can be sufficiently recognized by visual inspection, it can be recognized that the lower electrodes 32, 32 and the electrodes 51', 52' are reliably connected by soldering. .

以上の実施例の説明より明らかなように本考案
に係るチツプ抵抗器は抵抗体を上方又は下方へ向
けた状態で例えばリフロー式半田付けによりプリ
ント基板等に取付けても所要の電極同士が確実に
半田付け接続されているか否かを目視で容易に判
別し得る。
As is clear from the description of the embodiments above, the chip resistor according to the present invention can be mounted on a printed circuit board, etc. by reflow soldering, for example, with the resistor facing upward or downward, and the required electrodes can be reliably connected to each other. It is possible to easily visually determine whether or not the connection is made by soldering.

また、本考案に係るチツプ抵抗器は、横電極を
設けたから、半田ごてによつてチツプ抵抗器を容
易に着脱できるので、抵抗器の交換補修を短時間
に行い得る。
Further, since the chip resistor according to the present invention is provided with horizontal electrodes, the chip resistor can be easily attached and detached using a soldering iron, so that the resistor can be replaced or repaired in a short time.

さらに、本考案に係るチツプ抵抗器は、上部電
極に当接するクリツプの上電極に切り欠きを形成
してあるので、上電極の端面距離が長くなり、そ
の結果、上電極と上部電極との半田付強度が向上
するとともに、チツプ抵抗器をフエイスダウン方
式で実装するに際しても、チツプ抵抗器と例えば
プリント基板との半田付接続を強固にするという
効果をも奏する。
Furthermore, since the chip resistor according to the present invention has a notch formed in the upper electrode of the clip that contacts the upper electrode, the end face distance of the upper electrode becomes longer, and as a result, the solder between the upper electrode and the upper electrode increases. In addition to improving the bonding strength, this also has the effect of strengthening the solder connection between the chip resistor and, for example, a printed circuit board, even when the chip resistor is mounted face-down.

また、本考案に係るチツプ抵抗器は、前記切り
欠きを形成しているので、上部電極とクリツプの
上電極とを予め半田付しておく場合には、半田付
けの目視検査が容易になる。
Further, since the chip resistor according to the present invention has the cutout, visual inspection of the soldering becomes easy when the upper electrode and the upper electrode of the clip are soldered in advance.

なお、上述の実施例ではクリツプ3の上電極3
1及び下電極32の中央部に切欠き31a及び3
2aを形成したが、これに限ることなく第6図イ
に示すよう上電極31にのみ前記切欠き31aと
同様の切欠き31a′を形成することとしてもよ
く、また第6図ロに示すように横電極33の上部
にまで深く切込んだ切欠き31a″を上電極31の
中央部に形成してもよい。
Note that in the above embodiment, the upper electrode 3 of the clip 3
1 and the lower electrode 32 have notches 31a and 3 in the center.
However, the present invention is not limited to this, and a notch 31a' similar to the notch 31a may be formed only in the upper electrode 31 as shown in FIG. Alternatively, a notch 31a'' that is deeply cut into the upper part of the horizontal electrode 33 may be formed in the center of the upper electrode 31.

また、下電極32を第6図ハに示すように幅の
狭い一枚形状としてもよい。
Further, the lower electrode 32 may be formed into a single piece with a narrow width as shown in FIG. 6C.

さらに、第3図に示した実施例において、上部
電極21′と上電極31は半田付接続されている
と説明したが、本考案はこれに限られるものでな
い。例えば、プリント基板の電極に予め充分な量
の半田若しくは半田ペーストを予め付着しておい
てフエイスダウン方式で実装する場合や、プリン
ト基板の浸漬半田付法によつて実装する場合(但
し、この場合はフエイスダウン方式でなくてもよ
い)にあつては、上部電極21′と上電極31と
を予め半田付接続しておかなくとも、前記実装時
において、プリント基板の電極と上電極31若し
くは下電極32とが半田付されると同時に、半田
のヌレによつて上電極31と上部電極21′も半
田付される。そして、この場合においても、本考
案は上述したと同じ効果を奏するものである。
Further, in the embodiment shown in FIG. 3, it has been explained that the upper electrode 21' and the upper electrode 31 are connected by soldering, but the present invention is not limited to this. For example, when a sufficient amount of solder or solder paste is applied to the electrodes of a printed circuit board in advance and the face-down method is used, or when the printed circuit board is immersed in soldering. ), the upper electrode 21' and the upper electrode 31 do not have to be connected by soldering in advance, but the printed circuit board electrode and the upper electrode 31 or the lower At the same time that the electrode 32 is soldered, the upper electrode 31 and the upper electrode 21' are also soldered due to wetting of the solder. Also in this case, the present invention provides the same effects as described above.

またクリツプの材質を鉄等の磁性体にするとチ
ツプ抵抗器は磁石で取り扱うこことができるよう
になるので、実装の自動化を図る上でたいへん都
合がよい。
Furthermore, if the clip is made of a magnetic material such as iron, the chip resistor can be handled with a magnet, which is very convenient for automating mounting.

尚、実施例では薄膜抵抗体を例にとつて説明し
たが、本考案は、無論、厚膜抵抗体にも適用し得
るものである。
Although the embodiments have been explained using a thin film resistor as an example, the present invention can of course be applied to a thick film resistor.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のチツプ抵抗器の構成を示す側断
面図、第2図は従来のチツプ抵抗器を例えばプリ
ント基板にフエイスダウン方式で取付けた状態を
示す側断面図、第3図は本考案を薄膜チツプ抵抗
器について実施した例の外観を示す拡大斜視図、
第4図はクリツプの外観を示す拡大斜視図、第5
図は本考案に係るチツプ抵抗器をプリント基板に
取付けた状態を示す側断面図、第6図はクリツプ
の他の実施例を示す。 1,1′……支持基体、2……抵抗体、2′……
薄膜抵抗体、21,21,21′,21′……上部
電極、3……クリツプ、31……上電極、32…
…下電極、33……横電極、31a,31a′,3
1a″,32a……切欠き、41,42……半田、
5,5′……プリント基板、51,52,51′,
52′……電極。
Fig. 1 is a side sectional view showing the configuration of a conventional chip resistor, Fig. 2 is a side sectional view showing a conventional chip resistor mounted face-down on a printed circuit board, and Fig. 3 is a side sectional view showing the structure of a conventional chip resistor. An enlarged perspective view showing the appearance of an example of a thin film chip resistor,
Figure 4 is an enlarged perspective view showing the appearance of the clip, Figure 5 is an enlarged perspective view showing the appearance of the clip.
The figure is a sectional side view showing the state in which the chip resistor according to the present invention is attached to a printed circuit board, and FIG. 6 shows another embodiment of the clip. 1, 1'...Support base, 2...Resistor, 2'...
Thin film resistor, 21, 21, 21', 21'... upper electrode, 3... clip, 31... upper electrode, 32...
...lower electrode, 33...horizontal electrode, 31a, 31a', 3
1a'', 32a...notch, 41, 42...solder,
5, 5'...Printed circuit board, 51, 52, 51',
52'...electrode.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 支持基体の表面に設けた抵抗体の端部に上部電
極を形成し、上電極に切り欠きを形成したクリツ
プを、前記上電極が上部電極に当接するよう、支
持基体の端部に取り付けることにより、支持基体
の端部側面に横電極を形成したことを特徴とする
チツプ抵抗器。
By forming an upper electrode at the end of the resistor provided on the surface of the support base, and attaching a clip with a notch formed in the upper electrode to the end of the support base so that the upper electrode comes into contact with the upper electrode. , a chip resistor characterized in that a horizontal electrode is formed on the side surface of an end of a support base.
JP15789882U 1982-10-18 1982-10-18 chip resistor Granted JPS5961503U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15789882U JPS5961503U (en) 1982-10-18 1982-10-18 chip resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15789882U JPS5961503U (en) 1982-10-18 1982-10-18 chip resistor

Publications (2)

Publication Number Publication Date
JPS5961503U JPS5961503U (en) 1984-04-23
JPH0115121Y2 true JPH0115121Y2 (en) 1989-05-08

Family

ID=30347994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15789882U Granted JPS5961503U (en) 1982-10-18 1982-10-18 chip resistor

Country Status (1)

Country Link
JP (1) JPS5961503U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022116877A (en) * 2021-01-29 2022-08-10 Koa株式会社 Chip component

Also Published As

Publication number Publication date
JPS5961503U (en) 1984-04-23

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