JPH02201993A - Connection structure of printed board - Google Patents

Connection structure of printed board

Info

Publication number
JPH02201993A
JPH02201993A JP2213889A JP2213889A JPH02201993A JP H02201993 A JPH02201993 A JP H02201993A JP 2213889 A JP2213889 A JP 2213889A JP 2213889 A JP2213889 A JP 2213889A JP H02201993 A JPH02201993 A JP H02201993A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
terminal pattern
board
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2213889A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Mizumo
義之 水藻
Yasuhiro Toyoda
豊田 育弘
Kazuo Takematsu
竹松 一男
Masayoshi Horikawa
正義 堀川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Minolta Co Ltd
Original Assignee
Minolta Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minolta Co Ltd filed Critical Minolta Co Ltd
Priority to JP2213889A priority Critical patent/JPH02201993A/en
Publication of JPH02201993A publication Critical patent/JPH02201993A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/363Assembling flexible printed circuits with other printed circuits by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Abstract

PURPOSE:To allow a part between both terminal patterns to be free from the exposed part of a board which is lacking in solder and make the connection strength of the above patterns strong by connecting an FPC terminal pattern to an edge face terminal pattern of a printed board and fixing them with solder. CONSTITUTION:A positioning hole 2B of each flexible printed circuit board (FPC) 2 is fitted in a pin 5 and the FPC 2 is engaged in a recessed part 4A of a board fixing member 4. Then a positioning hole 1C of each printed wiring board (PWB) 1 is fitted in the pin and the PWB 1 is put on top of the FPC 2. As pins 5 cause the PWB 1 and the FPC 2 to be disposed compulsorily to prescribed positions, a terminal pattern 2A of the FPC 2 and the terminal pattern 1A of the PWB 1 coincide with each other accurately. Then solder 3 is poured into an edge face recessed part 1B and the terminal patterns 2A and 1A are connected and fixed each other. Since a part between both terminal patterns is free from the exposed part of a board lacking in solder, connection strength is intensified.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、プリント基板の接続端子パターン同士を接続
するためのプリント基板の接続構造に関する。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a printed circuit board connection structure for connecting connection terminal patterns of printed circuit boards.

(従来の技術) 従来はフレキシブルプリント基板(FPC)と他の基板
例えばハードプリント基板(PWB)とを接続させる場
合、互いの接続端子パターンを第5図に示すように夫々
の基板の縁で基板面に配設形成し、両接続端子パターン
分互いに一致させて、両基板1,2を平行に重ねてハン
ダ3で固定し、その後第6図に示すようにFPCを直角
に折曲している。しかし、このような接続方法では、再
接続端子パターンをハンダ3で接続固定する時に、第5
図Bに示すように、両接続端子パターン間にFPC2の
ベース厚dの隙間が生じるので、その間をハンダだけの
強度で保たなければならないために、パターン間に隙間
がない場合と比較して、パターン間の接続強度が弱くな
ると云う問題があった。
(Prior Art) Conventionally, when connecting a flexible printed circuit board (FPC) and another board, such as a hard printed circuit board (PWB), the connecting terminal patterns of each other are connected to each other at the edge of each board, as shown in FIG. The FPC is arranged and formed on the surface, and both connection terminal patterns are made to match each other, and both boards 1 and 2 are stacked in parallel and fixed with solder 3, and then the FPC is bent at a right angle as shown in Fig. 6. . However, in this connection method, when connecting and fixing the reconnection terminal pattern with solder 3, the fifth
As shown in Figure B, a gap of the base thickness d of the FPC2 is created between both connection terminal patterns, so the gap must be maintained with the strength of solder alone, so compared to the case where there is no gap between the patterns. However, there was a problem in that the connection strength between patterns was weakened.

上述したように、従来の接続方式では、両基板の接続端
子パターン間の接続強度が弱いので、プリント基板間の
接続強度を保つためにハンダの厚さを高くする等、何ら
かの補強対策が必要となってきた。
As mentioned above, in the conventional connection method, the connection strength between the connection terminal patterns on both boards is weak, so some kind of reinforcing measures are required, such as increasing the thickness of the solder, to maintain the connection strength between the printed circuit boards. It has become.

(発明が解決しようとする課題) 本発明は、2つのプリント基板の接続端子パターン同士
を、充分な接続強度を保つように接続させるプリント基
板同士の接続構造を提供することを目的とする。
(Problems to be Solved by the Invention) An object of the present invention is to provide a connection structure between printed circuit boards that connects the connection terminal patterns of two printed circuit boards so as to maintain sufficient connection strength.

(課題を解決するための手段) フレキシブルプリント基板を他のプリント基板とを接続
する場合において、他のプリント基板の方に形成した接
続端子パターンを上記基板の端面を回って裏面まで延出
形成し、フレキシブルプリント基板上の端子パターンを
上記的のプリント基板の裏面の端子パターンと一致させ
て同他のプリント基板の裏面と同他のプリント基板固定
部材との間に挿入し、両回路基板の各対応端子パターン
同士を上記的のプリント基板の端面部でハンダ接続した
(Means for Solving the Problem) When connecting a flexible printed circuit board to another printed circuit board, a connecting terminal pattern formed on the other printed circuit board is formed to extend around the end surface of the board to the back surface. , align the terminal pattern on the flexible printed circuit board with the terminal pattern on the back side of the above printed circuit board, insert it between the back side of the other printed circuit board and the other printed board fixing member, and then The corresponding terminal patterns were soldered together at the end face of the above-mentioned printed circuit board.

更に、接続強度を計るために、上記的のプリント基板の
端縁に形成した接続端子パターンの同基板端面への延長
部を、各端子パターン毎に上記基板の端面に形成した凹
部内に形成し、両回路基板の各対応端子パターン同士を
上記端面凹部でハンダ接続した。
Furthermore, in order to measure the connection strength, an extension of the connection terminal pattern formed on the edge of the above-mentioned printed circuit board to the end surface of the same board was formed in the recess formed on the end surface of the above-mentioned board for each terminal pattern. The respective corresponding terminal patterns of both circuit boards were soldered to each other at the end face recesses.

また、片面フレキシブルプリント基板と他のプリント基
板とを接続する場合において、片面フレキシブルプリン
ト基板に形成した接続端子パターン部を、パターン面を
外にして180度反曲させ、他方のプリント基板上の端
子パターンを上記片面フレキシブルプリント基板の反曲
させた端子パターンと一致させて同フレキシブルプリン
ト基板の反曲した部分とプリント基板固定部材との間に
挿入し、両回路基板の各対応端子パターン同士をハンダ
接続した。
In addition, when connecting a single-sided flexible printed circuit board to another printed circuit board, the connection terminal pattern formed on the single-sided flexible printed circuit board is bent 180 degrees with the pattern side facing out, and the terminals on the other printed circuit board are Align the pattern with the bent terminal pattern of the single-sided flexible printed circuit board, insert it between the bent part of the flexible printed circuit board and the printed circuit board fixing member, and solder the corresponding terminal patterns on both circuit boards. Connected.

(作用) 本発明によれば、他のプリント基板の端面に端子パター
ン毎に裏面にまで端子パターンを延出し、FPCの端子
パターンを上記裏面端子パターンに当接させ、FPC端
子パターンと他のプリント基板の端面端子パターンとを
ハンダにより接続固定させることにより、両方の端子パ
ターンの間にハンダのつかない基板露出部介在しないで
、両端子パターンがハンダ付されるので、接続強度が強
められ、また、他のプリント基板端面に凹部を形成し、
該凹部内に端子パターンを延出させ、該凹部で端子パタ
ーン間をハンダ付をすることによって、ハンダを介して
接続固定させる面積が広くなり接続強度が強くなる。な
お、上記的のプリント基板はハードプリント基板(PW
B)又はフレキシブルプリント基板(FPC)のどちら
でもがよりない。
(Function) According to the present invention, a terminal pattern is extended to the back surface for each terminal pattern on the end surface of another printed circuit board, and the FPC terminal pattern is brought into contact with the back surface terminal pattern, so that the FPC terminal pattern and the other printed circuit board are connected to each other. By connecting and fixing the terminal pattern on the end surface of the board with solder, both terminal patterns can be soldered without interposing an exposed part of the board where no solder is attached between the two terminal patterns, thereby increasing the connection strength. , forming a recess on the end surface of the other printed circuit board,
By extending the terminal patterns into the recesses and soldering the terminal patterns in the recesses, the area to be connected and fixed via the solder is increased, and the connection strength is increased. The above printed circuit board is a hard printed circuit board (PW).
B) or a flexible printed circuit board (FPC).

(実施例〉 第1図に本発明の一実施例を示す。第1図において、1
はハードプリント基板(PWB)で表面に端子パターン
IAが形成され、その端子パターンIAの縁はPWB 
1の端面に形成した端面凹部IBまで延びており、PW
B 1の側端近くに位置決め用孔ICが設けられである
。2はフレキシブルプリント基板(FPC)2で、端子
パターン2AがPWBIの端面凹部IBと一致するよう
に配設されており、端部の側端近くに上記位置決め用孔
ICと同じ位置に位置決め用孔2Bが設けられである。
(Example) Fig. 1 shows an example of the present invention. In Fig. 1, 1
is a hard printed circuit board (PWB) with a terminal pattern IA formed on its surface, and the edge of the terminal pattern IA is connected to the PWB.
It extends to the end face recess IB formed on the end face of PW.
A positioning hole IC is provided near the side end of B1. 2 is a flexible printed circuit board (FPC) 2, in which the terminal pattern 2A is arranged to match the end face recess IB of the PWBI, and a positioning hole is provided near the side edge of the end at the same position as the positioning hole IC. 2B is provided.

4は基板固定部材でFPC取付端面にFPC2と同じ幅
で且つFPCの厚さと同じ深さの凹部4Aを形成し、同
凹部の側端に位置決めビン5を上記位置決め用孔2Bと
同じ位置に垂直に固定しである。
Reference numeral 4 denotes a board fixing member, and a recess 4A having the same width as the FPC 2 and the same depth as the thickness of the FPC is formed on the FPC mounting end surface, and a positioning pin 5 is placed perpendicularly at the same position as the positioning hole 2B at the side end of the recess. It is fixed to .

PW)11とFPC2の接続方法について説明する。F
PC2の位置決め用孔2BEピン5に嵌合させ、FPC
2を基板固定部材4の凹部4Aに係合し、PWBIの位
置決め用孔ICをビンに嵌合させ、PWB 1をFPC
2の上に重ねる。ビン5によってPWB 1とFPC2
が所定の位置に強制的に配置されるので、FPC2の端
子パターン2AをPWB 1の端子パターンIAに正確
に一致させることができる0次に端面凹部IBにハンダ
3を流し込んで、FPC2の端子パターン2AとPWB
Iの端子パターンIAを接続固定する。
A method of connecting PW) 11 and FPC 2 will be explained. F
Fit the positioning hole 2BE pin 5 of PC2, and
2 into the recess 4A of the board fixing member 4, fit the positioning hole IC of the PWBI into the bottle, and connect the PWB 1 to the FPC.
Lay it on top of 2. PWB 1 and FPC2 by Bin 5
is forcibly placed in a predetermined position, so that the terminal pattern 2A of FPC2 can be accurately matched with the terminal pattern IA of PWB 1. Next, pour the solder 3 into the end face recess IB and adjust the terminal pattern of FPC2. 2A and PWB
Connect and fix the terminal pattern IA of I.

第3図に本実施例の端面に形成するパターンの製作方法
を示す、基板PWB1の端子パターンIAの先端部にス
ルーホールを設け、スルーホール面にパターンを形成後
にスルーホールの中心線を通過する切断面Kにおいて基
板PWB1を切断することによって、第1図に示すPW
B 1が製作される。
Fig. 3 shows a method of manufacturing the pattern to be formed on the end face of this embodiment. A through hole is provided at the tip of the terminal pattern IA of the substrate PWB1, and after forming the pattern on the through hole surface, the pattern is formed on the through hole surface and then the pattern passes through the center line of the through hole. By cutting the substrate PWB1 at the cutting plane K, the PW shown in FIG.
B1 is produced.

」二記実施例は両面ハードプリント基板とフレキシブル
プリント基板とを接続させる場合を述べているが、この
ような実施例においては、FPCとPWBの直角対向接
続において、RPCをPWBと基板固定部材で挟持する
ので、FPCの端部の曲げ応力を挟持部が受は持ち、接
続部に剥離応力がかかることがなくなり、接続強度が増
加するという効果も得られる。しかし、本発明は、この
ようなものに限らず、両面ハードブリ゛/ト基板のかわ
りに両面フレキシブルプリント基板でも良い。
The second embodiment describes the case where a double-sided hard printed circuit board and a flexible printed circuit board are connected. Since they are clamped, the clamping parts bear the bending stress at the ends of the FPC, and peeling stress is no longer applied to the connection parts, resulting in an effect of increasing the connection strength. However, the present invention is not limited to this, and a double-sided flexible printed circuit board may be used instead of the double-sided hard printed circuit board.

更に、両面プリント基板の代わりに、第4図に示すよう
に、片面フレキシブルプリント基板6の端部を180°
反曲させ1反曲させた部分を、接続する他方のプリント
基板2の上面に当接させ、端子パターン間をハンダで接
続固定しても、上記の如き両面プリント基板の実施例と
同じように、接続する2つのプリント基板の接続部の剥
離防止効果が期待できる。
Furthermore, instead of using a double-sided printed circuit board, as shown in FIG.
Even if the bent part is brought into contact with the top surface of the other printed circuit board 2 to be connected and the terminal patterns are connected and fixed with solder, the same result as in the double-sided printed circuit board example described above can be achieved. , the effect of preventing peeling of the connecting portion of two printed circuit boards to be connected can be expected.

(発明の効果) 本発明によれば、プリント基板の端面に端子パターン毎
に裏面にまで端子パターンを延出し、FPCの端子パタ
ーンを上記裏面端子パターンに当接させ、FPC端子パ
ターンとプリント基板の端面端子パターンとをハンダに
より接続固定させることにより、両方の端子パターンの
間にハンダのつかない基板露出部介在しないで、両端子
パターンがハンダ付されるので、接続強度が強められる
。また、プリント基板の端面に凹部を形成し、その四部
及び裏面に端子パターンを延長形成させ、裏面端子パタ
ーンにFPC端子パターンを当接させ、凹部端子パター
ンにFPC端子パターンをハンダ接続させたことで、端
子パターンの接続面積が増加し、接続強度が一段と強く
なった。
(Effects of the Invention) According to the present invention, each terminal pattern is extended to the back surface on the end surface of the printed circuit board, the terminal pattern of the FPC is brought into contact with the back surface terminal pattern, and the FPC terminal pattern and the printed circuit board are connected. By connecting and fixing the end face terminal pattern with solder, both terminal patterns can be soldered without intervening an exposed part of the board to which no solder is attached between the two terminal patterns, thereby increasing the connection strength. In addition, by forming a recess on the end surface of the printed circuit board, extending the terminal pattern on the four parts and the back surface, bringing the FPC terminal pattern into contact with the back surface terminal pattern, and soldering the FPC terminal pattern to the recessed terminal pattern, , the connection area of the terminal pattern has increased, and the connection strength has become even stronger.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例の斜視図、第2図は上記実施
例の側断面図、第3図は上記実施例の基板製作方法説明
図、第4図Aは本発明の別実施例の斜視図、第4図Bは
上記実施例の側断面図、第5図Aは従来例の斜視図、第
5図Bは従来例の側断面図、第6図は従来例の取付時の
斜視図である1・・・PWB、IA・・・端子パターン
、IB・・・端面凹部、IC・・・位置決め用孔、2・
・・FPC52A・・・端子パターン、2B・・・位置
決め用孔、3・・・ハンダ、4・・・基板固定部材、5
・・・ビン。
Fig. 1 is a perspective view of one embodiment of the present invention, Fig. 2 is a side sectional view of the above embodiment, Fig. 3 is an explanatory diagram of the substrate manufacturing method of the above embodiment, and Fig. 4A is another embodiment of the present invention. FIG. 4B is a side sectional view of the above embodiment, FIG. 5A is a perspective view of the conventional example, FIG. 5B is a side sectional view of the conventional example, and FIG. 6 is the installation of the conventional example. 1... PWB, IA... terminal pattern, IB... end face recess, IC... positioning hole, 2...
...FPC52A...terminal pattern, 2B...positioning hole, 3...solder, 4...board fixing member, 5
···bottle.

Claims (3)

【特許請求の範囲】[Claims] (1)フレキシブルプリント基板と他のプリント基板と
を接続する場合において、上記他のプリント基板の端面
に形成した接続端子パターンを上記基板の端部を回って
裏面まで延出形成し、フレキシブルプリント基板上の端
子パターンを上記他のプリント基板の裏面の端子パター
ンと一致させて同他のプリント基板の裏面と同他のプリ
ント基板固定部材との間に挿入し、両回路基板の各対応
端子パターン同士を上記他のプリント基板の端面でハン
ダ接続したことを特徴とするプリント基板接続構造。
(1) When connecting a flexible printed circuit board to another printed circuit board, the connecting terminal pattern formed on the end surface of the other printed circuit board is formed to extend around the edge of the above board to the back surface, and the flexible printed circuit board is Align the upper terminal pattern with the terminal pattern on the back side of the other printed circuit board, insert it between the back side of the other printed board and the same other printed board fixing member, and align the corresponding terminal patterns on both circuit boards. A printed circuit board connection structure characterized in that the above-mentioned other printed circuit board is soldered to the end face thereof.
(2)フレキシブルプリント基板と他のプリント基板と
を接続する場合において、上記他のプリント基板の端縁
に形成した接続端子パターンの同基板端面への延長部を
、各端子パターン毎に上記基板の端面に形成した凹部内
に形成すると共に、上記接続端子パターンを上記基板の
端部を回って裏面まで延出形成し、フレキシブルプリン
ト基板上の端子パターンを上記他のプリント基板の裏面
の端子パターンと一致させて同他のプリント基板の裏面
と同他のプリント基板固定部材との間に挿入し、両回路
基板の各対応端子パターン同士を上記他のプリント基板
の凹部端面部でハンダ接続したことを特徴とするプリン
ト基板接続構造。
(2) When connecting a flexible printed circuit board to another printed circuit board, extend the connecting terminal pattern formed on the edge of the other printed circuit board to the end surface of the same board for each terminal pattern. The connecting terminal pattern is formed in the recess formed on the end surface, and the connecting terminal pattern is formed to extend around the end of the board to the back surface, so that the terminal pattern on the flexible printed circuit board is the same as the terminal pattern on the back surface of the other printed board. Insert it between the back side of the other printed circuit board and the other printed circuit board fixing member, and solder the corresponding terminal patterns of both circuit boards to each other at the end of the recess of the other printed circuit board. Features a printed circuit board connection structure.
(3)片面フレキシブルプリント基板を他のプリント基
板に接続する場合において、片面フレキシブルプリント
基板に形成した接続端子パターン部を、パターン面を外
にして180度反曲させ、上記他のプリント基板上の端
子パターンを上記フレキシブルプリント基板の反曲させ
た端子パターンと一致させて同フレキシブルプリント基
板の反曲した部分とプリント基板固定部材との間に挿入
し、両回路基板の各対応端子パターン同士をハンダ接続
したことを特徴とするプリント基板接続構造。
(3) When connecting a single-sided flexible printed circuit board to another printed circuit board, bend the connection terminal pattern formed on the single-sided flexible printed circuit board 180 degrees with the pattern side facing out, and then Align the terminal pattern with the bent terminal pattern of the flexible printed circuit board, insert it between the bent part of the flexible printed circuit board and the printed circuit board fixing member, and solder the corresponding terminal patterns of both circuit boards. A printed circuit board connection structure characterized by a connection.
JP2213889A 1989-01-30 1989-01-30 Connection structure of printed board Pending JPH02201993A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2213889A JPH02201993A (en) 1989-01-30 1989-01-30 Connection structure of printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2213889A JPH02201993A (en) 1989-01-30 1989-01-30 Connection structure of printed board

Publications (1)

Publication Number Publication Date
JPH02201993A true JPH02201993A (en) 1990-08-10

Family

ID=12074525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2213889A Pending JPH02201993A (en) 1989-01-30 1989-01-30 Connection structure of printed board

Country Status (1)

Country Link
JP (1) JPH02201993A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198965A (en) * 1991-12-18 1993-03-30 International Business Machines Corporation Free form packaging of specific functions within a computer system
US5982626A (en) * 1996-06-07 1999-11-09 Asahi Kogaku Kogyo Kabushiki Kaisha Two dimensional coupling for flexible printed circuit boards
JP2012093646A (en) * 2010-10-28 2012-05-17 Seiko Epson Corp Electronic device and manufacturing method thereof
JP2017017263A (en) * 2015-07-06 2017-01-19 日産自動車株式会社 Module-board connection structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198965A (en) * 1991-12-18 1993-03-30 International Business Machines Corporation Free form packaging of specific functions within a computer system
US5982626A (en) * 1996-06-07 1999-11-09 Asahi Kogaku Kogyo Kabushiki Kaisha Two dimensional coupling for flexible printed circuit boards
JP2012093646A (en) * 2010-10-28 2012-05-17 Seiko Epson Corp Electronic device and manufacturing method thereof
JP2017017263A (en) * 2015-07-06 2017-01-19 日産自動車株式会社 Module-board connection structure

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