JPH04320090A - Electronic component connecting equipment - Google Patents

Abstract

PURPOSE:To provide a method for stably performing soldering on a substrate by using an automatic equipment without damaging the characteristics of many kinds of electronic components including less heat-resistant electronic components and unwashable electronic components. CONSTITUTION:Characterized is that processing rays of light are guided from a processing light irradiation means through an optical fiber to a suction nozzle 21 consisting of a light- permeable material and a processing light scanning means 27 that is provided on a axis of the suction nozzle 21, and by their scanning and irradiation through the suction nozzle 21 consisting of the light-permeable material are connected electronic components on a substrate 41. Further, a dichroic mirror 3 is provided in the middle of the light axis of the processing ray of light, a recognition optical system capable of recognizing the peripheral section of the suction nozzle 21 coaxially with the processing ray of light and a shape-detection means 37 capable of detecting the shape in a radiation position of the processing rays of light irradiation are provided, the rays of light required for recognition and the rays of light required for shape-detection can be constantly scanned in relation to the coaxial incidence with the processing rays of light by means of the mirror driving source, and the periphery of the irradiation position of the processing says of light are always recognizable and shape- detectable. And the shape of the processing rays of light to be radiated is controlled on the basis of the information to make it possible to connect the electronic components on the substitute.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connecting device for connecting electronic components to a circuit board.

0002

[Prior Art] Conventionally, when mounting electronic components on a circuit board, an adhesive is applied to the electronic component mounting position on the circuit board, and reflow solder is applied to the electrodes. The electronic components to be mounted are picked up by a suction nozzle, and the picked up electronic components are transported to the electronic component mounting position on the circuit board and mounted, temporarily fixed with adhesive, and all the electronic components are attached to the circuit board. Once the installation is complete, insert this circuit board into a reflow oven,
The reflow solder was reflowed, the solder was used to secure the parts, and the electrical connections were made.

[0003] Furthermore, when soldering to a board electronic components that cannot be reflow soldered all at once as described above due to their weak heat resistance, and electronic components that cannot be ultrasonically cleaned such as crystal oscillators, , soldering was performed by the reflow process shown in FIGS. 23 to 26. FIG. 23 shows a method for manually soldering weak heat-resistant electronic components. FIG. 24 shows a method of low-temperature reflow soldering of weakly heat-resistant electronic components. If soldering is performed at the same time by batch reflow, the solder that electrically connects the electronic components on the composite module component 96 will melt and the electrical characteristics of the module will be destroyed. ,
This composite module component is soldered using low-temperature reflow. Moreover, FIG. 25 is a flowchart for manually soldering an electronic component, such as a crystal oscillator, that cannot be cleaned by ultrasonic waves to a board. In Figure 26, Figure 2
3 and 25 show the flow of manual soldering work.

0004

[Problems to be Solved by the Invention] However, as described above, adhesive is applied to the electronic component mounting position of the circuit board, and reflow solder is applied to the electrodes. The components are picked up by a suction nozzle, and the picked up electronic components are transported to the electronic component mounting position on the circuit board and mounted, temporarily fixed with adhesive, and the mounting of all electronic components to the circuit board is completed. Then, insert this circuit board into a reflow oven,
In the method of reflowing the reflow solder, permanently fixing it with solder, and making electrical connections, the binding force of the adhesive on the electronic components is small, so it is necessary to transport the circuit board with the electronic components temporarily fixed. difficult to handle,
There was a problem with poor workability. In addition, it is possible to strengthen the binding force of the adhesive, but when applying the adhesive to the circuit board, a stringy state will occur, making it difficult to apply the adhesive stably, which will significantly reduce productivity. There was a problem.

Furthermore, it requires two steps: the step of mounting the electronic components on the circuit board and temporarily fixing them with adhesive, and the step of inserting the circuit board into a reflow oven and permanently fixing the electronic components to the circuit board. Therefore, there was a problem of low area productivity.

[0006] Furthermore, when soldering to a board electronic components that cannot be reflow soldered all at once as described above or electronic components that cannot be cleaned, such as crystal oscillators, due to their weak heat resistance, a large number of electronic components are used. In this case, as shown in Figure 26, soldering is currently performed manually, so the quality of soldering tends to be affected by the skill level of the operator, and it is difficult to reduce variations in soldering quality. The problem was that it was not suitable for mass production. Furthermore, when manually soldering electronic components that cannot be cleaned to a board, the solder 95 is supplied after preheating the board electrodes and electronic components with a soldering iron 98 as shown in FIG. The two are electrically connected by melting the solder and pouring it into the connection part, so when the solder melts, minute solder balls 99 scatter, and if these solder balls stay on the electronic circuit of the board, electronic Since there is a potential issue of damaging the function of the circuit itself, normally washable electronic components are cleaned all at once after soldering, but electronic components with a built-in crystal oscillator 97 are If ultrasonic waves are applied during cleaning, there is a possibility that the crystal oscillator will be destroyed, so cleaning is impossible and there is no solution. In addition, when low-temperature reflow soldering of a weakly heat-resistant electronic component such as the composite module component 96 consisting of multiple electronic components to the electrode part of the board using low-temperature solder, the melting point of the low-temperature solder is approximately 1
50℃, while the melting point of the eutectic solder used to connect the electronic components that make up this composite module component is close to 183℃, so strict temperature control is required for low-temperature reflow soldering. Otherwise, there is a problem in that the eutectic solder connecting the electronic components constituting the composite module components will melt, destroying the electrical characteristics of the module.

Therefore, in view of the above-mentioned conventional problems, the present invention has been developed to stabilize various types of electronic components, including weakly heat-resistant electronic components and electronic components that cannot be cleaned, using an automatic machine without impairing their characteristics. It is an object of the present invention to provide a method and means for soldering onto a board.

Another object of the present invention is to provide a method and apparatus for joining electronic components that can improve productivity by mounting and permanently fixing electronic components in one step.

[0009]

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a suction nozzle made of a translucent material and a processing beam scanning means provided on the axis of the suction nozzle. Guided by optical fiber from the processing light irradiation means,
The present invention is characterized in that electronic components are connected to the substrate by scanning and irradiating light through the suction nozzle made of the light-transmitting material.

Furthermore, a dichroic mirror is provided in the middle of the optical axis of the processing light beam, and a recognition optical system that can recognize the peripheral area of the suction nozzle and a shape detection means that can detect the shape at the processing light irradiation position are arranged coaxially with the processing light beam. However, the light beam necessary for recognition and the light beam necessary for shape detection can be scanned together by the mirror driving source in a coaxial incident relationship with the processing light beam, so that the vicinity of the processing light irradiation position can always be recognized and the shape detected. Based on this information, it is possible to control the shape of the processing light beam and connect electronic components to the substrate.

[0011]

[Operation] According to the present invention, by scanning and irradiating the processing light beam through the suction nozzle to the bonding position of the electronic component, processing such as soldering can be performed during the mounting process of the electronic component. In addition, when mounting electronic components, the processing light beam is sequentially scanned and irradiated onto each electrode section while the electrode section of the electronic component is in contact with the substrate electrode section. It is also possible to bond the two by reflowing, thereby eliminating the reflow process in a reflow oven. Additionally, when soldering electronic components using a processing beam, thermal damage may be caused to the board or electronic components. A recognition optical system that can recognize the peripheral area of the suction nozzle and a shape detection means that can detect the shape at the processing light irradiation position are installed coaxially with the processing light beam, and the light beam necessary for recognition and the light beam necessary for shape detection are connected to the mirror. It is possible to scan both the machining beam and the coaxial epi-illumination by the drive source, and the area around the machining beam irradiation position can always be recognized and the shape can be detected, so the state of the irradiated machining beam can be suitably controlled based on this information. However, it is also possible to connect electronic components onto the substrate without causing thermal damage to the substrate or electronic components.

Furthermore, it is possible to stably solder electronic components that are weakly heat resistant or cannot be cleaned onto a substrate without impairing their characteristics.

[0013]

Embodiment A first embodiment of the present invention will be described below with reference to FIGS. 1 to 18. FIG. 1 is a perspective view of a head portion of an electronic component connecting device according to the present invention, and FIG. 2 is a perspective view of the entire electronic component connecting device. The configuration of the device will be explained below. An XY robot 42 is installed on the main body frame 46, and a head portion 49 that transfers electronic components, supplies them onto a board, and connects them is locked onto the XY robot. The component transfer device 51 transfers the electronic components stored in the component storage section 50 into the movable range of the XY robot 42 . The board 41 is transported by the board transport section 48 to the board preheating section 45 and the component connection position 44 . The entire electronic component connecting device is operated using an operation panel 47 provided on the front of the device. This embodiment is an example using a YAG laser as a heating heat source for connecting electronic components. be. 52 is a flux application section.

Next, as shown in FIG.
2 will be explained in detail. The component transfer device 51 has a component regulating claw 60 that regulates the position of the electronic component 40 with high precision, and the component regulating section 59 moves the transfer motor 5 on the rail 57.
8 and transfer the electronic component 40. The substrate transport section 48 is composed of a pair of transport rails 74 having a pulley 63 and a transport belt 73, and moves the substrate 41 by the operation of the transport belt 73. The substrate preheating section 45 includes a substrate preheating box 75, an air dryer 61a, and a duct hose 64a that supplies hot air generated from the air dryer 61a to the substrate preheating box 75. For control, a slider 62a is arranged in series to adjust the power supply voltage to a suitable state.

On the other hand, a board regulating cylinder 65 is provided at the component connection position 44 to regulate the position of the board 41 with high precision. At the component connection position 44, hot air from air dryers 61b, 61c, and 61d is guided by duct hoses 64b, 64c, and 64d in order to prevent the temperature of the board from decreasing. Also, air dryers 61b, 61c, 6
In order to control the amount of heat of the hot air generated by the slider 1d, the slider 6 is used in the same manner as the slider 62a of the substrate preheating section 45.
2b, 62c, and 62d are arranged.

The flux application section 52 is equipped with a hydrometer 66 and a dirt detection sensor 67, and after pouring flux 71 into the recess of the flux block 70, it is pumped up by the upper and lower flux application cylinders 69, and the flux 71 is pumped up by the upper and lower flux application cylinders 69, and the flux 71 is pumped up by the upper and lower flux application cylinders 69, and the flux 71 is pumped up by the upper and lower flux application cylinders 69. Flux is applied to the electrode portion of the component 40 from below.

Next, the structure of the head section 49 will be explained with reference to FIG. The head section 49 is the XY robot 42 shown in FIG.
It is installed on the shaft mount 10 via the LM guide 9 and the head frame 13, and slides on the LM guide 9 in the X-axis direction, and is driven by a ball screw connected to an X-axis motor (not shown). 8. The head section 49 can be roughly divided into a scanning optical section 27 that scans a laser beam, and a gripping section 32 that grips and transfers electronic components, both of which are connected to the head frame 13. The electronic component 40 transferred from the component transfer device 51 is sucked and gripped by the tip nozzle 23 of the gripping section 32.
2, it is locked to the nozzle 21 in a state where it can be cushioned in the vertical direction. This nozzle 21 is connected to a transparent plate 38
This transparent plate 38 is inserted and fixed into a hole provided in the center, and this transparent plate 38 is connected to another transparent plate 36 arranged oppositely.
It is also fixed to the transparent plate holder 20. A large number of ventilation holes 19 are provided on the outer periphery of the transparent plate holder 20, and these ventilation holes 19 are further divided into the ventilation holes 17 of the inner holder 18 and the outer holder 15.
Since it is connected to the port 16 of the outer holder 15 with sufficient airtightness, when vacuum suction is performed from the port 16 of the outer holder 15, negative pressure is also generated on the component suction surface of the tip nozzle 23, and the component It can be gripped by suction. Also,
On the contrary, it goes without saying that if compressed air is supplied from the port 16 of the outer holder 15, the adsorption state of the components at the tip nozzle 23 can be released. In addition, the inner holder 18 is rotatably locked to the outer holder 15 together with the cross roller bearing 34, and the drive in the rotational direction is driven by the outer holder 1.
5 The cam follower 12, pulley 33, and timing belt 6 that are in slidable contact with the groove in the upper part.
The signal is transmitted from a motor (not shown) via the motor. On the other hand, in the vertical direction, the outer holder 15 itself is also movable by driving the nozzle vertical motor 28 via the ball screw 30 and the coupling 29.

Next, the scanning optical section 27 will be explained. The laser beam transmitted by the optical fiber 1 from the laser optical system 53 is guided to the collimator lens system 2 of the scanning optical section 27, and after being collimated to a size of approximately 1 to 3 mm, which is optimal for soldering, the laser beam is mirror 3
mirror 25 that can be reflected in the X direction by the galvanometer 24, and Y by the galvanometer 11.
The light is guided to a mirror 26 that can be swung in different directions, and is sequentially reflected. Next, the laser beam is irradiated with telecentric focus on the surface of the substrate 41 by the action of the fθ lens 31. Further, since the dichroic mirror 3 has a property of reflecting laser light but transmitting visible light, the optical axis of the dichroic mirror 3 coincides with the laser light reflected by the dichroic mirror 3, and the laser irradiation point on the substrate 41 By arranging the CCD camera 4 so as to focus the image on the CCD element, the laser irradiation point on the substrate 41 can be recognized no matter how the galvanometers 24 and 11 scan the laser beam. Furthermore, a half mirror 5 is provided on the optical axis connecting the CCD camera 4 and the dichroic mirror 3, and the CC
A temperature sensor 7 is located on the opposite side of the D camera 4, and the optical axis of the light beam reflected by the half mirror 5 coincides with the substrate 4.
Since the galvanometers 24 and 11 are arranged in a positional relationship that allows the temperature of the laser irradiation point on the substrate 41 to be measured, the temperature at the laser irradiation point on the substrate 41 can be measured no matter how the galvanometers 24 and 11 scan the laser. .

Further, the peripheral part of the transparent plate 38 is scanned by the scanning optical part 27 to detect the reflected light of the laser light irradiated to the electrode part of the electronic component 40, and to detect the point where the reflected light hit. Shape detection means 3 capable of providing position information
7 is provided. Of the above explanations, FIG. 4 is a diagram showing a simplified outline of the laser beam irradiation path.

Next, the operation of the above component connecting device will be explained. 1 to 4, the electronic component 40 stored in the component storage section 50 is transferred to the component regulating section 59 on the component transfer device 51 by a transfer means (not shown). On this component regulating section 59, a component regulating claw 60 regulates the position of the electronic component 40, and at the same time, the component regulating section 59 itself moves on the rail 57 by the drive of the transfer motor 58. Parts storage section 5
The electronic components 40 housed in the XY robot 42 are sequentially transferred within the movable range of the XY robot 42 with their positions regulated. Next, the head part 49 engaged on the XY robot 42
are placed opposite to a predetermined position above the electronic component 40 that has been transferred after position adjustment, and the nozzle vertical motor 28
The drive of the outer holder 1 is transmitted to the ball screw 30.
5 is lowered, a vacuum pump (not shown) connected to the port 16 of the outer holder 15 is operated, and the electronic component is sucked into the tip nozzle 23. next,
The tip nozzle 23 that has absorbed the electronic component 40 is raised again along with the outer holder 15, and the XY robot 42 is moved so that the electronic component 40 is located at a predetermined position above and opposite to the flux block 70 of the flux application section 52. . In the flux application section 52, a flux block 70, which has been submerged in advance in a flux 71 whose specific gravity, degree of contamination, and liquid level are controlled by a hydrometer 66, a dirt detection sensor 67, and a liquid level sensor 68, is coated with flux. It is moved up and down by the upper and lower cylinders 69, and the flux 71 is pumped up into the recessed part and applied to the electrode part of the electronic component 40 located above the recessed part. After applying the flux, the flux block 70 is lowered again by the flux application upper and lower cylinders 69 to sink into the flux 71, thereby completing the series of flux application operations.

[0021] Here, the necessity of flux application will be described. Flux is applied to clean the electrodes of circuit boards and electronic components, to remove oxide films adhering to the electrodes, and to reduce the surface tension of the solder during soldering. This is to ensure that the molten solder spreads to every corner. If the supplied board is coated with cream solder in advance, the cream solder itself contains flux, so the flux coating step is not necessary.

Next, the electronic component 40 whose electrode part has been coated with flux has its position recognized by the component recognition camera 43, and then is moved by the board regulating cylinder 65 at the component connection position 44 on the board transport section 48. X to a predetermined position above the component connection position of the board 41 whose position has been regulated
It is moved by the Y robot 42.

At this time, the substrate 41 is placed in the upstream substrate preheating section 4.
The air dryers 61b and 61c have already been preheated to a temperature suitable for component connection by the air dryers 61b and 61c before being transported to the component connection position, and while waiting at this component connection position.
, 61d, the preheating effect is not impaired.

[0024] This component connecting device uses cream solder coating and
In the normal mounting process consisting of electronic component mounting and reflow,
It is installed after the normal mounting process because it is applied to the retrofitting of electronic components that may be thermally destroyed or have their electrical characteristics damaged. For this reason, many electronic components are already soldered on the board supplied to this component connection device, and if the board gets too hot in the board preheating section of this device, it will be removed from the board that has already been reflow soldered all at once. There is a risk that the solder joints of the electronic components that are present may melt, causing the electronic components to become missing. Therefore, the heat amount of the hot air generated by the air dryer 61a is adjusted to a suitable amount by the slide duck 62a, and is then supplied to the substrate preheating box 75. Further, for the air dryers 61b, 61c, and 61d that supply hot air to the component connection position 44, slide ducks 62b, 62c, and 62d are arranged for the same reason to maintain the preheating effect.

Furthermore, as shown in FIG. 5, for the electrode portion of the component whose position has been recognized by the component recognition camera 43,
By sequentially scanning and irradiating the laser beam with the scanning optical section 27 of the head section 49, the electrode section of the electronic component is preheated to the optimum temperature for soldering, and the board 41 waiting at the component connection position 44 is heated. It can be transferred above. It goes without saying that the temperature measurement of the electronic component electrode section at this time can be monitored by the temperature sensor 7 provided in the scanning optical system. Furthermore, as shown in FIG. 5, the electronic component 40 is positioned facing above the component connection position on the board 41, and ΔX and Y in the X-axis direction with respect to the normal mounting position.
By scanning and irradiating the laser beam from the scanning optical section 27 of the head section 49 with an offset of ΔY in the axial direction, ΔZ in the Z-axis direction, and Δθ in the θ direction, the electrodes of the electronic component 40 can be detected within the same field of view. It is possible to preheat while monitoring with the temperature sensor 7 until both the electrode portion and the electrode portion of the substrate 41 reach a temperature state suitable for soldering. The amount of heat given during preheating can be controlled by controlling the scanning speed of the galvanometers 24 and 11 and the ON/OFF timing of the laser light output while keeping the laser light output constant;
, 11 are kept constant while controlling the output and ON/OFF timing of the laser beam.

Subsequently, after the electronic component electrode section and the substrate electrode section reach a predetermined preheating temperature, ΔX, ΔY, ΔZ,
The various offset values of Δθ are reset to zero, the electronic component 40 is mounted on the regular position on the board 41, and then the laser beam is scanned and irradiated to perform soldering on all the electrode parts. be exposed.

At this time, as shown in FIG. 6, the CCD camera 4 installed in the scanning optical section 27
Since the substrate electrode portion 81 and the electronic component electrode portion 80 can be captured within the same recognition field of view through the electronic device 38 and 38, the electronic component 40 can be positioned with respect to the substrate 41 with high precision.

Next, the data processing method of the scanning optical system and recognition optical system in this component connecting device will be described. FIG. 7 shows a state in which the head portion 49 is waiting above the component connection position 44, and at this time, the board regulating cylinder 6
The board mark 79 provided on the board 41 whose position has been regulated by 5 is recognized by the CCD camera 4 installed in the scanning optical section 27 of the head section 49, and this recognition screen is shown in FIG. The intersection of the cross lines 82 drawn in the screen is the irradiation position of the laser beam, and is the center of the screen of the scanning optical system. Furthermore, the XY
The head part 49 is moved by the robot 42, and the board mark 79 is recognized again by the board recognition camera 78, and the image shown in FIG.
You can get the recognition screen. As described above, the positions of the galvanometers 24 and 11 can be constantly corrected using the obtained recognition screen information of FIGS. 8 and 9 and the NC data between the XY robot position information. Next, the head section 49 is moved above the component recognition camera 43 mentioned above, the electronic component 40 held by the tip nozzle 23 is recognized, and the image shown on the left in FIG. 10 can be obtained. In this state, the inner holder 18 is rotated by a predetermined amount in the θ direction by a motor (not shown), and the image shown on the right in FIG. 10 can be obtained by recognizing the electronic component 40 even in this state. From these two image information, the rotational center positions of the inner holder 18 and the tip nozzle 23 can be calculated. By adding the correction amounts of the galvanometers 24 and 11 calculated earlier to this rotation center position, the N
Positional correction between the C data and the scanning optical system can be performed with high precision.

Next, the installation position information for each electronic component,
Of the part data that is the connection condition by laser beam, especially the method of teaching the laser beam irradiation condition is shown in Figures 11 to 11.
This will be explained based on FIG. 14.

This teaching work is performed using the aforementioned operation panel 47. First, the state for writing data is set, and then the settings for preheating using laser light and connection using laser light are also set. When actually connecting electronic components, as mentioned above, the electronic components are gripped by the tip nozzle, flux is applied to the electrodes, the board and electronic components are positioned with high precision, and then laser light is applied to the electronic components. Preheating and connection are performed, but in the case of teaching, teaching can be performed with or without gripping the electronic component, and it is also possible to choose whether or not to use laser preheating. It has become. According to the flow shown in FIG. 11, as long as you input the laser beam irradiation start position and irradiation end position, the speed of laser scanning between these two points, the laser beam output, the number of repetitions, etc., you can change from FIG. 13 to FIG. 15. The laser light irradiation conditions as shown can be freely set.

[0031] In the previously filed patent specification (Japanese Patent Application No. 3-37198), the present applicant claims that after re-melting the preliminary solder of all board electrode parts with a laser beam, the electrode parts of electronic parts are attached. However, an electronic component connecting method using soldering (a flow diagram is shown in FIG. 16) has been devised, but it can be similarly applied to the electronic component connecting apparatus according to the present invention. Further, in the previous invention, the solder melting of the board electrode part was managed by the time for supplying energy such as a laser beam, but in the electronic component connecting device according to the present invention, the temperature sensor 7 described above controls the melting of the solder by the laser beam Since the laser light irradiation conditions can be controlled while constantly monitoring the temperature at the light irradiation position, soldering can be performed with the minimum necessary energy supply, avoiding excessive thermal shock to both the board and electronic components. This allows the connection time itself to be significantly shortened without adding anything.

Furthermore, out of the laser light irradiated for soldering, the light reflected at the irradiation position is detected by the shape detecting means 37 installed in the inner holder 18.
The angle at which the laser beam is reflected at the irradiated position is calculated from the information about the position of the reflected light detected by the detection surface of the laser beam and the position information of the mirrors 25 and 26 that are swung by the galvanometers 24 and 11. can be calculated. Furthermore, by sequentially scanning the laser beam and detecting the reflection information of the laser beam at the peripheral portion, the shape at the laser beam irradiation position can be calculated and determined. Based on the information from the shape detection means 37, the laser beam irradiation conditions are determined while detecting the remelting status of the preliminary solder part and the formation status of the fillet formed on the electrode part of the electronic component. It is possible to control.

Further, in the previous invention, as shown in FIG. 17, a laser beam is irradiated in a linear manner through an output optical section 83 and a cylindrical lens 84, and a plurality of connection parts are simultaneously heated and soldered. However, according to the component connecting device of the present invention, as shown in FIG. It is possible to perform soldering by creating the same condition as when irradiated with light.

[0034] Furthermore, even if the preliminary solder portion is formed in advance by batch reflow, the flux component contained in the cream solder before reflow is evaporated during the reflow process, and the solder is solidified. Therefore, in the component connecting device of the present invention, even if electronic components are mounted and soldered after scanning and irradiating with a laser beam to remelt the components, solder balls will not be generated.

In the above embodiment, an air dryer was used as a heat source for preheating the substrate 41 in the substrate preheating section 45, but as shown in FIG. A heat block 87 having a built-in heater 86 shown in FIG. 20 is used as a heat source, and a heater driving means 88 positions the heat block 87 at a suitable position with respect to the substrate 41.
The same effect can be obtained even with a method of preheating 1.

The first embodiment has been described above, and the structure and operation of a means for applying flux at a higher speed other than that shown in the first embodiment will be described below as a second embodiment as shown in FIG.
The explanation will be based on 1. The bubble generating block 91 is submerged in a flux tank 92 filled with flux 71,
When air is sent into this via the hose 90, the flux 71 in the flux tank 92 foams, and flux bubbles 89 are generated on the liquid surface. The electronic component 40, which has been previously positioned at a predetermined position and supplied, is inserted into the tip nozzle 23.
The flux 71 can be applied to the electrode portion of the electronic component 40 by gripping it and moving it through the flux bubbles 89. According to this method, the flux application portion 52
There is no need for the head portion 49 to be opposed to the head portion 49 at a predetermined position above and stopped, and flux can be applied at a higher speed.

However, since the flux is applied not only to the electrode part of the electronic component 40 but also to the peripheral part of the electrode part, cleaning is required after the electronic component is retrofitted. However, as a means for applying flux when retrofitting washable weakly heat-resistant parts, it is possible to take advantage of the advantage of high-speed application and shorten the time required to connect parts.

The flux application means described above all apply the flux 71 to the electrode portions of the electronic component 40, but as a third embodiment, a method of applying flux 71 to the electrode portions of the substrate 41 is described. Let's talk about.

In FIG. 22, flux 71 filled in a container is supplied to a brush 93 via a hose 94. Since the tip of the brush 93 is formed by a large number of capillaries, an appropriate amount of flux is continuously supplied due to capillary action. The brush 93 is a driving means (not shown)
Since the substrate 41 is held in a state where it can be moved arbitrarily in three-dimensional directions, flux can be applied to any part on the substrate 41. According to this method, it is possible to stably apply the required amount of flux to the pre-soldered portion of the board in a smaller amount than when using a dispenser.

[0040]

[Effects of the Invention] According to the present invention, weak heat-resistant electronic components,
Various types of electronic components, including electronic components that cannot be cleaned, can be stably soldered onto a board by an automatic machine without damaging their characteristics.

[0041] Furthermore, since the mounting and final fixing of electronic components can be performed in one process, productivity can be improved, which can also contribute to an improvement in the area productivity of the factory.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of the head portion of the component connecting device of the present invention.

[Figure 2] Perspective view of the entire component connecting device

FIG. 3 is a perspective view showing the detailed configuration of the main parts of the electronic component connecting device shown in FIG. 2;

[Figure 4] Perspective view showing an overview of the optical system

[Fig. 5] A perspective view illustrating the operation of the electronic component connecting device.

[Figure 6] A diagram showing the positional relationship between the board and electronic components when the electronic components are positioned opposite to the board.

[Figure 7] A diagram showing the head of the electronic component connecting device facing the positioned board.

[Figure 8] Illustration of an image captured by the scanning optical system

[Figure 9
] Diagram of image captured by board recognition optical system

[Figure 10
】Illustration of the image captured by the parts recognition camera

[Figure 11
]Flow diagram explaining how to teach connection conditions

[Figure 12] Diagram explaining how to give laser light output

[Figure 13] Diagram showing an example of laser irradiation

[Figure 14] Diagram showing an example of laser irradiation

[Figure 15] Diagram showing an example of laser irradiation

[Figure 16]
Flow diagram showing the method of connecting electronic components in the prior application

[Figure 17] Diagram showing a method of connecting electronic components using a cylindrical lens

FIG. 18 is a diagram showing a method of reciprocating a light beam at high speed and irradiating it as a pseudo linear light using the electronic component connecting device of the present application.

[Figure 19] Diagram showing light irradiation means as a heat source for substrate preheating

[Figure 20] Diagram showing a heat block as a heat source for substrate preheating

[Fig. 21] A diagram showing an example of flux application as a second embodiment of the present application.

[Fig. 22] A diagram showing an example of flux application as a third embodiment of the present application.

[Figure 23] Diagram showing the flow of manually connecting weak heat-resistant parts to the board

[Figure 24] Diagram showing the flow of connecting weak heat-resistant components to a board by low-temperature soldering

[Figure 25] Diagram showing the flow of manually connecting electronic components that cannot be cleaned to a board

[Figure 26] Diagram showing how to manually connect electronic components to a board

[Explanation of symbols]

1 Optical fiber 2 Collimator lens system 3 Dichroic mirror 4 CCD camera 5 Half mirror 6 Dimming belt 7 Temperature sensor 8 Ball screw 9 LM guide 10 X-axis mount 11 Galvanometer 12 Cam follower 13 Head frame 14 LM guide 15 Outer holder 16 Port 17 Ventilation hole 18 Inner holder 19 Ventilation hole 20 Transparent plate holder 21 Nozzle 22 Nozzle holder 23 Tip nozzle 24 Galvanometer 25 Mirror 26 Mirror 27 Scanning optical section 28 Nozzle up and down motor 29 Coupling 30 Ball screw 31 fθ lens 32 Grip section 33 Pulley 34 Cross Roller bearing 35 Annular groove 36 Transparent plate 37 Shape detection means 38 Transparent plate 39 Compression spring 40 Electronic components 41 Board 42 XY robot 43 Component recognition camera 44 Component connection position 45 Board preheating section 46 Main frame 47 Operation panel 48 Board transport section 49 Head section 50 Component storage section 51 Component transfer device 52 Flux application section 53 Laser optical system 54 Laser power source 55 Pulley 56 Pulley 57 Rail 58 Transfer motor 59 Component regulation section 60 Component regulation claw 61 Air dryer 62 Slide duck 63 Pulley 64 Duct hose 65 Board regulating cylinder 66 Hydrometer 67 Dirt detection sensor 68 Liquid level sensor 69 Flux application section upper and lower cylinders 70 Flux block 71 Flux 72 Cover 73 Transport belt 74 Transport rail 75 Board preheating box 76 Bracket 77 Shape detection means 78 Board recognition camera 79 Board Mark 80 Electronic component electrode section 81 Board electrode section 82 Cross line 83 Output optical section 84 Cylindrical lens 85 Light irradiation means 86 Heater 87 Heat block 88 Heater driving means 89 Flux foam 90 Hose 91 Air bubble generation block 92 Flux tank 93 Brush 94 Hose 95 Solder 96 Composite module parts 97 Crystal oscillator 98 Soldering iron 99 Solder ball

Claims (14)

[Claims] 1. A suction nozzle capable of suctioning a component made of a translucent material, and processing light irradiation means for irradiating a processing light beam through the suction nozzle, and mounting the component of the suction nozzle on a substrate via a bonding member. What is claimed is: 1. An electronic component connecting device, characterized in that the electronic component connecting device is provided with processing light irradiation means for scanning and irradiating a processing light beam through the suction nozzle made of the light-transmitting material. 2. The electronic component connecting device according to claim 1, further comprising processing beam scanning means provided on the axis of the suction nozzle. 3. The electronic component connecting device according to claim 1, wherein the processing light beam is guided from the processing light irradiation means by an optical fiber. 4. The electronic component connecting device according to claim 1, wherein the processing beam scanning means is a mechanism for shaking a mirror that reflects the processing beam. [Claim 5] A recognition unit is provided so that the vicinity of the processing light irradiation position can be recognized, and a dichroic mirror is provided in the middle of the optical axis of the processing light, which can reflect the processing light and transmit visible light. The electronic component connecting device according to claim 1, characterized in that: [Claim 6] A recognition optical system capable of scanning by coaxial epi-illumination with the processing light beam makes it possible to recognize the position of the electronic component while the suction nozzle is gripping the electronic component, and to position the electronic component relative to the mounting position on the board. The electronic component connecting device according to claim 1, wherein the electronic component connecting device is capable of being mounted while being positioned relatively within the same recognition field of view, and capable of scanning and irradiating the contact portion with the processing light beam. [Claim 7] The processing light beam is irradiated by positioning the electronic component in close contact with and facing the electrode portion of the substrate, which has been previously subjected to surface treatment such as preliminary soldering, and is provided so that the processing light beam can be sequentially scanned. The electronic component device according to claim 1, characterized in that: 8. The irradiation with the processing light is performed after the electronic component is positioned above the electrode portion of the substrate whose surface has been previously treated, and the processing light is scanned and irradiated onto the electronic component electrode portion or the substrate electrode portion to preheat it. 2. The electronic component connecting device according to claim 1, wherein the electronic component connecting device is configured to bring the electronic component into close contact with the substrate electrode portion and to connect the electronic component by successively irradiating the processing light beam. 9. The device is characterized in that the electronic component gripped by the suction nozzle is mounted and connected after the preliminary solder of all the board electrode parts is melted by processing light irradiation before mounting. The electronic component connecting device according to claim 7 or 8. 10. The electronic component connecting device according to claim 1, further comprising temperature detection means coaxial with the processing light beam and capable of detecting the temperature at the processing light irradiation position. 11. After the temperature detection means detects that the preliminary solder on the substrate electrode portion has melted due to the processing light irradiation before mounting, the electronic component gripped by the suction nozzle is mounted, and the processing light irradiation is started after mounting. The electronic component is characterized in that it is configured to determine based on temperature detection information that solder fillets have been formed in all joint parts, and to terminate processing light irradiation after installation and connect the electronic component to the board. The electronic component connecting device according to claim 10. 12. The electronic component connecting device according to claim 1, further comprising shape detection means coaxial with the processing light beam and capable of detecting the shape at the processing light irradiation position. 13. After the temperature detecting means detects that the preliminary solder on the substrate electrode portion has melted due to the processing light irradiation before mounting, the electronic component gripped by the suction nozzle is mounted, and the processing light irradiation is performed after mounting. The temperature information detected by the temperature detection means and the shape information detected by the shape detection means that detects the shape at the processing light irradiation position are also collected. 2. The electronic component connecting device according to claim 1, wherein the processing light irradiation is terminated after the electronic component is mounted on the board, and the electronic component is connected onto the board. 14. In the step of connecting the electronic component to the substrate electrode section, the method includes means for preheating the substrate alone and the electronic component, and means for applying flux to the electronic component or the substrate electrode section. The electronic component connecting device according to claim 1, characterized in that: