JPH10328823A - Cleaning device and automatic soldering equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To clean a whole peripheral face of an iron tip with a single nozzle by turning an air blow nozzle around a soldering iron axial center for cleaning a soldering iron tip part. SOLUTION: The device is provided with a single air blow nozzle 31 to blow air to a tip part of a soldering iron 1 for cleaning and a rotation mechanism 17 to turn the nozzle 31 to any peripheral position around a axial center P of the soldering iron 1. The rotation mechanism 17 rotates a stepping motor 24 in normal/reverse directions and then rotates a drive pulley 25/a driven pulley 27, by rotating the driven pulley, a rotary body 28 integrated therein is rotated, the nozzle 31/a solder feed nozzle 2 mounted to a hold member 16 are turned around the axial center P of the soldering iron 1 shown by a virtual line. Further, control of the stepping motor 24, that is, control of a turning position of the air blow nozzle 31/the solder core wire feed nozzle 2 is of sequence control.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic soldering apparatus for automatically performing soldering by a soldering robot and a cleaning apparatus for cleaning a soldering iron.

[0002]

2. Description of the Related Art FIG. 9 is a view showing the vicinity of a solder head of a conventional automatic soldering apparatus.

[0003] A soldering iron 100 includes a soldering head 101.
And the base of the solder head 101 is
It is attached to a robot arm of a soldering robot (not shown), and the movement of the robot arm guides the soldering iron 100 to a predetermined soldering location.

[0004] A solder core (thread solder) is
A supply nozzle 102 for automatically supplying to the tip of the soldering iron 100 is attached to a support rod 104 via a supply holder 103, and air is blown onto the iron tip of the soldering iron 100 to remove the adhered matter. A blow nozzle 107 is attached to the support rod 10.
4 is held by a holding portion 105 of the solder head 101 that protrudes.

In such an automatic soldering apparatus, the soldering iron 100 held by the solder head 101 is guided to a predetermined soldering location, and a solder core wire is automatically supplied from a supply nozzle 102 to the tip of the soldering iron 100 at a predetermined supply angle. Then, if necessary, for example, prior to soldering, air is blown from the air blow nozzle 107 to the soldering iron 100 to clean the ironing tip.

[0006]

However, in such a conventional example, the air blow nozzle 107 is mounted on the support rod 10.
Solder head 1 holding soldering iron 100 via 4
01 is provided at a fixed position integral with the soldering iron 100, and air is blown only to the ironing tip of the soldering iron 100 from a certain direction. However, there is a problem in that the surface that is not sufficiently exposed to the air is insufficiently cleaned, and the adhered substance remains, thereby deteriorating the soldering quality.

Therefore, a plurality of air blow nozzles are
It is conceivable that air is blown from multiple directions by arranging along the circumferential direction centering on the axis of the soldering iron, but not only the configuration becomes complicated, but also the adherents scatter around and the maintenance is reduced. There is a drawback that it becomes difficult.

The present invention has been made in view of the above points, and provides a cleaning apparatus capable of sufficiently cleaning a soldering iron using a single nozzle and an automatic soldering apparatus using the same. The purpose is to do.

[0009]

In order to achieve the above-mentioned object, the present invention is configured as follows.

That is, the present invention relates to a soldering iron cleaning apparatus for spraying a cleaning material onto a soldering iron to clean the soldering iron. Rotating means for moving.

The rotating means includes a drive source, a power transmission mechanism for transmitting the rotational power of the drive source, and a rotating body that rotates about the axis by the rotational power transmitted via the power transmission mechanism. And the rotating body may support the injection nozzle.

The drive source is a forward / reverse rotation motor, the power transmission mechanism is a drive pulley that is rotationally driven by the forward / reverse rotation motor, and a driven pulley that rotates about the axis following the rotation of the drive pulley. May be provided.

[0013] The cleaning material may be air.

An automatic soldering apparatus according to the present invention includes the cleaning apparatus according to the present invention, and includes a solder core feeding device for supplying a solder core to a soldering iron by the rotating means, together with the injection nozzle, around the axis. May be rotated.

According to the cleaning device of the present invention, since the injection nozzle for cleaning the soldering iron by spraying a cleaning material is provided around the axis of the soldering iron, the rotation means is provided. Can be sufficiently cleaned.

The rotating means is transmitted through a drive source such as a forward / reverse rotation motor, a power transmission mechanism such as a drive pulley and a driven pulley for transmitting the rotational power of the drive source, and the power transmission mechanism. And a rotating body that rotates around the axis by the rotating power, and the rotating body supports the injection nozzle, so that the cleaning can be performed by the injection nozzle while rotating around the axis of the soldering iron. .

Further, according to the automatic soldering apparatus of the present invention, the entire peripheral surface of the soldering iron can be sufficiently cleaned with a single injection nozzle. Since it is rotated around the axis together with the injection nozzle, soldering can be performed by supplying a solder core from an optimum position around the axis of the soldering iron.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings.

(Embodiment 1) FIG. 1 is a configuration diagram of a system using an automatic soldering apparatus according to this embodiment.

This soldering system comprises a soldering iron 1
And a soldering robot 3 provided with a supply nozzle 2 for supplying a solder core to the soldering iron 1 and the like as described later.
A robot controller 4 for controlling the movement of the robot 3 and a soldering controller 5 for controlling the temperature of the soldering iron 1 based on the supply of a solder core and the output of a temperature sensor (not shown) for detecting the temperature of the soldering iron 1. ,
A sequencer 6 for controlling the controllers 4 and 5 in a predetermined procedure, and a CCD camera 7 for imaging a soldering target.
Image processing of the imaging signal from the CCD camera 7, and matching processing between the image processing information and CAD information of the soldering target, that is, design position information of the soldering target. And a computer 8 for calculating a correction value for correcting the attachment position and providing the correction value to the robot controller 4.

FIG. 2 is a partial cross-sectional view of the vicinity of a solder head as a main part of the present invention.

The automatic soldering apparatus according to this embodiment comprises:
A soldering iron 1 having a small-diameter heat-generating portion 9 at the tip, a soldering head 10 holding the soldering iron 1, a soldering robot 3 that supports the soldering head 10, and
A holding plate 13 connected to a leading end of the robot arm 11 via a connecting shaft 12 and the like, a supply nozzle 2 for supplying a solder core to the heat generating portion 9 of the soldering iron 1, and air to a soldering tip of the soldering iron 1. An air blow nozzle 31 serving as an injection nozzle for spraying and cleaning;
A holding member 16 for holding the holders 14 and 38 holding the base 31 via the support rod 15, and a turning mechanism for turning the holding member 16 to an arbitrary position in the circumferential direction around the axis P of the soldering iron 1. 17 and the solder head 10
The soldering iron 1 held by the robot arm 11 is guided to a predetermined soldering position by the movement of the robot arm 11.

In this embodiment, a cleaning device for cleaning the soldering iron 1 is composed of a single air blow nozzle 31 for cleaning by blowing air to the iron tip of the soldering iron 1, and the air blow nozzle 31 is connected to the axis of the soldering iron 1. Rotating mechanism 17 for rotating to any position in the circumferential direction around P
And

The rotation mechanism 17 is provided for the robot arm 11
Forward and reverse rotating stepping motor 24 supported by a supporting arm 23 attached to the connecting portion of the motor, and a drive pulley 25 rotationally driven by the stepping motor 24
Between the drive pulley 25 and the timing belt 26
Is wound around the driven pulley 25 and rotates. The driven pulley 27 rotates integrally with the driven pulley 27 and holds the air blow nozzle 31 and the supply nozzle 2 via the holders 14 and 38. A rotating body 28 to which the member 16 is attached, and a rotation position detecting sensor 29 for detecting the rotating position of the rotating body 28 are provided. Is provided with a bearing 30 so that the connecting shaft 12 does not rotate.

In the rotating mechanism 17, the driving pulley 25 is driven to rotate by the forward or reverse rotation of the stepping motor 24. The driven pulley 27 is rotated by the rotation of the driving pulley 25, and the driven pulley 27 is rotated. The rotating body 28 integrated with the pulley 27 rotates to hold the holding member 16.
With the air blow nozzle 31 and the supply nozzle 2,
As shown by the imaginary line in FIG.
The control of the stepping motor 24, that is, the control of the rotational positions of the nozzles 31 and 2 is performed by the sequencer 6.

By rotating the air blow nozzle 31 in the circumferential direction around the soldering iron 1 by this rotating mechanism 17, air is blown to the ironing tip of the soldering iron 1 so as to cover the entire peripheral surface of the ironing tip. It is possible to blow air over the entire area, and the iron tip can be more reliably cleaned compared to the conventional example that blows air from only one direction.
Thereby, the soldering quality can be improved. In addition, since the cleaning is performed by the single air blow nozzle 31, the configuration is simplified as compared with the configuration in which a plurality of air blow nozzles are provided, and the cleaning of the iron tip can be performed uniformly over the entire peripheral surface.

The cleaning of the iron tip over the entire circumference by the air blow nozzle 31 is performed, for example, as shown in FIG.
In a container 39 for collecting the deposit removed from the iron tip,
By moving the soldering tip of the soldering iron 1, the deposits are collected in the container 39, and are not scattered around, thereby facilitating maintenance.

In this embodiment, the soldering iron is cleaned by blowing air, but the present invention is not limited to air, and may be cleaned by blowing other gas or fine particles.

In this embodiment, the supply nozzle 2 can also be rotated to any position in the circumferential direction around the soldering iron 1 as shown by the phantom line in FIG.
When there is an obstacle in front of the soldering point or when there is a restriction on the supply angle of the solder core, the supply nozzle 2 is moved in the circumferential direction around the axis P of the soldering iron 1 so as to avoid them. It is possible to perform soldering by rotating to the optimum position.

An example of the soldering work process will be described. First, after cleaning the iron tip of the soldering iron 1 by blowing air while rotating the air blow nozzle 31, immediately before applying the soldering iron to the part to be soldered. Then, the primary solder is supplied to wet the soldering iron tip, heat is transmitted through the solder and preheated as it is, and then the secondary solder is supplied and the soldering iron is applied to the soldering position and heated, so that the soldering is performed. It attaches.

(Embodiment 2) FIG. 4 is a partial sectional view showing the vicinity of a solder head according to another embodiment of the present invention.
Are assigned the same reference numerals.

In this embodiment, the position of the supply nozzle 2 can be automatically adjusted along the axial direction of the soldering iron 1 without the operator manually adjusting the position of the supply nozzle 2 by loosening the screw of the supply holder. It is configured as follows.

That is, in this embodiment, the soldering iron 1 is held on the holding plate 13 which is fixedly attached to the distal end of the robot arm 11 of the soldering robot 3 via the connecting shaft 12 or the like. The solder head 10 is attached so as to be displaceable within a certain range W in the axial direction of the soldering iron 1. The solder head 10 is supported by a pair of guide shafts 19 integrated with the holding plate 13, and is externally fitted to the guide shaft 19 inside an insertion hole 20 of the solder head 10 through which these guide shafts 19 pass. A spring 21 is housed, and the tip of the soldering iron 1 is pressed against a soldering target 22, whereby the solder head 1 is pressed against the urging force of the spring 21.
0 is the range W until the end comes into contact with the end face of the holding plate 13.
It is configured to be able to be displaced over the range.

On the other hand, a supply nozzle 2 for supplying a solder core
Is held at a fixed position along the axial direction of the soldering iron 1.

Therefore, by changing the amount of pressing of the tip of the soldering iron 1 against the soldering object 22, the amount of displacement of the solder head 10 along the guide shaft 19 can be changed. ,
For example, as shown in FIGS. 5A and 5B, the soldering iron 1 from the tip of the soldering iron 1 to the tip of the supply nozzle 2 is provided.
, That is, the position of the supply nozzle 2 with respect to the soldering iron 1 can be varied along the axial direction of the soldering iron 1.

Therefore, in this embodiment, when the coordinate position of the robot arm 11 for designating the movement of the robot arm 11 of the soldering robot 3 is input as a numerical value by the robot controller 4, the soldering iron 1 is soldered. The displacement amount for pressing the target 22 and displacing the soldering iron 1 along the axial direction is input so that the desired displacement amount, and therefore the position of the supply nozzle 2 with respect to the soldering iron 1, becomes the desired supply position. is there.

For example, when it is desired to increase the axial distance from the tip of the soldering iron 1 to the tip of the supply nozzle 2, the coordinate position of the robot arm 11 is input so that the amount of pressing on the soldering target 22 is reduced. By doing so, the displacement of the solder head 10 due to the soldering iron 1 contacting the soldering target 22 is reduced,
As shown in FIG. 5A, when the distance from the tip of the soldering iron 1 to the tip of the supply nozzle 2 is increased, and conversely, the distance from the tip of the soldering iron 1 to the tip of the supply nozzle 2 is required to be reduced. By inputting the coordinate position of 11 so that the amount of pressing on the soldering target 22 becomes large, the displacement of the solder head 10 due to the pressing of the soldering iron 1 against the soldering target 22 increases, As shown in FIG. 5B, the distance from the tip of the soldering iron 1 to the tip of the supply nozzle 2 is reduced.

As described above, by inputting the coordinates specifying the movement of the robot arm 11 as numerical values, that is, by the program for the robot controller 4, the position of the supply nozzle 2 with respect to the soldering iron 1 can be variably set. The operator does not need to perform the troublesome operation of loosening the screw of the supply holder and manually adjusting the position of the supply nozzle as described above. The wire can be supplied.

That is, it is possible to quickly cope with various kinds of soldering positions, and it is possible to omit a troublesome manual operation of changing a supply position by an operator, and the soldering quality is stable, always smoothly and efficiently. Soldering can be performed.

Other configurations are the same as those of the above-described embodiment.

(Embodiment 3) FIG. 6 is a partial cross-sectional view of a main part of still another embodiment of the present invention, and portions corresponding to FIG. 2 are denoted by the same reference numerals.

In this embodiment, the position of the supply nozzle 2 for supplying the solder core is automatically retracted to a position where it does not interfere with the cleaning of the soldering iron tip of the soldering iron 1 or the replacement of the soldering iron. The following arrangement is made so that the original position can be automatically returned again after the replacement is completed.

That is, in this embodiment, the supply position where the supply nozzle 2 can supply the solder core inclined with respect to the axis P of the soldering iron 1 and the axis P of the soldering iron 1
The supply position is a position at which a solder core can be supplied to the soldering iron 1 at a predetermined supply angle with respect to the retreat position parallel to The retracted position is a position where the soldering iron 1 can be cleaned and replaced without the supply nozzle 2 being in the way.

The swing mechanism 32 includes a pinion 3 provided on a supply holder 14 for holding the supply nozzle 2 in a swingable manner.
3, a rack 34 that meshes with the pinion 33, and an air cylinder 35 that drives the rack 34 forward and backward along a support rod 15 that supports the supply holder 14. The air cylinder 35 Fixedly attached to

In the swing mechanism 32, the air cylinder 3
The feed nozzle 2 is moved through the rack 34 and the pinion 33 by moving the piston rod 36 of
Supply position inclined with respect to soldering iron 1 and soldering iron 1
Swinging between a retracted position and a retracted position which is parallel to.

Since the supply nozzle 2 is swung by the swing mechanism 32 in this manner, when cleaning the soldering iron 1 or replacing the soldering iron 1, the swing mechanism 3 is rotated by the sequencer 6.
2 and the piston rod 36 of the air cylinder 35
And the cleaning or replacement is performed by swinging the supply nozzle 2 to the retreat position, and then the piston rod 36 of the air cylinder 35 is retracted to return the supply nozzle 2 to the supply position.

Thus, when cleaning the iron tip of the soldering iron 1, the iron tip can be sufficiently cleaned without the supply nozzle 2 being in the way.

After the soldering iron 1 has been replaced,
The position of the supply nozzle 2 can be returned to the same position as before the replacement without a troublesome operation of manually adjusting the position of the supply nozzle 2 to the original position.

The other structure is the same as that of the embodiment shown in FIG.

As another embodiment of the present invention, the inclination angle of the supply nozzle 2 may be arbitrarily adjusted by using a forward / reverse rotation motor as a driving source instead of the air cylinder 35.

(Embodiment 4) FIG. 7 is a partial sectional view of a main part of still another embodiment of the present invention, and portions corresponding to FIG. 2 are denoted by the same reference numerals.

In this embodiment, the holding member 16
The supply nozzle 2 is held, and a glass tube heater 37 for preheating by blowing high-temperature nitrogen gas to a portion to be soldered is held.
Is moved integrally with the soldering iron 1 in accordance with the movement of the soldering iron, and a high-temperature nitrogen gas is blown to the soldering location immediately before soldering to perform preheating.

As described above, since the glass tube heater 37 is provided so as to move integrally with the soldering iron 1 and is preliminarily heated by locally blowing high-temperature nitrogen gas immediately before soldering, the vicinity of the soldering portion is reduced. Since the resin component does not undergo thermal deformation and preheating is performed immediately before soldering, thermal efficiency is improved.

Moreover, since nitrogen gas is used, the solder and the base metal are not oxidized as in the case of using air, and the soldering quality can be improved.

Further, since the glass tube heater 37 can be turned around the axis P of the soldering iron 1 by the turning mechanism 17, the direction in which the high-temperature nitrogen gas is blown from the glass tube heater 37 can be easily changed.

Although nitrogen gas is used in this embodiment, air or another inert gas may be used as another embodiment of the present invention.

(Other Embodiments) As another embodiment of the present invention, the above embodiments may be appropriately combined. For example, the embodiment of FIG. The supply nozzle 2 may be swung in combination.

Further, the mounting structure of the solder head 10 is not limited to the embodiment of FIG. 4 described above. For example, as shown in FIG. 8, the guide shaft 19 of the holding plate 13 slides on the solder head 10. Equipped with a bush 70, the recess 71 of the solder head 10 and the holding plate 1
3, a compression coil spring 72 is provided, and the tip of the soldering iron 1 is pressed against a soldering target object.
The solder head 10 may be smoothly displaced along the guide shaft 19 over a range W until it comes into contact with the end face of the holding plate 13 against the urging force of the compression coil spring 72.

No.

As described above, according to the present invention, since the injection nozzle for spraying the cleaning material onto the soldering iron for cleaning is provided around the axis of the soldering iron, a single injection nozzle is provided. The nozzle can sufficiently clean the entire peripheral surface of the soldering iron.

The rotating means is transmitted via a drive source such as a forward / reverse rotation motor, a power transmission mechanism such as a drive pulley and a driven pulley for transmitting the rotational power of the drive source, and the power transmission mechanism. And a rotating body that rotates around the axis by the rotating power, and the rotating body supports the injection nozzle, so that the cleaning can be performed by the injection nozzle while rotating around the axis of the soldering iron. .

Further, since the soldering wire feeder is rotated about the axis together with the injection nozzle by the rotating means, the soldering is performed by supplying the soldering core from an optimum position about the axis of the soldering iron. be able to.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a soldering system according to one embodiment of the present invention.

FIG. 2 is a partial cross-sectional view of a main part of the present invention in the vicinity of a solder head.

FIG. 3 is a diagram showing a cleaning state.

FIG. 4 is a partial cross-sectional view of the vicinity of a solder head according to another embodiment of the present invention.

FIG. 5 is an enlarged view for explaining the operation.

FIG. 6 is a partial cross-sectional view of the vicinity of a solder head according to another embodiment of the present invention.

FIG. 7 is a partial sectional view of the vicinity of a solder head according to another embodiment of the present invention.

FIG. 8 is a partial sectional view of a solder head according to another embodiment of the present invention.

FIG. 9 is a diagram showing a conventional example.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 soldering iron 2 supply nozzle 3 soldering robot 10 soldering head 11 robot arm 17 rotating mechanism 22 soldering target 24 stepping motor 25 drive pulley 27 driven pulley 28 rotating body 31 air blow nozzle

Claims (6)

[Claims] 1. An apparatus for cleaning a soldering iron by spraying a cleaning material on a soldering iron, comprising: an injection nozzle for spraying the cleaning material on the soldering iron; and a rotation for rotating the injection nozzle about an axis of the soldering iron. And a cleaning device. 2. The rotating means, comprising: a driving source; a power transmission mechanism for transmitting rotational power of the driving source; and a rotating body that rotates about the axis by rotational power transmitted via the power transmission mechanism. The cleaning device according to claim 1, further comprising: the rotating body supporting the injection nozzle. 3. The drive source is a forward / reverse rotation motor, the power transmission mechanism is driven around the axis by a rotation of the drive pulley driven by the forward / reverse rotation motor. And a driven pulley.
The cleaning device according to the above. 4. The cleaning apparatus according to claim 1, wherein the cleaning material is air. 5. An automatic soldering device comprising the cleaning device according to claim 1. 6. The automatic soldering apparatus according to claim 5, wherein said rotating means rotates a solder core feeding device for supplying a solder core to said soldering iron around said axis together with said injection nozzle.