JPH04316844A - Preparation of laminated sheet - Google Patents
Preparation of laminated sheetInfo
- Publication number
- JPH04316844A JPH04316844A JP3083853A JP8385391A JPH04316844A JP H04316844 A JPH04316844 A JP H04316844A JP 3083853 A JP3083853 A JP 3083853A JP 8385391 A JP8385391 A JP 8385391A JP H04316844 A JPH04316844 A JP H04316844A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- laminate
- chopped strands
- impregnated
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 29
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000003365 glass fiber Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010924 continuous production Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 11
- 238000003475 lamination Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000011800 void material Substances 0.000 description 3
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、ボイドの発生が少ない
電気用に適した積層板の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a laminate suitable for electrical use with few voids.
【0002】0002
【従来の技術】半導体の技術進歩及び電子機器の発達に
伴って積層板の需要が益々多く、さらに高機能の要求が
強い。従来、この積層板の製造は、繊維基材に樹脂を含
浸乾燥して得たプリプレグを必要枚数重ね加熱加圧して
成形する。又、このプリプレグを重ねた積層材の片面ま
たは両面に金属箔を重ねて加熱加圧成形して銅張積層板
とする方法が行われる。又、この方法とは別に連続的に
製造する方法がある。すなわち、連続的に搬送される基
材に常温液状樹脂を塗布含浸した後、さらにこれを連続
的に加熱加圧して積層板を得る。上記連続製造において
、電気用積層板を作る場合、ガラス繊維基材に樹脂を含
浸するとき、充分に含浸するほど微小ボイドが加熱加圧
成形時に抜け難く、樹脂硬化後もボイドが積層板内に残
る。そのボイドのために吸湿性が強く、電気特性が悪い
。BACKGROUND OF THE INVENTION With the advancement of semiconductor technology and the development of electronic equipment, the demand for laminates is increasing, and there is a strong demand for higher functionality. Conventionally, this laminate is manufactured by stacking a required number of prepregs obtained by impregnating and drying a fiber base material with a resin, and heating and pressing them to form them. Also, a method is used in which a metal foil is layered on one or both sides of a laminate made of prepregs, and then heated and pressed to form a copper-clad laminate. In addition to this method, there is also a continuous manufacturing method. That is, after a room temperature liquid resin is applied and impregnated onto a continuously conveyed base material, this is further heated and pressed continuously to obtain a laminate. In the above continuous manufacturing process, when making electrical laminates, when the glass fiber base material is impregnated with resin, the more impregnated the glass fiber base material is, the more difficult it is for microvoids to come out during heat and pressure molding, and even after the resin hardens, the voids remain inside the laminate. remain. Due to its voids, it has strong hygroscopic properties and poor electrical properties.
【0003】0003
【発明が解決しようとする課題】解決しようとする問題
点は、積層板の連続製造においてガラス繊維基材への樹
脂を含浸するときのボイド発生要因を除くことにある。
本発明は、ボイド発生の少ない電気用積層板の連続製造
方法を提供することを目的とする。The problem to be solved is to eliminate the cause of void generation when impregnating a glass fiber base material with a resin in the continuous production of laminates. SUMMARY OF THE INVENTION An object of the present invention is to provide a continuous manufacturing method for electrical laminates with less generation of voids.
【0004】0004
【課題を解決するための手段】上記目的を達成するため
に、本発明は、2枚の長尺樹脂含浸ガラス繊維基材を同
方向に送り重ね合わせて加熱加圧する積層板の連続製造
において、該2枚の樹脂含浸ガラス繊維基材間に予め脱
泡したチョップドストランド含有熱硬化性樹脂層を設け
て加熱加圧成形する連続的積層板の製造方法である。熱
硬化性樹脂に対するチョップドストランドの含有率が5
〜25%のとき効果がある。チョップドストランドは径
が6〜13μm、長さが3〜25mmを用いる。径、長
さ、含有率が上記以下であるとチョップドストランドの
補強効果が弱く、上記以上であると、樹脂中のチョップ
ドストランドの復元力が強くなるため樹脂を塗布する際
に空気を巻き込みやすくなってボイドの原因となる。チ
ョップドストランド含有樹脂の脱泡については、減圧法
、遠心分離法等があるが、脱泡が可能であれば方法に限
定はない。本発明に使用する熱硬化性樹脂は、フェノー
ル樹脂、エポキシ樹脂、不飽和ポリエステル樹脂、ジア
リルフタレート樹脂、不飽和アクリル樹脂、ビニルエス
テル樹脂等全般にわたって適用できる。又、樹脂に配合
する充填剤は、水酸化アルミニウム、クレー、タルク、
ワラストナイト、3酸化アンチモン、5酸化アンチモン
或いはこれらの混合物を使用可能である。上記の樹脂を
含浸する基材はガラス繊維の織布あるいは不織布とし、
樹脂含浸にはキス法、リバース法等があるが、充分に含
浸可能な方法であればよい。[Means for Solving the Problems] In order to achieve the above object, the present invention provides continuous production of a laminate in which two elongated resin-impregnated glass fiber substrates are fed in the same direction, overlapped, and heated and pressurized. This is a method for manufacturing a continuous laminate in which a thermosetting resin layer containing chopped strands which has been degassed in advance is provided between the two resin-impregnated glass fiber substrates and then heated and press-molded. The content ratio of chopped strands to thermosetting resin is 5
Effective when ~25%. The chopped strands used have a diameter of 6 to 13 μm and a length of 3 to 25 mm. If the diameter, length, and content are less than the above, the reinforcing effect of the chopped strands will be weak; if the diameter, length, and content are more than the above, the restoring force of the chopped strands in the resin will be strong, making it easy to trap air when applying the resin. This may cause voids. Regarding the defoaming of the chopped strand-containing resin, there are methods such as a reduced pressure method and a centrifugal separation method, but the method is not limited as long as defoaming is possible. The thermosetting resin used in the present invention can be generally applied to phenol resins, epoxy resins, unsaturated polyester resins, diallyl phthalate resins, unsaturated acrylic resins, vinyl ester resins, etc. In addition, the fillers added to the resin include aluminum hydroxide, clay, talc,
Wollastonite, antimony trioxide, antimony pentoxide or mixtures thereof can be used. The base material impregnated with the above resin is a glass fiber woven fabric or non-woven fabric,
There are kiss methods, reverse methods, etc. for resin impregnation, but any method that allows sufficient impregnation may be used.
【0005】[0005]
【作用】本発明によると、積層板の心材層を予め脱泡す
るためにボイド発生の要因がなく、積層板表面層のボイ
ド発生要因については従来技術によって充分に対処でき
る。According to the present invention, since the core layer of the laminate is degassed in advance, there are no causes of void generation, and the causes of void generation in the surface layer of the laminate can be sufficiently dealt with by conventional techniques.
【0006】[0006]
【実施例】本発明の実施例に用いる金属箔張積層板の製
造を、その装置例の側面図を示す図1によって説明する
。連続的に搬送する2枚の樹脂含浸基材1の間にチョッ
プドストランドを混和した熱硬化性樹脂を脱泡器3で減
圧脱泡した後塗布した。その樹脂含浸基材1の2枚を合
わせロール8で重ね、さらにその両面に銅箔4を重ねた
後、硬化炉5を通し、切断機6で切断して銅張積層板7
を得た。さらに、この実施例の使用材料を説明する。
不飽和ポリエステル樹脂(日立化成ポリセットPS−1
740)100重量部(以下部と称す)に対してBPO
ペースト(50%過酸化ベンゾイル)2部を添加した樹
脂をガラス布に含浸して樹脂含浸基材1とし、その2枚
の間に、上記樹脂102部にチョップドストランド15
部、水酸化アルミニウム50部を添加攪拌後、50To
rrで15分間減圧脱泡して得た樹脂を塗布した。次い
で、厚さ35μの銅箔をその両面に重ね、硬化炉5を無
圧100℃、25分間で通し、切断して500×500
mmの銅張積層板を得た。EXAMPLE The production of a metal foil-clad laminate used in an example of the present invention will be explained with reference to FIG. 1, which shows a side view of an example of the apparatus. A thermosetting resin mixed with chopped strands was degassed under reduced pressure using a deaerator 3 and then applied between two continuously conveyed resin-impregnated substrates 1 . The two sheets of the resin-impregnated base material 1 are stacked together using a roll 8, and copper foil 4 is further stacked on both sides, and then passed through a curing furnace 5 and cut with a cutting machine 6 to form a copper-clad laminate 7.
I got it. Furthermore, the materials used in this example will be explained. Unsaturated polyester resin (Hitachi Chemical Polyset PS-1
740) BPO per 100 parts by weight (hereinafter referred to as parts)
A glass cloth is impregnated with a resin to which 2 parts of paste (50% benzoyl peroxide) is added to form a resin-impregnated base material 1, and between the two sheets, 102 parts of the above resin is mixed with 15 chopped strands.
After adding and stirring 50 parts of aluminum hydroxide, 50To
A resin obtained by defoaming under reduced pressure at rr for 15 minutes was applied. Next, copper foil with a thickness of 35 μm was layered on both sides, passed through a curing furnace 5 at 100° C. for 25 minutes without pressure, and cut into a 500×500
A copper-clad laminate with a thickness of 1.5 mm was obtained.
【0007】実施例に対比する比較例として次のことを
行った。実施例に用いたと同じ熱硬化性樹脂配合物を含
浸したガラスペーパ(秤量75g/m2)2枚をチョッ
プドストランドを混和した熱硬化性樹脂配合物に代えて
用いた他は実施例と同様にして500×500mmの銅
張積層板を得た。[0007] As a comparative example to compare with the example, the following was carried out. The procedure was the same as in the example except that two sheets of glass paper (weighing 75 g/m2) impregnated with the same thermosetting resin compound as used in the example were used instead of the thermosetting resin compound mixed with chopped strands. A copper-clad laminate of 500 x 500 mm was obtained.
【0008】実施例及び比較例で得た両面銅張積層板の
銅箔面をエッチング処理後のボイド数を測定した。結果
を表1に示す。The number of voids after etching the copper foil surface of the double-sided copper-clad laminates obtained in Examples and Comparative Examples was measured. The results are shown in Table 1.
【0009】[0009]
【表1】[Table 1]
【0010】0010
【発明の効果】本発明によると、表1の実施例及び比較
例の示す値によって明らかなように、発生するボイド数
が顕著に少ない電気用として適切な積層板を得ることを
確認した。According to the present invention, as is clear from the values shown in Examples and Comparative Examples in Table 1, it has been confirmed that a laminate suitable for electrical use can be obtained in which the number of voids generated is significantly small.
【図1】 本発明の製造方法の説明図である。FIG. 1 is an explanatory diagram of the manufacturing method of the present invention.
1 樹脂含浸基材 2
チョップドストランド含有熱硬化性樹脂
3 脱泡器
4 銅箔5 硬化炉
6 切断機7 銅張積層板1 Resin-impregnated base material 2
Thermosetting resin containing chopped strands 3 Defoamer
4 Copper foil 5 Hardening furnace
6 Cutting machine 7 Copper-clad laminate
Claims (2)
同方向に送り重ね合わせて加熱加圧する積層板の連続製
造において、該2枚の樹脂含浸ガラス繊維基材間に予め
脱泡したチョップドストランド含有熱硬化性樹脂層を設
けて加熱加圧成形することを特徴とする積層板の製造方
法。Claim 1: In the continuous production of a laminate in which two elongated resin-impregnated glass fiber substrates are fed in the same direction and overlapped and then heated and pressurized, the gap between the two resin-impregnated glass fiber substrates is degassed in advance. A method for manufacturing a laminate, comprising providing a thermosetting resin layer containing chopped strands and performing heating and pressure molding.
脂のチョップドストランド含有率を5〜25%とするこ
とを特徴とする請求項1記載の積層板の製造方法。2. The method for producing a laminate according to claim 1, wherein the chopped strand content of the chopped strand-containing thermosetting resin is 5 to 25%.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3083853A JPH04316844A (en) | 1991-04-16 | 1991-04-16 | Preparation of laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3083853A JPH04316844A (en) | 1991-04-16 | 1991-04-16 | Preparation of laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04316844A true JPH04316844A (en) | 1992-11-09 |
Family
ID=13814254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3083853A Pending JPH04316844A (en) | 1991-04-16 | 1991-04-16 | Preparation of laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04316844A (en) |
-
1991
- 1991-04-16 JP JP3083853A patent/JPH04316844A/en active Pending
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