JPH04313299A - Mounting structure in electronic apparatus - Google Patents

Mounting structure in electronic apparatus

Info

Publication number
JPH04313299A
JPH04313299A JP7875191A JP7875191A JPH04313299A JP H04313299 A JPH04313299 A JP H04313299A JP 7875191 A JP7875191 A JP 7875191A JP 7875191 A JP7875191 A JP 7875191A JP H04313299 A JPH04313299 A JP H04313299A
Authority
JP
Japan
Prior art keywords
electrode
conductive member
anisotropic conductive
board
ground pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7875191A
Other languages
Japanese (ja)
Other versions
JP2904449B2 (en
Inventor
Noboru Koike
昇 小池
Junichi Matsumoto
淳一 松元
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba AVE Co Ltd
Original Assignee
Toshiba Corp
Toshiba AVE Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba AVE Co Ltd filed Critical Toshiba Corp
Priority to JP3078751A priority Critical patent/JP2904449B2/en
Publication of JPH04313299A publication Critical patent/JPH04313299A/en
Application granted granted Critical
Publication of JP2904449B2 publication Critical patent/JP2904449B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Waveguide Connection Structure (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To provide a mounting structure for an electronic apparatus in which a function of conducting a first electrode to a second electrode and a function of conducting a shielded case with a ground pattern are realized by one member to facilitate assembling. CONSTITUTION:An anisotropically conductive member 30 to be conducted only in a thickness direction is interposed between a first electrode 26 and a second electrode 36, and between a ground pattern 24 and the end face of a shielded case 38.

Description

【発明の詳細な説明】[Detailed description of the invention]

[発明の目的] [Purpose of the invention]

【0001】0001

【産業上の利用分野】本発明は、無線機の如く電波シー
ルドが必要となる電子部品を有する電子機器における実
装構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure for an electronic device such as a radio device having electronic components that require radio wave shielding.

【0002】0002

【従来の技術】無線機のうち軽量,薄型化の要求される
携帯形無線機には小形,薄形の部品が多く実装される。 このなかでも液晶表示部をもつ携帯形無線機では、液晶
駆動用の部品として薄形のTAB部品(フィルムキャリ
ア部品)が実装されることが多くなっている。
2. Description of the Related Art Among radio devices, portable radio devices are required to be lightweight and thin, and many small and thin parts are mounted thereon. Among these, in portable radio devices having a liquid crystal display section, thin TAB parts (film carrier parts) are often mounted as parts for driving the liquid crystal.

【0003】これらTAB部品は、通常のディスクリー
ト形部品やフラットパッケージ形部品とは全く異なる方
法で印刷配線板に実装される。このため、これらTAB
部品は、通常の部品が実装される印刷配線板(メインP
C板と称す)とは異なる印刷配線板(サブPC板と称す
)に実装され、この実装後のサブPC板が何らかの手段
でメインPC板に取付,接続される。この従来の構造を
図5を用いて説明する。
[0003] These TAB components are mounted on printed wiring boards in a completely different manner from ordinary discrete components or flat package components. Therefore, these TAB
The parts are printed wiring boards (main P) on which normal parts are mounted.
The PC board is mounted on a printed wiring board (referred to as a sub PC board) different from the PC board (referred to as a C board), and the sub PC board after this mounting is attached and connected to the main PC board by some means. This conventional structure will be explained using FIG. 5.

【0004】メインPC板1に対し、おす,めす一対の
コネクタ3を介してサブPC板5が取付られている。サ
ブPC板5には液晶駆動用のTAB部品7が実装されて
いる。一方メインPC板1にはTAB部品以外のディス
クリート部品8やフラットパッケージ部品が実装されて
いる。
A sub-PC board 5 is attached to the main PC board 1 via a pair of male and female connectors 3. A TAB component 7 for driving the liquid crystal is mounted on the sub PC board 5. On the other hand, on the main PC board 1, discrete components 8 and flat package components other than TAB components are mounted.

【0005】そしてTAB部品7をシールドするために
TAB部品7を覆うようにシールドケース9が設けられ
ている。このときシールドケース9をメインPC板1に
対してすきまなく被せるために、メインPC板1のアー
スパターン11とシールドケース9の端面との間に弾性
パッキン13が設けられている。通常、弾性パッキン1
3をメインPC板1に対して位置決めをするために、シ
ールドケース9の端面には凹部9aが形成され、凹部9
a内に弾性パッキン13がはめ込まれる。
A shield case 9 is provided to cover the TAB component 7 in order to shield the TAB component 7. At this time, in order to cover the main PC board 1 with the shield case 9 without any gaps, an elastic packing 13 is provided between the ground pattern 11 of the main PC board 1 and the end face of the shield case 9. Usually elastic packing 1
3 with respect to the main PC board 1, a recess 9a is formed on the end surface of the shield case 9.
An elastic packing 13 is fitted inside a.

【0006】なおアースパターン11はスルーホール1
5を介してメインPC板1の内層のベタアース17に接
続されている。従ってシールドケース9,弾性パッキン
13,スルーホール15及びベタアース17によりTA
B部品7が覆われシールドが行われる。一方、コネクタ
3の端子はスルーホール19と導通しており、さらにス
ルーホール19はメインPC板1の他の内層に設けられ
たパターン20により、シールドケース9の外部の回路
部に接続されている。
[0006] The ground pattern 11 is a through hole 1.
5 to the solid ground 17 on the inner layer of the main PC board 1. Therefore, the shield case 9, elastic packing 13, through hole 15 and solid ground 17 provide TA.
Part B 7 is covered and shielded. On the other hand, the terminal of the connector 3 is electrically connected to the through hole 19, and the through hole 19 is further connected to a circuit section outside the shield case 9 by a pattern 20 provided on another inner layer of the main PC board 1. .

【0007】この構造では、コネクタ3を結合させる工
程の他に、シールドケース端面の凹部9aに弾性パッキ
ン13をはめこみ、シールドケース9とアースパターン
11との間に位置させる工程が必要であった。
[0007] In this structure, in addition to the process of coupling the connector 3, a process of fitting the elastic packing 13 into the recess 9a of the end face of the shield case and positioning it between the shield case 9 and the ground pattern 11 is required.

【0008】また、弾性パッキン13の位置決めのため
の凹部9aをシールドケース9に形成しなければならず
、その分ケース端面を巾広にしておく必要がある。この
ためシールドケース9の板厚が大きくなり無線機全体の
軽量化、小形化の妨げとなっていた。
Furthermore, a recess 9a for positioning the elastic packing 13 must be formed in the shield case 9, and the end face of the case must be made wider accordingly. For this reason, the thickness of the shield case 9 becomes large, which hinders the reduction in weight and size of the entire radio device.

【0009】[0009]

【発明が解決しようとする課題】本発明は上記欠点を解
決するためになされたもので、2つの電極を接続すると
同時に、シールドケースをアースパターンに導通させる
機能を一つの部材にて実現させることにより組立が容易
となり、かつシールドケースにシールド用接続部材のた
めの凹部を形成する必要もなくシールドケースを軽量,
小形にすることのできる電子機器における実装構造を提
供することを目的とする。 [発明の構成]
[Problems to be Solved by the Invention] The present invention has been made to solve the above-mentioned drawbacks, and aims to achieve the function of connecting two electrodes and simultaneously connecting the shield case to the earth pattern using a single member. This makes assembly easier, and there is no need to form a recess in the shield case for the shield connection member, making the shield case lightweight and lightweight.
The purpose of the present invention is to provide a mounting structure for electronic equipment that can be made compact. [Structure of the invention]

【0010】0010

【課題を解決するための手段】本発明は厚さ方向にのみ
導通する1つの異方性導電部材を、第1のPC板のアー
スパターンとシールドケース端面との間、及び第1の電
極と第2の電極との間に介在させて上記目的を達成して
いる。
[Means for Solving the Problems] The present invention provides an anisotropic conductive member that conducts only in the thickness direction between the ground pattern of the first PC board and the end face of the shield case, and between the first electrode and the ground pattern of the first PC board. The above object is achieved by interposing it between the electrode and the second electrode.

【0011】[0011]

【作用】このような構成としたので異方性導電部材によ
り、第1,第2の電極を導通させると共に、アースパタ
ーンにシールドケースを導通させることができる。従っ
て異方性導電部材を取付けるだけで上記機能を達成でき
るので組立が容易となる。
[Operation] With such a structure, the first and second electrodes can be electrically connected to each other by the anisotropic conductive member, and the shield case can be electrically connected to the ground pattern. Therefore, the above function can be achieved simply by attaching the anisotropic conductive member, making assembly easy.

【0012】0012

【実施例】本発明の実施例を図面を用いて説明する。図
1に示す如く第1の印刷配線板(以下第1のPC板と称
す)22の表面には、アースパターン24が枠形に形成
されている。アースパターン24の領域内にはアースパ
ターン24と導通したスルーホール24aが設けられる
と共に、ねじ挿通孔24bが形成されている。一方、枠
形のアースパターン24の内部の領域には第1の電極2
6と、これと接続したスルーホール28aとが設けられ
る。また枠形のアースパターン24の外部領域にはスル
ーホール28bが設けられ、さらにスルーホール28b
は図示しない電子部品に接続されている。
[Embodiment] An embodiment of the present invention will be explained with reference to the drawings. As shown in FIG. 1, a frame-shaped ground pattern 24 is formed on the surface of a first printed wiring board (hereinafter referred to as a first PC board) 22. A through hole 24a electrically connected to the earth pattern 24 is provided in the area of the earth pattern 24, and a screw insertion hole 24b is also formed. On the other hand, the first electrode 2 is located inside the frame-shaped ground pattern 24.
6 and a through hole 28a connected thereto are provided. Further, a through hole 28b is provided in the outer area of the frame-shaped earth pattern 24, and a through hole 28b
is connected to an electronic component (not shown).

【0013】第1のPC板22に積層される異方性導電
部材30は、一方の面がアースパターン24及び第1の
電極26に接触させられる。異方性導電部材30は、シ
リコンゴムに金属細線が規則正しく埋め込まれており、
厚さ方向にのみ導通し、かつ表面方向にたわむ性質を有
している。
One surface of the anisotropic conductive member 30 laminated on the first PC board 22 is brought into contact with the ground pattern 24 and the first electrode 26 . The anisotropic conductive member 30 has thin metal wires regularly embedded in silicone rubber,
It has the property of being electrically conductive only in the thickness direction and bending in the surface direction.

【0014】第2の印刷配線板(以下第2のPC板と称
す)32の一方の面にはTAB部品34が実装され、他
方の面には第2の電極36が印刷されている。TAB部
品34の実装方法はディスクリート部品の実装方法とは
異なる。従って、ディスクリート部品の実装される第1
のPC板22とは独立した第2のPC板にTAB部品3
4が実装されている。そして第2のPC板は、第2の電
極36が異方性導電部材30を挾んで第1の電極26と
対向し、かつ異方性導電部材30の他方の面に接触する
状態で配置される。
A TAB component 34 is mounted on one side of a second printed wiring board (hereinafter referred to as a second PC board) 32, and a second electrode 36 is printed on the other side. The mounting method for the TAB component 34 is different from the mounting method for discrete components. Therefore, the first
TAB parts 3 are mounted on a second PC board independent of the PC board 22 of
4 has been implemented. The second PC board is arranged such that the second electrode 36 sandwiches the anisotropic conductive member 30, faces the first electrode 26, and is in contact with the other surface of the anisotropic conductive member 30. Ru.

【0015】シールドケース38には四隅にねじ孔40
が設けられる。シールドケース38はその端面が異方性
導電部材30を挾んでアースパターン24に対向し、か
つ異方性導電部材30の他方の面に接触する状態で配置
される。この状態でねじ42をねじ挿通孔24bに挿通
しねじ孔40に締付けることにより、第1のPC板22
に異方性導電部材30,第2の印刷配線板32,及びシ
ールドケース38が取付けられる。
The shield case 38 has screw holes 40 at the four corners.
is provided. The shield case 38 is disposed such that its end surface faces the ground pattern 24 with the anisotropic conductive member 30 in between, and is in contact with the other surface of the anisotropic conductive member 30 . In this state, by inserting the screw 42 into the screw insertion hole 24b and tightening it into the screw hole 40, the first PC board 22
Anisotropic conductive member 30, second printed wiring board 32, and shield case 38 are attached to.

【0016】図1のA−A断面を表した図2に示す如く
、第1のPC板22は多層の印刷配線板である。第1の
電極26と接続されたスルーホール28aは、第1のP
C板22の内層に設けられたパターン25につながって
いる。さらにパターン25はシールドケース38により
囲まれる領域の外側に位置するスルーホール28bに接
続されている。
As shown in FIG. 2, which is a cross-sectional view taken along line AA in FIG. 1, the first PC board 22 is a multilayer printed wiring board. The through hole 28a connected to the first electrode 26 is connected to the first P
It is connected to a pattern 25 provided on the inner layer of the C plate 22. Furthermore, the pattern 25 is connected to a through hole 28b located outside the area surrounded by the shield case 38.

【0017】一方,アースパターン24に接続されたス
ルーホール24bは、第1のPC板22の他の内層に設
けられたベタアース23につながっている。このように
第1のPC板22の一方面側はシールドケース38によ
り覆われ、他方面側は第1のPC板22の内層のベタア
ースにより覆われ、しかも両者は異方性導電部材30,
アースパターン24,スルーホール24aを介して接続
されているので同電位となる。しかも異方性導電部材3
0の金属細線のピッチは、無線機の使用周波数を入とす
ると入/100 に比べ十分に狭くなっている。従って
電磁波の出入りは完全に防止されTAB部品34がシー
ルドされる。
On the other hand, the through hole 24b connected to the ground pattern 24 is connected to a solid ground 23 provided on the other inner layer of the first PC board 22. In this way, one side of the first PC board 22 is covered with the shield case 38, and the other side is covered with the solid earth of the inner layer of the first PC board 22, and both are connected to the anisotropic conductive member 30,
Since they are connected via the ground pattern 24 and the through hole 24a, they have the same potential. Moreover, the anisotropic conductive member 3
The pitch of the thin metal wires of 0 is sufficiently narrower than the pitch of 1/100, assuming that the frequency used by the radio is 1/100. Therefore, electromagnetic waves are completely prevented from entering and exiting, and the TAB component 34 is shielded.

【0018】図2の一部詳細を表した図3に示す如く、
第1の電極26,第2の電極36はそれぞれ異方性導電
部材30の一方の面30a、他方の面30bに接触し、
ちょうど向かい合って位置づけられるので、異方性導電
部材30を通じて導通が行われる。またシールドケース
38もまたアースパターン24に異方性導電部材30を
介して導通する。なお異方性導電部材30は厚さ方向以
外に導通しないので、第1,第2の電極26,36とア
ースパターン24とが短絡してしまうおそれはない。
As shown in FIG. 3, which shows some details of FIG. 2,
The first electrode 26 and the second electrode 36 are in contact with one surface 30a and the other surface 30b of the anisotropic conductive member 30, respectively,
Since they are positioned exactly opposite to each other, electrical conduction occurs through the anisotropic conductive member 30. Further, the shield case 38 is also electrically connected to the ground pattern 24 via the anisotropic conductive member 30. Note that since the anisotropic conductive member 30 does not conduct in any direction other than the thickness direction, there is no possibility that the first and second electrodes 26, 36 and the ground pattern 24 will be short-circuited.

【0019】このように異方性導電部材30を第1の電
極26と第2の電極36との間、及びアースパターン2
4とシールドケース38端面との間に設けたので、異方
性導電部材30により電極同士を接続させると同時にシ
ールドケース38をアースパターン24に導通させるこ
とができる。従って異方性導電部材30を取付けるだけ
で済むので、従来接続コネクタの接合作業とシールドケ
ース接続用の弾性パッキンの取付作業とが必要であった
構造に比べ組立が容易となる。
In this way, the anisotropic conductive member 30 is placed between the first electrode 26 and the second electrode 36 and between the ground pattern 2
4 and the end face of the shield case 38, the anisotropic conductive member 30 connects the electrodes and at the same time allows the shield case 38 to be electrically connected to the ground pattern 24. Therefore, since it is only necessary to attach the anisotropic conductive member 30, assembly is easier than in the conventional structure, which requires the work of joining connectors and the work of attaching elastic packing for connecting the shield case.

【0020】また弾性パッキンの機能も異方性導電部材
30が兼ねることになるので弾性パッキンが不要となる
。従って弾性パッキンを取付けるための凹部をケース端
面に設ける必要がなくケースの板厚を薄くできるので軽
量,小形にすることができる。
Furthermore, since the anisotropic conductive member 30 also functions as an elastic packing, the elastic packing becomes unnecessary. Therefore, there is no need to provide a recess on the end face of the case for attaching the elastic packing, and the thickness of the case can be reduced, making it lightweight and compact.

【0021】次に他の実施例を図4を用いて説明する。 第1のPC板44の表面にはアースパターン46が枠状
に設けられると共に、この枠の外側領域に第1の電極5
2が設けられている。
Next, another embodiment will be explained using FIG. 4. A ground pattern 46 is provided in a frame shape on the surface of the first PC board 44, and a first electrode 5 is provided in an area outside the frame.
2 is provided.

【0022】アースパターン46はスルーホール48及
び内層のベタアース54に接続されている。第1のPC
板44上には、異方性導電部材56の一方の面がアース
パターン46,第1の電極52に接触するように配置さ
れる。異方性導電部材56の他方の面には、シールドケ
ース62の端面がアースパターン46に対向する状態で
取付けられる。また第2のPC板58は第2の電極60
を有し、第2の電極60が第1の電極52に対向する状
態で取付けられる。なおシールドされるべき部品は第2
のPC板58上に実装されず、第1のPC板44上であ
ってシールドケース62により覆われる領域に実装され
る。本実施例によっても上記実施例と同様な作用,効果
を奏する。なお第2のPC板58は印刷配線板に限定さ
れず、電極を有する電子部品、例えばLCDであっもよ
い。また異方性導電部材の厚さを大きくすることにより
、第2のPC板に向かい合う第1のPC板の領域にも電
子部品が実装可能となる。
The ground pattern 46 is connected to the through hole 48 and the solid ground 54 on the inner layer. 1st PC
An anisotropic conductive member 56 is placed on the plate 44 so that one surface thereof is in contact with the ground pattern 46 and the first electrode 52 . A shield case 62 is attached to the other surface of the anisotropic conductive member 56 with an end surface facing the ground pattern 46 . The second PC board 58 also has a second electrode 60
The second electrode 60 is attached to face the first electrode 52. The parts to be shielded are the second
It is not mounted on the first PC board 58, but is mounted on the first PC board 44 in an area covered by the shield case 62. This embodiment also provides the same functions and effects as those of the above embodiment. Note that the second PC board 58 is not limited to a printed wiring board, and may be an electronic component having electrodes, such as an LCD. Furthermore, by increasing the thickness of the anisotropic conductive member, electronic components can be mounted even in the region of the first PC board facing the second PC board.

【0023】[0023]

【発明の効果】以上説明したように本発明では異方性導
電部材を第1の電極と第2の電極との間、及びアースパ
ターンとシールドケース端面との間に設けたので、異方
性導電部材により電極同士を導通させると同時にシール
ドケースをアースパターンに導通させることができる。 よって従来の構造ではコネクタと弾性パッキンの2つの
取付が必要であったのに比べ、本発明では異方性導電部
材の取付だけで済むので組立が格段に容易となる。
Effects of the Invention As explained above, in the present invention, since the anisotropic conductive member is provided between the first electrode and the second electrode and between the earth pattern and the end face of the shield case, the anisotropic The conductive member allows the electrodes to be electrically connected to each other and the shield case to the ground pattern at the same time. Therefore, compared to the conventional structure that required two attachments, the connector and the elastic packing, the present invention requires only the attachment of the anisotropic conductive member, making assembly much easier.

【0024】またシールドケースをアースパターンに接
続するための弾性パッキンが不要となるので、弾性パッ
キンを取付けるための凹部をシールドケース端面に設け
る必要がなく、ケースの板厚を薄くでき軽量,小形にす
ることができる。
Furthermore, since there is no need for an elastic packing to connect the shield case to the ground pattern, there is no need to provide a recess on the end face of the shield case for attaching the elastic packing, and the case can be made thinner and lighter and smaller. can do.

【図面の簡単な説明】[Brief explanation of drawings]

【図1】本発明の一実施例を説明する分解斜視図である
FIG. 1 is an exploded perspective view illustrating an embodiment of the present invention.

【図2】図1のA−A線断面図である。FIG. 2 is a sectional view taken along the line AA in FIG. 1;

【図3】図2の一部を拡大して表した図である。FIG. 3 is an enlarged view of a part of FIG. 2;

【図4】本発明の他の実施例を説明する図である。FIG. 4 is a diagram illustrating another embodiment of the present invention.

【図5】従来例を説明する図である。FIG. 5 is a diagram illustrating a conventional example.

【符号の説明】[Explanation of symbols]

22  第1の印刷配線板      24  アース
パターン26  第1の電極            
30  異方性導電部材32  第2の印刷配線板  
    36  第2の電極38  シールドケース
22 First printed wiring board 24 Earth pattern 26 First electrode
30 Anisotropic conductive member 32 Second printed wiring board
36 Second electrode 38 Shield case

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】  アースパターン及び第1の電極を有す
る第1の印刷配線板と、前記アースパターン及び前記第
1の電極に一方の面が接触して設けられ厚さ方向にのみ
導電性を有する異方性導電部材と、第2の電極を有し、
この第2の電極が前記異方性導電部材を挾んで前記第1
の電極に対向し、かつ前記異方性導電部材の他方の面に
接触して設けられる第2の印刷配線板と、端面を有し、
この端面が前記異方性導電部材を挾んで前記アースパタ
ーンに対向し、かつ前記異方性導電部材の他方の面に接
触して設けられる導電性を有したケースとを具備するこ
とを特徴とする電子機器における実装構造。
1. A first printed wiring board having a ground pattern and a first electrode, one surface of which is in contact with the ground pattern and the first electrode, and has conductivity only in the thickness direction. having an anisotropic conductive member and a second electrode,
This second electrode sandwiches the anisotropic conductive member and
a second printed wiring board facing the electrode and in contact with the other surface of the anisotropic conductive member, and having an end surface;
and a conductive case, the end face of which faces the ground pattern while sandwiching the anisotropic conductive member, and is provided in contact with the other surface of the anisotropic conductive member. Mounting structure in electronic equipment.
【請求項2】  アースパターンは枠形に形成され、こ
のアースパターンの枠内に第1の電極が設けられ、第2
の印刷配線板がシールドケースにより覆われていること
を特徴とする請求項1記載の電子機器における実装構造
2. The earth pattern is formed in a frame shape, a first electrode is provided within the frame of the earth pattern, and a second electrode is provided within the frame of the earth pattern.
2. The mounting structure for an electronic device according to claim 1, wherein the printed wiring board is covered by a shield case.
【請求項3】  アースパターン及び第1の電極を有す
る印刷配線板と、前記アースパターン及び前記第1の電
極に一方の面が接触して設けられ厚さ方向にのみ導電性
を有する異方性導電部材と、第2の電極を有し、この第
2の電極が前記異方性導電部材を挾んで前記第1の電極
に対向し、かつ前記異方性導電部材の他方の面に接触し
て設けられるユニットと、端面を有し、この端面が前記
異方性導電部材を挾んで前記アースパターンに対向し、
かつ前記異方性導電部材の他方の面に接触して設けられ
る導電性を有したケースとを具備することを特徴とする
電子機器における実装構造。
3. A printed wiring board having a ground pattern and a first electrode, and an anisotropic printed wiring board having one surface in contact with the ground pattern and the first electrode and having conductivity only in the thickness direction. It has a conductive member and a second electrode, the second electrode sandwiching the anisotropic conductive member, facing the first electrode, and contacting the other surface of the anisotropic conductive member. a unit provided as a base, and an end face, the end face sandwiching the anisotropic conductive member and facing the ground pattern;
and a conductive case provided in contact with the other surface of the anisotropic conductive member.
JP3078751A 1991-04-11 1991-04-11 Mounting structure in electronic equipment Expired - Fee Related JP2904449B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3078751A JP2904449B2 (en) 1991-04-11 1991-04-11 Mounting structure in electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3078751A JP2904449B2 (en) 1991-04-11 1991-04-11 Mounting structure in electronic equipment

Publications (2)

Publication Number Publication Date
JPH04313299A true JPH04313299A (en) 1992-11-05
JP2904449B2 JP2904449B2 (en) 1999-06-14

Family

ID=13670599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3078751A Expired - Fee Related JP2904449B2 (en) 1991-04-11 1991-04-11 Mounting structure in electronic equipment

Country Status (1)

Country Link
JP (1) JP2904449B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008059643A1 (en) * 2006-11-16 2008-05-22 Panasonic Corporation Three-dimensional electronic circuit apparatus
WO2009037807A1 (en) * 2007-09-21 2009-03-26 Panasonic Corporation Electronic component package and method for producing the same
JP2011199226A (en) * 2010-03-24 2011-10-06 Gunze Ltd Electromagnetic wave shielding material and plasma display panel mounted therewith
WO2014065252A1 (en) * 2012-10-24 2014-05-01 ポリマテック・ジャパン株式会社 Electromagnetic wave shield gasket and electromagnetic wave shield structure

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008059643A1 (en) * 2006-11-16 2008-05-22 Panasonic Corporation Three-dimensional electronic circuit apparatus
WO2009037807A1 (en) * 2007-09-21 2009-03-26 Panasonic Corporation Electronic component package and method for producing the same
JP5234001B2 (en) * 2007-09-21 2013-07-10 パナソニック株式会社 Electronic component package and manufacturing method thereof
JP2011199226A (en) * 2010-03-24 2011-10-06 Gunze Ltd Electromagnetic wave shielding material and plasma display panel mounted therewith
WO2014065252A1 (en) * 2012-10-24 2014-05-01 ポリマテック・ジャパン株式会社 Electromagnetic wave shield gasket and electromagnetic wave shield structure
JPWO2014065252A1 (en) * 2012-10-24 2016-09-08 ポリマテック・ジャパン株式会社 Electromagnetic shielding gasket and electromagnetic shielding structure

Also Published As

Publication number Publication date
JP2904449B2 (en) 1999-06-14

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