JP5234001B2 - Electronic component package and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electronic component package in which electronic components such as coils and semiconductors are mounted on a wiring board, and a method for manufacturing the same.

  In recent years, along with the downsizing and higher functionality of electronic devices such as mobile phones, the electric and magnetic fields generated from coils and semiconductors are suppressed in order to suppress the influence of electronic parts such as coils and semiconductors from external electric and magnetic fields. However, it is necessary to shield these plural electronic components together so that the surrounding circuits are not affected.

  FIG. 22A is an exploded perspective view of a conventional electronic component package 107 shown in Patent Document 1. FIG. FIG. 22B is a cross-sectional view of the electronic component package 107.

  As shown in FIG. 22A, a plurality of electronic components 103 are mounted on the printed wiring board 104. An earth pad 105 is formed at the end of the printed wiring board 104. As shown in FIG. 22B, the end 102 of the metal cap 101 is placed on the ground pad 105 of the printed wiring board 104 and fixed with the solder 106 to form an electronic component package 107. The metal cap 101 is also fixed to the ceiling surface of the tallest electronic component 103 with solder 106 to control the thickness of the electronic component package 107.

  In the conventional electronic component package 107, the tallest electronic component 103 is mounted at a substantially central portion of the electronic component package 107 in order to adjust the height of the electronic component package 107 or ensure the strength of the package 107. There is a need. The electronic component 103 fixed to the metal cap 101 is directly transmitted with distortion generated due to thermal expansion or the like of the metal cap 101. The distortion generates a stress in the soldered portion of the electronic component 103 and may affect the reliability of the electronic component 103.

  Further, in the conventional electronic component package 107, the variation in the thickness of the electronic component 103 and the variation in the height of the electronic component 103 after mounting affect the variation in the height of the metal cap 101. Further, when the height of the electronic component 103 becomes higher than the design value, a gap is generated between the end portion 102 of the metal cap 101 and the ground pad 105 of the printed wiring board 104. This gap may affect the shield characteristics of the metal cap 101 and may reduce the mounting strength of the metal cap 101.

  Further, in the conventional electronic component package 107, the electronic component 103 can be mounted only on one side of the printed wiring board 104.

  FIG. 23 is a perspective view of another conventional electronic component package 301 described in Patent Document 2. In FIG. An electronic component 303 such as a coil or a semiconductor mounted on the surface of the substrate 302 is sealed with a sealing body 304 made of an insulating resin such as an epoxy resin. A nickel plating layer 305 is formed on the surface of the sealing body 304.

  In order to increase the productivity of the conventional electronic component package 301, it is necessary to increase the area of the substrate 302 and to manufacture a plurality of electronic component packages 301 at once. The plurality of electronic component packages 301 are divided into predetermined dimensions by dicing.

  When the area of the substrate 302 is increased, warpage and undulation of the substrate 302 are increased, and the thickness of the sealing body 304 in the substrate 302 is likely to vary. The liquid insulating resin may leak from the surface of the substrate 302 to the outside.

  When the liquid insulating resin filled in the substrate 302 is heat-cured over several hours, if the large substrate 302 is not accurately held horizontally, the thickness of the sealing body 304 varies, and further, the liquid insulating resin In some cases, the resin leaks from the surface of the substrate 302 to the outside.

  In order to fill and cure the insulating resin to be the sealing body 304 on the plurality of substrates 302, the dryer needs to have many shelves. However, in practice, it is difficult to hold all the shelves horizontally, and the shelves themselves may tilt and deform during heating.

  At the time of heating, the substrate 302 itself may be distorted or warped due to thermal expansion, which causes variations in the thickness of the sealing body 304.

  Moreover, in the electronic component package 301, the process of forming the nickel plating layer 305 formed in order to acquire a shielding effect is required, and a man-hour increases. Further, the cost is increased by the step of sealing the electronic component 303 with an insulating resin such as an epoxy resin that becomes the sealing body 304.

  Furthermore, in the conventional electronic component package 301, the large substrate 302 is cut by dicing in two directions, and the time required for dicing and the cost due to equipment increase.

JP 2003-309397 A JP-A-11-163583

  The electronic component package includes a first wiring board, an electronic component mounted on the upper surface of the first wiring board, an adhesive layer provided on the upper surface of the first wiring board, and an upper surface of the adhesive layer. A second wiring board provided; and a metal cap that covers the upper surface of the first wiring board, the second wiring board, and the electronic component. The second wiring board is smaller than the first wiring board.

  In this electronic component package, even if the metal cap is distorted, unnecessary stress is not generated on the electronic component.

The exploded perspective view of the electronic component package in Embodiment 1 The perspective view of the electronic component package in Embodiment 1 The perspective view of the other metal cap in Embodiment 1. 1 is a bottom perspective view of an electronic component package in Embodiment 1. FIG. The perspective view which shows the manufacturing method of the electronic component package in Embodiment 1 The perspective view which shows the manufacturing method of the electronic component package in Embodiment 1 The perspective view which shows the manufacturing method of the electronic component package in Embodiment 1 The exploded perspective view of the electronic component package in Embodiment 2 The perspective view of the electronic component package in Embodiment 2 The perspective view of the other metal cap in Embodiment 2. FIG. The bottom perspective view of the electronic component package in Embodiment 2 FIG. 10 is a bottom perspective view of another electronic component package in the second embodiment. The perspective view which shows the manufacturing method of the electronic component package shown to FIG. 6B. The exploded perspective view of the electronic component package in Embodiment 3 of this invention The perspective view of the electronic component package in Embodiment 3 Bottom perspective view of electronic component package in Embodiment 3 The perspective view which shows the manufacturing method of the electronic component package in Embodiment 3. FIG. The perspective view which shows the manufacturing method of the electronic component package in Embodiment 3. FIG. The perspective view of the electronic component package in Embodiment 4 of this invention Sectional drawing in line 13B-13B of the electronic component package shown to FIG. 13A The bottom perspective view of the electronic component package in Embodiment 4 The perspective view which shows the manufacturing method of the electronic component package in Embodiment 4. FIG. The perspective view which shows the manufacturing method of the electronic component package in Embodiment 4. FIG. The perspective view which shows the manufacturing method of the electronic component package in Embodiment 4. FIG. The perspective view which shows the manufacturing method of the electronic component package in Embodiment 4. FIG. Sectional drawing which shows the manufacturing method of the electronic component package in Embodiment 4 Sectional drawing which shows the manufacturing method of the electronic component package in Embodiment 4 The perspective view which shows the manufacturing method of the electronic component package in Embodiment 4. FIG. The perspective view which shows the manufacturing method of the electronic component package in Embodiment 4. FIG. An exploded perspective view of a conventional electronic component package Sectional view of a conventional electronic component package Perspective view of another conventional electronic component package

(Embodiment 1)
1A is an exploded perspective view of electronic component package 111 according to Embodiment 1. FIG. The metal cap 112 is formed by bending a metal plate into a U shape by pressing, and has a claw 118. Specifically, the metal cap 112 includes a top surface portion 112 </ b> A, side surface portions 112 </ b> B and 112 </ b> C, and a claw 118. The top surface portion 112A has a rectangular shape having sides 1112B and 1112C opposite to each other and sides 1112D and 1112E opposite to each other. The side surfaces 112B and 112C extend downward from the sides 1112B and 1112C of the top surface 112A, respectively. The claw 118 extends downward from the side 1112D. The claw 118 is formed by positioning the metal cap 112 when the metal cap 112 is fixed to the wiring board 113 and bending a small protrusion or a part of the metal plate. The claw 118 may have a hook shape.

  A plurality of electronic components 116 are mounted on the upper surface 113 </ b> A of the wiring board 113. The electronic component 116 is a chip component such as a high-frequency semiconductor or a chip coil, and may be a component that generates electromagnetic noise or is easily affected by surrounding electromagnetic noise.

  A wiring pattern and a solder resist are provided on the upper surface 113A and the lower surface 113B of the wiring board 113. A wiring pattern and a solder resist are provided on the upper surface 114A and the lower surface 114B of the wiring board 114. A wiring pattern and a solder resist are provided on the upper surface 154A and the lower surface 154B of the wiring board 154. The electronic component 116 has an external electrode portion connected to the upper surface 113A of the wiring board 113 by soldering. The wiring boards 113, 114, and 154 are printed wiring boards, but may be other wiring boards.

  The wiring board 114 is fixed to the upper surface 113A at the end 113C of the wiring board 113 through the adhesive layer 115. That is, the adhesive layer 115 is provided on the upper surface 113A of the end portion 113C of the wiring board 113, and the wiring board 114 is fixed on the adhesive layer 115. The wiring board 154 is fixed to the upper surface 113A at the end 113D opposite to the end 113C of the wiring board 113 via the adhesive layer 155. That is, the adhesive layer 155 is provided on the upper surface 113A of the end portion 113D of the wiring board 113, and the wiring board 154 is fixed on the adhesive layer 155. The wiring boards 114 and 154 extend in parallel with each other.

  FIG. 1B is a perspective view of the electronic component package 111. The top surface portion 112A of the metal cap 112 is located on the upper surface 114A of the wiring board 114 and the upper surface 154A of the wiring board 154, and covers the upper surface 113A of the wiring board 113 and the electronic component 116.

  The metal cap 112, that is, the side portions 112B and 112C have a height 117B. It is desirable that the height 117B is 117C or less in total of the thicknesses of the wiring boards 113 and 114 and the adhesive layer 115. Further, it is desirable that the height of the electronic component 116 from the upper surface 113A of the wiring board 113 is smaller than the height of the upper surfaces 114A and 154A of the wiring boards 114 and 154 from the upper surface 113A. As a result, the electronic component 116 and the metal cap 112 can be prevented from coming into direct contact.

  As shown in FIG. 1B, the claw 118 formed on the metal cap 112 is applied to the wiring board 114, so that the displacement of the metal cap 112 can be prevented, and the metal cap 112 can be easily raised with respect to the wiring board 114. It can be positioned with accuracy.

  By enlarging the claw 118, the shielding effect by the claw 118 can be obtained. 1C is a perspective view of another metal cap 612 according to Embodiment 1. FIG. In FIG. 1C, the same parts as those in FIG. 1A are denoted by the same reference numerals, and the description thereof is omitted. Instead of the claw 118 of the metal cap 112 shown in FIG. 1A, the metal cap 612 includes a side surface portion 112D extending downward from the side 1112D of the top surface portion 112A, and a side surface portion 112E extending downward from the side 1112E opposite to the side 1112D. Have The side surface portion 112D is connected to the side surface portions 112B and 112C, and the side surface portion 112E is connected to the side surface portions 112B and 112C. The side portions 112D and 112E cover the side surfaces of the wiring boards 114 and 154 and the side surfaces of the adhesive layers 115 and 155, and can effectively shield the electronic component 116.

  As described above, the electronic component package 111 is a small Chip Size / Scale Package (CSP) capable of shielding a plurality of electronic components 116 such as semiconductors.

  FIG. 2 is a bottom perspective view of the electronic component package 111. A plurality of electrodes 119 </ b> B are provided on the lower surface 113 </ b> B of the wiring board 113. The electrode 119B is connected to the motherboard, and the electronic component package 111 is configured to be mounted on the motherboard. The plurality of electrodes 119B shown in FIG. 2 is a Land Grid Array (LGA) or a Fine Pitch LGA (FLGA). Depending on the application, the plurality of electrodes 119B may be a Ball Grid Array (BGA) or a Fine Pitch BGA (FBGA). The electrode 119B can be formed by a copper foil or a solder resist formed on the lower surface 113B of the wiring board 113, and the mounting density of the electronic component package 111 can be increased.

  By forming the wiring board 113 with a multilayer wiring board such as a glass epoxy resin or a multilayer board using a build-up technique, the lower surface 113B of the electronic component package 111 can be made compatible with high-density mounting.

  By making the wiring boards 114 and 154 smaller than the wiring board 113, the area where the electronic component 116 can be mounted on the upper surface 113A of the wiring board 113 can be increased.

  In the electronic component package 111, wiring boards 114 and 155 are provided on adhesive layers 115 and 155 provided on the upper surface 113A of the wiring board 113, respectively. Since the metal cap 112 is provided on the upper surfaces 114A and 154A of the wiring boards 114 and 154, the height of the metal cap 112 can be controlled with high accuracy, so that variations in the thickness of the electronic component package 111 can be suppressed and thin portions can be formed. Also, the electronic component package 111 can be mounted. The metal cap 112 is fixed to the wiring boards 114 and 154 provided at the opposite ends 113C and 113D of the wiring board 113. With this structure, the metal cap 112 can be parallel to the upper surface 113A of the wiring board 113 with high accuracy, and the rigidity of the electronic component package 111 can be increased. Further, with this structure, the metal cap 112 can be easily fitted and fixed to the wiring boards 114 and 154 with an automatic machine, and the productivity of the electronic component package 111 can be increased.

  The metal cap 112 is formed by bending a metal plate into a U-shape. The height 117B of the metal cap 112 (side surfaces 112B and 112C) is equal to or smaller than the total height 117C of the wiring board 113, the adhesive layer 115, and the wiring board 114. This can prevent the electronic component 116 from being stressed due to the attachment of the metal cap 112. The metal cap 112 can be attached to the wiring boards 113, 114, 154 by soldering or machining.

  Next, a method for manufacturing the electronic component package 111 will be described. 3 to 5 are perspective views showing a method for manufacturing the electronic component package 111. FIG.

  As shown in FIG. 3, the holes formed in the adhesive layers 115 and 155 are filled with a conductive paste to form through holes 120A and 120B. The adhesive layer 115 having the through hole 120A and the wiring board 114 are laminated. An adhesive layer 155 having a through hole 120B and a wiring board 154 are laminated. Thereafter, the adhesive layers 115 and 155 are laminated on the wiring board 113 with a tool such as a mold or a press. In this manner, the wiring boards 114 and 154 are fixed to the wiring board 113 by the adhesive layers 115 and 155 having the through holes 120A and 120B, respectively. The adhesive layer 115 has an upper surface 115A and a lower surface 115B opposite to the upper surface 115A. The adhesive layer 155 has an upper surface 155A and an opposite lower surface 155B. The lower surfaces 115B and 155B are located on the upper surface 113A of the wiring board 113. Upper surfaces 115A and 155A are located on lower surfaces 114B and 154B of wiring boards 114 and 154, respectively.

  A plurality of electrodes 119A are formed on the upper surface 113A of the wiring board 113. An electrode 131A is formed on the lower surface 114B of the wiring board 114. An electrode 131B is formed on the lower surface 154B of the wiring board 154. The through hole 120A connects the electrode 119A of the wiring board 113 and the electrode 131A of the wiring board 114. The through hole 120B connects the electrode 119A of the wiring board 113 and the electrode 131B of the wiring board 154.

  The wiring boards 114 and 154 may be simultaneously fixed to the wiring board 113 with adhesive layers 115 and 155 having through holes 120A and 120B. In this way, man-hours can be reduced.

  When the adhesive layers 115 and 155 are not hard solids, the adhesive layers 115 and 155 are attached to the wiring board 113 in advance. By adhering the adhesive layers 115 and 155 to the wiring boards 114 and 154 in advance, the adhesive layers 115 and 155 can be easily handled.

  FIG. 4 is a perspective view of the laminated wiring boards 113, 114, 154 and adhesive layers 115, 155. The upper surface 113A of the wiring board 113 has an effective area 121 that can be exposed from the adhesive layers 115 and 155 and on which the electronic component 116 can be mounted. The electronic component 116 is mounted on the effective area 121 of the upper surface 113A of the wiring board 113. By fixing the wiring boards 114 and 154 to the opposite ends 113C and 113D of the wiring board 113 via the adhesive layers 115 and 155, the effective area 121 can be increased, and the adhesive layers 115 and 155 and the wiring The electronic components 116 can be mounted at a high density until just before the plates 114 and 154.

  By expanding the effective area 121, the printing area of the solder paste on the upper surface 113A of the wiring board 113 can be expanded, the thickness variation of the solder paste can be reduced, and the printing accuracy of the solder paste can be increased. As a result, workability can be improved and the production cost of the electronic component package 111 can be suppressed. By cutting the laminated wiring boards 113, 114, 154 and the adhesive layers 115, 155 along the dividing line 111A, a plurality of electronic component packages 111 can be produced in a lump.

  FIG. 5 is a perspective view of the divided wiring boards 113, 114, 154 and adhesive layers 115, 155. The laminated wiring boards 113, 114, 154 and the adhesive layers 115, 155 can be cut by a mechanical method using a router bit or the like. Alternatively, the laminated wiring boards 113, 114, 154 and the adhesive layers 115, 155 may be divided by slits, V grooves, or perforations formed in advance along the dividing lines 111A on the wiring boards 113, 114, 154. .

  By mounting the electronic component 116 on the upper surface 113A of the wiring board 113 before dividing the laminated wiring boards 113, 114, 154 and the adhesive layers 115, 155, the mounting cost can be suppressed. Even when the wiring board 113 is folded and divided, since the wiring boards 114 and 154 maintain the rigidity of the wiring board 113, it is difficult to generate unnecessary stress on the electronic component 116 when the wiring board 113 is cut. By the above method, the electronic component package 111 capable of reliably shielding the electronic component 116 can be stably manufactured.

  The through holes 120A and 120B have a shielding effect. Further, by forming the through holes 120A and 120B with a member having high thermal conductivity, the heat of the wiring board 113 and the electronic component 116 can be sent to the metal cap 112 to effectively dissipate the electronic component 116.

  The adhesive layers 115 and 155 desirably have a sheet shape, and are made of a thermosetting resin and an inorganic filler such as alumina or silicon oxide dispersed in the thermosetting resin. By making the adhesive layers 115 and 155 into a sheet shape, thickness variations of the adhesive layers 115 and 155 can be suppressed. In addition, through holes 120A and 120B can be easily formed by forming holes in the adhesive layers 115 and 155 with a laser or the like and filling them with a conductive paste. By using an epoxy resin as the thermosetting resin for the adhesive layers 115 and 155, the reliability of the electronic component package 111 can be improved.

  In addition, the thermosetting resin is a heat of 5% by weight to 30% by weight of polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyether sulfone (PES), etc. with respect to the thermosetting resin. A plastic resin may be added. Thereby, the fluidity | liquidity at the time of a heating can be suppressed, and it can prevent that a thermoplastic resin softens | flows out and flows out from the adhesion layer 115, or oozes out. When the content of the thermoplastic resin is less than 5% by weight with respect to the thermosetting resin, the added effect may not be obtained. When the content of the thermoplastic resin exceeds 30% by weight with respect to the thermosetting resin, the adhesive strength and reliability of the adhesive layers 115 and 155 may be affected.

  The thickness of the adhesive layers 115 and 155 is desirably 30 μm or more and 300 μm or less. When the thickness of the adhesive layers 115 and 155 is less than 30 μm, sufficient adhesive strength may not be obtained due to the unevenness of the surface of the wiring boards 113, 114 and 154. When the thickness of the adhesive layers 115 and 155 is larger than 300 μm, it is difficult to make the electronic component package 111 thin. The particle size of the inorganic filler is desirably 1 μm or more and less than 30 μm. When the particle size of the inorganic filler is less than 1 μm, the inorganic filler is expensive and difficult to disperse in the thermosetting resin. When the particle diameter exceeds 30 μm, it is difficult to make the adhesive layer 115 thin, and it may be difficult to form holes in the adhesive layer 115 with a laser in order to form the through holes 120A and 120B.

  As for the content rate of the inorganic filler in the contact bonding layers 115 and 155, 30 volume% or more and 80 volume% or less are desirable. When the content of the inorganic filler is less than 30% by volume, the thermosetting resin may protrude or ooze out from the portion where the electronic component 116 is mounted in the bonding process of the bonding layers 115 and 155. When the content rate of an inorganic filler exceeds 80 volume%, the adhesive force of the contact bonding layers 115 and 155 may be made small.

  The thermal expansion coefficients of the adhesive layers 115 and 155 are desirably 4 ppm / ° C. or more and 65 ppm / ° C. or less at a temperature lower than the glass transition temperature of the thermosetting resin. In order to make the thermal expansion coefficient smaller than 4 ppm / ° C., it is necessary to use a special and expensive inorganic filler. When the thermal expansion coefficient is larger than 65 ppm / ° C., the electronic component package 111 may be distorted or warped. The thermal expansion coefficient of the adhesive layer 115 is preferably smaller than the wiring boards 113, 114, and 154. As a result, warpage and undulation due to heat of the electronic component package 111 can be suppressed.

  The glass transition temperature can be measured by the TMA method or DSC method shown in JIS C 6481 or the like. In the TMA method, the test piece is heated from room temperature at a rate of 10 ° C./min, and the thermal expansion coefficient in the thickness direction is measured with a thermal analyzer. In the DSC method, the test piece is heated from room temperature at a rate of 20 ° C./min, and the calorific value is measured with a differential operation calorimeter.

  Note that the reliability of the electronic component package 111 can be improved by using FR4 grade or FR5 grade highly reliable members for the adhesive layers 115 and 155 and the wiring boards 113, 114 and 154.

  When the size of the wiring board 113 is 10 mm × 10 mm or less, the strength of the electronic component package 111 can be secured with the structure shown in FIG. 1A. When the size of the wiring board 113 exceeds 10 mm × 10 mm, another adhesive layer having the same structure as the adhesive layers 115 and 155 is provided at the center between the adhesive layers 115 and 155 on the upper surface 113A, and the adhesive layer is formed on the adhesive layer. Another wiring board having the same structure as the wiring boards 114 and 154 may be provided. The upper surface of the wiring board abuts on the top surface portion 112 </ b> A of the metal cap 112. As a result, the strength of the electronic component package 111 in the thickness direction can be increased. Moreover, the rigidity of the electronic component package 111 can be increased by fixing the wiring board and the metal cap 112 with soldering or an adhesive.

  The metal cap 112 is preferably formed of a metal plate having a thickness of 0.1 mm to 1.0 mm. If the thickness is less than 0.1 mm, there is a possibility of deformation during handling. On the other hand, when the thickness exceeds 1.0 mm, it becomes difficult to process the metal plate and the weight increases. In addition to the shielding effect, the metal cap 112 can provide a heat dissipation effect and a heat spread effect. In this case, the shape of the metal cap 112 may be a fin shape, or a heat radiating fin may be attached to the metal cap 112.

  Further, in this case, by forming the through holes 120A and 120B with a member having high thermal conductivity, the heat of the wiring board 113 and the electronic component 116 can be sent to the metal cap 112 to effectively dissipate the electronic component 116. .

  Further, by plating at least part of the metal cap 112, discoloration of the metal part can be prevented. Further, by performing nickel plating or solder plating, the metal cap 112 can be firmly connected to the wiring boards 114 and 154 with solder.

  In the electronic component package 111, the wiring boards 114 and 154 are fixed to the wiring board 113 through the adhesive layers 115 and 155, respectively, and the metal cap 112 is fixed to the wiring boards 114 and 154. The metal cap 112 is not in contact with the electronic component 116 mounted on the upper surface 113A of the wiring board 113 and is separated. Thereby, since the external force transmitted to the metal cap 112 is not transmitted to the electronic component 116, no stress is generated in the electronic component 116, and a small and highly reliable electronic component package 111 is obtained. Further, the height of the electronic component 116 or variations in height do not affect the height 117B of the metal cap 112 or the height of the electronic component package 111.

(Embodiment 2)
FIG. 6A is an exploded perspective view of electronic component package 211 in the second exemplary embodiment. The wiring pattern formed on the upper surface 213A of the wiring board 213 and the metal cap 212 are connected via the electrode 232A formed on the upper surface 214A of the wiring board 214 and the electrode 232B formed on the upper surface 254A of the wiring board 254. can do. The wiring boards 213, 214, and 254 are printed wiring boards, but may be other wiring boards.

  The metal cap 212 is formed by bending a metal plate into a U shape by pressing, and has a claw 218. Specifically, the metal cap 212 includes a top surface portion 212 </ b> A, side surface portions 212 </ b> B and 212 </ b> C, and a claw 218. The top surface 212A has a rectangular shape having sides 1212B and 1212C opposite to each other and sides 1212D and 1212E opposite to each other. The side surfaces 212B and 212C extend downward from the sides 1212B and 1212C of the top surface 212A, respectively. The claw 218 extends downward from the side 1212D. The claw 218 is formed by positioning the metal cap 212 when the metal cap 212 is fixed to the wiring board 213 and bending a small protrusion or a part of the metal plate. The claw 218 may have a hook shape.

  A plurality of electronic components 216A are mounted on the upper surface 213A of the wiring board 213. The electronic component 216A is a chip component such as a high-frequency semiconductor or a chip coil, and may be a component that generates electromagnetic noise or is easily affected by surrounding electromagnetic noise. A plurality of electronic components 216B are mounted on the lower surface 213B of the wiring board 213. The electronic component 216B is a chip component such as a high-frequency semiconductor or a chip coil, and generates electromagnetic noise or is easily influenced by surrounding electromagnetic noise.

  By forming the wiring board 213 with a multilayer wiring board, the electronic component 216A and the electronic component 216B can be connected. The electronic component 216A and the electronic component 216B can be connected to each other via a through hole connected to the upper surface 213A and the lower surface 213B of the wiring board 213, thereby increasing the degree of freedom in designing the circuit pattern of the electronic component package 211. .

  The wiring board 113 may incorporate a solid pattern or a shield pattern made of copper foil or the like. With this pattern, the electronic components 216A and 216B can be electromagnetically separated from each other, and interference can be prevented.

  A wiring pattern and a solder resist are formed on the upper surface 213A and the lower surface 213B of the wiring board 213. The electronic components 216A and 216B have external electrode portions connected to the upper surface 213A and the lower surface 213B of the wiring board 213 by soldering.

  The wiring board 214 is fixed to the upper surface 213A at the end 213C of the wiring board 213 through the adhesive layer 215. That is, the adhesive layer 215 is provided on the upper surface 213A of the end portion 213C of the wiring board 213, and the wiring board 214 is fixed on the adhesive layer 215. The wiring board 254 is fixed to the upper surface 213 </ b> A at the end 213 </ b> D opposite to the end 213 </ b> C of the wiring board 213 through the adhesive layer 255. That is, the adhesive layer 255 is provided on the upper surface 213A of the end portion 213D of the wiring board 213, and the wiring board 254 is fixed on the adhesive layer 255.

  The wiring board 264 is fixed to the lower surface 213B at the end 213C of the wiring board 213 through the adhesive layer 265. That is, the adhesive layer 265 is provided on the lower surface 213B of the end portion 213C of the wiring board 213, and the wiring board 264 is fixed on the adhesive layer 265. The wiring board 274 is fixed to the lower surface 213B via an adhesive layer 275 at an end 213D opposite to the end 213C of the wiring board 213. That is, the adhesive layer 275 is provided on the lower surface 213 </ b> B at the end 213 </ b> D of the wiring board 213, and the wiring board 274 is fixed on the adhesive layer 275. The wiring boards 214, 254, 264, 274 extend in parallel to each other.

  FIG. 6B is a perspective view of the electronic component package 211. The top surface portion 212A of the metal cap 212 is located on the upper surface 214A of the wiring board 214 and the upper surface 254A of the wiring board 254, and covers the upper surface 213A of the wiring board 213 and the electronic component 216A. The side portions 212B and 212C of the metal cap 212 extend to the wiring boards 264 and 274 and surround the electronic component 216B.

  The metal cap 212, that is, the side portions 212B and 212C has a height 217B. The height 217B is preferably 217C or less in total of the thicknesses of the wiring boards 213, 214, 264 and the adhesive layers 215, 265. In addition, the height of the electronic component 216A from the upper surface 213A of the wiring board 213 is desirably smaller than the height of the upper surfaces 214A and 254A of the wiring boards 214 and 254 from the upper surface 213A. Thereby, it is possible to prevent the electronic component 216A and the metal cap 212 from coming into direct contact. Also, with this structure, it is possible to ensure an insulation distance between the metal cap 212 and the motherboard on which the electronic component package 211 is mounted.

  By enlarging the nail 218, the shielding effect by the nail 218 can be obtained. FIG. 6C is a perspective view of another metal cap 712 according to the second embodiment. In FIG. 6C, the same parts as those in FIG. 6A are denoted by the same reference numerals, and the description thereof is omitted. The metal cap 712 includes a side surface portion 212D extending downward from the side 1212D of the top surface portion 212A and a side surface portion 212E extending downward from the side 1212E opposite to the side 1212D, instead of the claw 218 of the metal cap 212 shown in FIG. Have The side surface portion 212D is connected to the side surface portions 212B and 212C, and the side surface portion 212E is connected to the side surface portions 212B and 212C. The side portions 212D and 212E cover the side surfaces of the wiring boards 213, 214, 254, 264, and 274 and the side surfaces of the adhesive layers 215, 255, 265, and 275, and can effectively shield the electronic components 216A and 216B.

  As described above, the electronic component package 211 is a small chip size / scale package (CSP) that can shield a plurality of electronic components such as semiconductors.

  FIG. 7A is a bottom perspective view of the electronic component package 211. A plurality of electrodes 232C are provided on the lower surface 264B of the wiring board 264. A plurality of electrodes 232D are provided on the lower surface 274B of the wiring board 274. The electrodes 232C and 232D are connected to the motherboard, and the electronic component package 211 is configured to be mounted on the motherboard. The plurality of electrodes 232C and 232D shown in FIG. 7A is a Land Grid Array (LGA) or a Fine Pitch LGA (FLGA). Depending on the application, the plurality of electrodes 232C and 232D may be Ball Grid Array (BGA) or Fine Pitch BGA (FBGA). The electrodes 232C and 232D can be formed of copper foil or solder resist formed on the lower surfaces 264B and 274B of the wiring boards 264 and 274, and the mounting density of the electronic component package 211 can be increased.

  FIG. 7B is a bottom perspective view of another electronic component package 211A according to Embodiment 2. 7B, the same reference numerals are given to the same portions as those of the electronic component package 211 shown in FIG. 7A, and the description thereof is omitted. An electronic component package 211A illustrated in FIG. 7B includes a metal cap 712 illustrated in FIG. 6C instead of the metal cap 212 of the electronic component package 211 illustrated in FIG. 7A.

  6A, 6B, 7A, and 7B, by making the wiring boards 214, 254, 264, and 274 smaller than the wiring board 213, the electronic components 216A and 216B on the upper surface 213A and the lower surface 213B of the wiring board 213 are formed. The area of the part that can be mounted can be increased. By mounting the electronic components 216A and 216B on the upper surface 213A and the lower surface 213B of the wiring board 213, the electronic component package 211 can be reduced in size and weight.

  The metal cap 212 is formed by bending a metal plate into a U-shape. The height 217B of the metal cap 212 (side surfaces 212B and 212C) is equal to or smaller than the total height 217C of the wiring board 213, the adhesive layers 215 and 265, and the wiring boards 214 and 264. Thereby, it can prevent that the stress resulting from attachment of the metal cap 212 generate | occur | produces in the electronic component 216A. The metal cap 212 can be attached to the wiring boards 213, 214, 254, 264, 274 by soldering or machining.

  By applying the claws 218 formed on the metal cap 212 to the wiring board 214, it is possible to prevent the metal cap 212 from being displaced, and the metal cap 212 can be easily positioned with high accuracy with respect to the wiring board 214. .

  Next, a method for manufacturing the electronic component package 211 will be described. FIG. 8 is an exploded perspective view showing a method for manufacturing the electronic component package 211. The holes formed in the adhesive layers 215, 255, 265, and 275 are filled with a conductive paste to form through holes 220A, 220B, 220C, and 220D, respectively. Thereafter, adhesive layers 215 and 255 are laminated on the lower surfaces 214B and 254B of the wiring boards 214 and 254, respectively, and adhesive layers 265 and 275 are laminated on the upper surfaces 264A and 274A of the wiring boards 264 and 274, respectively. Thereafter, the adhesive layers 215 and 255 are laminated on the upper surface 213A of the wiring board 213 with a tool such as a mold or a press, and the adhesive layers 265 and 275 are laminated on the lower surface 213B of the wiring board 213 with a tool such as a mold or a press. In this way, the wiring boards 213, 214, 254, 264, 274 are fixed by the adhesive layers 215, 255, 265, 275 having the through holes 220A, 220B, 220C, 220D, respectively.

  A plurality of electrodes 219A are formed on the upper surface 213A of the wiring board 213. An electrode 231A is formed on the lower surface 214B of the wiring board 214. An electrode 231B is formed on the lower surface 254B of the wiring board 254. The through hole 220A connects the electrode 219A of the wiring board 213 and the electrode 231A of the wiring board 214. The through hole 220B connects the electrode 219A of the wiring board 213 and the electrode 231B of the wiring board 254. A plurality of electrodes 219B are formed on the lower surface 213B of the wiring board 213. An electrode 231C is formed on the upper surface 264A of the wiring board 264. An electrode 231D is formed on the upper surface 274A of the wiring board 274. The through hole 220C connects the electrode 219B of the wiring board 213 and the electrode 231C of the wiring board 264. The through hole 220D connects the electrode 219B of the wiring board 213 and the electrode 231D of the wiring board 274. The adhesive layer 215 has an upper surface 215A and a lower surface 215B on the opposite side. The adhesive layer 255 has an upper surface 255A and a lower surface 255B on the opposite side. The lower surfaces 215B and 255B are located on the upper surface 213A of the wiring board 213. Upper surfaces 215A and 255A are located on lower surfaces 214B and 254B of wiring boards 214 and 254, respectively. The adhesive layer 265 has an upper surface 265A and a lower surface 265B on the opposite side. The adhesive layer 275 has an upper surface 275A and a lower surface 275B on the opposite side. The upper surfaces 265A and 275A are located on the lower surface 213B of the wiring board 213. The lower surfaces 265B and 275B are located on the upper surfaces 264A and 274A of the wiring boards 264 and 274, respectively.

  Note that the wiring boards 213, 214, 254, 264, 274 may be simultaneously laminated and fixed by the adhesive layers 215, 255, 265, 275 having the through holes 220A, 220B, 220C, 220D, respectively. In this way, man-hours can be reduced.

  Thereafter, the wiring boards 213, 214, 254, 264, 274 and the adhesive layers 215, 255, 265, 275 are divided in the same manner as the wiring boards 113, 114, 154 and the adhesive layers 115, 155 shown in FIGS. . Thereafter, the metal cap 212 is attached to the wiring boards 213, 214, 254, 264, and 274 so that the metal cap 212 contacts the upper surfaces 214 A and 254 A of the wiring boards 214 and 254.

  The through holes 220A to 220D have a shielding effect. Further, by forming the through holes 220A to 220D with a member having high thermal conductivity, the heat of the wiring board 213 and the electronic components 216A and 216B can be sent to the metal cap 212 to effectively dissipate the electronic components 216A and 216B. it can.

  By electrically connecting the wiring pattern formed on the wiring boards 213, 214, 254, 264, 274 and the metal cap 212, not only the metal cap 212 but also the wiring boards 213, 214, 254, 264, 274 The electronic components 216A and 216B can have a shielding effect and a heat dissipation effect.

  Adhesive layers 215, 255, 265, and 275 are made of the same material as adhesive layers 115 and 155 according to Embodiment 1 shown in FIG. 1A, have the same thickness and shape, and have the same effect.

  In addition, the reliability of the electronic component package 211 can be improved by using a highly reliable member of FR4 grade or FR5 grade for the adhesive layers 215, 255, 265, 275 and the wiring boards 213, 214, 254, 264, 274. .

  When the size of the wiring board 213 is 10 mm × 10 mm or less, the strength of the electronic component package 211 can be ensured with the structure shown in FIG. 6A. When the size of the wiring board 213 exceeds 10 mm × 10 mm, another adhesive layer having the same structure as the adhesive layers 215 and 255 is provided at the center between the adhesive layers 215 and 255 on the upper surface 213A, and the adhesive layer is formed on the adhesive layer. Another wiring board having the same structure as the wiring boards 214 and 254 may be provided. The upper surface of the wiring board comes into contact with the top surface portion 212 </ b> A of the metal cap 212. As a result, the strength of the electronic component package 211 in the thickness direction can be increased. In addition, the rigidity of the electronic component package 211 can be increased by fixing the wiring board and the metal cap 212 with soldering or an adhesive.

  The metal cap 212 is desirably formed of a metal plate having a thickness of 0.1 mm to 1.0 mm. If the thickness is less than 0.1 mm, there is a possibility of deformation during handling. On the other hand, when the thickness exceeds 1.0 mm, it becomes difficult to process the metal plate and the weight increases. In addition to the shielding effect, the metal cap 212 can provide a heat dissipation effect and a heat spread effect. In this case, the shape of the metal cap 212 may be a fin shape, or a heat radiating fin may be attached to the metal cap 212.

  In this case, the through holes 220A and 220B are formed of a member having high thermal conductivity, so that the heat of the wiring board 213 and the electronic components 216A and 216B is sent to the metal cap 212 to effectively dissipate the electronic components 216A and 216B. can do.

  Further, by plating at least a part of the metal cap 212, discoloration of the metal part can be prevented. Further, by performing nickel plating or solder plating, the metal cap 212 can be firmly connected to the wiring boards 214 and 254 with solder.

  In the electronic component package 211, the wiring boards 214 and 254 are fixed to the wiring board 213 through the adhesive layers 215 and 255, respectively, and the metal cap 212 is fixed to the wiring boards 214 and 254. The metal cap 212 is not in contact with the electronic component 216A mounted on the upper surface 213A of the wiring board 213 and is separated. Thereby, since the external force transmitted to the metal cap 212 is not transmitted to the electronic component 216A, no stress is generated in the electronic component 216A, and a small and highly reliable electronic component package 211 is obtained. Further, the height of the electronic component 216 </ b> A or variations in height do not affect the height 217 </ b> C of the metal cap 212 and the height of the electronic component package 211.

(Embodiment 3)
FIG. 9 is an exploded perspective view of the electronic component package 411 according to the third embodiment. The metal cap 412 is formed by bending a metal plate into a U shape by pressing, and has a claw 418. Specifically, the metal cap 412 includes a top surface portion 412A, side surface portions 412B and 412C, and claws 418. The top surface portion 412A has a rectangular shape having sides 1412B and 1412C opposite to each other and sides 1412D and 1412E opposite to each other. The side surface portions 412B and 412C extend downward from the sides 1412B and 1412C of the top surface portion 412A, respectively. The claw 418 extends downward from the side 1412D. The claw 418 is formed by positioning the metal cap 412 when the metal cap 412 is fixed to the wiring board 413 and bending a small protrusion or a part of the metal plate. The claw 418 may have a hook shape.

  A plurality of electronic components 416A are mounted on the upper surface 413A of the wiring board 413. The electronic component 416A is a chip component such as a high-frequency semiconductor or a chip coil, and may be a component that generates electromagnetic noise or is easily affected by surrounding electromagnetic noise.

  A wiring pattern and a solder resist are provided on the upper surface 413A and the lower surface 413B of the wiring board 413. A wiring pattern and a solder resist are provided on the upper surface 414A and the lower surface 414B of the wiring board 414. The electronic component 416A has an external electrode portion connected to the upper surface 413A of the wiring board 413 by soldering.

  The wiring board 414 is fixed to the upper surface 413A at the end 413C of the wiring board 413 through the adhesive layer 415. That is, the adhesive layer 415 is provided on the upper surface 413A of the end 413C of the wiring board 413, and the wiring board 414 is fixed on the adhesive layer 415. The wiring board 454 is fixed to the upper surface 413A at the end 413D opposite to the end 413C of the wiring board 413 through the adhesive layer 455. That is, the adhesive layer 455 is provided on the upper surface 413A of the end portion 413D of the wiring board 413, and the wiring board 454 is fixed on the adhesive layer 455.

  A plurality of electronic components 416B are mounted on the upper surface 453A of the wiring board 453. The electronic component 416B is a chip component such as a high-frequency semiconductor or a chip coil, and may be a component that generates electromagnetic noise or is easily affected by surrounding electromagnetic noise.

  A wiring pattern and a solder resist are provided on the upper surface 453A and the lower surface 453B of the wiring board 453. A wiring pattern and a solder resist are provided on the upper surface 414A and the lower surface 414B of the wiring board 414. A wiring pattern and a solder resist are provided on the upper surface 464A and the lower surface 464B of the wiring board 464. The electronic component 416B has an external electrode portion connected to the upper surface 453A of the wiring board 453 by soldering. The wiring boards 413, 414, 453, and 464 are printed wiring boards, but may be other wiring boards.

  The wiring board 464 is fixed to the upper surface 453A at the end 453C of the wiring board 453 through the adhesive layer 465. That is, the adhesive layer 465 is provided on the upper surface 453A of the end portion 453C of the wiring board 453, and the wiring board 464 is fixed on the adhesive layer 465. The wiring board 474 is fixed to the upper surface 453A at the end 453D opposite to the end 453C of the wiring board 453 through the adhesive layer 475. That is, the adhesive layer 475 is provided on the upper surface 453A of the end portion 453D of the wiring board 453, and the wiring board 474 is fixed on the adhesive layer 475. The wiring boards 414, 454, 464, 474 extend in parallel with each other.

  An adhesive layer 485 is provided on the upper surface 464 A of the wiring board 464. An adhesive layer 495 is laminated on the upper surface 474 A of the wiring board 474. An adhesive layer 485 is provided on the lower surface 413B of the end 413C of the wiring board 413. An adhesive layer 495 is laminated on the lower surface 413B of the end 413D of the wiring board 413. Between the wiring boards 413 and 453, the through holes 420E and 420F formed in the adhesive layers 485 and 495, the electrodes formed in the wiring boards 464 and 474, and the through holes formed in the adhesive layers 465 and 475 are electrically connected. Can be connected.

  FIG. 10A is a perspective view of the electronic component package 411. The top surface portion 412A of the metal cap 412 is located on the upper surface 414A of the wiring board 414 and the upper surface 454A of the wiring board 454, and covers the upper surface 413A of the wiring board 413 and the electronic component 416A. Side portions 412B and 412C of the metal cap 412 extend to the wiring board 453 and surround the electronic component 416B.

  FIG. 10B is a bottom perspective view of the electronic component package 411. A plurality of electrodes 419D are provided on the lower surface 453B of the wiring board 453. The electrode 419D is connected to the motherboard, and the electronic component package 411 is configured to be mounted on the motherboard. The electrode 419D is a Land Grid Array (LGA) or a Fine Pitch LGA (FLGA). Note that the electrode 419D may be a Ball Grid Array (BGA) or a Fine Pitch BGA (FBGA) depending on the application. The electrode 419D can be formed by a copper foil or a solder resist formed on the lower surface 453B of the wiring board 453, and the mounting density of the electronic component package 411 can be increased.

  Next, a method for manufacturing the electronic component package 411 will be described. 11 and 12 are perspective views showing a method for manufacturing the electronic component package 411. FIG.

  Similar to the electronic component package 111 shown in FIG. 3, an adhesive layer 415 having a through hole and a wiring board 414 are laminated. An adhesive layer 455 having a through hole and a wiring board 454 are stacked. Thereafter, the adhesive layers 415 and 455 are laminated on the wiring board 413 with a tool such as a mold or a press. In this way, the wiring boards 413, 414, and 454 are fixed by the adhesive layers 415 and 455 having through holes. Electrodes 432A and 432B are provided on the upper surfaces 414A and 454A of the wiring boards 414 and 454, respectively. The upper surface 413A of the wiring board 413 has an effective area 421 that can be exposed from the adhesive layers 415 and 455 to mount the electronic component 416A. The electronic component 416A is mounted on the effective area 421 of the upper surface 413A of the wiring board 413. By fixing the wiring boards 414 and 454 to the opposite ends 413C and 413D of the wiring board 413 via the adhesive layers 415 and 455, the effective area 421 can be increased, and the adhesive layers 415 and 455 and the wiring The electronic components 416A can be mounted with high density until just before the plates 414 and 454.

  By expanding the effective area 421, the printing area of the solder paste on the upper surface 413A of the wiring board 413 can be increased, the thickness variation of the solder paste can be reduced, and the printing accuracy of the solder paste can be increased. As a result, workability can be improved and the production cost of the electronic component package 411 can be suppressed. The laminated wiring boards 413, 414, and 454 and the adhesive layers 415 and 455 are cut along the dividing line 411A.

  An adhesive layer 465 having a through hole and a wiring board 464 are stacked. An adhesive layer 475 having a through hole and a wiring board 474 are stacked. Thereafter, the adhesive layers 465 and 475 are laminated on the wiring board 453 with a tool such as a die or a press. In this way, the wiring boards 453, 464, and 474 are fixed by the adhesive layers 465 and 475 having through holes. Through holes 420E and 420F are formed by filling the holes formed in the adhesive layers 485 and 495 with a conductive paste. An adhesive layer 485 having a through hole 420E is laminated on the upper surface 464A of the wiring board 464. An adhesive layer 495 having a through hole 420F is laminated on the upper surface 474A of the wiring board 474. Through holes 420E and 420F are exposed on the upper surfaces 485A and 495A of the adhesive layers 485 and 495, respectively. The upper surface 453A of the wiring board 453 has an effective area 421A that can be exposed from the adhesive layers 465 and 475 to mount the electronic component 416B. The electronic component 416B is mounted on the effective area 421A of the upper surface 453A of the wiring board 453. By fixing the wiring boards 464 and 474 to the opposite ends 453C and 453D of the wiring board 453 via the adhesive layers 465 and 475, the effective area 421A can be increased, and the adhesive layers 465 and 475 and the wiring The electronic components 416B can be mounted with high density until just before the plates 464 and 474. By making the wiring boards 414, 454, 464, and 474 smaller than the wiring boards 413 and 453, the effective areas 421 and 421A of the upper surfaces 413A and 453A of the wiring boards 413 and 453 can be increased.

  Note that the adhesive layer 485 and the adhesive layer 465 may be fixed to the upper surface 464A and the lower surface 464B of the wiring board 464, respectively, and the adhesive layer 495 and the adhesive layer 475 may be fixed to the upper surface 474A and the lower surface 474B of the wiring board 474, respectively. Thereafter, adhesive layers 465 and 475 are laminated on the upper surface 453A of the wiring board 453.

  By expanding the effective area 421A, it is possible to increase the printing area of the solder paste on the upper surface 453A of the wiring board 453, reduce the thickness variation of the solder paste, and increase the printing accuracy of the solder paste. As a result, workability can be improved and the production cost of the electronic component package 411 can be suppressed. The laminated wiring boards 453, 464, 474 and the adhesive layers 465, 475, 485, 495 are cut along the dividing line 411B.

  Thereafter, the wiring boards 464 and 474 are laminated on the lower surface 413B of the wiring board 413 through the adhesive layers 485 and 495 having the through holes 420E and 420F, respectively. The adhesive layer 415 has an upper surface 415A and a lower surface 415B opposite to the upper surface 415A. The adhesive layer 455 has an upper surface 455A and a lower surface 455B on the opposite side. The lower surfaces 415B and 455B are located on the upper surface 413A of the wiring board 413. Upper surfaces 415A and 455A are located on lower surfaces 414B and 454B of wiring boards 414 and 454, respectively. The adhesive layer 465 has an upper surface 465A and a lower surface 465B on the opposite side. The adhesive layer 475 has an upper surface 475A and a lower surface 475B on the opposite side. Upper surfaces 465A and 475A are located on lower surfaces 464B and 474B of wiring boards 464 and 474, respectively. The lower surfaces 465B and 475B are located on the upper surface 453A of the wiring board 453. The adhesive layer 485 has an upper surface 485A and a lower surface 485B opposite to the upper surface 485A. The adhesive layer 495 has an upper surface 495A and a lower surface 495B opposite to the upper surface 495A. The lower surfaces 485B and 495B are located on the upper surfaces 464A and 474A of the wiring boards 464 and 474, respectively. The upper surfaces 485A and 495A are located on the lower surface 413B of the wiring board 413.

  FIG. 12 is a perspective view of divided wiring boards 413, 414, 453, 454, 464, 474 and adhesive layers 415, 455, 465, 475, 485, 495. Laminated wiring boards 413, 414, 453, 454, 464, 474 and adhesive layers 415, 455, 465, 475, 485, 495 are cut along the dividing lines 411A, 411B by a mechanical method such as router bits. can do. Alternatively, the wiring boards 413, 414, 453, 454, 464, which are laminated on the wiring boards 413, 414, 453, 454, 464, 474 with slits, V grooves and perforations formed in advance along the dividing lines 411 A, 411 B 474 and adhesive layers 415, 455, 465, 475, 485, 495 may be divided.

  Before dividing the wiring boards 413, 414, 453, 454, 464, 474 and the adhesive layers 415, 455, 465, 475, 485, 495, the electronic component 416A is formed on the upper surfaces 413A, 453 of the wiring boards 413, 453. By mounting 416B, the mounting cost can be suppressed. Even when the wiring boards 413 and 453 are folded and divided, the wiring boards 414, 454, 464 and 474 maintain the rigidity of the wiring boards 413 and 453, so that they are not necessary for the electronic components 416A and 416B when the wiring boards 413 and 453 are cut. It is difficult to generate a significant stress. By the above method, the electronic component package 411 that can reliably shield the electronic components 416A and 416B can be stably manufactured.

  Adhesive layers 415, 455, 465, 475, 485, and 495 are made of the same material as adhesive layers 115 and 155 according to Embodiment 1 shown in FIG. 1A, have the same shape and thickness, and have the same effect.

  The electronic component package 411 can be obtained by using FR4 grade or FR5 grade highly reliable members for the adhesive layers 415, 455, 465, 475, 485, 495 and the wiring boards 413, 414, 453, 454, 464, 474. Can improve the reliability.

  The electronic component package 411 can be obtained by using FR4 grade or FR5 grade highly reliable members for the adhesive layers 415, 455, 465, 475, 485, 495 and the wiring boards 413, 414, 453, 454, 464, 474. Can improve the reliability.

  When the size of the wiring boards 413 and 453 is 10 mm × 10 mm or less, the strength of the electronic component package 411 can be secured with the structure shown in FIG. When the size of the wiring boards 413 and 453 exceeds 10 mm × 10 mm, another adhesive layer having the same structure as the adhesive layers 415 and 455 is provided at the center between the adhesive layers 415 and 455 on the upper surface 413A, and the adhesive layer layer Another wiring board having the same structure as the wiring boards 414 and 454 may be provided thereon. The upper surface of the wiring board contacts the top surface portion 412A of the metal cap 412. Thereby, the strength in the thickness direction of the electronic component package 411 can be increased. Moreover, the rigidity of the electronic component package 411 can be increased by fixing the wiring board and the metal cap 412 by soldering or adhesive.

  The metal cap 412 is desirably formed of a metal plate having a thickness of 0.1 mm to 1.0 mm. If the thickness is less than 0.1 mm, there is a possibility of deformation during handling. On the other hand, when the thickness exceeds 1.0 mm, it becomes difficult to process the metal plate and the weight increases. In addition to the shielding effect, the metal cap 412 can provide a heat dissipation effect and a heat spread effect. In this case, the shape of the metal cap 412 may be a fin shape, or a heat radiating fin may be attached to the metal cap 412.

  Further, in this case, by forming the through holes 420A and 420B with a member having high thermal conductivity, the heat of the wiring boards 413 and 453 and the electronic components 416A and 416B is sent to the metal cap 412, so that the electronic components 416A and 416B are effectively used. Can dissipate heat.

  Further, by plating at least a part of the metal cap 412, discoloration of the metal part can be prevented. Further, by performing nickel plating or solder plating, the metal cap 412 can be firmly connected to the wiring boards 414 and 454 with solder.

  In the electronic component package 411, the wiring boards 414 and 454 are fixed to the wiring board 413 via the adhesive layers 415 and 455, respectively, and the metal cap 412 is fixed to the wiring boards 414 and 454. The metal cap 412 is not in contact with the electronic component 416A mounted on the upper surface 413A of the wiring board 413 and is separated. Thereby, since the external force transmitted to the metal cap 412 is not transmitted to the electronic component 416A, no stress is generated in the electronic component 416A, and a small and highly reliable electronic component package 411 is obtained. Further, the height of the electronic component 416A or variations in height do not affect the height 417C of the metal cap 412 and the height of the electronic component package 411.

(Embodiment 4)
FIG. 13A is a perspective view of electronic component package 311 in the fourth exemplary embodiment. 13B is a cross-sectional view taken along line 13B-13B of the electronic component package 311 shown in FIG. 13A.

  A plurality of electronic components 316 such as semiconductors and chip components are mounted on the upper surface 313A of the wiring board 313.

  A wiring pattern and a solder resist are provided on the upper surface 313A and the lower surface 313B of the wiring board 313. A wiring pattern and a solder resist are provided on the upper surface 314A and the lower surface 314B of the wiring board 314. A wiring pattern and a solder resist are provided on the upper surface 354A and the lower surface 354B of the wiring board 354. The electronic component 316 has an external electrode portion connected to the upper surface 313A of the wiring board 313 by soldering. The wiring boards 313, 314, and 354 are printed wiring boards, but may be other wiring boards.

  The wiring board 314 is fixed to the upper surface 313A at the end 313C of the wiring board 313 via the adhesive layer 315. That is, the adhesive layer 315 is provided on the upper surface 313A of the end portion 313C of the wiring board 313, and the wiring board 314 is fixed on the adhesive layer 315. The wiring board 354 is fixed to the upper surface 313A at the end 313D opposite to the end 313C of the wiring board 313 via the adhesive layer 355. That is, the adhesive layer 355 is provided on the upper surface 313A of the end portion 313D of the wiring board 313, and the wiring board 354 is fixed on the adhesive layer 355. The wiring boards 314 and 354 extend in parallel with each other.

  At least a part of the plurality of electronic components 316 is covered with a filling layer 312 made of resin filled between the wiring boards 314 and 354. By covering the electronic component 316 with the filling layer 312, long-term reliability of the electronic component 316 can be improved.

  The height of the filling layer 312 from the upper surface 313A of the wiring board 313 is preferably equal to or lower than the height of the upper surface 314A of the wiring board 314 from the upper surface 313A of the wiring board 313. Thereby, the filling layer 312 is hardly damaged during handling, and the electronic component packages 311 can be stacked in the thickness direction. Further, with this structure, the liquid resin is dammed by the wiring boards 314 and 354, whereby the thickness of the filling layer 312 made of the resin can be made uniform, and the filling layer 312 can be made thin. The cost can be reduced.

  As described above, the electronic component package 311 is a small Chip Size / Scale Package (CSP) capable of protecting a plurality of electronic components 316 such as semiconductors with the filling layer 312.

  FIG. 14 is a bottom perspective view of the electronic component package 311. A plurality of electrodes 318B are provided on the lower surface 313B of the wiring board 313. The electrode 318B is connected to the motherboard, and the electronic component package 311 is configured to be mounted on the motherboard. The plurality of electrodes 318B illustrated in FIG. 14 are a Land Grid Array (LGA) or a Fine Pitch LGA (FLGA). Depending on the application, the plurality of electrodes 318B may be a Ball Grid Array (BGA) or a Fine Pitch BGA (FBGA). The electrode 318B can be formed by a copper foil or a solder resist formed on the lower surface 313B of the wiring board 313, and the mounting density of the electronic component package 311 can be increased.

  By making the wiring boards 314 and 354 smaller than the wiring board 313, the area where the electronic component 316 can be mounted on the upper surface 313A of the wiring board 313 can be increased.

  When the wiring boards 313, 314, and 354 are made of glass epoxy resin, the filling layer 312 mainly contains an epoxy resin so that the thermal expansion coefficients of the wiring boards 313, 314, and 354 and the filling layer 312 are matched. Can do. Thereby, when the wiring board 313 is thin, for example, even when the wiring board 313 is a four-layer multilayer wiring board having a thickness of 0.6 mm or less, preferably 0.4 mm or less, the wiring board 313 is not warped, and the Warping of the component package 311 can be prevented.

  Next, a method for manufacturing the electronic component package 311 will be described. 15 to 18, 20, and 21 are perspective views illustrating a method for manufacturing the electronic component package 311.

  As shown in FIG. 15, the holes formed in the adhesive layers 315 and 355 are filled with a conductive paste to form through holes 319A and 319B. An adhesive layer 315 having a through hole 319A and a wiring board 314 are stacked. An adhesive layer 355 having a through hole 319B and a wiring board 354 are stacked. Thereafter, the adhesive layers 315 and 355 are laminated on the wiring board 313 with a tool such as a mold or a press. In this manner, the wiring boards 314 and 354 are fixed to the wiring board 313 by the adhesive layers 315 and 355 having the through holes 319A and 319B, respectively. In particular, when the adhesive layers 315 and 355 are not hard solids, the adhesive layers 315 and 355 are previously attached to the wiring board 313 in this way. By fixing the adhesive layers 315 and 355 to the wiring boards 314 and 354 in advance, the adhesive layers 315 and 355 can be easily handled. The adhesive layer 315 has an upper surface 315A and a lower surface 315B on the opposite side. The adhesive layer 355 has an upper surface 355A and a lower surface 355B on the opposite side. The lower surfaces 315B and 355B are located on the upper surface 313A of the wiring board 313. Upper surfaces 315A and 355A are located on lower surfaces 314B and 354B of wiring boards 314 and 354, respectively.

  A plurality of electrodes 318A are formed on the upper surface 313A of the wiring board 313. An electrode 331A is formed on the lower surface 314B of the wiring board 314. An electrode 331B is formed on the lower surface 354B of the wiring board 354. The through hole 319A connects the electrode 318A of the wiring board 313 and the electrode 331A of the wiring board 314. The through hole 319B connects the electrode 318A of the wiring board 313 and the electrode 331B of the wiring board 354.

  The wiring boards 314 and 354 may be simultaneously fixed to the wiring board 313 with adhesive layers 315 and 355 having through holes 319A and 319B. In this way, man-hours can be reduced.

  FIG. 16 is a perspective view of laminated wiring boards 313, 314, and 354 and adhesive layers 315 and 355. FIG. The upper surface 313A of the wiring board 313 has an effective area 320 that is exposed from the adhesive layers 315 and 355 and on which the electronic component 316 can be mounted. The electronic component 316 is mounted on the effective area 320 of the upper surface 313A of the wiring board 313. By fixing the wiring boards 314 and 354 to the opposite ends 313C and 313D of the wiring board 313 via the adhesive layers 315 and 355, the effective area 320 can be increased, and the adhesive layers 315 and 355 and the wiring Electronic components 316 can be mounted with high density until just before the plates 314 and 354.

  By expanding the effective area 320, the printing area of the solder paste on the upper surface 313A of the wiring board 313 can be expanded, the thickness variation of the solder paste can be reduced, and the printing accuracy of the solder paste can be increased. As a result, workability can be improved and the production cost of the electronic component package 311 can be suppressed.

  Electrodes 332A and 332B may be provided on the upper surfaces 314A and 354A of the wiring boards 314 and 354, respectively. By connecting the electrodes 332A and 332B to the motherboard, the electronic component package 311 can be mounted on the motherboard with the upper surface 313A of the wiring board 313 facing the motherboard.

  As shown in FIG. 17, a plurality of electronic components 316 are mounted on the effective area 320 on the upper surface 313 </ b> A of the wiring board 313. Thereafter, at least a part of the electronic component 316 is covered with the filling layer 312.

  FIG. 18 shows a wall 321 for forming the filling layer 312. A cutout 322 is formed in the wall portion 321. As shown in FIG. 18, the wall portion 321 is fixed to the wiring boards 313, 314, and 354. The wall portion 321 is removable from the wiring boards 313, 314, and 354 and can be reused, and the filling layer 312 can be formed efficiently. The effective area 320 of the upper surface 313A of the wiring board 313 is entirely surrounded by the wiring boards 314 and 354, the adhesive layers 315 and 355, and the wall portion 321. A filler to be the filling layer 312 is injected into the effective area 320 of the upper surface 313A of the wiring board 313 surrounded by them.

  19A and 19B are cross-sectional views of the wiring board 313 in which the filler 323 is injected into the effective area 320. The filler 323 is made of a liquid resin such as a silicon resin or an epoxy resin before being cured. The viscosity of the filler 323 is preferably 1 poise or more and 1000 poise or less in the range of the shear rate of 1 / second to 100 / second. A low viscosity filler 323 of less than 1 poise is expensive. In the high-viscosity filler 323 exceeding 1000 poise, bubbles entrained inside the filler 323 are difficult to escape. When the shear rate when measuring the viscosity is less than 1 / second, it is difficult to measure the viscosity because shear stress hardly occurs. When the shear rate exceeds 100 / sec, it is necessary to measure the viscosity with an expensive viscometer with stable rotation during high-speed rotation.

  FIG. 19A shows a large amount of filler 323 filled in the effective area 320 surrounded by the wall portion 321 and the wiring boards 314 and 354. When the filler 323 protrudes above the upper surfaces 314A and 354A of the wiring boards 314 and 354 as described above, the surface of the filler 323 is easily damaged, which affects the reduction in the height of the electronic component package 311. Furthermore, there is a possibility that the filler 323 overflows from the wiring boards 314 and 354, and there is a possibility that the electrode 318B formed on the outer peripheral portion of the electronic component package 311 and the lower surface 313B of the wiring board 313 is soiled.

  A height H301 from the upper surface 313A of the bottom 322A of the notch 322 formed in the wall portion 321 is lower than a height H302 from the upper surface 313A of the upper surfaces 314A and 354A of the wiring boards 314 and 354A. Thereby, excess filler 323 can be discharged from the notch 322 to the outside from the effective area 320, and the height of the filler 323 from the upper surface 313A is made lower than that of the wiring boards 314 and 354 as shown in FIG. 19B. It is possible to prevent the filler 323 from overflowing from the wiring boards 314 and 354. Thereby, as shown in FIG. 14, electrodes 332A and 332B can be formed on the upper surfaces 314A and 354A of the wiring boards 314 and 354, respectively. Thereby, the filler 323 can be easily filled, and the filler 323 can be filled and cured automatically by a machine.

  FIG. 20 shows a filling layer 312 obtained by curing the filler 323. In FIG. 20, the wall portion 321 is removed. By cutting the laminated wiring boards 313, 314, and 354 and the adhesive layers 315 and 355 along the dividing line 311A, a plurality of electronic component packages 311 can be produced collectively.

  FIG. 21 is a perspective view of the divided wiring boards 313, 314, and 354, the adhesive layers 315 and 355, and the filling layer 312. FIG. The wiring boards 313, 314, and 354, the adhesive layers 315 and 355, and the filling layer 312 can be cut by a mechanical method using a router bit or the like. Alternatively, the laminated wiring boards 313, 314, 354 and the adhesive layers 315, 355 may be divided by slits, V grooves, or perforations formed in advance along the dividing line 311A on the wiring boards 313, 314, 354. .

  Adhesive layers 315 and 355 are made of the same material as adhesive layers 115 and 155 according to Embodiment 1 shown in FIG. 1A, have the same thickness and shape, and have the same effect.

  Note that the reliability of the electronic component package 311 can be improved by using a highly reliable member of FR4 grade or FR5 grade for the adhesive layers 315, 355 and the wiring boards 313, 314, 354.

In addition, the reliability of the filling layer 312 can be improved because the filler 323 (filling layer 312) mainly contains a resin such as an epoxy resin or a silicon resin. Note that the filler 323 may contain an inorganic filler such as glass, silicon oxide, or alumina in order to increase the strength of the filler layer 312. The filler 323 may contain a flame retardant such as aluminum hydroxide, thereby making the filler layer 312 flame retardant. Aluminum hydroxide Al (OH) ₃ is a white powder crystal and is stable up to a temperature of about 200 ° C. When the temperature rises above that, dissociation reaction of water of crystallization occurs, and aluminum hydroxide is divided into 66% Al ₂ O ₃ and 34% water, and a large endothermic effect is obtained during this reaction, making the packed bed 312 flame-retardant. To do.

  The electronic component package 311 can be shielded by covering the surface of the electronic component package 311 with a conductor film such as a nickel plating layer.

  In the above embodiment, terms indicating directions such as “upper surface”, “lower surface”, and “downward” indicate relative directions depending on the positions of components of the electronic component package such as a wiring board and an adhesive layer. However, it does not indicate an absolute direction such as a vertical direction.

  Since this electronic component package does not cause unnecessary stress on the electronic component even if the metal cap is distorted, it is useful for a small electronic device that is not easily affected by noise.

112 metal cap 112A top surface portion 112B side surface portion (first side surface portion)
112C Side surface portion (first side surface portion)
113 Wiring board (first wiring board)
113C end (first end)
113D end (second end)
114 Wiring board (second wiring board)
115 Adhesive layer (first adhesive layer)
116 Electronic component (first electronic component)
120A Through hole 154 Wiring board (third wiring board)
155 Adhesive layer (second adhesive layer)
212 Metal cap 212A Top surface portion 212B Side surface portion (first side surface portion)
212C Side surface (first side surface)
213 Wiring board (first wiring board)
213C end (first end)
213D end (second end)
214 Wiring board (second wiring board)
215 Adhesive layer (first adhesive layer)
216A Electronic component (first electronic component)
216B Electronic component (second electronic component)
220A Through hole 254 Wiring board (third wiring board)
255 Adhesive layer (second adhesive layer)
H.264 wiring board (fourth wiring board)
265 Adhesive layer (third adhesive layer)
274 Wiring board (fifth wiring board)
275 Adhesive layer (fourth adhesive layer)
312 Filling layer 313 Wiring board (first wiring board)
313C end (first end)
313D end (second end)
314 Wiring board (second wiring board)
315 Adhesive layer (first adhesive layer)
316 Electronic Component 320A Through Hole 323 Filler 354 Wiring Board (Third Wiring Board)
355 Adhesive layer (second adhesive layer)
412 Metal cap 412A Top surface portion 412B Side surface portion (first side surface portion)
412C Side surface portion (first side surface portion)
413 Wiring board (first wiring board)
413C end (first end)
413D end (second end)
414 Wiring board (second wiring board)
415 Adhesive layer (first adhesive layer)
416A Electronic component (first electronic component)
416B Electronic component (second electronic component)
420A Through hole 453 Wiring board (seventh wiring board)
454 Wiring board (third wiring board)
455 Adhesive layer (second adhesive layer)
464 Wiring board (fourth wiring board)
465 Adhesive layer (fifth adhesive layer)
474 Wiring board (fifth wiring board)
475 Adhesive layer (sixth adhesive layer)
485 Adhesive layer (third adhesive layer)
495 Adhesive layer (fourth adhesive layer)
1112B side (first side)
1212B side (first side)
1412B side (first side)
1112C side (second side)
1212C side (second side)
1412C side (second side)

Claims (8)

A first wiring board;
A first electronic component mounted on the upper surface of the first wiring board;
A first adhesive layer provided on the upper surface of the first wiring board;
A second wiring board smaller than the first wiring board provided on the upper surface of the first adhesive layer;
A second adhesive layer provided on the upper surface of the first wiring board;
A third wiring board smaller than the first wiring board provided on the upper surface of the second adhesive layer;
A metal cap that covers the upper surface of the first wiring board, the second wiring board, the first electronic component, and the third wiring board ;
The first wiring board has a first end and a second end opposite to each other;
The first adhesive layer and the second adhesive layer are provided on the first end and the second end of the first wiring board, respectively.
The metal cap is
A top surface portion having a first side and a second side opposite to each other in contact with the upper surfaces of the second wiring board and the third wiring board;
Extending downward from the first side of the top surface portion, the total height of the first wiring board, the first adhesive layer, and the second wiring board; and the first wiring board; A first side surface portion having a height equal to or lower than a total height of the second adhesive layer and the third wiring board;
A total height of the first wiring board, the first adhesive layer, and the second wiring board; and the first wiring board, extending downward from the second side of the top surface portion. A second side surface portion having a height equal to or less than a total height of the second adhesive layer and the third wiring board;
Having an electronic component package. The electronic component package according to claim 1, wherein the first adhesive layer has a through hole that electrically connects the first wiring board and the second wiring board. The electronic component package according to claim 1, wherein the first adhesive layer includes a thermosetting resin and an inorganic filler and has a sheet shape having a thickness of 30 μm or more and 300 μm or less. And a second electronic component mounted on the lower surface of the front Symbol first wiring board,
A third adhesive layer provided on the lower surface of the first wiring board;
The fourth wiring board provided on the lower surface of the third adhesive layer;
Further electronic component package according to claim 1 comprising a. A fourth adhesive layer provided on the lower surface of the first wiring board;
The fifth wiring board provided on the lower surface of the fourth adhesive layer;
Further comprising
The third adhesive layer and the fourth adhesive layer are provided on the first end and the second end of the first wiring board, respectively.
The electronic component package according to claim 4 . A third adhesive layer provided before SL on the lower surface of the first wiring board,
A fourth wiring board provided on the lower surface of the third adhesive layer;
A fourth adhesive layer provided on the lower surface of the first wiring board;
A fifth wiring board provided on the lower surface of the fourth adhesive layer;
A fifth adhesive layer provided on the lower surface of the fourth wiring board;
A sixth adhesive layer provided on the lower surface of the fifth wiring board;
A seventh wiring board provided on the lower surface of the fifth adhesive layer and on the lower surface of the sixth adhesive layer;
A second electronic component mounted on the upper surface of the seventh wiring board;
Further electronic component package according to claim 1 comprising a. Fixing a second wiring board smaller than the first wiring board through a first adhesive layer on an upper surface of the first wiring board;
Fixing a third wiring board smaller than the first wiring board via a second adhesive layer on the upper surface of the first wiring board;
Mounting a first electronic component on the top surface of the first wiring board;
And a step of covering with the first of said upper surface and said second wiring board and the first electronic component third metal cap and a wiring board of the wiring board,
The first wiring board has a first end and a second end opposite to each other;
The first adhesive layer and the second adhesive layer are provided on the first end and the second end of the first wiring board, respectively.
The metal cap is
A top surface portion having a first side and a second side opposite to each other in contact with the upper surfaces of the second wiring board and the third wiring board;
Extending downward from the first side of the top surface portion, the total height of the first wiring board, the first adhesive layer, and the second wiring board; and the first wiring board; A first side surface portion having a height equal to or lower than a total height of the second adhesive layer and the third wiring board;
A total height of the first wiring board, the first adhesive layer, and the second wiring board; and the first wiring board, extending downward from the second side of the top surface portion. A second side surface portion having a height equal to or less than a total height of the second adhesive layer and the third wiring board;
Electronic component package manufacturing method. Fixing a fourth wiring board smaller than the first wiring board via a third adhesive layer on the lower surface of the first wiring board;
Mounting a second electronic component on the lower surface of the first wiring board;
The method of manufacturing an electronic component package according to claim 7 , further comprising:

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