JPH04304694A - Manufacture of metal base wiring board - Google Patents
Manufacture of metal base wiring boardInfo
- Publication number
- JPH04304694A JPH04304694A JP9629091A JP9629091A JPH04304694A JP H04304694 A JPH04304694 A JP H04304694A JP 9629091 A JP9629091 A JP 9629091A JP 9629091 A JP9629091 A JP 9629091A JP H04304694 A JPH04304694 A JP H04304694A
- Authority
- JP
- Japan
- Prior art keywords
- metal base
- metal
- fiber sheet
- insulating layer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 81
- 239000002184 metal Substances 0.000 title claims abstract description 81
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000835 fiber Substances 0.000 claims abstract description 33
- 239000011888 foil Substances 0.000 claims abstract description 21
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 16
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000011342 resin composition Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 12
- 239000011889 copper foil Substances 0.000 abstract description 10
- 229910052782 aluminium Inorganic materials 0.000 abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 8
- 239000011256 inorganic filler Substances 0.000 abstract description 7
- 229910003475 inorganic filler Inorganic materials 0.000 abstract description 7
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000005470 impregnation Methods 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 description 20
- 239000011347 resin Substances 0.000 description 20
- 230000017525 heat dissipation Effects 0.000 description 8
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N Bisphenol A Natural products C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- MTEOMEWVDVPTNN-UHFFFAOYSA-E almagate Chemical compound O.O.[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Al+3].[O-]C([O-])=O MTEOMEWVDVPTNN-UHFFFAOYSA-E 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- -1 bisphenol A glycidyl ethers Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、絶縁層を介して金属ベ
ースの上に金属箔を貼り合わせた金属ベース配線基板の
製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a metal base wiring board in which a metal foil is laminated onto a metal base via an insulating layer.
【０００２】0002
【従来の技術】近年、電子機器の軽量、薄型、高密度化
が進み、これに使用される電子部品の高密度化に伴って
、単位面積あたりの発熱量は著しく増大している。その
ため、これらの電子部品を実装する配線基板も耐熱性及
び放熱性に優れたものが要求されている。これらの要求
を満足するものとして、最近では鉄、銅、アルミニウム
等の高熱伝導性を有する金属板をベースとしたプリント
配線板が用いられるようになっている2. Description of the Related Art In recent years, electronic devices have become lighter, thinner, and more dense, and as electronic components used in these devices have become more dense, the amount of heat generated per unit area has increased significantly. Therefore, wiring boards on which these electronic components are mounted are also required to have excellent heat resistance and heat dissipation. Recently, printed wiring boards based on metal plates with high thermal conductivity such as iron, copper, and aluminum have been used to meet these demands.
【０００３】従来
の金属ベース配線基板の製造方法としては、金属ベース
と銅箔を樹脂絶縁層で接着し、銅箔を必要部分のみ選択
的に残して、他の部分をエッチングにより溶解除去し、
回路パターンを形成するサブトラクティブ法がある。ま
た、金属ベース上に樹脂絶縁層を形成し、その樹脂絶縁
層の上に化学メッキによって回路パターンを形成するフ
ルアディティブ法や、前記樹脂絶縁層の上に化学メッキ
と電解メッキの組み合わせにより回路パターンを形成す
るセミアディティブ法が知られている。[0003] Conventional methods for manufacturing metal-based wiring boards include bonding a metal base and copper foil with a resin insulating layer, selectively leaving only the necessary portions of the copper foil, and dissolving and removing other portions by etching.
There is a subtractive method for forming circuit patterns. In addition, a fully additive method in which a resin insulating layer is formed on a metal base and a circuit pattern is formed on the resin insulating layer by chemical plating, or a circuit pattern is formed on the resin insulating layer by a combination of chemical plating and electrolytic plating. A semi-additive method for forming is known.
【０００４】サブトラクティブ法による金属ベース配線
基板にしろ、アディティブ法（フルアディティブ法及び
セミアディティブ法）による金属ベース配線基板にしろ
、金属ベースと銅箔との間の絶縁性を確保しなければな
らないから、金属ベース上に耐電圧性の高い材料により
絶縁層を形成する技術は重要であり、通常絶縁層として
はエポキシ樹脂のような樹脂材料が用いられている。[0004]Whether it is a metal-based wiring board made by the subtractive method or a metal-based wiring board made by the additive method (full additive method and semi-additive method), insulation between the metal base and the copper foil must be ensured. Therefore, the technique of forming an insulating layer using a material with high voltage resistance on a metal base is important, and usually a resin material such as epoxy resin is used as the insulating layer.
【０００５】しかしながら、金属ベースと銅箔をエポキ
シ樹脂のような樹脂絶縁層により接着した場合、回路パ
ターンを形成する銅箔から金属ベースへの熱伝導性が悪
くなり、金属ベース配線基板の特徴とする高放熱性を生
かすことができない。そこで、本発明の発明者は銅箔か
ら金属ベースへの熱伝導性を高め、金属ベースの高放熱
性を生かすため、絶縁層中に無機充填剤を添加した金属
ベース配線基板を案出した（特願平２−１６５３３４号
、出願日：平成２年６月２２日）。この無機充填剤とし
てはアルミナ粉体等が使用されているが、絶縁層中に均
一に分散させることが難しく、放熱性のムラが発生する
恐れがあり、また、絶縁層中に高充填すると粘度が増大
して塗布作業が困難になるという欠点があった。また、
この無機充填剤を添加された樹脂材料を金属ベースの表
面に塗布するためにはドクターブレード法等によらなけ
ればならず、絶縁層の膜厚精度を出しにくく、厚み精度
の高い金属ベース配線基板を得にくかった。However, when a metal base and copper foil are bonded together using a resin insulating layer such as epoxy resin, the thermal conductivity from the copper foil forming the circuit pattern to the metal base deteriorates, which is a disadvantage of the characteristics of metal-based wiring boards. It is not possible to take advantage of the high heat dissipation properties. Therefore, the inventor of the present invention devised a metal-based wiring board in which an inorganic filler is added to the insulating layer in order to increase the thermal conductivity from the copper foil to the metal base and take advantage of the high heat dissipation properties of the metal base ( Japanese Patent Application No. 165334 (Hei 2-165334, filing date: June 22, 1990). Alumina powder is used as this inorganic filler, but it is difficult to uniformly disperse it in the insulating layer, which may cause uneven heat dissipation, and if it is filled to a high level in the insulating layer, the viscosity increases. There was a drawback that the amount increased, making the coating work difficult. Also,
In order to apply this inorganic filler-added resin material to the surface of a metal base, it is necessary to use a doctor blade method, etc., which makes it difficult to achieve film thickness accuracy of the insulating layer, and metal-based wiring boards with high thickness accuracy. It was difficult to obtain.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、叙上の従来
例の欠点及び先願発明に鑑みてなされたものであり、そ
の目的とするところは、絶縁層中に無機充填剤を均一に
高充填することができ、しかも、絶縁層の厚み精度の高
い金属ベース配線基板の製造方法を提供することにある
。[Problems to be Solved by the Invention] The present invention has been made in view of the drawbacks of the conventional examples mentioned above and the invention of the prior application, and its object is to uniformly distribute an inorganic filler in an insulating layer. It is an object of the present invention to provide a method for manufacturing a metal-based wiring board that can be highly filled and has a highly accurate thickness of an insulating layer.
【０００７】[0007]
【課題を解決するための手段】本発明の金属ベース配線
基板の製造方法は、熱硬化性樹脂組成物を含浸させたア
ルミナ繊維シートを金属ベースの上に敷き、前記樹脂含
浸アルミナ繊維シートの上に金属箔を重ね、金属ベース
と前記樹脂含浸アルミナ繊維シートと金属箔とを加熱加
圧することにより前記樹脂含浸アルミナ繊維シートを介
して金属ベースと金属箔を貼り合わせることを特徴とし
ている。[Means for Solving the Problems] The method for manufacturing a metal-based wiring board of the present invention includes the steps of: spreading an alumina fiber sheet impregnated with a thermosetting resin composition on a metal base; The method is characterized in that the metal base and the metal foil are bonded to each other via the resin-impregnated alumina fiber sheet by overlapping the metal foil and heating and pressurizing the metal base, the resin-impregnated alumina fiber sheet, and the metal foil.
【０００８】[0008]
【作用】本発明にあっては、熱硬化性樹脂からなる絶縁
層中にアルミナ繊維シートを充填しているので、アルミ
ナ繊維シートを通して金属箔から金属ベースへ熱を伝え
ることができ、金属ベース配線基板の放熱性を高めるこ
とができる。しかも、無機充填剤としてアルミナ繊維シ
ートを用いているので、無機充填剤を絶縁層中に均一に
分散させることができ、充填ムラによって部分的に放熱
性の悪い部分が生じることがない。また、絶縁層中に無
機充填剤を高密度で充填させることができ、金属箔から
金属ベースへの熱伝導性を極めて良好にでき、金属ベー
ス配線基板の放熱性をより高くすることができる。さら
に、均一な厚みのアルミナ繊維シートを用いることによ
って絶縁層の膜厚精度を高くすることができ、厚み精度
の高い金属ベース配線基板を得ることができる。また、
熱硬化性樹脂を含浸されたアルミナ繊維シートを金属ベ
ースと金属箔の間に挟むだけでよいので、金属ベース配
線基板の量産性を高めることができる。[Function] In the present invention, since the alumina fiber sheet is filled in the insulating layer made of thermosetting resin, heat can be transferred from the metal foil to the metal base through the alumina fiber sheet, and the metal base wiring The heat dissipation of the substrate can be improved. Furthermore, since an alumina fiber sheet is used as the inorganic filler, the inorganic filler can be uniformly dispersed in the insulating layer, and uneven filling will not cause parts with poor heat dissipation. Furthermore, the inorganic filler can be filled in the insulating layer at a high density, and the thermal conductivity from the metal foil to the metal base can be made extremely good, making it possible to further improve the heat dissipation performance of the metal-based wiring board. Furthermore, by using an alumina fiber sheet with a uniform thickness, the thickness accuracy of the insulating layer can be increased, and a metal-based wiring board with high thickness accuracy can be obtained. Also,
Since it is only necessary to sandwich the alumina fiber sheet impregnated with a thermosetting resin between the metal base and the metal foil, the mass productivity of metal-based wiring boards can be improved.
【０００９】[0009]
【実施例】図１は本発明による金属ベース配線基板の製
造方法を示す断面図である。金属ベース１の材質は特に
限定されず、鉄、銅などでもよいが、軽量で加工の容易
なアルミニウムが望ましい。アルミナ繊維シート２は高
純度アルミナを用いたアルミナ繊維織布やアルミナ繊維
不織布が好ましく、特に限定しないが、純度９９．５％
以上のα−Ａｌ２Ｏ３を用いたアルミナ繊維織布が好適
である。アルミナ繊維含浸用の熱硬化性樹脂３について
も特に限定しないが、耐熱性、耐湿性、耐電圧性に優れ
たビスフェノールＡ型グリシジルエーテル類、クレゾー
ルノボラック類、フェノールノボラック類を始めとする
エポキシ樹脂と、アミン系、酸無水物系、潜在性硬化剤
等のいずれかとを必要当量混合し、有機溶剤で希釈した
ものを使用するとよい。しかして、均一な厚みのアルミ
ナ繊維シート２を含浸用熱硬化性樹脂３に浸漬させ、こ
れを金属ベース１の上面に重ねて敷き、アルミナ繊維シ
ート２の上に銅箔等の金属箔５を重ね、金属ベース１と
金属箔５とを加熱加圧する。これによってアルミナ繊維
シート２に含浸させられている熱硬化性樹脂３が硬化し
、金属ベース１と金属箔５とが熱硬化性樹脂３によって
接着される。そして、金属ベース１と金属箔５の間に熱
硬化性樹脂３とアルミナ繊維シート２とからなる均一な
厚みの絶縁層４が形成される。この絶縁層４は、内部に
アルミナ繊維シート２を充填されているので、熱伝導性
に優れ、金属箔５からなる回路パターンから金属ベース
１へ効率よく熱を伝え、金属ベース１から熱を放散させ
る。また、アルミナ繊維シート２を用いることにより、
絶縁層４中にアルミナ繊維シート２を均一に、かつ高密
度に分布させることができるので、金属ベース配線基板
の全体にわたって金属箔５から金属ベース１へ均一に、
より効率的に熱を伝えることができる。さらに、絶縁層
４にアルミナ繊維シート２を充填させているので、絶縁
層の機械的強度も高くなる。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a sectional view showing a method of manufacturing a metal base wiring board according to the present invention. The material of the metal base 1 is not particularly limited, and may be iron, copper, etc., but aluminum is preferable because it is lightweight and easy to process. The alumina fiber sheet 2 is preferably an alumina fiber woven fabric or alumina fiber nonwoven fabric using high-purity alumina, and is not particularly limited, but has a purity of 99.5%.
An alumina fiber woven fabric using the above α-Al2O3 is suitable. The thermosetting resin 3 for impregnating alumina fibers is not particularly limited, but may include epoxy resins such as bisphenol A glycidyl ethers, cresol novolacs, and phenol novolacs, which have excellent heat resistance, moisture resistance, and voltage resistance. , an amine type, an acid anhydride type, a latent curing agent, etc. in the required equivalent amount and diluted with an organic solvent. Then, an alumina fiber sheet 2 of uniform thickness is dipped in a thermosetting resin 3 for impregnation, and this is laid over the top surface of the metal base 1, and a metal foil 5 such as copper foil is placed on the alumina fiber sheet 2. The metal base 1 and the metal foil 5 are overlapped and heated and pressurized. As a result, the thermosetting resin 3 impregnated into the alumina fiber sheet 2 is cured, and the metal base 1 and the metal foil 5 are bonded together by the thermosetting resin 3. Then, an insulating layer 4 of uniform thickness made of thermosetting resin 3 and alumina fiber sheet 2 is formed between metal base 1 and metal foil 5. Since this insulating layer 4 is filled with alumina fiber sheet 2 inside, it has excellent thermal conductivity, efficiently transmits heat from the circuit pattern made of metal foil 5 to metal base 1, and radiates heat from metal base 1. let In addition, by using the alumina fiber sheet 2,
Since the alumina fiber sheet 2 can be uniformly and densely distributed in the insulating layer 4, it can be distributed uniformly from the metal foil 5 to the metal base 1 over the entire metal base wiring board.
Heat can be transferred more efficiently. Furthermore, since the insulating layer 4 is filled with the alumina fiber sheet 2, the mechanical strength of the insulating layer is also increased.
【００１０】次に、具体的に製作した本発明の実施例を
従来例１及び２と比較して説明する。（実施例）まず、
以下のようにして実施例の金属ベース配線基板を製作し
た。アルミナ繊維シートとしてα−Ａｌ２Ｏ３純度９９
．５％、密度３．６ｇ／ｃｍ３、厚み２５０ｍｍのアル
マックスクロス（商品名：鐘紡株式会社製）を用い、こ
のアルミナ繊維シートをエポキシ当量４５０〜５００の
ビスフェノールＡ型グリシジルエーテル１００重量部、
キシレン溶媒２０重量部、ジシアンジアミド５重量部、
イミダゾール系触媒１重量部からなる熱硬化性樹脂溶液
中に浸漬し、１００℃で１時間加熱した。ついで、トリ
クロロエタンで表面を脱脂した厚さ１ｍｍのアルミニウ
ム板の上に樹脂を含浸させたアルミナ繊維シートを置き
、これをアルミニウム板と厚さ３５μｍの銅箔で挟み、
５０ｋｇ／ｍｍ２の圧力を加えながら１８０℃で１時間
加熱プレスし、実施例の銅張り金属ベース配線基板を得
た。Next, a specifically manufactured embodiment of the present invention will be explained in comparison with conventional examples 1 and 2. (Example) First,
The metal base wiring board of the example was manufactured in the following manner. α-Al2O3 purity 99 as alumina fiber sheet
．． 5%, density 3.6 g/cm3, thickness 250 mm Almax cloth (product name: Kanebo Co., Ltd.) was used, and this alumina fiber sheet was treated with 100 parts by weight of bisphenol A glycidyl ether having an epoxy equivalent of 450 to 500,
20 parts by weight of xylene solvent, 5 parts by weight of dicyandiamide,
It was immersed in a thermosetting resin solution containing 1 part by weight of an imidazole catalyst and heated at 100° C. for 1 hour. Next, an alumina fiber sheet impregnated with resin was placed on a 1 mm thick aluminum plate whose surface had been degreased with trichloroethane, and this was sandwiched between the aluminum plate and a 35 μm thick copper foil.
Heat pressing was performed at 180° C. for 1 hour while applying a pressure of 50 kg/mm 2 to obtain a copper-clad metal base wiring board of the example.
【００１１】（従来例１）厚さ１ｍｍのアルミニウム板
の表面に、エポキシ当量４５０〜５００のビスフェノー
ルＡ型グリシジルエーテル１００重量部、キシレン溶媒
２０重量部、ジシアンジアミド５重量部、イミダゾール
系触媒１重量部からなる熱硬化性樹脂溶液をドクターブ
レード法によって１００μｍの厚さに塗布し、１００℃
で１時間乾燥させた。この上に厚さ３５μｍの銅箔を重
ね、上記実施例と同じ条件下で加熱プレスし、従来例１
の銅張り金属ベース配線基板を得た。(Conventional Example 1) 100 parts by weight of bisphenol A type glycidyl ether having an epoxy equivalent of 450 to 500, 20 parts by weight of xylene solvent, 5 parts by weight of dicyandiamide, and 1 part by weight of imidazole catalyst are placed on the surface of a 1 mm thick aluminum plate. A thermosetting resin solution consisting of was applied to a thickness of 100 μm using a doctor blade method, and
It was dried for 1 hour. A copper foil with a thickness of 35 μm was placed on top of this and hot pressed under the same conditions as in the above example.
A copper-clad metal-based wiring board was obtained.
【００１２】（従来例２）従来例１で用意した絶縁層形
成用の熱硬化性樹脂溶液に、平均粒径０．５μｍ、純度
９９．８％のアルミナ粉末を樹脂分１００容量％に対し
て３０容量％添加し、これを攪拌してアルミナ粉末を分
散させた後、従来例１と同様の処理ないし操作を経て従
来例２の銅張り金属ベース配線基板を得た。(Conventional Example 2) Alumina powder with an average particle size of 0.5 μm and a purity of 99.8% was added to the thermosetting resin solution for forming an insulating layer prepared in Conventional Example 1 based on the resin content of 100% by volume. After adding 30% by volume and stirring to disperse the alumina powder, the same treatment or operation as in Conventional Example 1 was carried out to obtain a copper-clad metal base wiring board of Conventional Example 2.
【００１３】上記のようにして製作された従来例１、従
来例２及び実施例の各金属ベース配線基板について、各
々の熱伝導度、絶縁層膜厚精度、絶縁層無機物含有量、
引張強度を調べた。この結果を表１に示す。Regarding each of the metal base wiring boards of Conventional Example 1, Conventional Example 2, and Example manufactured as described above, each thermal conductivity, insulating layer thickness accuracy, insulating layer inorganic content,
The tensile strength was examined. The results are shown in Table 1.
【００１４】[0014]
【表１】[Table 1]
【００１５】表１より明らかなように、本発明の実施例
では、従来例１及び２に比較して各特性の良好な金属ベ
ース配線基板を得ることができた。特に、実施例によれ
ば、絶縁層膜厚精度及び引張強度が従来例に比べて著し
く改善される。As is clear from Table 1, in the example of the present invention, it was possible to obtain a metal-based wiring board with better characteristics than in conventional examples 1 and 2. In particular, according to the example, the thickness accuracy and tensile strength of the insulating layer are significantly improved compared to the conventional example.
【００１６】[0016]
【発明の効果】本発明によれば、絶縁層を介して金属箔
から金属ベースへ伝わる熱伝導性を極めて良好にするこ
とができ、金属ベース配線基板の特徴とする高放熱性を
極めて高めることができる。また、絶縁層の膜厚精度を
高めることができるので、厚み精度の高い金属ベース配
線基板を製作することができる。さらに、絶縁層材料も
液状でなくシート状物として取り扱うことができるので
、量産性が向上する。さらに、絶縁層にアルミナ繊維シ
ートが充填されているので、絶縁層の機械的強度も向上
する。[Effects of the Invention] According to the present invention, the heat conductivity transmitted from the metal foil to the metal base through the insulating layer can be made extremely good, and the high heat dissipation characteristic of the metal-based wiring board can be extremely improved. Can be done. Furthermore, since the thickness accuracy of the insulating layer can be improved, a metal-based wiring board with high thickness accuracy can be manufactured. Furthermore, since the insulating layer material can be handled as a sheet rather than a liquid, mass productivity is improved. Furthermore, since the insulating layer is filled with alumina fiber sheets, the mechanical strength of the insulating layer is also improved.
【図１】本発明の一実施例を示す概略断面図である。FIG. 1 is a schematic cross-sectional view showing one embodiment of the present invention.
１ 金属ベース ２ アルミナ繊維シート ３ 熱硬化性樹脂 ４ 絶縁層 ５ 金属箔 1 Metal base 2 Alumina fiber sheet 3 Thermosetting resin 4 Insulating layer 5 Metal foil
Claims (1)
ミナ繊維シートを金属ベースの上に敷き、前記樹脂含浸
アルミナ繊維シートの上に金属箔を重ね、金属ベースと
前記樹脂含浸アルミナ繊維シートと金属箔とを加熱加圧
することにより前記樹脂含浸アルミナ繊維シートを介し
て金属ベースと金属箔を貼り合わせることを特徴とする
金属ベース配線基板の製造方法。1. An alumina fiber sheet impregnated with a thermosetting resin composition is spread on a metal base, a metal foil is placed on the resin-impregnated alumina fiber sheet, and the metal base and the resin-impregnated alumina fiber sheet are bonded together. A method for manufacturing a metal base wiring board, which comprises bonding a metal base and metal foil together via the resin-impregnated alumina fiber sheet by heating and pressurizing the metal foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9629091A JPH04304694A (en) | 1991-04-01 | 1991-04-01 | Manufacture of metal base wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9629091A JPH04304694A (en) | 1991-04-01 | 1991-04-01 | Manufacture of metal base wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04304694A true JPH04304694A (en) | 1992-10-28 |
Family
ID=14160945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9629091A Pending JPH04304694A (en) | 1991-04-01 | 1991-04-01 | Manufacture of metal base wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04304694A (en) |
-
1991
- 1991-04-01 JP JP9629091A patent/JPH04304694A/en active Pending
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