JPH04304693A - Chip package and composite chip package - Google Patents

Abstract

PURPOSE:To make it possible to connect chip components without strain induced by a thermal cycle by laying out each terminal of a chip component in face- shape and bonding each terminal with a flexible board. CONSTITUTION:There are provide chip components 101, such as an IC, a resistor, a capacitor, and a coil. A sealing resin integrates each chip components 101, and hence forms one piece component 105 having a bump 103 attached to the terminal of each chip component 101. Each terminal of the chip components 101 is integrally laid out in face shape and bonded with a flexible board 106. This construction makes it possible to eliminate thermal strain produced by a thermal cycle and provide a reliable bonding performance and enhance a heat emission performance more satisfactorily if a further attempt is made to integrate the chip components 101, using a good conductor sheet.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module mounted with chip components.

0002

BACKGROUND OF THE INVENTION In recent years, the number of functions that can be achieved with electrical circuits has increased significantly, and as a result, electrical circuits have become more complex and the number of electrical components used in them has increased considerably. As a result, wiring boards have become more complex, and miniaturization has also been required. In order to meet such demands, a mounting method (packaging method) called a multi-chip module has recently been proposed. This device has multiple chips (ICs and chip components) mounted on one circuit board (usually a multilayer board) and housed in one package, so that they form one functional block. It is generally designed. A plurality of these functional blocks are mounted on a single circuit board (single layer or multilayer) together with a carrier IC chip and chip components to form a single system.

[0003] In order to reduce the size and cost, bare IC chips (bare chips) are increasingly being mounted face down.

0004

[Problems to be Solved by the Invention] However, mounting bare chips face-down has the problem of connection failure due to distortion during thermal cycling, and the inability to mount ICs that generate heat due to poor heat conduction. .

[0005]

[Means for Solving the Problems] In order to solve the above problem, the present invention arranges and integrates the terminals of the chip components so that they are lined up in a plane, and connects the terminals with a flexible substrate. .

[0006]

[Operation] Therefore, not only can a reliable connection be obtained without thermal distortion due to thermal cycles, but also heat dissipation characteristics can be improved if the chip components are integrated using a plate made of a good thermal conductor.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a chip package according to the present invention will be described below with reference to the drawings. (FIG. 1) is a sectional view of a chip mounting body of the present invention.

In (FIG. 1), 101 is an IC, a resistor,
Chip parts such as capacitors and coils. 102 is a sealing resin that integrates each chip component 101;
An integrated component 105 is formed. Reference numeral 103 denotes bumps attached to terminals (IC input/output pads, etc.) of each chip component. The terminals of the chip section are arranged and integrated so that they are lined up in a plane.

Reference numeral 104 represents an electrical bonding material such as solder or conductive adhesive. Reference numeral 106 is a multilayer flexible board, which is constructed of many layers with conductor wiring 108 supported by an insulating sheet 107, and each terminal is connected. The conductor wiring 108 of each layer is connected through a via hole 109 filled with a conductor. In the chip mounted body having this configuration, since the substrate is flexible, there is little distortion due to thermal cycles between the substrate and the integrated components, and the reliability is high.

[0010] In this embodiment, the integrated component was mounted only on one side of the multilayer flexible board, but it goes without saying that it can be mounted on both sides. Further, even if it is mounted on one side, it is also possible to mount a plurality of integrated parts. Also,
It is also possible to leave a part of the flexible substrate as a connection terminal and wrap the entire flexible substrate with resin or the like.

[0011] In this embodiment, a multi-layer flexible substrate is used, but of course, the effects of the present invention are not lost even with a single-layer flexible substrate. Further, it is also possible to fill the space between the integrated component 105 and the flexible substrate 106 with resin or the like for reinforcement or protection.

[0012] It is preferable that this resin is softer to suppress the occurrence of distortion. (FIG. 2) is another embodiment of the invention. In this embodiment, a plurality of chip components are embedded in resin and integrated, each terminal is exposed on two upper and lower surfaces, and each terminal on the same surface is joined by two upper and lower flexible substrates. In (FIG. 2), 205 is an integrated component, which consists of a chip component 201, a resin 202, and a bump 203. 206 is a flexible substrate, and an insulating sheet 20
7, a conductor wiring 208, and a via hole 209. The integrated component 205 and the flexible multilayer substrate are electrically connected using a bonding agent 204. It is also possible to connect the upper and lower flexible multilayer substrates on the outside. With such a chip mounting body, high-density three-dimensional mounting can be realized.

FIG. 3 shows another embodiment. Most of them (
It is the same as the one in FIG. 1), except that a good heat conductor 301 made of metal or the like is placed on the back side of the chip component 101. This is an effective configuration for mounting a power chip. This idea can also be applied to the configuration shown in FIG. 2, and the chip component 201 can be attached to both sides of a good heat conductor, and the configuration shown in FIG. 2 can be adopted.

[0014] The flexible substrate is generally made of a polyimide sheet covered with copper foil and etched with wiring. Different sheet materials are also known. In addition, there is also a flexible substrate in which a conductor sintered on a releasable substrate is transferred to a resin sheet, as in the embodiment described later.

[0015] A plurality of the chip mounts described so far can be combined to form another composite chip mount as if they were integrated. (Figure 4) shows its configuration. In (FIG. 4), 401 is a chip mounting body as described in (FIG. 1) and (FIG. 3). 402 is a bump attached to the input/output terminal of the chip mounting body 401. 406 is an individual chip component of the carrier. These parts are integrated with resin 404. Reference numeral 405 is a wiring board, which electrically connects each chip mounting body and individual chip components. 403 is an electrical bonding agent such as solder.

(Example 1) Two test ICs having 64 pads, all of which were short-circuited with a pad spacing of 200 μm, were provided with gold bumps by wire bonding, and further soldered by dipping. Two ICs were placed face down on a releasable flat plate, epoxy resin was poured over the top, cured, and peeled off from the substrate. This was cut and formed into a rectangular parallelepiped. The solder bump surfaces were carefully polished so that all bumps on the two test ICs were exposed to the polished surface, creating an integrated part. The size was approximately 10 x 10 mm.

Next, a sinterable conductive paste material having the following composition was applied to a flattened hexagonal boron nitride plate (TG grade manufactured by Denka Co., Ltd.) with the following composition: Cu 79.9 CuO 2.55 Glass powder 2.55 Vehicle 15.0 Total 100.00wt% Width 300μ
Screen printing was performed on striped lines of m. This conductor paste was prepared by kneading the above-mentioned inorganic composition with a vehicle in which ethyl cellulose was dissolved in terpineol using a three-stage roll.

After drying this at 120° C. for 10 minutes, it was fired in a mesh belt furnace in a nitrogen atmosphere. The conditions were 900°C for 10 minutes and 6 hours from loading to unloading.
It was 0 minutes. As a result, the pattern of the sintered conductor (sintered copper)
The pattern could be formed with high accuracy without peeling off from the substrate. The pattern width of the sintered conductor was approximately 300 μm, with almost no shrinkage in the width direction, and the thickness of the sintered conductor was approximately 15 μm.

Polyimide sheet with epoxy adhesive (
A coverlay sheet for FPC manufactured by Toray Industries, Inc. (hereinafter simply referred to as polyimide sheet) was layered on the sintered conductor, and then heated and pressurized to 160°C. After cooling, the polyimide sheet is peeled off, and the sintered conductor is glued to the polyimide sheet.
I got a flexible board.

[0020] Solder paste was printed on the necessary parts of this flexible substrate, and after drying, it was reflowed.

The exposed bump portion of the integrated component and the solder portion of the flexible substrate were aligned and pressed and heated to obtain a chip mount for testing. All terminals were securely connected and withstood 500 thermal cycles from -20°C to 100°C.

[0022]

[Effects of the Invention] By using the present invention, it is possible to bond chip components without distortion due to thermal cycles, which not only has good reliability but also has a compact shape, robustness, and unprecedented mounting.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a chip package according to the present invention.

FIG. 2 is a sectional view of another chip mounting body of the present invention.

FIG. 3 is a sectional view of another chip mounting body of the present invention.

FIG. 4 is a cross-sectional view of the composite chip package of the present invention.

[Explanation of symbols]

101, 201 Chip parts 102, 202, 404 Resin 103, 203, 402 Bump 104, 204, 403 Bonding agent 105, 205 Integrated parts 106, 206 Flexible board 107, 207 Insulation sheet 108, 208 Conductor wiring 109 Beer Hall 405 Wiring board 406 Individual chip parts

Claims (12)

[Claims] 1. A chip mounting body characterized in that each terminal of a chip component is arranged and integrated so as to be lined up in a plane, and each terminal is connected by a flexible substrate. 2. The chip mounting body according to claim 1, wherein the chip components are embedded in a resin and integrated, each terminal is exposed on one surface, and the chip components are bonded by a flexible substrate. [Claim 3] A claim characterized in that the chip components are embedded in resin and integrated, each terminal is exposed on two upper and lower surfaces, and each terminal on the same surface is connected by two upper and lower flexible substrates. The chip-mounted body according to 1. 4. The chip mounting body according to claim 1, wherein the chip components are arranged and integrated on one side of a good heat conductive plate and are connected by a flexible substrate. [Claim 5] A claim characterized in that chip components are arranged and integrated on both sides of a single good heat conductive plate, respective terminals are arranged above and below, and each terminal is connected by two upper and lower flexible substrates. The chip-mounted body according to item 1. 6. The chip mounting body according to claim 1, wherein the flexible substrate has a structure in which a sintered conductor is bonded onto a resin substrate. 7. A composite chip mount body comprising a plurality of chip mount bodies in which each terminal of a chip component is arranged and integrated so as to be lined up in a plane, and each terminal is connected by a flexible substrate. 8. The device according to claim 7, wherein a plurality of chip components are integrated by embedding them in a resin, each terminal is exposed on one surface, and a plurality of chip mounting bodies are connected by a flexible substrate. composite chip assembly. 9. A plurality of chip mounting bodies are combined by embedding and integrating chip components in resin, exposing each terminal on two upper and lower surfaces, and connecting each terminal on the same surface with two upper and lower flexible substrates. Claim 7 characterized in that they are integrated.
The described composite chip mounting body. 10. The composite chip mounting according to claim 7, characterized in that the chip components are arranged and integrated on one side of a good thermally conductive plate, and a plurality of chip mounting bodies connected by a flexible substrate are integrated. body. [Claim 11] A plurality of chip mounting bodies in which chip components are arranged and integrated on both sides of a single good heat conductive plate, each terminal is arranged above and below, and each terminal is connected by two upper and lower flexible substrates. 8. The composite chip package according to claim 7, wherein the composite chip package is integrally bonded. 12. Claim 7, wherein the flexible substrate has a structure in which a sintered conductor is bonded onto a resin substrate.
12. The composite chip-mounted body according to any one of 11 to 11.