JPH0430464U - - Google Patents

Info

Publication number
JPH0430464U
JPH0430464U JP7232590U JP7232590U JPH0430464U JP H0430464 U JPH0430464 U JP H0430464U JP 7232590 U JP7232590 U JP 7232590U JP 7232590 U JP7232590 U JP 7232590U JP H0430464 U JPH0430464 U JP H0430464U
Authority
JP
Japan
Prior art keywords
lead
leads
soldering
detection means
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7232590U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7232590U priority Critical patent/JPH0430464U/ja
Publication of JPH0430464U publication Critical patent/JPH0430464U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Investigating Or Analyzing Materials Using Thermal Means (AREA)
JP7232590U 1990-07-09 1990-07-09 Pending JPH0430464U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7232590U JPH0430464U (enrdf_load_stackoverflow) 1990-07-09 1990-07-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7232590U JPH0430464U (enrdf_load_stackoverflow) 1990-07-09 1990-07-09

Publications (1)

Publication Number Publication Date
JPH0430464U true JPH0430464U (enrdf_load_stackoverflow) 1992-03-11

Family

ID=31610166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7232590U Pending JPH0430464U (enrdf_load_stackoverflow) 1990-07-09 1990-07-09

Country Status (1)

Country Link
JP (1) JPH0430464U (enrdf_load_stackoverflow)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59202048A (ja) * 1983-05-02 1984-11-15 Hitachi Ltd 電子部品の接続状態検査方法
JPS62297750A (ja) * 1986-06-17 1987-12-24 Matsushita Electric Ind Co Ltd ハンダ付け検査装置
JPS6398529A (ja) * 1986-10-15 1988-04-30 Matsushita Electric Ind Co Ltd 温度検出方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59202048A (ja) * 1983-05-02 1984-11-15 Hitachi Ltd 電子部品の接続状態検査方法
JPS62297750A (ja) * 1986-06-17 1987-12-24 Matsushita Electric Ind Co Ltd ハンダ付け検査装置
JPS6398529A (ja) * 1986-10-15 1988-04-30 Matsushita Electric Ind Co Ltd 温度検出方法

Similar Documents

Publication Publication Date Title
JPS6446638A (en) Method and apparatus for testing circuit plate weld connection part
JPH0430464U (enrdf_load_stackoverflow)
JP4173286B2 (ja) 検査装置
JP2534839B2 (ja) 半田付け装置
JPH037258B2 (enrdf_load_stackoverflow)
JPH01307650A (ja) はんだ付け検査方法およびその装置
JPH0288156U (enrdf_load_stackoverflow)
JPS5734401A (en) Apparatus and method for measuring of tape width
JPH0288157U (enrdf_load_stackoverflow)
JPH01227006A (ja) 部品装着検査装置
Alander et al. Infrared vision techniques in quality control of surface-mount circuit board solder paste printing
JPS5940783Y2 (ja) チツプ部品の半田付良否の検出装置
JPH03195906A (ja) 半田付け状態検査装置
JPS607311A (ja) 形状検出方法
JPS63181947U (enrdf_load_stackoverflow)
JPH02183104A (ja) 半田付け外観検査方法及びその装置
JPH02278105A (ja) 半田付検査装置
JPS60194400U (ja) 基板検査装置
JPS62113864U (enrdf_load_stackoverflow)
JPH03117968A (ja) 原稿読み取り装置
JPH0269641A (ja) 被測定物の反射光取込み装置
JPS63113947U (enrdf_load_stackoverflow)
JPH01116672U (enrdf_load_stackoverflow)
JPS6442407U (enrdf_load_stackoverflow)
JPH01182745A (ja) スルーホール欠陥検出装置