JPH04302449A - Tab tape - Google Patents

Abstract

PURPOSE:To simplify and reduce, in size, an aging apparatus by facilitating an electrical connection between ICs, which are packaged by the TAB method, and the aging apparatus. CONSTITUTION:A ground pattern 6 and a source line 7 are provided along the edges of a TAB tape, respectively, where sprocket holes 3a and 3b are prepared. When the ground pattern 6 and the source line are electrically connected to all ICs 2, electrical power can be supplied to all of the ICs 2 by the simple connection of a power source 10 across the ground pattern 6 and the source line 7 at an arbitrary point on the tape.

Description

[Detailed description of the invention]

0001

[Industrial Application Field] The present invention is directed to TAB (Tape A).
IC using automated bonding method
It is related to the assembly of.

0002

[Prior Art] Figure 3 shows an I
In the figure, reference numeral 1 denotes a tape base material, which has the same dimensions as a photographic film with a tape width of 35 mm, and is made of insulating polyimide or the like. 2 is an IC mounted on the tape base material 1, 2a, 2
b, 2c are arranged in succession at equal intervals. 3a, 3
b is a sprocket hole that serves both for feed control and positioning of the tape base material 1, 4a to 4j are leads electrically connected to IC 2, and 5a to 5j are conductive patterns integrated with leads 4a to 4j. It's a pad. lead 4a
4j and the test pads 5a to 5j are formed in advance on the tape base material 1, and the conductive patterns of the tape base material 1 and the leads 4
a to 4j and test pads 5a to 5j are collectively referred to as TAB.
It's called tape.

Next, the operation will be explained. Once assembled, the TAB undergoes various electrical tests in the same way as regular ICs. One of these tests is an energized aging test. This energization aging test applies a power supply voltage to each IC, accelerates failures that occur in the early stages, and eliminates defects. In this energization aging test, the method of supplying power to each IC is to use two of the test pads 5a to 5j, the power supply side test pad 5j and the ground side test pad 5e.
In order to supply power to the points, press the test pins against the two points above. Note that this test pin is often an IC socket.

0004

[Problems to be Solved by the Invention] Since test pads on the power and ground sides of ICs mounted using the conventional TAB method were provided for each IC, it was difficult to
A contact was required for each test pad. In particular, when testing a tape in which ICs are continuously mounted, there are problems such as the aging device being large and having a complicated structure.

[0005] This invention was made in order to solve the above-mentioned problems, and the power supply point to all the ICs mounted on the TAB tape is set at any point from the beginning to the end of the tape. The purpose of this is to simplify and downsize the aging device by providing only one location.

[0006]

[Means for Solving the Problems] The TAB tape according to the present invention has a grounding pattern and a power line provided at locations including sprocket holes on both sides of the tape, and connects these grounding patterns and power lines to all ICs. It is.

[0007]

[Operation] The TAB tape of the present invention can supply power to all ICs on the tape by simply connecting the power source to the ground pattern and power line at any one point on the tape. Furthermore, since a ground pattern and a power line are provided at a location including the sprocket hole, power can be supplied from any part of the tape by using the sprocket itself of the device as an electrode for supplying power.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. Figure 1 is a plan view of the TAB tape, Figure 2 is the TA of Figure 1.
FIG. 3 is a plan view showing a state in which the B tape is attached to an aging device. In the figures, parts that are the same as those of the conventional device are represented by the same reference numerals. 6 is the ground pattern, 7 is the power line, 8a
, 8b is a power pole sprocket, 9a and 9b are ground pole sprockets, 10a and 10b are power supplies, 11a and 11b are ground wires that connect the power supplies 10a and 10b to the ground pole sprockets 9a and 9b, and 12a and 12b are power pole sprockets. This is a power line connected to 8a and 8b.

Next, the operation will be explained. The ground pattern 6 and power line 7 provided on both sides of the TAB tape are connected to all ICs 2. In other words, it is connected to the test pads 5e and 5j of all IC2 over the entire length of the tape.

The ground pattern 6 and power line 7 provided on both sides of the tape can have a wide pattern line width by using the sprocket hole portion as a pattern, so that large currents due to the common connection of each IC power line can be made wider. supply becomes possible.

[0011] Also, a power line 7 is provided at the sprocket portion,
Moreover, by using the sprocket on the device side as an electrode, power can be supplied to the tape from any part of the tape. That is, before starting aging, the TAB tape is set in the aging device. The electrode side sprockets 8a, 8b and the ground electrode sprockets 9a, 9b sequentially feed the tape in the direction of the arrow while rotating in the direction in which the sprocket holes on the tape are arranged. When the feeding is finished, the power supplies 10a and 10b start supplying power. The power pole sprockets 8a, 8b and the ground pole sprockets 9a, 9b are made of conductive material, and are electrically connected by contacting with the ground pattern 6 and the power line 7 on the TAB tape. Note that although two power sources 10a and 10b are shown, one may be used, or a plurality of power sources may be provided to prevent a voltage drop.

0012

[Effects of the Invention] As described above, according to this invention, TAB
Since the ground pattern and power line are provided on the tarp, electrical connection to the aging device is facilitated, and the device can be configured simply.

[Brief explanation of drawings]

FIG. 1 is a plan view showing an embodiment of the present invention.

FIG. 2 is a plan view showing the TAB tape of FIG. 1 attached to an aging device.

FIG. 3 is a plan view showing an IC mounted using the conventional TAB method.

[Explanation of symbols]

1 Tape base material 2　　　　　　　　IC 3a, 3b sprocket hole 4a-4g lead 5a-5g Test pad 6 Grounding pattern 7 Power line

Claims (1)

[Claims] 1. A TAB tape in which a plurality of ICs are mounted on a tape substrate and sprocket holes are provided on both sides of the tape base material, and a grounding pattern that utilizes the sprocket hole portions as a pattern on both sides of the tape base material. and a power line, and the ground pattern and power line are connected to all ICs.
tape.