JPH0590333A - Film mount type semiconductor device - Google Patents

Abstract

PURPOSE:To make lead interconnections electrically stable, and to provide the lead interconnections with a path for escaping electric charges when static electricity is applied by connecting a lead pattern to an electrically conductive pattern provided along the edges of a film. CONSTITUTION:A device hole 104 is stamped substantially at the center of a tape carrier 101, and sprocket holes 102 are also stamped along the upper and lower edges of the tape carrier. Lead interconnections 103 connected to bump electrodes of a semiconductor are arranged along the periphery of the tape, and connected via an electrically conductive pattern 106 for connection purposes to an electrically conductive pattern 105 which is given a ground potential by way of sprockets for conveyance purposes. Thereby, the lead interconnections 103 are potentially grounded, and hence provided with an electrical path for escaping static electricity applied during manufacturing processes, whereby it is possible to ensure that the destruction of integrated circuit elements due to static electricity is prevented.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a semiconductor chip, TA
B (Tape Automated Bonding)
The present invention relates to a structure of a lead wiring portion in a semiconductor device mounted on a film by a method and an electric characteristic inspection method.

[0002]

2. Description of the Related Art Conventionally, there is a method in which a semiconductor chip is mounted on a film by the TAB method, the film is appropriately cut, and the film is connected to an external circuit or the like through lead wiring formed in advance on the film.

The flat structure of this film type semiconductor device is shown in FIG.

A device hole 204 for accommodating a semiconductor chip 202 and a sprocket hole 205 for carrying a tape are formed on a tape carrier 201 formed of a polyimide film. The lead wires 203 corresponding to the bump electrodes previously formed on the semiconductor chip 202 are printed and formed on the.

In this film mounting type semiconductor device,
The lead wirings 203 connected to the bump electrodes formed on the semiconductor chip 202 were individually independent and were in an open state in terms of potential.

[0006]

However, in the above film mounting type semiconductor device, since the lead wire 203 is electrically unstable in the open state, the tape carrier 201 itself is easily charged by static electricity, When static electricity is applied to an arbitrary lead wire 203, the integrated circuit element of the semiconductor chip mounted on the tape carrier is destroyed.

Therefore, in the manufacture of the film-mounted semiconductor device, it is necessary to take measures against static electricity such as earthing of the human body, earthing of the manufacturing equipment, static elimination by an ion analyzer, and deterioration of reliability due to electrostatic breakdown of the semiconductor device. I was imitating.

Therefore, the present invention is to solve the above-mentioned problem, and its problem is to electrically stabilize the lead wiring 203 to provide a film mounting type having a path for discharging charges when static electricity is applied. It is to provide a semiconductor device.

[0009]

In order to solve the above problems, in a film mounting type semiconductor device, a semiconductor chip is mounted on a film and a lead pattern consisting of a plurality of wirings connected to the semiconductor chip is formed. Then, the means taken by the present invention is to arrange a conductive pattern portion in the peripheral portion of the tape carrier, and to apply a ground potential via a sprocket for conveyance,
Further, each lead pattern is connected to this conductive pattern.

[0010]

Embodiments of the present invention will now be described with reference to the accompanying drawings.

(Embodiment 1) FIG. 1 is a plan view showing an embodiment of a film mounting type semiconductor device. Tape carrier 1
A device hole 104 is punched out at substantially the center of 01, and a sprocket hole 102 is punched at the upper and lower ends. Lead wiring 103 connected to semiconductor bump electrodes
Is arranged around the tape and is connected to the conductive pattern 105 to which a ground potential is applied via the transport sprocket via the conductive pattern for connection 106. Therefore, the lead wire 103 is electrically grounded and has an electric path through which the static electricity is released to the ground side even if static electricity is applied during the manufacturing process.

On the other hand, in the final electrical characteristic inspection step, the conductive patterns for connection 106 connected to the conductive patterns 105 arranged between the lead wirings 103 and around the tape are punched out before the inspection. It is possible to electrically insulate the lead wiring and perform electrical characteristic inspection as an independent electrode.

(Second Embodiment) Next, a second embodiment of the film mounting type semiconductor device according to the present invention will be described with reference to FIG.

This embodiment is the same as the first embodiment shown in FIG. 1 except for the conductive pattern 106 for connection, and the description thereof will be omitted.

In FIG. 2, the conductive pattern 106 for connection is used.
Is a batch of each wiring pattern from the outer end of the lead wiring,
It is connected to the ground conductive pattern 105 and each wiring pattern is electrically grounded. When the lead wirings are arranged on all sides, new grounding conductive patterns connecting the grounding conductive patterns arranged on both sides are provided.

At the time of the final electrical characteristic inspection, the grounding conductive patterns are collectively removed before the inspection so that the lead wirings are electrically independent. In this case, the ground power supply pattern 10
Since 5 is punched out, the punching precision as high as that required in the first embodiment is not required.

[0017]

As described above, according to the present invention, since an excessive current due to static electricity is not applied to the integrated circuit element of the semiconductor pellet mounted on the tape carrier, electrostatic breakdown of the integrated circuit element can be surely prevented. ..

[Brief description of drawings]

FIG. 1 is a first embodiment of a film type semiconductor device according to the present invention.
FIG.

FIG. 2 is a second example of the film type semiconductor device according to the present invention.
FIG.

FIG. 3 is a plan view showing a flat structure of a conventional film type semiconductor device.

[Explanation of symbols]

 101 tape carrier 102 sprocket hole 103 lead wiring 104 device hole 105 conductive pattern 106 conductive pattern for ground 201 tape carrier 202 semiconductor chip 203 lead wiring 204 device hole 205 sprocket hole

Claims (2)

[Claims] 1. A film mounting type semiconductor device in which a semiconductor chip is mounted on a film, and a lead pattern comprising a plurality of wirings connected to the semiconductor chip is formed. A film-mounted semiconductor device, which is connected to a conductive pattern provided in a peripheral portion. 2. The film mounting type semiconductor device according to claim 1, wherein the connecting portion between the lead pattern and the conductive pattern provided on the peripheral portion of the film is punched out at the time of the electric characteristic inspection, and the electric characteristic is obtained. A film-mounted semiconductor device characterized by being inspected.