JPH04297046A - Film carrier - Google Patents

Abstract

PURPOSE:To effect the inspection of all products wherein a packaged semiconductor device is subjected to a continuous electric test by connecting a first dielectric adhesive film, for use in fixing leads, with a second dielectric adhesive film, for use in securing a film, by means of a third dielectric adhesive film. CONSTITUTION:On a film carrier, which is made up of metal, is disposed a first dielectric adhesive film 2, for use in fixing leads, such as a polyimide film on which an adhesive is applied. Further disposed on the film carrier is a second dielectric adhesive film 3 which firmly fixes the first dielectric adhesive film 2 on the film carrier 1. The second and third dielectric adhesive films 2 and 3 are interconnected with each other by means of a third dielectric film 4. The separation, before or after the packaging of a semiconductor device, of second leads 5 located between the first and second dielectric adhesive films 2 and 3 enables the continuous electric test of a semiconductor on the film carrier.

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a film carrier used for mounting semiconductor integrated circuit chips such as ICs and LSIs.

<Prior Art> As shown in FIG. 3, the prior art had a film carrier structure consisting only of metal bodies.

In the conventional film carrier structure as described above, as shown in FIG. 3, all the leads 7 are electrically conductive through the metal body of the outer frame, which is an advantage of the film carrier after semiconductor elements are mounted. Continuous electrical testing on the film carrier was not possible.

<Problems to be Solved by the Invention> The present invention solves the above-mentioned drawbacks of the prior art, and makes it possible to inspect all mounted semiconductor elements by continuous electrical testing, even if the film carrier is made of a metal body. The purpose is to do so.

<Means for Solving the Problem> That is, the present invention, as shown in FIG. There is a second insulating adhesive film 3 that fixes the first insulating adhesive film 2 and the film carrier 1, and each insulating adhesive film is fixed by a third insulating adhesive film 4. Structure of connected film carrier.

By cutting the second lead portion 5 between the first insulating adhesive film 2 and the second insulating adhesive film 3 before or after semiconductor element mounting, continuous electrical tests on the film carrier can be performed. The present invention provides a film carrier structure that enables reduction of electrical testing time and costs.

<Function> As shown in Fig. 1, the first insulating adhesive film 2 and the second
By cutting the second lead portion 5 sandwiched between the first insulating adhesive film 3 and the second insulating adhesive film 3, conduction between the respective leads 7 is eliminated, and the first insulating adhesive film 2 and the semiconductor element are Since it is fixed to the film carrier 1 by the insulating adhesive film 3, continuous electrical tests can be performed on the film carrier.

Furthermore, by taking advantage of the continuous process on the film carrier, which is an advantage of film carriers, it is possible to perform a continuous reel-to-reel process from manufacturing the film carrier to mounting it on the product board, reducing manufacturing costs and time. Become.

<Example> Examples of the present invention are shown in FIGS. 2(A) to 2(H).

A polyimide film 14 having a thickness of 50 μm was coated with an adhesive 15 to a thickness of 20 μm to obtain an insulating adhesive film (see FIG. 2(A)). Figure 2 (B) is created by punching.
) A double ring was fabricated as shown in (). Note that a test groove 10 and an alignment hole 16 were provided in the first ring.

As shown in FIG. 2(C), the above-mentioned double ring is attached to the sprocket hole 6 and the alignment hole 16 on a film carrier 1 in which leads 7 are formed on a 70 μm thick copper foil.
By aligning and bonding, the film carrier structure of the present invention was obtained (Figure 2 (D)
reference).

Next, the semiconductor element 13 is mounted on the film carrier, and the semiconductor element is further molded 11 (see Fig. 2 (E).
), the second lead portion 5 sandwiched between the first ring 8 and the second ring 9 was cut to eliminate electrical continuity between the leads 7 (see FIG. 2(F)). Next, the first ring 8
An electrical test was conducted using the test groove 10, and defective products were punched out.

Next, as shown in FIGS. 2(G) to 2(H), by mounting the non-defective products as a result of the electrical test onto the product board 12, we take advantage of the continuous process on the film carrier, which is an advantage of the film carrier. Everything from manufacturing the film carrier to mounting it on the product board could be done in a continuous reel-to-reel process.

FIG. 4 shows another embodiment of the invention. According to the figure, it can be seen that there are various embodiments depending on the shape of the lead and other factors.

<Effects of the Invention> When the second lead portion 5 sandwiched between the first insulating adhesive film and the second insulating adhesive film is cut, conduction between each lead is lost, and the electrical conductivity on the film carrier is lost. Continuous electrical testing becomes possible.

Furthermore, by taking advantage of the continuous process on the film carrier, which is an advantage of film carriers, it is possible to perform a continuous reel-to-reel process from manufacturing the film carrier to mounting it on the product board, reducing manufacturing costs and time. Become.

[Brief explanation of drawings]

FIG. 1 is a plan view showing an embodiment of the film carrier of the present invention. FIGS. 2(A) to 2(F) are sectional views showing an example of use after mounting a semiconductor element on the film carrier of the present invention. FIG. 3 is a plan view showing an example of a conventional film carrier. FIG. 4 is a plan view showing another embodiment of the present invention. 1...Film carrier 2...First insulating adhesive film 3...Second insulating adhesive film 4...Third insulating adhesive film 5...Second lead portion 6...Sprocket hole 7...Lead 8...No. 1 ring 9...2nd ring 10...groove 11...mold 12...product substrate 13...semiconductor element 14...polyimide film 15...adhesive 16...alignment hole

Claims (2)

[Claims] 1. A film carrier made of a metal body, wherein there is a first insulating adhesive film for fixing leads, and a second insulating adhesive film for fixing the first insulating adhesive film and the film carrier. A film carrier characterized in that adhesive films are present and each insulating adhesive film is connected by a third insulating adhesive film. Claim 2: Claim 2, characterized in that an insulating adhesive film is present on both sides of the film carrier consisting of a metal body.
The film carrier described in item 1).