JPS6286847A - Chip carrier - Google Patents

Abstract

PURPOSE:To improve the reliability of a wire bonding between an electronic part chip and printed circuits by extending the end of every other printed circuit to the electronic part chip side from other printed circuit to form the extension in a wide portion. CONSTITUTION:An electronic part chip 2 is mounted at the center on a circuit board 1, and many printed circuits 3a, 3b which arrive at between the vicinity of the chip 2 and the end of the board 1 are formed substantially radially on the board 1. The every other printed circuits 3a are formed smaller than the width of the other printed circuits 3b, the end of the chip 2 side of the circuit 3a formed smaller than the width is extended from the other printed circuit 3b to the chip 2 side to form the extension in a wide portion 4. The chip 2 and the ends of the printed circuits 3a, 3b are wire bonded at 5 therebetween.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a chip carrier used as an IC package or the like.

[Background Art I Electronic devices such as IC packages are manufactured by packaging an electronic component chip such as a semiconductor chip attached to a lead frame by resin sealing or airtight sealing. As the number of terminals in such electronic devices increases due to higher integration, attempts are being made to use wiring boards instead of lead frames as carriers to support electronic component chips. In response to the increase in the number of terminals, attempts have been made to draw out the terminals from all sides of the wiring board used as a carrier.

FIG. 2 shows an example of a chip carrier A in which such terminals are drawn out from all sides, in which a large number of printed circuits 3 having leads #am are provided radially on the surface of the wiring board 1, and the terminals are drawn out from all four sides of the wiring board 1. A through-hole plating layer 9 is formed on the inner periphery of the semicircular through-hole 8 provided in each section, and this through-hole plating layer and the printed circuit 3 are formed.
It is formed by connecting each printed circuit 3 to an electronic component chip 2 such as a semiconductor device mounted in the center of the wiring board 1 by wire bonding 5. This chip carrier A is mounted on the surface of a wiring board etc. on which printed wiring etc. are applied, and is put into use by connecting the through-hole plating layer 9, which will become a terminal part, to the wiring circuit of the wiring board by soldering etc. .

In the chip carrier A shown in FIG. 2, as the integration of electronic component chips 2 becomes more advanced, the number of terminals steadily increases. The number of circuits 3 also increases, and as the number of printed circuits 3 increases in this way, the density of forming the printed circuits 3 increases. Each printed circuit 3 provided radially on the wiring board 1 is provided so that one end is close to the electronic component chip 2, but since the length of one side of the electronic component chip 2 is short, As the number of printed circuits 3 increases, the width of the end of each printed circuit 3 on the electronic component chip 2 side becomes extremely narrow, as shown in FIG. However, as the width of each printed circuit 3 becomes narrower, it becomes difficult to perform the wire bonding 5 between the electronic component chip 2 and the end of the printed circuit 3, and the reliability of the wire bonding 5 decreases. It is. For accurate wire bonding 5, the width l of the printed circuit 3 is required to be approximately 100 μm or more.

Therefore, in order to make the width l thicker, it is necessary to increase the opening distance between the electronic component chip 2 and the end of the printed circuit 3 as shown in FIG. If the distance NIL is increased, the wire bonding 5 formed between the electronic component chip 2 and the printed circuit 3 becomes longer, and the reliability of the wire bonding 5 also decreases in this case.

[Object of the Invention] The present invention has been made in view of the above points, and an object of the present invention is to provide a chip carrier with excellent reliability in wire bonding performed between an electronic component chip and a printed circuit. It is something to do.

[Disclosure of the Invention J] However, the chip carrier according to the present invention has an electronic component chip 2 mounted on the central part of the surface of the wiring board 1, and a chip carrier in the vicinity of the electronic component chip 2 and the edge of the wiring board 1 on the surface of the wiring board 1. A large number of printed circuits 3a and 3b are provided in a substantially radial manner between the two printed circuits 3a and 3b, and every other printed circuit 3a is formed to be smaller in width than the other printed circuits 3b. The end of the electronic component chip 2ffllll of the printed circuit 3a is extended toward the electronic component chip side 2 from other printed circuits 3b, and this extended portion is formed into a wide part 4, and the electronic component chip 2 and each printed circuit 3a, 3
This circuit is characterized in that wire bonding 5 is applied to the opening with the end of the circuit b, and every other printed circuit 3a is formed to be smaller in width than the other printed circuits 3b, and this width dimension is Small printed circuit 3
Asahi's printed circuit 3, which is the end of the electronic component chip 2WI in a.
Extend this from a to the electronic component chip side 2! The above object has been achieved by forming the L-shaped part in the wide part 4, and the present invention will be described in detail below with reference to Examples.

The wiring board 1 has metal foil such as copper foil or aluminum foil on the surface of an insulating board such as a laminate. Layer adhesion or insulation on the surface of a metal plate! It is formed by laminating and bonding metal foils through a single layer, and by removing unnecessary parts by etching or other common methods on the metal foils, a large number of printed circuits 3a, 3b are formed. is provided on the surface of the wiring board 1.

These printed circuits 3a and 3b are electronic component chips 2
The printed circuits 3m and 3b are formed radially between the part to be mounted and the end of the wiring board 1, and the ends of each printed circuit 3m and 3b are connected to the half provided at the end of the wiring board 1 as shown in figure plS2. It is designed to be continuous with the through-hole plating ff19 applied to the inner periphery of the circular through-hole 8.

Also, this printed circuit 3 lit 3 b is Ikekata's RA
As shown in FIG. The width dimension 11 of each end portion is smaller than the width dimension 12 of the i portion on the electronic component chip 2 side of every other printed circuit 3b. Therefore, there is no need to increase the distance @Ll (Ll<L) between the ends of the printed circuits 3a, 3b and the electronic component chip 2, and the width dimension 11 of the printed circuit 3a can be reduced. This means that the width dimension 12 (b=1>) of the circuit 3b can be increased.In each printed circuit 3a in which the width dimension 11 is formed small, as shown in FIG. Also, a circuit is extended to the electronic component chip 2fll, and the width dimension of the extended portion of this circuit is widened to form a wide part 4.1 Wide part 4
is its width dimension! , is formed to be approximately equal to the width dimension 12.

An electronic component chip 2 such as a semiconductor chip is mounted and mounted on the center part of the surface of the wiring board 1 on which the printed circuits 3 m and 3 b are formed in this way, and the electronic component chip 2 and each printed circuit 3 at a b are mounted. 2g of electronic component chips
The end of A, that is, the wide part 4 in the printed circuit 3a
By performing wire bonding 5 as shown by the chain line in FIG. 11 between the electronic component chip 2 and the j1 part of the printed circuit 3b, and electrically connecting the electronic component chip 2 and each printed circuit 3a, 3b, the printed circuit 3a , 3b, a chip carrier A is prepared using the wiring board 1 as a carrier.

In order to perform the wire bonding 5 in this way, the printed circuit 3IJ needs to have its end portion kept away from the electronic component chip 2 (its width dimension 12 can be made large, and the width dimension of the printed circuit 3IJ can be made large). 11 is formed small, the width dimension 13 of the wide part 4 can be made large, so that the width dimension 13 of the wide part 4 can be made large, so that there is Moreover, the wire bonding 5 can be reliably performed over a short distance, and the reliability of the wire bonding 5 can be improved. After the electronic component chip 2 is mounted in this manner, the electronic component chip 2 may be made into a puff canon if necessary.
It is finished as a C package.

[Effect of the invention 1 As described above, in the present invention, a large number of printed circuits are provided on the surface of the wiring board in a substantially radial manner extending between the vicinity of the electronic component chip and the end of the wiring board, and every other printed circuit is This printed circuit is made smaller in width than the other printed circuits, and the end of the printed circuit with the smaller width on the electronic component chip side is extended further toward the electronic component chip than the other printed circuits. j! The wire bonding part is formed into a wide part and wire bonding is performed between the electronic component chip and the end of each printed circuit, so it is possible to increase the distance between the end of the printed circuit and the electronic component chip. R to reduce the width dimension of every other printed circuit without the need for
This means that every other printed circuit can be made larger in width, and in printed circuits that are made smaller in width, the width of the circuit can be made larger in the wide part. As a result, wire bonding can be reliably performed at a short distance between the print edge and the edge of the print, which has a large size, and the reliability of wire bonding can be improved.

[Brief explanation of drawings]

FIG. 1 is a plan view of a portion of the chip carrier according to the present invention, FIG. 2 is a reduced perspective view showing the entire chip carrier, and FIG. 3 is a plan view of a portion of the chip carrier 77 in the conventional example.
FIG. 4 is a plan view of a part of a chip carrier in another conventional example. 1 is a wiring board, 2 is an electronic component chip, 3 is a printed circuit, 4 is a wide part, and 5 is a wire bonding.

Claims (1)

[Claims] (1) An electronic component chip is mounted in the center of the surface of the wiring board, and a large number of printed circuits are provided on the surface of the wiring board in a substantially radial manner extending between the vicinity of the electronic component chip and the edge of the wiring board. Every other printed circuit is formed to be smaller in width than the other printed circuits, and the end of the printed circuit with the smaller width on the electronic component chip side is extended closer to the electronic component chip than the other printed circuits. A chip carrier characterized in that the extension part of the lever is formed into a wide part and wire bonding is performed between the electronic component chip and the end of each printed circuit.