JPH0428478B2 - - Google Patents
Info
- Publication number
- JPH0428478B2 JPH0428478B2 JP14432983A JP14432983A JPH0428478B2 JP H0428478 B2 JPH0428478 B2 JP H0428478B2 JP 14432983 A JP14432983 A JP 14432983A JP 14432983 A JP14432983 A JP 14432983A JP H0428478 B2 JPH0428478 B2 JP H0428478B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- cream solder
- solder
- hydroxycarboxylic
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 36
- 239000006071 cream Substances 0.000 claims description 25
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 17
- 230000004907 flux Effects 0.000 claims description 15
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 12
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 12
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 12
- 239000004034 viscosity adjusting agent Substances 0.000 claims description 7
- 239000002253 acid Substances 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 5
- 239000000194 fatty acid Substances 0.000 claims description 5
- 229930195729 fatty acid Natural products 0.000 claims description 5
- 150000004665 fatty acids Chemical class 0.000 claims description 5
- KIHBGTRZFAVZRV-UHFFFAOYSA-N 2-hydroxyoctadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(O)C(O)=O KIHBGTRZFAVZRV-UHFFFAOYSA-N 0.000 claims description 4
- 239000004359 castor oil Substances 0.000 claims description 4
- 235000019438 castor oil Nutrition 0.000 claims description 4
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 4
- 239000012190 activator Substances 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- CPLYLXYEVLGWFJ-UHFFFAOYSA-N 2-hydroxyarachidic acid Chemical compound CCCCCCCCCCCCCCCCCCC(O)C(O)=O CPLYLXYEVLGWFJ-UHFFFAOYSA-N 0.000 claims description 2
- RPGJJWLCCOPDAZ-UHFFFAOYSA-N 2-hydroxybehenic acid Chemical compound CCCCCCCCCCCCCCCCCCCCC(O)C(O)=O RPGJJWLCCOPDAZ-UHFFFAOYSA-N 0.000 claims description 2
- OYHQOLUKZRVURQ-HZJYTTRNSA-N Linoleic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 claims description 2
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 claims description 2
- 235000020661 alpha-linolenic acid Nutrition 0.000 claims description 2
- 235000020778 linoleic acid Nutrition 0.000 claims description 2
- OYHQOLUKZRVURQ-IXWMQOLASA-N linoleic acid Natural products CCCCC\C=C/C\C=C\CCCCCCCC(O)=O OYHQOLUKZRVURQ-IXWMQOLASA-N 0.000 claims description 2
- 229960004488 linolenic acid Drugs 0.000 claims description 2
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 claims description 2
- JGHSBPIZNUXPLA-UHFFFAOYSA-N 2-hydroxyhexadecanoic acid Chemical compound CCCCCCCCCCCCCCC(O)C(O)=O JGHSBPIZNUXPLA-UHFFFAOYSA-N 0.000 claims 2
- 230000001590 oxidative effect Effects 0.000 claims 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 14
- VDQLTWSIHIWIFQ-UHFFFAOYSA-N 5-chloro-2-(3,4-dimethoxyphenyl)-2-propan-2-ylpentanenitrile Chemical compound COC1=CC=C(C(CCCCl)(C#N)C(C)C)C=C1OC VDQLTWSIHIWIFQ-UHFFFAOYSA-N 0.000 description 8
- ULQISTXYYBZJSJ-UHFFFAOYSA-N 12-hydroxyoctadecanoic acid Chemical compound CCCCCCC(O)CCCCCCCCCCC(O)=O ULQISTXYYBZJSJ-UHFFFAOYSA-N 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 238000009472 formulation Methods 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 229940114072 12-hydroxystearic acid Drugs 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000003760 tallow Substances 0.000 description 3
- 230000009974 thixotropic effect Effects 0.000 description 3
- 239000004606 Fillers/Extenders Substances 0.000 description 2
- 235000019484 Rapeseed oil Nutrition 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 2
- 229940063655 aluminum stearate Drugs 0.000 description 2
- 239000000440 bentonite Substances 0.000 description 2
- 229910000278 bentonite Inorganic materials 0.000 description 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 235000013869 carnauba wax Nutrition 0.000 description 2
- 239000004203 carnauba wax Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000003240 coconut oil Substances 0.000 description 2
- 235000019864 coconut oil Nutrition 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 235000019198 oils Nutrition 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- VACHUYIREGFMSP-UHFFFAOYSA-N (+)-threo-9,10-Dihydroxy-octadecansaeure Natural products CCCCCCCCC(O)C(O)CCCCCCCC(O)=O VACHUYIREGFMSP-UHFFFAOYSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- JPFGKGZYCXLEGQ-UHFFFAOYSA-N 1-(4-methoxyphenyl)-5-methylpyrazole-4-carboxylic acid Chemical compound C1=CC(OC)=CC=C1N1C(C)=C(C(O)=O)C=N1 JPFGKGZYCXLEGQ-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- VJOGZGLNDROOFS-UHFFFAOYSA-N 9,10,12,13-tetrahydroxy-octadecanoic acid Chemical compound CCCCCC(O)C(O)CC(O)C(O)CCCCCCCC(O)=O VJOGZGLNDROOFS-UHFFFAOYSA-N 0.000 description 1
- DJKUVMZEGIWUTP-UHFFFAOYSA-N 9,10,12-trihydroxyoctadecanoic acid Chemical compound CCCCCCC(O)CC(O)C(O)CCCCCCCC(O)=O DJKUVMZEGIWUTP-UHFFFAOYSA-N 0.000 description 1
- VACHUYIREGFMSP-SJORKVTESA-N 9,10-Dihydroxystearic acid Natural products CCCCCCCC[C@@H](O)[C@@H](O)CCCCCCCC(O)=O VACHUYIREGFMSP-SJORKVTESA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000013871 bee wax Nutrition 0.000 description 1
- 235000015278 beef Nutrition 0.000 description 1
- 239000012166 beeswax Substances 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 235000013868 candelilla wax Nutrition 0.000 description 1
- 239000004204 candelilla wax Substances 0.000 description 1
- 229940073532 candelilla wax Drugs 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- MSUOLNSQHLHDAS-UHFFFAOYSA-N cerebronic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCC(O)C(O)=O MSUOLNSQHLHDAS-UHFFFAOYSA-N 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000002529 flux (metallurgy) Substances 0.000 description 1
- IUJAMGNYPWYUPM-UHFFFAOYSA-N hentriacontane Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCCCCC IUJAMGNYPWYUPM-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- -1 polyethylene glycolic acid Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- WBHHMMIMDMUBKC-XLNAKTSKSA-N ricinelaidic acid Chemical compound CCCCCC[C@@H](O)C\C=C\CCCCCCCC(O)=O WBHHMMIMDMUBKC-XLNAKTSKSA-N 0.000 description 1
- 229960003656 ricinoleic acid Drugs 0.000 description 1
- FEUQNCSVHBHROZ-UHFFFAOYSA-N ricinoleic acid Natural products CCCCCCC(O[Si](C)(C)C)CC=CCCCCCCCC(=O)OC FEUQNCSVHBHROZ-UHFFFAOYSA-N 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000010698 whale oil Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
Description
本発明はクリームはんだに関する。
クリームはんだは粉末はだをロジン類、活性
剤、溶剤および適当な粘度調整剤ならびにその他
の添加剤を含むフラツクスに分散させたクリーム
はんだ状のはんだである。これは主として、接合
すべき金属基材上に塗布もしくは印刷して使用す
るものである。
従つて、クリームはんだに要請される性能は、
人体に対する安全性、良好なはんだ付性、高絶縁
性、非腐食性および保存中に劣化しない等の一般
的なはんだフラツクスに要請される性能の他、印
刷特性およびはんだ付後の洗浄性において優れて
いることが特に要求される。特にクリームはんだ
を精密電子部品に使用する際には、印刷時の吐出
性が優れ、スクリーン版やノズルより良好に吐出
されること、および吐出物がニジミやダレを生じ
ないことが必要である。吐出性を良好にするため
には、ある程度の流動性を必要とするが、流動性
が高い場合にはニジミやダレを生ずるため、両者
を満足する粘度特性を有することがクリームはん
だにとつては重要である。
従来、このような性質のクリームはんだを得る
ために、フラツクス中に適当な粘度調整剤を添加
する。例えばエステル系物質；ヤシ油、牛脂、ヒ
マシ油、鯨油、菜種油等の硬化油、半硬化油、木
ロウ、密ロウ、キヤンデリラワツクス、カルナウ
バラツクス等、遊離酸類；アジピン酸、コルク
酸、アゼライン酸、セバシン酸、ドデカン２酸、
ミリスチン酸、パルミチン酸、ステアリン酸、ア
ラキジン酸、ベヘニン酸、ヤシ油脂肪酸、牛脂脂
肪酸、菜種油脂肪酸、モンタン酸、ポリエチレン
グリコール酸、安息香酸、フタール酸、トリメリ
ト酸等および無機または有機体質顔料；例えばベ
ントナイト、有機ベントナイト、超微粉シリカ、
超微粉アルミナ、アルミニウムステアレート等が
使用されてきた。
しかしながら、上記エステル系物質は、はんだ
付後の洗浄性が不充分であるとともに、金属基剤
に対する溶融はんだのヌレを阻害し、はんだ付性
を悪化させる傾向があり、遊離酸類は、充分なチ
クソトロピー性を有しないため、印刷時の吐出性
を向上させずに、ニジミやだれを生ずる傾向があ
り、さらに有機もしくは無機体質顔料は金属基材
に対する溶融はんだのヌレ性を阻害するととも
に、はんだの流れを悪化させ、はんだボールの発
生の原因になる。
本発明者らは、微小部品の精密なはんだ付を可
能とするため、高度の印刷、吐出特性と良好なは
んだ付性を持ち、かつ洗浄工程の短縮を目的とし
たクリームはんだの開発を行なつた結果、ヒドキ
ロシル基を有するカルボン酸をクリームはんだの
フラツクスに配合することにより、優れたチクソ
トロピーを有するクリームはんだを製造すること
が可能であることを見出し、本発明を完成した。
即ち、本発明は、はんだとロジン類、活性剤、溶
剤、粘度調整剤を少なくとも含むフラツクスとか
らなるクリームはんだにおいて、粘度調整剤とし
て炭素数16〜24のヒドロキシカルボン酸を含有す
るクリームはんだを提供する。本発明において、
炭素数16〜24のヒドロキシカルボン酸は好ましく
は脂肪族カルボン酸であり、１または複数個のヒ
ドロキシル基を有し、かつ好ましくは不飽和基を
有さないものである。このようなヒドロキシカル
ボン酸の例は、12−ヒドロキシステアリン酸、２
−ヒドロキシパルミチン酸、２−ヒドロキシステ
アリン酸、２−ヒドロキシアラキジン酸、２−ヒ
ドロキシベヘン酸、２−ヒドロキシリグノセリン
酸、硬化ヒマシ油の脂肪酸、オレイン酸、リノー
ル酸またはリノレン酸の酸化物、12−ヒドロキシ
ステアリン酸、９，10−ジヒドロキシステアリン
酸、９，10，12−トリヒドロキシステアリン酸、
９，10，12，13−テトラヒドロキシステアリン酸
等である。特に好ましいヒドロキシカルボン酸は
12−ヒドロキシステアリン酸、であり、これらを
フラツクスの重量に基づき約５〜約20％使用す
る。炭素数が16より小さいヒドロキシカルボン酸
は、それ自体融点が低く、粘度調整効果が十分で
ない。また炭素数が24より多いヒドロキシカルボ
ン酸は工業的実用性に欠ける。また不飽和基を有
するヒドロキシカルボン酸、例えばリシノール酸
は融点が低く、それを単独で使用したのでは充分
な粘度調整効果は得られない。
オキシカルボン酸をクリームはんだの粘度調整
剤としてフラツクス中に配合すると、ヒドロキシ
カルボン酸分子内の水酸基と比較的長鎖の炭素鎖
と遊離のカルボキシル基の相互作用によつて、水
素結合性のゲルを形成し、非常に大きなチクソト
ロピー性を与える。ヒドロキシカルボン酸の配合
量がフラツクス全量の５％より小さいと、上記の
効果は不十分であり、20％以上配合すると良好な
粘性特性は得られない。従つて、クリームはんだ
に要請される性能がこれらのヒドロキシカルボン
酸によつて得られるはんだ付性や高絶縁性、非腐
蝕性等にうまく適合する時は、フラツクスに配合
するロジン類に変えて、あるいはその一部と置き
変えて使用してもよい。
ヒドロキシカルボン酸を増粘剤として使用する
と、非腐食性、高絶縁性等を損うことなく、はん
だ付性が著しく向上し、さらに塩化系またはフロ
ン系洗浄剤に融解することから、はんだ付け後の
洗浄性が向上する。
以下、実施例をあげれ本発明を説明する。
実施例 １〜３
以下の処方でクリームはんだ用フラツクスを調
製する。処 方
重量部
ヒドロキシステアリン酸 10
重合ロジン 55
ジエチレングリコールモノブチルエーテル 34
ジエチルアミン臭化水素酸塩 １
上記の処方のフラツクス13重量部中に粉末はん
だ87重量部を加え、十分混練してクリームはんだ
を得た。得られたクリームはんだのはんだ付性、
チクソトロピー性、洗浄性を表−１に示す。
比較例 １〜７
以下の処方でクリームはんだ用フラツクスを調
製する。処方１
重量部
ステアリン酸 10
重合ロジン 50
ジエチレングリコールモノブチル 30
エーテルヒドロアビエチルアルコール ５
メチルヒドロアビエテート ４
ジエチルアミン臭化水素酸 １処方２
重量部
硬化牛脂 10
重合ロジン 50
ジエチレングリコールモノブチル 30
エーテルヒドロアビエチルアルコール ５
メチルヒドロアビエテート ４
ジエチルアミン臭化水素酸 １処方３
重量部
ポリエチレングリコール20000 10
重合ロジン 50
ジエチレングリコールモノブチル 30
エーテルヒドロアビエチルアルコール ５
メチルヒドロアビエテート ４
ジエチルアミン臭化水素酸 １処方４
重量部
カルナウバワツクス 10
重合ロジン 50
ジエチレングリコールモノブチル 30
エーテルヒドロアビエチルアルコール ５
メチルヒドロアビエテート ４
ジエチルアミン臭化水素酸 １処方５
重量部
超微粉シリカ ４
重合ロジン 51
ジエチレングリコールモノブチル 32
エーテルヒドロアビエチルアルコール ６
メチルヒドロアビエテート ６
ジエチルアミン臭化水素酸 １処方６
重量部
ステアリン酸アルミニウム ４
重合ロジン 51
ジエチレングリコールモノブチル 32
エーテルヒドロアビエチルアルコール ６
メチルヒドロアビエテート ６
ジエチルアミン臭化水素酸 １処方７
重量部
硬化ヒマシ油 ４
重合ロジン 51
ジエチレングリコールモノブチル 32
エーテルヒドロアビエチルアルコール ６
メチルヒドロアビエテート ６
ジエチルアミン臭化水素酸 １
上記の処方フラツクス13重量部中に粉末はんだ
87重量部を加え、十分混練してクリームはんだを
得た。得られたクリームはんだのはんだ付け性、
チクソトロピー性、洗浄性を表−１に示す。
The present invention relates to cream solder. Cream solder is a solder in the form of a cream solder in which powdered solder is dispersed in a flux containing rosins, activators, solvents, appropriate viscosity modifiers, and other additives. This is mainly used by coating or printing on metal substrates to be bonded. Therefore, the performance required for cream solder is
In addition to the performance required for general solder flux such as safety for the human body, good solderability, high insulation, non-corrosion, and no deterioration during storage, it also has excellent printing characteristics and post-soldering cleanability. It is particularly required that In particular, when cream solder is used for precision electronic components, it is necessary that it has excellent ejection properties during printing, that it ejects better than a screen plate or nozzle, and that the ejected material does not bleed or sag. A certain level of fluidity is required in order to have good dispensing properties, but if the fluidity is high, it will cause bleeding or sagging, so it is important for cream solder to have viscosity characteristics that satisfy both. is important. Conventionally, in order to obtain cream solder having such properties, a suitable viscosity modifier is added to the flux. For example, ester-based substances; hydrogenated oils such as coconut oil, tallow, castor oil, whale oil, rapeseed oil, semi-hardened oils, wood wax, beeswax, candelilla wax, carnauba wax, etc.; free acids; adipic acid, corkic acid; , azelaic acid, sebacic acid, dodecanedioic acid,
Myristic acid, palmitic acid, stearic acid, arachidic acid, behenic acid, coconut oil fatty acid, tallow fatty acid, rapeseed oil fatty acid, montanic acid, polyethylene glycolic acid, benzoic acid, phthalic acid, trimellitic acid, etc. and inorganic or organic extender pigments; for example bentonite , organic bentonite, ultrafine silica,
Ultrafine powder alumina, aluminum stearate, etc. have been used. However, the above-mentioned ester-based substances have insufficient cleanability after soldering and tend to impede the wetting of molten solder onto the metal base, resulting in poor solderability. Organic or inorganic extender pigments inhibit the wetting of molten solder onto metal substrates and impede solder flow. This will worsen the problem and cause solder balls to form. In order to enable precision soldering of minute parts, the present inventors have developed a cream solder that has advanced printing and dispensing characteristics, good solderability, and aims to shorten the cleaning process. As a result, the inventors discovered that it is possible to produce cream solder with excellent thixotropy by blending a carboxylic acid having a hydroxyl group into the flux of cream solder, and completed the present invention.
That is, the present invention provides a cream solder consisting of solder and a flux containing at least a rosin, an activator, a solvent, and a viscosity modifier, which contains a hydroxycarboxylic acid having 16 to 24 carbon atoms as the viscosity modifier. do. In the present invention,
The hydroxycarboxylic acid having 16 to 24 carbon atoms is preferably an aliphatic carboxylic acid, having one or more hydroxyl groups, and preferably having no unsaturated groups. Examples of such hydroxycarboxylic acids are 12-hydroxystearic acid, 2-hydroxystearic acid,
-Hydroxypalmitic acid, 2-hydroxystearic acid, 2-hydroxyarachidic acid, 2-hydroxybehenic acid, 2-hydroxylignoceric acid, fatty acids of hydrogenated castor oil, oleic acid, linoleic acid or linolenic acid oxides, 12 -Hydroxystearic acid, 9,10-dihydroxystearic acid, 9,10,12-trihydroxystearic acid,
9,10,12,13-tetrahydroxystearic acid and the like. Particularly preferred hydroxycarboxylic acids are
12-hydroxystearic acid, and these are used in an amount of about 5 to about 20%, based on the weight of the flux. Hydroxycarboxylic acids having less than 16 carbon atoms have a low melting point and do not have a sufficient viscosity adjusting effect. Moreover, hydroxycarboxylic acids having more than 24 carbon atoms lack industrial practicality. Furthermore, hydroxycarboxylic acids having unsaturated groups, such as ricinoleic acid, have a low melting point, and if they are used alone, a sufficient viscosity adjusting effect cannot be obtained. When oxycarboxylic acid is added to flux as a viscosity modifier for cream solder, a hydrogen-bonding gel is formed due to the interaction between the hydroxyl group in the hydroxycarboxylic acid molecule, the relatively long carbon chain, and the free carboxyl group. formation, giving it very large thixotropic properties. If the amount of hydroxycarboxylic acid is less than 5% of the total flux, the above effect will be insufficient, and if it is more than 20%, good viscosity properties will not be obtained. Therefore, when the performance required for cream solder is well suited to the solderability, high insulation, non-corrosion, etc. obtained by these hydroxycarboxylic acids, it is recommended to use rosin instead of the rosin compounded in the flux. Alternatively, it may be used in place of a part of it. When hydroxycarboxylic acid is used as a thickener, solderability is significantly improved without impairing non-corrosion and high insulation properties.Furthermore, since it dissolves in chloride-based or fluorocarbon-based cleaning agents, it can be used after soldering. Improves cleaning performance. The present invention will be explained below with reference to Examples. Examples 1 to 3 A cream solder flux is prepared according to the following formulation. Prescription parts by weight Hydroxystearic acid 10 Polymerized rosin 55 Diethylene glycol monobutyl ether 34 Diethylamine hydrobromide 1 87 parts by weight of powdered solder was added to 13 parts by weight of the above-mentioned flux and thoroughly kneaded to obtain cream solder. Solderability of the obtained cream solder,
The thixotropic properties and detergency are shown in Table 1. Comparative Examples 1 to 7 Cream solder fluxes were prepared according to the following formulations. Formula 1 part by weight Stearic acid 10 Polymerized rosin 50 Diethylene glycol monobutyl 30 Etherhydroabiethyl alcohol 5 Methylhydroabietate 4 Diethylamine hydrobromide 1 Formula 2 parts by weight Hardened beef tallow 10 Polymerized rosin 50 Diethylene glycol monobutyl 30 Etherhydroabiethyl alcohol 5 Methylhydroabietate 4 Diethylamine hydrobromide 1 formulation 3 parts by weight Polyethylene glycol 20000 10 Polymerized rosin 50 Diethylene glycol monobutyl 30 Etherhydroabiethyl alcohol 5 Methylhydroabietate 4 Diethylamine hydrobromide 1 formulation 4 parts by weight Carnauba Wax 10 Polymerized rosin 50 Diethylene glycol monobutyl 30 Etherhydroabiethyl alcohol 5 Methylhydroabietate 4 Diethylamine hydrobromide 1 formulation 5 parts by weight Ultrafine silica 4 Polymerized rosin 51 Diethylene glycol monobutyl 32 Etherhydroabiethyl alcohol 6 Methylhydro Abietate 6 Diethylamine hydrobromide 1 formulation 6 parts by weight Aluminum stearate 4 Polymerized rosin 51 Diethylene glycol monobutyl 32 Etherhydroabiethyl alcohol 6 Methylhydroabietate 6 Diethylamine hydrobromide 1 formulation 7 parts by weight Hydrogenated castor oil 4 Polymerization Rosin 51 Diethylene glycol monobutyl 32 Etherhydroabiethyl alcohol 6 Methylhydroabietate 6 Diethylamine hydrobromide 1 Powdered solder in 13 parts by weight of the above formulated flux
87 parts by weight was added and thoroughly kneaded to obtain cream solder. Solderability of the obtained cream solder,
The thixotropic properties and detergency are shown in Table-1.
【表】【table】
Claims (1)
度調整剤を少なくとも含むフラツクスとからなる
クリームはんだにおいて、粘度調整剤として炭素
数16〜24のヒドロキシカルボン酸を含有するクリ
ームはんだ。 ２ ヒドロキシカルボン酸をフラツクス全量の５
〜20重量％含有する第１項記載のクリームはん
だ。 ３ ヒドロキシカルボン酸が硬化ひまし油の脂肪
酸である第１項記載のクリームはんだ。 ４ ヒドロキシカルボン酸が２−ヒドロキシパル
ミチン酸、２−ヒドロキシステアリン酸、２−ヒ
ドロキシアラキジン酸、２−ヒドロキシベヘン
酸、および２−ヒドロキシグノセリン酸のいずれ
かから選ばれた第１項記載のクリームはんだ。 ５ ヒドロキシカルボン酸がリノール酸またはリ
ノレン酸を酸化することによつて得られるヒドロ
キシカルボン酸である第１項記載のクリームはん
だ。[Claims] 1. A cream solder consisting of solder and a flux containing at least a rosin, an activator, a solvent, and a viscosity modifier, the cream solder containing a hydroxycarboxylic acid having 16 to 24 carbon atoms as the viscosity modifier. . 2 Add hydroxycarboxylic acid to 5% of the total amount of flux.
20% by weight of the cream solder according to item 1. 3. The cream solder according to item 1, wherein the hydroxycarboxylic acid is a fatty acid of hydrogenated castor oil. 4. The cream according to item 1, wherein the hydroxycarboxylic acid is selected from 2-hydroxypalmitic acid, 2-hydroxystearic acid, 2-hydroxyarachidic acid, 2-hydroxybehenic acid, and 2-hydroxygnoceric acid. Solder. 5. The cream solder according to item 1, wherein the hydroxycarboxylic acid is a hydroxycarboxylic acid obtained by oxidizing linoleic acid or linolenic acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14432983A JPS6033895A (en) | 1983-08-06 | 1983-08-06 | Cream solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14432983A JPS6033895A (en) | 1983-08-06 | 1983-08-06 | Cream solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6033895A JPS6033895A (en) | 1985-02-21 |
| JPH0428478B2 true JPH0428478B2 (en) | 1992-05-14 |
Family
ID=15359572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14432983A Granted JPS6033895A (en) | 1983-08-06 | 1983-08-06 | Cream solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6033895A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0929481A (en) * | 1995-07-20 | 1997-02-04 | Matsushita Electric Ind Co Ltd | Cream solder |
| WO2014057846A1 (en) * | 2012-10-11 | 2014-04-17 | 株式会社ダイセル | Solvent composition for manufacturing electric device |
| CN104985355A (en) * | 2015-07-01 | 2015-10-21 | 芜湖市爱德运输机械有限公司 | Lead-free solder scaling powder and preparation method thereof |
| CN104985356A (en) * | 2015-07-01 | 2015-10-21 | 芜湖市爱德运输机械有限公司 | No-halogen scaling powder and preparation method thereof |
| CN104985357A (en) * | 2015-07-01 | 2015-10-21 | 芜湖市爱德运输机械有限公司 | Halogenless soldering aid and preparation method thereof |
| JP7037837B1 (en) | 2020-09-23 | 2022-03-17 | 株式会社弘輝 | Flux and solder paste |
-
1983
- 1983-08-06 JP JP14432983A patent/JPS6033895A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6033895A (en) | 1985-02-21 |
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