JPH04284610A - Composite laminated component - Google Patents

Abstract

PURPOSE:To enhance the circuit resistance of the title component by a method wherein an intermediate layer which mixed with a magnetic material which is substantially the same as that for a ceramic magnetic layer with a dielectric material which is substantially the same as that for a ceramic dielectric layer is formed between the ceramic magnetic layer for an inductor chip body and the ceramic dielectric layer for a capacitor chip body. CONSTITUTION:A capacitor chip body 2 constituted by laminating ceramic dielectric layers 21 and internal electrode layers 25 and an inductor chip body 3 constituted by laminating ceramic magnetic layers 31 and internal conductors 35 are united via an intermediate layer 4. Thereby, an LC composite component 1 is formed. At this time, a mixed material which has mixed a dielectric material which is substantially the same as that for the dielectric layers 21 with a magnetic material which is substantially the same as that for the magnetic layers 31 is contained in the intermediate layer 4. An N-Zn ferrite and/or an Ni-Cu-Zn ferrite are contained in the magnetic layers 31. Thereby, the difference in a coefficient of thermal expansion between the magnetic layers and the dielectric layers and a steep change in a composition at their interface are relaxed, and it is possible to restrain the local precipitation of Cu, Zn and the like at their bonding interface.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to composite laminated parts such as LC composite parts.

0002

[Prior Art] A multilayer ceramic LC composite component includes a capacitor chip body composed of a laminated ceramic dielectric layer and an internal electrode layer, and an inductor chip body composed of a laminated ceramic magnetic layer and an internal conductor. It is integrally formed with.

[0003] Such composite laminated parts are often used in various electronic devices because of their small volume, high robustness, and high reliability.

These parts, such as LC composite parts, are usually produced by laminating paste for internal conductors, paste for magnetic layers, paste for dielectric layers, and paste for internal electrode layers using thick film technology, and then firing the resulting product. The external electrode paste is printed or transferred onto the surface of the sintered body, and then fired. In this case, the magnetic material used for the magnetic layer is Ni-
Cu-Zn ferrite is commonly used.

However, as a magnetic material, Ni-Cu-Z
It was found that when n-ferrite and Ni-Zn ferrite were used, the circuit resistance was significantly lower than expected.

[0006] The inventors of the present invention investigated this phenomenon and found that during firing or baking the external electrodes, the bonding interface between the ceramic magnetic layer of the inductor chip body and the ceramic dielectric layer of the capacitor chip body. It was found that Cu, Cu oxide, Zn, Zn oxide, etc. were precipitated to form a layer with low electrical resistance, and as a result, the circuit resistance of the component was significantly reduced.

[0007] In order to solve such problems, a bonding interface between the ceramic magnetic layer and the ceramic dielectric layer,
For example, an intermediate layer such as non-magnetic ferrite is provided, and Cu, Z
It is possible to prevent the precipitation of n and the like. Although such an intermediate layer reduces the amount of these precipitates, it cannot completely prevent local precipitation at the bonding interface. For this reason,
The circuit resistance of the component is not improved satisfactorily.

[0008]

SUMMARY OF THE INVENTION An object of the present invention is to suppress local precipitation of Cu, Zn, etc. at the bonding interface between a ceramic magnetic layer and a ceramic dielectric layer, and to provide a composite laminate component with high circuit resistance. Our goal is to provide the following.

[0009]

[Means for Solving the Problems] Such objects are achieved by the present invention as described in (1) to (5) below.

(1) Integrally includes a capacitor chip body composed of a laminated ceramic dielectric layer and an internal electrode layer, and an inductor chip body composed of a laminated ceramic magnetic layer and an internal conductor. A composite laminate component, wherein a dielectric material substantially the same as the ceramic dielectric layer and a magnetic material substantially the same as the ceramic magnetic layer are provided between the capacitor chip body and the inductor chip body. One or more intermediate layers containing a mixed material of Ni-
A composite laminate component containing Zn ferrite and/or Ni-Cu-Zn ferrite.

(2) The weight ratio of the magnetic material to the dielectric material in the mixed material of the intermediate layer is 1/9 to 9.
The composite laminate component according to (1) above, which is /1.

(3) The above-mentioned (1) or (1) has two or more intermediate layers, and the weight ratio of the magnetic material to the dielectric material in the mixed material of the intermediate layer is larger toward the inductor chip body. 2) The composite laminate component described in 2).

(4) The composite laminate component according to any one of (1) to (3) above, wherein the ceramic dielectric layer contains a titanium oxide dielectric.

(5) The composite laminate component according to any one of (1) to (4) above, wherein the capacitor chip body and the inductor chip body are co-fired.

[0015]

[Operation] The composite laminate component of the present invention has a magnetic material substantially the same as the ceramic magnetic layer and a ceramic dielectric layer between the ceramic magnetic layer of the inductor chip body and the ceramic dielectric layer of the capacitor chip body. and substantially the same dielectric material.

By providing such an intermediate layer,
The difference in thermal expansion coefficient between the ceramic magnetic layer and the ceramic dielectric layer and the steep change in composition at the interface are alleviated, and local precipitation of Cu, Cu oxide, Zn, Zn oxide, etc. at the interface can be suppressed, and electrical Formation of a layer with low resistance can be prevented. Therefore, a composite laminate component with sufficiently high circuit resistance is realized.

[0017]

[Specific Configuration] The specific configuration of the present invention will be explained in detail below.

FIG. 1 shows a laminated ceramic LC composite component which is a preferred embodiment of the composite laminated component of the present invention.

The LC composite component 1 shown in FIG. 1 includes a capacitor chip body 2 formed by laminating a ceramic dielectric layer 21 and an internal electrode layer 25, and a laminated ceramic magnetic layer 31 and an internal conductor 35. The inductor chip body 3 is integrated with an inductor chip body 3 formed by the above structure via an intermediate layer 4, and has an external electrode 51 on the surface.

The intermediate layer 4 contains a mixed material in which a dielectric material substantially the same as that of the ceramic dielectric layer 21 and a magnetic material substantially the same as that of the ceramic magnetic layer 31 are mixed.

[0021] In this case, the dielectric material and magnetic material are
It is sufficient that they are substantially the same, but it is particularly preferable that they be the same. Further, although the intermediate layer 4 is a single layer in the illustrated example, it is preferable to have a multilayer structure of two or more layers.

[0022] The term "substantially the same materials" does not mean that the compositions are completely the same, but also when the compositions are slightly different, for example, if the constituent components containing 10 mol% or more are 30%
This includes cases in which the relative ratio is within the following range.

For example, when the magnetic material of the ceramic magnetic layer 31 is Ni-Cu-Zn ferrite, the difference in Ni content is about 3 mol % or less in terms of NiO, and the difference in Cu content is 2 mol % in terms of CuO. % or less, and if the difference in Zn content is less than about 4 mol% in terms of ZnO, they are substantially the same, and in the case of Ni-Zn ferrite, the difference in Ni content is about 5 mol% in terms of NiO. Hereinafter, if the difference in Zn content is about 5 mol % or less in terms of ZnO, they are substantially the same.

In this case, the Ni-Cu-
Zn ferrite and Ni-Zn ferrite contain Co, M
n, etc. may be contained in an amount of about 5 wt% or less of the total, and Ca, Si, Bi, V, Pb, etc. may be contained in an amount of about 1 wt% or less.

Further, in the case of Ni--Zn ferrite, various glasses such as borosilicate glass are usually added in order to lower the firing temperature.

Further, for example, if the dielectric material of the ceramic dielectric layer 21 is a titanium oxide dielectric, the difference in Ti content is about 10 wt% or less in terms of TiO2, and if it further contains Cu, etc. The difference in content of Cu
They are substantially the same if they are each about 7 wt% or less in terms of each oxide such as O.

In this case, various glasses such as borosilicate glass may be added to lower the firing temperature.

The content ratio of the dielectric material and the magnetic material in the mixed material of the intermediate layer 4 is not particularly limited, but the content ratio of the magnetic material W2 to the content W1 of the dielectric material, that is, the weight ratio W2 /W1 is preferably 1/9 to 9/1.

C below the above range or above the above range
It is difficult to suppress local precipitation of u, Cu oxide, Zn, Zn oxide, etc.

[0030] The thickness of the intermediate layer 4 is not particularly limited and may be selected appropriately depending on the application, etc., but it is usually 5 to 150 μm.
That's about it.

Further, there is no particular restriction on the number of laminated layers of the intermediate layer 4, and it may have a single layer structure as shown in the illustrated example, but Cu, Z
In order to further reduce the precipitation of n, etc., a multilayer structure with two or more layers is used, and the layer closer to the inductor chip body has a lower W2/W1.
It is preferable to lay the layers so that the In this case, W2 /W1 of each layer may be set, for example, within the range of 1/9 to 9/1, and the total weight ratio W2 /W1 of the entire intermediate layer
It is preferable that W1 be approximately 5/5.

[0032] In the case of multiple layers, there is no particular limit to the number of laminated layers;
The number of laminated layers is usually about 1 to 5 when considering workability etc., although it may be selected as appropriate depending on the purpose and the like. Note that the total thickness of the intermediate layer may be the same as described above, and the thickness of each layer may be different or the same.

[0033] Before firing, the LC composite part 1 of the present invention:
There is a certain degree of steep change in composition at the interface between the ceramic magnetic layer 31, the intermediate layer 4, and the ceramic dielectric layer 21, and each layer can be clearly distinguished, but mutual diffusion may occur due to firing or baking of the external electrode 51, etc. After firing, the layer has a nearly continuous or gently sloped profile.

The material of the ceramic magnetic layer 31 of the inductor chip body 3 is Ni--Cu--Zn ferrite and/or Ni--Zn ferrite, especially Ni--Cu--Z.
n-ferrite is used.

The Ni-Zn ferrite used in the present invention is not particularly limited and may be selected from various compositions depending on the purpose. For example, the NiO content may be 10 to 25 mol%, the ZnO content may be Preferably, the amount is 15 to 40 mol%.

[0036] Furthermore, the Ni-Cu-Zn ferrite used in the present invention is not particularly limited and may be selected from various compositions depending on the purpose.
15-25 mol%, CuO content is 5-15 mol%
, the content of ZnO is preferably 20 to 30 mol%.

[0037] In addition, Co, Mn, etc. contribute to the total 5w.
The content may be about t% or less. Furthermore, Ca, S
It may contain about 1 wt% or less of i, Bi, V, Pb, etc.

Further, when Ni--Zn ferrite is used, various glasses such as borosilicate glass are usually further contained.

In the present invention, there is no particular restriction on the conductive material constituting the internal conductor 35, and Ag, Pt, Pd, Au, C
The material may be selected from u, Ni, and alloys containing one or more of these, such as Ag-Pd alloys, but in order to obtain a practical Q as an inductor, it is necessary to have a low resistivity. It is preferable to use Ag, Cu, and alloys containing one or more of these.

The inductor chip body 3 of the LC composite component 1 may have a conventionally known structure, and its outer shape is usually approximately rectangular parallelepiped. As shown in FIG. 1, the internal conductor 35 is normally arranged in a spiral shape within the magnetic layer 31 to constitute an internal winding, and both ends of the internal conductor 35 are connected to each external electrode 51.
, 51.

In such a case, the winding pattern of the internal conductor 35, that is, the shape of the closed magnetic circuit, can be made into various patterns, and the number of turns can be appropriately selected depending on the application. Further, the dimensions of each part of the inductor chip body 3 are not limited, and may be appropriately selected depending on the application.

Note that the thickness of the internal conductor 35 is usually 5 to 3 mm.
The winding pitch is usually about 40 to 100 μm, and the number of turns is usually about 1.5 to 50.5 turns. Further, the base thickness of the magnetic layer 31 is usually 250 to 500 μm.
The thickness of the magnetic layer between the inner conductors 35 and 35 is usually 10~
It should be about 100 μm.

The ceramic dielectric layer 21 of the capacitor chip body 2 is not particularly limited and various dielectric materials may be used, but it is preferable to use a titanium oxide dielectric material because of its low firing temperature. In addition, titanate-based composite oxides, zirconate-based composite oxides, or mixtures thereof can also be used. Further, in order to lower the firing temperature, glass such as borosilicate glass may be included.

Specifically, as the titanium oxide type, NiO, CuO, Mn3 O4, Al2 O3,
Examples of titanic acid-based composite oxides include MgO, SiO2, etc., especially TiO2 containing CuO, and BaTiO3,
SrTiO3, CaTiO3, MgTiO3 and mixtures thereof are used as zirconate complex oxides such as Ba
ZrO3, SrZrO3, CaZrO3, MgZ
Examples include rO3 and mixtures thereof.

In the present invention, the conductive material constituting the internal electrode layer 25 is not particularly limited, and may include Ag, Pt, Pd, Au,
Cu, Ni, Ag-Pd alloy, etc.
It may be selected from alloys containing more than 100% of Ag.
, Ag alloys such as Ag-Pd alloys are suitable.

The capacitor chip body 2 of the LC composite component 1 may have a conventionally known structure, and its outer shape is usually approximately rectangular parallelepiped. As shown in FIG. 1, one end of the internal electrode layer 25 is connected to the external electrode 51.

There are no particular restrictions on the dimensions of each part of the capacitor chip body 2, and they may be selected as appropriate depending on the intended use.

The number of dielectric layers 21 to be laminated may be determined depending on the purpose, but is usually about 1 to 100. Also,
The thickness of each layer of the dielectric layer 21 is usually 20 to 150 mm.
The thickness of each layer of the internal electrode layer 25 is usually about 5 to 30 μm.

There is no particular restriction on the conductive material constituting the external electrode 51 of the LC composite component 1 of the present invention; for example, Ag, Pt
, Pd, Au, Cu, Ni, and alloys containing one or more of these, such as Ag-Pd alloys, and Ag alloys such as Ag and Ag-Pd alloys are particularly suitable. Further, the shape and dimensions of the external electrode 51 are not particularly limited and may be appropriately determined depending on the purpose and use, but the thickness is usually about 100 to 2500 μm.

The dimensions of the LC composite component 1 of the present invention are not particularly limited and may be selected appropriately depending on the purpose and use, but are usually (2.0 to 10.0 mm) x (1.2 to 15 mm). .0
mm)×(1.2 to 5.0 mm).

Furthermore, the composite laminate component of the present invention is not limited to the above-mentioned LC composite component, but may be various other composite laminate components as long as it partially has the above-described configuration. good.

[0052] Composite laminate parts such as the LC composite part 1 of the present invention can be manufactured by a conventional printing method using paste or a sheet method.

The ceramic magnetic layer paste is prepared as follows.

First, raw material powder of ferrite, for example, Ni
Various powders such as O, ZnO, CuO, Fe2 O3, etc.
Wet mix a predetermined amount using a ball mill, etc. The particle size of the raw material powder used is approximately 0.1 to 10 μm.

[0055] The wet-mixed mixture is usually dried using a spray dryer, and then calcined. This is usually processed using a ball mill with a powder particle size of 0.01 to 0.5 μm.
Wet-pulverize until the particle size reaches a certain level, and dry with a spray dryer.

The obtained ferrite powder is kneaded with a binder such as ethyl cellulose and a solvent such as terpineol or butyl carbitol to form a paste.

[0057] The paste for the magnetic layer may contain various glasses and oxides, if necessary.

There is no particular restriction on the composition of the paste for the ceramic dielectric layer, and various dielectric materials or raw material powders that become a dielectric by firing are selected depending on the composition of the ceramic dielectric layer as described above, and various binders and powders are selected. It can be prepared by kneading it with a solvent.

As the raw material powder, oxides constituting titanium oxide-based and titanic acid-based composite oxides may be used. Depending on the composition of the corresponding oxide dielectric, Ti, B or
Oxides of a, Sr, Ca, Zr, etc. may be used.

Compounds that become oxides upon firing, such as carbonates, sulfates, nitrates, oxalates, organometallic compounds, etc., may also be used.

These raw material powders usually have an average particle size of 0.
．． A material with a diameter of about 1 to 5 μm is used.

[0062] Furthermore, various types of glasses may be contained as necessary.

For the paste for the intermediate layer, ferrite powder is produced in the same manner as the paste for the ceramic magnetic layer, and similarly to the paste for the ceramic dielectric layer, various dielectric materials or dielectric materials are prepared by firing according to the desired composition. What is necessary is to select raw material powders and knead them with various binders and various solvents to adjust.

In this case, as described above, a ferrite powder having substantially the same composition as the ferrite powder used in the paste for the ceramic magnetic layer, especially a ferrite powder having the same composition, and a raw material powder used in the paste for the ceramic dielectric layer are fired. and a raw material powder that has substantially the same composition, especially the same composition, by firing, and adjusts it to a desired mixing ratio.

Conditions such as the ferrite raw material powder, the dielectric raw material powder, and the particle size of the ferrite powder may be the same as described above.

[0066] Furthermore, various glasses and oxides may be included as sintering aids and the like, if necessary.

The internal conductor paste, the internal electrode layer paste, and the external electrode paste are each made of the various conductive metals and alloys described above, or various oxides, organometallic compounds, and resinates that become the conductive materials described above after firing. etc., and the above-mentioned various binders and solvents are kneaded.

[0068] There is no particular restriction on the content of the binder and solvent in each of the pastes described above, and the content may be a normal content, for example,
Binder is about 1-5wt%, solvent is about 10-50wt
It may be about %. Further, each paste may contain additives selected from various dispersants, plasticizers, dielectrics, insulators, etc., as necessary. The total content of these is preferably 10 wt% or less.

When manufacturing the LC composite component 1, for example, first, a paste for the magnetic layer and a paste for the internal conductor are laminated and printed on a substrate such as PET, and then a paste for the intermediate layer is printed on the paste for the magnetic layer. A green chip is formed by printing a dielectric layer paste and an internal electrode layer paste on the intermediate layer paste. Next, after cutting into a predetermined shape, it is peeled off from the substrate.

Note that after forming a green sheet using the paste for the magnetic layer and the paste for the dielectric layer, and printing the paste for the internal conductor and the paste for the internal electrode layer on this, the paste for the intermediate layer and the paste for the intermediate layer are used. A green chip may be formed by laminating green sheets formed by using the same method.

Next, the external electrode paste is printed or transferred onto the green chip, and the magnetic layer paste, internal conductor paste, intermediate layer paste, dielectric layer paste, internal electrode layer paste, and external electrode paste are simultaneously applied. Fire.

[0072] Alternatively, the chip body may be fired first, and then the paste for external electrodes may be printed and fired.

[0073] The firing temperature is 800 to 930°C, especially 85°C.
It is preferable to set it as 0-900 degreeC. Further, the firing time is preferably 0.05 to 5 hours, particularly 0.1 to 3 hours. Firing is usually performed in air.

Note that composite laminated parts other than LC composite parts may also be manufactured as described above.

The composite laminated component of the present invention, such as the LC composite component manufactured in this way, can be mounted on a printed circuit board by soldering the external electrodes, etc., and used in various electronic devices. .

[0076]

[Examples] Hereinafter, the present invention will be explained in more detail by giving specific examples of the present invention.

[Preparation of LC composite parts] The following pastes were prepared. (Magnetic layer paste) NiO (17 mol%), CuO (9 mol%), ZnO (
25 mol%) and Fe2O3 (49 mol%) powders were wet mixed using a ball mill, and then this wet mixture was dried with a spray dryer, calcined at 750°C, and made into granules. This was ground in a ball mill and then dried in a spray dryer to obtain Ni--Cu--Zn ferrite raw material powder with an average particle size of 0.1 μm.

Next, 3.84 parts by weight of ethyl cellulose and 78 parts by weight of terpineol were added to 100 parts by weight of this raw material powder, and the mixture was kneaded with a triple roll to form a paste.

(Paste for internal conductor) Average particle size 0.8μ
2.m of ethyl cellulose per 100 parts by weight of Ag.
5 parts by weight and 40 parts by weight of terpineol were added and kneaded using three rolls to form a paste.

(Paste for dielectric layer) Average particle size 0.7μ
m TiO2 (92 mol%), average particle size 0.05 μm
of CuO (4 mol%) and Ni with an average particle size of 0.5 μm
O (4 mol%) was used. To 100 parts by weight of this dielectric powder, 3.5 parts by weight of ethyl cellulose and 40 parts by weight of terpineol were added and kneaded using three rolls to form a paste.

(Paste for internal electrode layer) Average particle size 0.8
For every 100 parts by weight of μm Ag, 2.
5 parts by weight and 40 parts by weight of terpineol were added and kneaded using three rolls to form a paste.

(Paste for intermediate layer) 100 parts by weight of Ni-Cu-Zn ferrite raw material powder used in the paste for the magnetic layer and 100 parts by weight of the dielectric powder used in the paste for the dielectric layer.
To the weight part, 3.5 parts by weight of ethyl cellulose and 40 parts by weight of terpineol were added and kneaded with a three-roll mill to form a paste.

(External electrode paste) Average particle size 1.2μ
3.0 parts by weight of ethyl cellulose per 100 parts by weight of Ag
Parts by weight, 7 parts by weight of glass frit, 40 parts by weight of terpineol
Parts by weight were added and kneaded using three rolls to form a paste.

The paste for the magnetic layer and the paste for the internal conductor produced in this way are printed and laminated, then the paste for the intermediate layer is printed, and then the paste for the dielectric layer and the paste for the internal electrode layer are printed. They were laminated to form a green chip.

[0085] Next, it was fired in air at 890°C for 2 hours.

After baking, a paste for external electrodes was printed, and then baked in air at 600° C. for 30 minutes to bake the external electrodes.

[0087] In this way, 5.0 mm x 5.0 mm x
LC filter composite part sample No. 3.0 mm shown in FIG. 1 was produced.

[0088] The thickness of the intermediate layer was 50 μm.

The thickness of the interlayer magnetic layer is 40 μm, the thickness of the internal winding (internal conductor) is 15 μm, and the wire width is 300 μm.
, the number of turns was 25 turns.

The thickness of the interlayer dielectric layer is 100 μm, the number of laminated dielectric layers is 5, and the thickness of the internal electrode layer is 15 μm.
And so.

[0091] The thickness of the external electrode was 800 μm.

[0092] Also, sample No. Sample No. 1 was prepared in the same manner except that the single-layer intermediate layer in No. 1 was changed to three layers. 2 was produced.

Sample No. Of the three intermediate layers in 2, the intermediate layer on the magnetic layer side has a dielectric powder content of W1,
The content of Ni-Cu-Zn ferrite raw material powder is W2
When the weight ratio W2 /W1 is 7/3, sample No. Similar to 1, W2 /W1
A paste was used in which the ratio of W2 /W1 was 5/5 and the ratio of W2 /W1 was 3/7 for the intermediate layer on the dielectric layer side. Also,
The thickness of each of the three layers was 20 μm, and the total thickness of the intermediate layer was 60 μm.

[0094] As a comparison sample, No. 1 was used except that no intermediate layer was provided. Sample No. 1 similar to 1. No. 3 except that an intermediate layer was provided in which the Ni-Cu-Zn ferrite raw material powder and dielectric powder were replaced with non-magnetic Zn ferrite raw material powder. Sample No. 1 similar to 1. 4
and were created.

[0095] X-ray analysis was performed on each sample obtained to determine the concentration distribution of Fe, Ni, Zn, and Cu in the vicinity of the joint between the capacitor chip body and the inductor chip body.

Sample No. FIG. 2 shows a graph showing the concentration of each element in Sample No. 1. FIG. 3 shows a graph showing the concentration of each element in Sample No. 2. 3
FIG. 4 shows a graph showing the concentration of each element.

From the graph of FIG. 4, comparison sample No.
3 indicates that there are peaks of Zn and Cu between the capacitor chip body (dielectric layer) and the inductor chip body (magnetic layer), and that there is local precipitation of Zn, Zn oxide, Cu, and Cu oxide. You can check it.

In contrast, sample No. of the present invention. 1
and no. In No. 2, peaks of Zn and Cu are seen between the inductor chip body and the capacitor chip body; It is lower in height than No. 3, and has a broad peak that covers almost the entire area of the middle layer. 3
It can be confirmed that there is no local precipitation such as.

Next, the circuit resistance IR of each sample was measured. The results are shown in Table 1.

[0100]

[Table 1]

The effects of the present invention are clear from the results shown in Table 1.

[0102] In addition, sample No. 1 or N
o. A paste was prepared by replacing the Ni-Cu-Zn ferrite in Sample No. 2 with Ni-Zn ferrite and adding glass frit. 1 or No. 2 T
When iO2 and CuO were replaced with only TiO2 and a glass frit was added to prepare pastes, various samples were prepared using these pastes, and similar results were obtained.

[0103] In addition to the LC filter composite part, the L
Similar results were obtained when composite laminated parts such as C-traps were manufactured.

[0104]

Effects of the Invention The composite laminate component of the present invention has a structure in which localized Cu is removed at the interface between the inductor chip body and the capacitor chip body.
There is almost no precipitation of Zn, Cu oxide, Zn or Zn oxide. Therefore, the circuit resistance of the components is high.

[Brief explanation of the drawing]

FIG. 1: LC, which is a preferred embodiment of the composite laminate component of the present invention.
FIG. 2 is a perspective view showing a part of the composite component cut away.

FIG. 2 is a graph showing the concentration distribution of each element according to X-ray analysis of the composite laminate component of the present invention.

FIG. 3 is a graph showing the concentration distribution of each element according to X-ray analysis of the composite laminate component of the present invention.

FIG. 4 is a graph showing the concentration distribution of each element according to X-ray analysis of a conventional composite laminate component.

[Explanation of symbols]

1 LC composite parts 2 Capacitor chip body 21 Ceramic dielectric layer 25 Internal electrode layer 3 Inductor chip body 31 Ceramic magnetic layer 35 Internal conductor 4 Middle class 51 External electrode

Claims (5)

[Claims] 1. A composite body integrally comprising a capacitor chip body formed by laminating a ceramic dielectric layer and an internal electrode layer, and an inductor chip body formed by laminating a ceramic magnetic layer and an internal conductor. The multilayer component includes a dielectric material substantially the same as the ceramic dielectric layer and a magnetic material substantially the same as the ceramic magnetic layer between the capacitor chip body and the inductor chip body. A composite material characterized in that one or more intermediate layers containing a mixed material are formed, and the ceramic magnetic layer contains Ni-Zn ferrite and/or Ni-Cu-Zn ferrite. Laminated parts. 2. The composite laminate component according to claim 1, wherein the weight ratio of the magnetic material to the dielectric material in the mixed material of the intermediate layer is 1/9 to 9/1. 3. The inductor according to claim 1, wherein the intermediate layer has two or more layers, and the weight ratio of the magnetic material to the dielectric material in the mixed material of the intermediate layer is larger toward the inductor chip body. composite laminate parts. 4. The composite laminate component according to claim 1, wherein the ceramic dielectric layer contains a titanium oxide dielectric. 5. The composite laminate component according to claim 1, wherein the capacitor chip body and the inductor chip body are co-fired.