JP3421656B2 - Ferrite materials and components for ceramic inductors - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ferrite material for a ceramic inductor, and more particularly to a stable ferrite material having excellent temperature characteristics used for a ferrite sintered body used as various magnetic materials.

[0002]

2. Description of the Related Art In a multilayer chip component such as a chip inductor or a chip bead, a magnetic paste and an internal conductor paste are usually laminated and integrated by a thick film technique and then fired to form an external electrode by using an external electrode paste. After doing
It is manufactured by firing. In this case, the magnetic material used for the magnetic layer is Ni-C capable of low temperature sintering.
u-Zn ferrite is generally used.

By the way, Ni-Cu-Zn ferrite and N
It is known that when i-Zn ferrite is used, it affects electromagnetic properties and sinterability depending on the contents of S and Cl in the ferrite raw material (Japanese Patent No. 2867196, JP-A-11-144934). Gazette), this S and C
1 is based on using iron sulfate as a starting material or iron chloride as a starting material when producing iron oxide as a raw material of ferrite. Further, a manufacturing method has been proposed in which an additive (sintering aid) is added to obtain a high-density ferrite sintered body.

[0004]

In a conventional ferrite material, at a firing temperature lower than the melting point of Ag used for the internal conductor, a high-density sintered body with few pores cannot be obtained, and a moisture resistance load test, etc. The magnetic properties deteriorate. Therefore, even if it is fired at a high temperature or densified by an additive, as a side effect, disconnection or disappearance of the internal conductor, Ag diffusion or Cu segregation causes a different phase at the grain boundary, resulting in inductance or Q or There is a problem that the temperature characteristic is deteriorated and a migration phenomenon occurs due to diffused Ag, which causes deterioration of insulation resistance and short circuit failure.

Therefore, an object of the present invention is to provide a Ni-based ferrite material which has a high density of laminated chip parts and a magnetic core and a small temperature characteristic without using an additive.

[0006]

[Means for Solving the Problems] In order to achieve the above-mentioned object, the inventors of the present invention have conducted research to provide a ferrite material that can achieve this object according to the following (1) to (2) and (3) to () below. It was found that 5) can provide a ferrite component that can achieve this object.

(1) In the Ni-based ferrite material, the specific surface area of the nickel compound as a raw material is 1.0 to 10 m ²
/ G and content of sulfur component is 100 to 100 in terms of S
A ferrite material characterized by using a raw material of 0 ppm.

(2) The composition of the Ni-based ferrite material is Fe ₂ O ₃ = 25 to 52 mol%, ZnO = 0 to 40 mol%, CuO = 0 to 20 mol%, NiO = 1 to 65 mol%, MgO The ferrite material according to (1) above, which is composed of the balance.

(3) A chip component formed by laminating a ferrite magnetic layer and an internal conductor, wherein the ferrite magnetic layer has a specific surface area of a nickel compound of 1.0 to
10m ² / g and content of sulfur component is 100 in terms of S
The specific surface area of the Ni-based ferrite material using the raw material of 1 to 1000 ppm or the nickel compound of the raw material is 1.
0-10 m ² / g and content of sulfur component is 1 in S conversion
A raw material having an amount of 0 to 1000 ppm is used, and the composition thereof is Fe ₂ O ₃ = 25 to 52 mol%, ZnO = 0 to 4
0 mol%, CuO = 0 to 20 mol%, NiO = 1 to 65
A chip inductor or chip bead component characterized by being composed of a Ni-based ferrite material composed of mol% and the balance of MgO.

(4) Laminate the ferrite magnetic layer and the inner conductor
Composite having at least an inductor part formed by stacking layers
This is a laminated component, and the ferrite magnetic layer is a raw material.
Specific surface area of the nickel compound is 1.0 to 10 m²/ G and
When the content of Ou component is 100-1000ppm in S conversion
Ni-based ferrite material using a certain raw material, or raw material
The specific surface area of the nickel compound is 1.0 to 10 m²/ G
Content of sulfur component is 100-1000pp in S conversion
m is used, and the composition is Fe ₂O₃=
25-52 mol%, ZnO = 0-40 mol%, CuO =
0-20 mol%, NiO = 1-65 mol%, balance MgO
Composed of a Ni-based ferrite material
A composite laminated component characterized in that

(5) Ni-based ferrite using a raw material in which the ferrite core has a specific surface area of the nickel compound of the raw material of 1.0 to 10 m ² / g and a sulfur component content of 100 to 1000 ppm in terms of S The material or the raw material nickel compound has a specific surface area of 1.0 to 10 m ² / g and a sulfur component content of 100 to 1000 pp in terms of S.
m is a raw material and its composition is Fe ₂ O ₃ =
25-52 mol%, ZnO = 0-40 mol%, CuO =
A ferrite magnetic core comprising 0 to 20 mol%, NiO = 1 to 65 mol%, and a Ni-based ferrite material composed of the balance of MgO.

According to the present invention, in the ferrite material for a ceramic inductor, by setting the specific surface area of the nickel compound and the content of the S component within a predetermined range, the density can be increased without using any additive, A ferrite material with small temperature characteristics despite its high density can be obtained. The ferrite core and the laminated chip component made of this ferrite material have excellent moisture resistance and temperature characteristics, and can further reduce variations in sintered body density and inductance.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Generally, a ferrite material is obtained by mixing an iron compound and another ferrite-constituting element compound and calcining the mixture. It is known that in this calcination step, the solid-state reaction rate for forming spinel crystals changes depending on the amounts of S and Cl contained in the ferrite mixed powder. Due to the difference in the reaction rate, the raw material or the intermediate product remains, or a different phase occurs due to segregation due to thermal dissociation to make the powder composition non-uniform, which adversely affects the sintered body density and magnetic properties.

It is also known that the amount of S and Cl remaining in the powder obtained by pulverizing the powder after calcination affects the magnetic properties. The S and Cl are contained in the ferrite constituent element compound.

The inventors of the present invention have conducted an investigation based on such findings. As a result, by restricting the specific surface area of the nickel compound and the content of the S component in the ferrite material, it is possible to increase the density without using an additive. Therefore, we have found a ferrite material with small temperature characteristics despite its high density.

The ferrite material of the present invention will be specifically described below. First, a ferrite constituent element compound such as Fe
₂ O ₃ , NiO, CuO, ZnO, MgO is used as a starting material, weighed so as to have a desired composition after firing, and wet mixed with pure water by a ball mill or the like.

The wet-mixed product is dried by a spray dryer or the like and then calcined. Then, the calcined product is wet-milled with pure water by a ball mill or the like. Wet pulverized and dried with a spray dryer,
A ferrite powder is obtained. At this time, for the nickel compound, a raw material having a specific surface area of 1.0 to 10 m ² / g and a sulfur component content of 100 to 1000 ppm in terms of S is used.

The specific surface area of the nickel compound is 1.0 m ² /
If it is less than g, the nickel compound does not form a solid solution even after pre-baking, and the ferrite-constituting element compound remains, and the value of the sintered body density becomes lower than the sintered body density of 4.85 g / cm ³ which guarantees the moisture resistance. . On the other hand, if it exceeds 10 m ² / g, the handling of the powder is poor and the powder is light when mixed with water, so that it floats on the surface and the mixing property is poor. Therefore, since the nickel compound in the powder after wet mixing is poorly dispersed, the nickel compound is difficult to form a solid solution after the calcination, the ferrite-constituting element compound remains, and the sintered body density becomes lower than 4.85 g / cm ^3. , Moisture resistance is not guaranteed.

Further, even if the specific surface area is 1.0 to 10 m ² / g, if the S component is less than 100 ppm, the density of the sintered body will be low and the moisture resistance cannot be guaranteed. Again 1000pp
If it exceeds m, the density of the sintered body will increase, but the diffusion of Ag and C
Segregation of u increases, and the inductance and temperature characteristics deteriorate.

The temperature characteristic is the rate of change when 25 ° C. and 85 ° C. inductances are measured and 25 ° C. is used as a reference. The temperature characteristic needs to be within ± 3%, and more preferably within ± 2%, so that the temperature characteristic is ± 2% and the sintered body density is sufficient to satisfy 4.85 g / cm ^3. Has a specific surface area of the nickel compound of ² to 5 m ² /
g and the content of sulfur component is 250 to 700 p in terms of S
pm is more preferred.

The specific surface area may be measured by the BET method. Further, the sulfur content is converted to SO by oxidizing and burning the nickel compound as a raw material in an oxygen atmosphere.
₂ should be analyzed with an infrared detector.

In the calcination of the mixed powder, in order to determine the optimum calcination temperature, the powder calcinated at different temperatures is measured by an X-ray diffractometer, and the calcination temperature with the highest spinel synthesis rate is obtained. Should be selected.

Here, the spinel synthesis rate means the peak intensity (Isp311) of the (311) plane of spinel type ferrite in powder X-ray diffraction and (10) of α-Fe ₂ O ₃ .
4) peak intensity (IFe104) of the plane and (1) of CuO
It is a value represented by the following formula from the peak intensity (ICu111) of the 11) plane. Also, in X-ray diffraction, the radiation source is C
u, voltage 40 kV, current 40 mA, scanning speed 2 ° / mi
It was measured by n.

Spinel synthesis rate = Isp311 / (Isp311 + IFe104
+ ICu111) × 100 (%) If the spinel synthesis rate is less than 96%, a large amount of ferrite-constituting element compounds remain and the density of the sintered body is low, so 96% or more is preferable, and 99% or more is more preferable to determine the optimum temperature. preferable.

The reason for limiting the composition range of ferrite in the present invention is as follows.

When Fe ₂ O _{3 as the} main component is out of the range of 25 to 52 mol%, the density of the sintered body does not reach 4.85 g / cm ³ and becomes low, and the relative permeability, Q and insulation resistance IR are decreased. It causes problems such as deterioration.

When ZnO exceeds 40 mol%, Q is lowered and the Curie temperature becomes 100 ° C. or lower, which is not practical.

When CuO exceeds 20 mol%, Q is lowered. Further, when it is used for a composite laminated component, CuO or ZnO is deposited on a joint surface with a dissimilar material such as a capacitor material, and IR is lowered.

When NiO exceeds 65 mol%, sintering does not occur below the melting point of Ag. If NiO is less than 1%, the insulation resistance IR deteriorates.

When a part of NiO is replaced with MgO, the temperature characteristics are improved while maintaining the sintered body density and relative permeability.
When it exceeds 15 mol%, the density of the sintered body and the relative magnetic permeability are deteriorated.

Besides, oxides such as Co and Mn may be contained in an amount of about 2 wt% or less of the whole. These C
Although o and Mn do not improve the sintered body density, Co improves Q and Mn improves the insulation resistance IR.

An embodiment of the present invention will be described below. The composition after firing is Fe ₂ O ₃ = 49.0 mol%, NiO = 2
5.0 mol%, CuO = 12.0 mol%, ZnO = 1
It was weighed so as to be 4.0 mol%, wet-mixed with pure water in a ball mill, and dried by a spray dryer. At this time, the raw material nickel oxide having a specific surface area of 1 to 71 m ² / g and a sulfur component content of 0 to 1130 ppm in terms of S was used.

Next, this mixed powder is heated at 700 to 800 ° C. for 1 hour.
It was calcined for 0 hours. Then, the calcined powder was wet-milled with pure water in a ball mill and dried by a spray dryer. Then, 10 parts by weight of polyvinyl alcohol was added to 100 parts by weight of the obtained pulverized powder to make granules and press-molded into a toroidal shape.

This molded body was fired at 880 ° C. for 2 hours to obtain a sintered body. The sintered body density was calculated from the weight and size of the sintered body. In addition, the relative magnetic permeability μi and Q are 20 turns of copper wire wound around a toroid, and the inductance and Q are measured by an LCR meter at a measurement frequency of 10 MHz and a measurement current of 0.5 mA.
Was measured, and the relative magnetic permeability μi was determined using the following formula.

Relative permeability μi = (le × L) / (μo × Ae × N ² ) le: Magnetic path length L: Inductance of sample μo:
Permeability in vacuum Ae: cross-sectional area of sample N: number of turns of coil Next, a laminated chip inductor was prepared. To 100 parts by weight of the pulverized powder, 4 parts by weight of ethyl cellulose and 78 parts by weight of terpineol were added and kneaded with a three-roll to prepare a magnetic paste. On the other hand, average particle size 0.6
2.5 parts by weight of ethyl cellulose and 40 parts by weight of terpineol were added to 100 parts by weight of Ag having a thickness of μm, and the mixture was kneaded with a three-roll to prepare an internal electrode paste.
The magnetic layer paste and the internal electrode paste were alternately printed and laminated, and then baked at 850 ° C. for 2 hours to obtain a multilayer chip inductor.

This 3216 type (length and width are 3.2)
The dimensions of the multilayer chip inductor (× 1.6 mm) are 3.2.
mm × 1.6 mm × 1.2 mm, and the number of turns was 5.5 turns. Next, an external electrode was formed by baking at 600 ° C. on the end of the above multilayer chip inductor, and the inductance L and Q were measured using a LCR meter at a measurement frequency of 10 MHz and a measurement current of 0.1 mA.

The temperature characteristics of the inductance of the toroidal and multilayer chip inductors are the rate of change when the inductance is measured at a measurement frequency of 1 MHz at 25 ° C. and 85 ° C. and 25 ° C. is used as a reference.

The results are shown in Table 1.

[0039]

[Table 1]

As is clear from Table 1, it is clear from Comparative Examples 1 to 6 that the nickel compound has a specific surface area of 1.0 to 10 m ² / g and a sulfur component content of 100 to 1000 ppm in terms of S. As described above, the sintered body has a toroidal density of 4.85 g / cm ³ and a chip inductor of 5.
Below 15 g / cm ³ , moisture resistance cannot be guaranteed.

The S component of the nickel compound is 1000 p
When it exceeds pm, as shown in Comparative Example 7, the density of the sintered body reaches a density at which moisture resistance can be guaranteed, but the temperature characteristic is ± 3.
It shows a large value exceeding%.

With a ferrite material within the scope of the present invention, the density of the sintered body is 4.85 g / cm ^{3 for the} toroidal and 5.15 g / cm ³ or more for the chip inductor, and the temperature characteristic is suppressed within ± 3%. You can see that

Particularly, the specific surface area of the nickel compound is 2 to 5 m.
² / g and the content of sulfur component is 250 to 70 in terms of S
In the case of 0 ppm, as shown in Examples 3, 4, 5, 7, and 8, a sintered body having more excellent density and temperature characteristics can be obtained.

Next, the ferrite material of the present invention Fe ₂ O ₃ =
49 mol%, ZnO = 25 mol%, CuO = 9 mol%,
An LC composite laminated part using NiO = 17 mol% will be described with reference to FIG.

The LC composite component 1 shown in FIG. 1 comprises a capacitor section 2 formed by laminating a ceramic dielectric layer 21 and an internal electrode layer 22, a ceramic magnetic layer 31 and an internal conductor 32. The integrated inductor portion 3 is integrated with an external electrode 41 formed on the surface.

The capacitor section 2 and the inductor section 3 are
A conventionally known structure may be used, and the outer shape is usually a substantially rectangular parallelepiped shape. The size of the LC composite component 1 is not particularly limited and can be set as appropriate according to the application.
0.0 mm x 0.8 to 15.0 mm x 1.0 to 5.0 m
It can be about m.

The ceramic magnetic layer 31 of the inductor section 3
Is composed of the ferrite material of the present invention. That is, the magnetic material layer paste obtained by kneading the ferrite material of the present invention with a binder such as ethyl cellulose and a solvent such as terpineol and butyl carbitol is printed and laminated alternately with the internal electrode paste to form the inductor portion 3. can do. There is no limitation on the content of the binder and the solvent in this magnetic layer paste. For example, the content of the binder is 1 to 5% by weight, and the content of the solvent is 10 to 5%.
It can be set in the range of about 0% by weight.

The inductor portion 3 can also be formed by using a ceramic magnetic material layer sheet. That is, a ferrite material of the present invention, a slurry obtained by kneading a binder containing polyvinyl butyral or acrylic as a main component and a solvent such as toluene or xylene in a ball mill,
A magnetic material layer sheet is obtained by coating on a polyester film or the like by a doctor blade method or the like and drying. There is no limitation on the content of the binder in the magnetic layer sheet, for example, 1
It can be set within the range of about 5% by weight.

The conductive material forming the internal electrodes 32 of the inductor part 3 is not particularly limited, but in order to obtain a practical Q as an inductor, a conductive material mainly composed of Ag having a low resistivity may be used. preferable. Usually, Ag, Ag alloy, Cu, Cu alloy or the like is used. Each layer of the internal electrode 32 has an oval shape, and each layer of the adjacent internal electrodes 32 is
Since the electrical connection is ensured in a spiral shape, the internal electrode 3
2 constitutes a closed magnetic circuit coil (winding pattern), and external electrodes 41 are connected to both ends thereof.

In such a case, the winding pattern of the inner conductor 32, that is, the shape of the closed magnetic circuit can be various patterns, and the number of turns can be selected appropriately according to the application.
Further, there is no limitation on the size of each part of the inductor part 3 and it may be appropriately selected according to the application.

The thickness of the inner conductor 32 is usually 3-5.
0 μm, winding pitch is usually 10-400 μm,
The number of turns is usually about 1.5 to 50.5 turns. The base thickness of the magnetic layer 31 is usually 100 to 500 μm, and the magnetic layer thickness between the inner conductors 32, 32 is usually 10 to 100 μm.

The ceramic dielectric layer 21 of the capacitor section 2
There are no particular restrictions on the material used for the above, and various dielectric materials may be used. However, since the firing temperature is low, it is preferable to use a titanium oxide-based dielectric. In addition, a titanic acid-based composite oxide, a zirconic acid-based composite oxide, or a mixture thereof can also be used. Further, glass such as borosilicate glass may be contained in order to lower the firing temperature.

Specifically, as the titanium oxide type, NiO, CuO, Mn ₃ O ₄ , Al ₂ O ₃ and Mg may be used as required.
O, SiO _{2 and the} like, particularly TiO _{2 and the} like containing CuO, and BaTiO ₃ and SrTiO ₃ as titanic acid-based composite oxides.
₃ , CaTiO ₃ , MgTiO ₃ and mixtures of these
Zirconic acid-based composite oxides include BaZrO ₃ , Sr.
ZrO ₃ , CaZrO ₃ , MgZrO ₃ and mixtures thereof are used. When the mixed material is not used, for example, nonmagnetic Zn ferrite or the like can be used.

Ceramic dielectric layer 21 of capacitor section 2
The dielectric layer paste obtained by kneading the material used for (1) with various binders and solvents can be formed by alternately printing and laminating the internal electrode paste. There is no limitation on the content of the binder and the solvent in the dielectric layer paste. For example, the content of the binder may be set to 1 to 5% by weight, and the content of the solvent may be set to about 10 to 50% by weight. it can.

It can also be formed by using a dielectric layer sheet. That is, a slurry obtained by kneading a dielectric material with various binders and a solvent in a ball mill is applied onto a polyester film or the like by a doctor blade method or the like and dried to obtain a dielectric layer sheet. This dielectric layer sheet can be formed by alternately laminating with the internal electrode paste. The content of the binder in the dielectric layer sheet is not limited, and can be set within a range of, for example, about 1 to 5% by weight.

Internal electrode layer 22 constituting the capacitor section 2
There is no particular limitation on the conductive material that forms Ag, Pt, P
d, Au, Cu, Ni or an alloy containing one or more of these, such as an Ag-Pd alloy, may be selected.
Particularly, Ag alloys such as Ag and Ag-Pd alloys are suitable.

The size of each part of the capacitor part 2 is not particularly limited, and may be appropriately selected according to the application and the like. The number of laminated dielectric layers 21 is 1 to 100, the thickness of each dielectric layer is 10 to 150 μm, and the thickness of each internal electrode layer 22 is 3 to 30 μm.

The conductor material used for the external electrode 41 is not particularly limited, and may be selected from Ag, Pt, Pd, Au, Cu, Ni, and alloys containing one or more of them such as Ag-Pd alloy. The shape and size of the external electrode 41 are not particularly limited and may be appropriately determined depending on the purpose and application, but the thickness is usually about 3 to 200 μm.

The internal conductor paste, the internal electrode paste, and the external electrode paste are each made of the above-mentioned various conductive metals, alloys, or various oxides, organometallic compounds, resinates, etc. which become the above-mentioned conductive material after firing. It is prepared by kneading the above-mentioned various binders and a solvent.

When manufacturing the LC composite component 1, for example, first, the magnetic layer paste and the internal conductor paste are laminated and printed on a substrate such as PET (polyethylene terephthalate) to form the inductor section 3. The dielectric layer paste and the internal electrode paste are laminated and printed thereon to form the capacitor section 2. Or condenser part 2
May be formed first, and the inductor portion 3 may be formed thereon.

A green sheet is formed by using the magnetic layer paste or the dielectric layer paste, the internal conductor paste and the internal electrode layer paste are printed on the green sheet, and these are laminated to form a green chip. You may form. In this case, the dielectric layer adjacent to the magnetic layer may be directly printed.

Then, the external electrode paste is printed or transferred onto the green chip, and the magnetic layer paste, the internal conductor paste, the dielectric layer paste, the internal electrode layer paste and the external electrode paste are simultaneously fired.

Alternatively, the green chip may be fired first, and then the external electrode paste may be printed or transferred and fired.

The firing temperature is 800 to 930 ° C., especially 850.
It is preferable to set the temperature to ˜900 ° C. Baking temperature is 800 ℃
If it is less than 0.99, firing becomes insufficient. On the other hand, if it exceeds 930 ° C., the internal electrode material may diffuse into the ferrite material, and electromagnetic characteristics may be significantly deteriorated. The firing time is 0.0
It is preferably 5 to 5 hours, particularly 0.1 to 3 hours. The firing is performed at an oxygen partial pressure PO ₂ = 1 to 100%.

The baking temperature for baking the external electrodes is usually about 500 to 700 ° C., and the baking time is usually 10
It is about 3 minutes to 3 hours, and firing is usually performed in air.

In the present invention, it is preferable to perform the heat treatment during and after firing in an atmosphere containing oxygen in excess of the atmosphere.

By performing heat treatment in an oxygen-excess atmosphere, a substance such as a metal such as Cu or Zn or a substance such as Cu ₂ O or Zn ₂ O which has a low resistance is deposited or is deposited.
It can be deposited in the form of oxides such as CuO and ZnO, which have high resistance and are harmless.

The heat treatment is preferably performed during and after firing.

For example, when the firing of the green chip and the firing for burning the external electrode are performed simultaneously, when performing the firing for burning the external electrode at the time of this firing, after this firing, and after firing the green chip, It is preferable to perform a predetermined heat treatment when the external electrode is baked or after the external electrode is baked. When the firing is performed twice as in the latter case, heat treatment may be further performed during and after firing of the green chip depending on the case.

The oxygen partial pressure ratio in the heat treatment atmosphere is 20.8.
-100%, more preferably 50-100%, particularly preferably 100%.

When the oxygen partial pressure ratio is less than 20.8%, the ability to suppress the precipitation of Cu, Zn, Cu ₂ O, Zn ₂ O, etc. is lowered.

Since such heat treatment in an oxygen-excess atmosphere is usually performed at the same time as firing or external electrode baking, various conditions such as heat treatment temperature and holding time are the same as the firing conditions and external electrode baking conditions. However, when the heat treatment is performed alone, the heat treatment temperature is 550 to 900 ° C., particularly 650 to 800 ° C., and the holding time is 0.5 to 2 hours, especially 1
It is preferably set to be 1.5 hours.

The composite laminated parts other than the LC composite part may be manufactured as described above.

The composite laminated component such as the LC composite component manufactured in this manner is mounted on a printed circuit board or the like by soldering external electrodes, and is used for various electronic devices and the like.

Fe ₂ O ₃ , NiO, Cu in the magnetic layer
The composition of O, ZnO, and MgO can be measured by fluorescent X-ray analysis by the glass beat method.

[0076]

According to the present invention, the following effects can be obtained.

(1) In the nickel-based ferrite material, the specific surface area of the nickel compound as a raw material is 1.0 to 1
0 m ² / g and the content of sulfur component is 100 in terms of S
By using a raw material having a concentration of up to 1000 ppm, it is possible to achieve a high density without using an additive, and it is possible to provide a ferrite material for obtaining a ferrite having a small temperature characteristic despite the high density. . Since the laminated chip component and the ferrite core made of this ferrite material have a high density, they can be provided with good moisture resistance and excellent temperature characteristics.

(2) In the nickel ferrite material, the specific surface area of the nickel compound as a raw material is 1.0 to 1
0 m ² / g and the content of sulfur component is 100 in terms of S
~ 1000 ppm, the composition of the ferrite material is Fe
₂ O ₃ = 25 to 52 mol%, ZnO = 0 to 40 mol%,
CuO = 0 to 20 mol%, NiO = 1 to 65 mol%, M
Provided is a ferrite material in which gO is the balance and the density can be increased without using an additive, the temperature characteristics are excellent despite the high density, and the ferrite material can be sintered even below the melting point of Ag. be able to. The laminated chip component and the ferrite core made of this ferrite material also have similar excellent characteristics.

(3) A chip component constituted by laminating a ferrite magnetic layer and an internal conductor, wherein the ferrite magnetic layer has a specific surface area of the nickel compound of 1.0 to
10m ² / g and content of sulfur component is 100 in terms of S
The specific surface area of the Ni-based ferrite material using the raw material of 1 to 1000 ppm or the nickel compound of the raw material is 1.
0-10 m ² / g and content of sulfur component is 1 in S conversion
A raw material having an amount of 0 to 1000 ppm is used, and the composition thereof is Fe ₂ O ₃ = 25 to 52 mol%, ZnO = 0 to 4
0 mol%, CuO = 0 to 20 mol%, NiO = 1 to 65
Provided is a chip inductor or a chip bead component which has a high density and a small temperature characteristic and can be sintered even at a melting point of Ag or less by being composed of a Ni-based ferrite material composed of mol% and the balance of MgO. be able to.

(4) The ferrite magnetic layer and the inner conductor are laminated.
Composite having at least an inductor part formed by stacking layers
This is a laminated component, and the ferrite magnetic layer is a raw material.
Specific surface area of the nickel compound is 1.0 to 10 m²/ G and
When the content of Ou component is 100-1000ppm in S conversion
Ni-based ferrite material using a certain raw material, or raw material
The specific surface area of the nickel compound is 1.0 to 10 m²/ G
Content of sulfur component is 100-1000pp in S conversion
m is used, and the composition is Fe ₂O₃=
25-52 mol%, ZnO = 0-40 mol%, CuO =
0-20 mol%, NiO = 1-65 mol%, balance MgO
To be composed of a Ni-based ferrite material composed of
The higher the density, the smaller the temperature characteristics
Also provides composite laminated parts that can be sintered even below the melting point of Ag.
can do.

(5) Ni-based ferrite using a raw material in which the ferrite core has a specific surface area of the nickel compound of the raw material of 1.0 to 10 m ² / g and a sulfur component content of 100 to 1000 ppm in terms of S The material or the raw material nickel compound has a specific surface area of 1.0 to 10 m ² / g and a sulfur component content of 100 to 1000 pp in terms of S.
m is a raw material and its composition is Fe ₂ O ₃ =
25-52 mol%, ZnO = 0-40 mol%, CuO =
By using a Ni-based ferrite material composed of 0 to 20 mol%, NiO = 1 to 65 mol%, and the balance of MgO, the temperature characteristics are small even though the density is high, and the sintering is performed even below the melting point of Ag. A possible ferrite core can be provided.

[Brief description of drawings]

FIG. 1 is an example of a composite laminated component using a ferrite material for a ceramic inductor of the present invention.

[Explanation of symbols] 1 LC composite parts 2 Capacitor section 3 Inductor section 21 Ceramic Dielectric Layer 22 Internal electrode 31 Ceramic Magnetic Layer 32 inner conductor 41 External electrode

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takahiro Sato 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDK Corporation (56) References JP-A-11-144934 (JP, A) JP-A-12 -109325 (JP, A) JP-A-8-91919 (JP, A) JP-A-55-136172 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01F 1/12- 1/375

Claims (5)

(57) [Claims] 1. In a Ni-based ferrite material, a nickel compound as a raw material has a specific surface area of 1.0 to 10 m ² / g and a sulfur component content of 100 to 1000 pp in terms of S.
A ferrite material characterized by using a raw material of m. 2. The composition of the Ni-based ferrite material is Fe ₂
O ₃ = twenty-five to fifty-two mol%, ZnO = 0 to 40 mol%, C
uO = 0 to 20 mol%, NiO = 1 to 65 mol%, Mg
The ferrite material according to claim 1, wherein O is the balance. 3. A chip component formed by laminating a ferrite magnetic layer and an internal conductor, wherein the ferrite magnetic layer has a specific surface area of a nickel compound as a raw material of 1.0 to 10 m.
² / g and content of sulfur component is 100 to 10 in S conversion
Ni-based ferrite material using a raw material of 00 ppm,
Alternatively, the specific surface area of the raw material nickel compound is 1.0 to 1
0 m ² / g and content of sulfur component is 100 to S conversion
The composition is composed of Fe ₂ O ₃ = 25 to 52 mol%, ZnO = 0 to 40 mol%, CuO = 0 to 20 mol%, NiO = 1 to 65 mol%, and the balance of MgO while using a raw material of 1000 ppm. A chip inductor or chip bead component, which is composed of a Ni-based ferrite material. 4. A composite laminated component having at least an inductor portion formed by laminating a ferrite magnetic layer and an internal conductor, wherein the ferrite magnetic layer has a specific surface area of a nickel compound as a raw material of 1.0 to 10 m. Ni-based ferrite material using a raw material having a content of ² / g and a sulfur component of 100 to 1000 ppm in terms of S, or a nickel compound as a raw material having a specific surface area of 1.0 to 10 m ² / g and containing a sulfur component. A raw material whose amount is 100 to 1000 ppm in terms of S is used, and its composition is Fe ₂ O ₃ = 25 to
52 mol%, ZnO = 0-40 mol%, CuO = 0-2
A composite laminated component characterized by being composed of a Ni-based ferrite material composed of 0 mol%, NiO = 1 to 65 mol%, and the balance of MgO. 5. A Ni-based ferrite material using a raw material for which the specific surface area of the raw material nickel compound is 1.0 to 10 m ² / g and the content of the sulfur component is 100 to 1000 ppm in terms of S in the magnetic core of the ferrite magnetic core. Alternatively, a raw material in which the specific surface area of the raw material nickel compound is 1.0 to 10 m ² / g and the content of the sulfur component is 100 to 1000 ppm in terms of S and the composition is Fe ₂ O ₃ = 25 to
52 mol%, ZnO = 0-40 mol%, CuO = 0-2
A ferrite magnetic core characterized by being composed of a Ni-based ferrite material composed of 0 mol%, NiO = 1 to 65 mol%, and the balance of MgO.