JP2002246217A - Ferrite material and part for ceramic inductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ferrite material by which laminated chips or a magnetic core or the like can be made to have a low temperature characteristic at high density without using additives. SOLUTION: An Ni-based ferrite material uses a nickel compound having a specific surface area of 1.0 to 10 m2/g and containing a sulphur content of 100 to 1000 ppm in terms of S.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ferrite material for a ceramic inductor, and more particularly to a stable ferrite material having excellent temperature characteristics used for a ferrite sintered body used as various magnetic materials.

[0002]

2. Description of the Related Art For example, a laminated chip component such as a chip inductor or a chip bead is usually formed by laminating and integrating a magnetic paste and an internal conductor paste by a thick film technique and then forming an external electrode by using an external electrode paste. After doing
It is manufactured by firing. In this case, the magnetic material used for the magnetic layer is Ni-C
u-Zn ferrite is generally used.

By the way, Ni—Cu—Zn ferrite and N
When i-Zn ferrite is used, it is known that the electromagnetic characteristics and sinterability are affected depending on the contents of S and Cl in the ferrite raw material (Japanese Patent No. 2867196, Japanese Patent Application Laid-Open No. H11-144934). No.), S and C
1 is based on using iron sulfate as a starting material or iron chloride as a starting material when producing iron oxide as a raw material of ferrite. Further, a production method in which an additive (sintering aid) is added to obtain a high-density ferrite sintered body has been proposed.

[0004]

In a conventional ferrite material, if the firing temperature is lower than the melting point of Ag used for the inner conductor, a high-density sintered body with few porosity cannot be obtained, and a humidity resistance load test or the like is not possible. The magnetic properties deteriorate. Therefore, even if firing at a high temperature or densification by an additive is performed, as a side effect, disconnection or disappearance of the internal conductor, diffusion of Ag or segregation of Cu causes a heterogeneous phase at the grain boundary, resulting in inductance, Q, There has been a problem in that the temperature characteristics are deteriorated, or a migration phenomenon occurs due to diffused Ag, which causes deterioration of insulation resistance and short-circuit failure.

Accordingly, an object of the present invention is to provide a ferrite material having a high density of laminated chip parts and a magnetic core and a small temperature characteristic without using an additive in a Ni-based ferrite material.

[0006]

In order to achieve the above-mentioned object, the present inventors have conducted studies to provide a ferrite material which can achieve this object according to the following (1) and (2) and the following (3) to ( According to 5), it has been found that a ferrite component that can achieve this object can be provided.

(1) In a Ni-based ferrite material, the specific surface area of a nickel compound as a raw material is 1.0 to 10 m ^2.
/ G and the content of sulfur component is 100 to 100 in S conversion.
A ferrite material using a raw material having 0 ppm.

(2) The composition of the Ni-based ferrite material is Fe ₂ O ₃ = 25 to 52 mol%, ZnO = 0 to 40 mol%, CuO = 0 to 20 mol%, NiO = 1 to 65 mol%, MgO Is the ferrite material according to the above (1), comprising the remainder.

(3) A chip component formed by laminating a ferrite magnetic layer and an internal conductor, wherein the ferrite magnetic layer has a specific surface area of a raw material nickel compound of 1.0 to 1.0.
10 m ² / g and the content of sulfur component is 100 in S conversion.
Ni-based ferrite material using a raw material having a concentration of about 1000 ppm or a nickel compound as a raw material having a specific surface area of 1.
0 to 10 m ² / g and the content of sulfur component is 1 in S conversion.
A raw material having a composition of 00 to 1000 ppm is used, and the composition is Fe ₂ O ₃ = 25 to 52 mol%, ZnO = 0 to 4
0 mol%, CuO = 0-20 mol%, NiO = 1-65
A chip inductor or chip bead part characterized by being composed of a Ni-based ferrite material composed of mol% and the remainder of MgO.

(4) The ferrite magnetic layer and the inner conductor are
Composite having at least an inductor portion composed of layers
This ferrite magnetic layer is a laminated component,
The specific surface area of the nickel compound is 1.0 to 10 m^Two/ G and a
The content of the au component is 100 to 1000 ppm in S conversion.
Ni-based ferrite material using a certain raw material or raw material
Specific surface area of the nickel compound is 1.0 to 10 m^Two/ G
The sulfur component content is 100-1000pp in S conversion
m and the composition is Fe _TwoO_Three=
25-52 mol%, ZnO = 0-40 mol%, CuO =
0-20 mol%, NiO = 1-65 mol%, MgO balance
It is composed of Ni-based ferrite material composed of
A composite laminated part characterized by the above-mentioned.

(5) Ni-based ferrite made of a ferrite core using a raw material in which the specific surface area of the nickel compound as raw material is 1.0 to 10 m ² / g and the sulfur component content is 100 to 1000 ppm in terms of S The specific surface area of the nickel compound as the material or the raw material is 1.0 to 10 m ² / g, and the content of the sulfur component is 100 to 1000 pp in S conversion.
m and the composition is Fe ₂ O ₃ =
25-52 mol%, ZnO = 0-40 mol%, CuO =
A ferrite core comprising a Ni-based ferrite material composed of 0 to 20 mol%, NiO = 1 to 65 mol%, and the remainder of MgO.

According to the present invention, in the ferrite material for a ceramic inductor, by setting the specific surface area of the nickel compound and the content of the S component within a predetermined range, the density can be increased without using an additive, A ferrite material having a small temperature characteristic despite high density can be obtained. The ferrite core and the laminated chip component made of this ferrite material are excellent in moisture resistance and temperature characteristics, and can further reduce variations in sintered body density and inductance.

[0013]

DETAILED DESCRIPTION OF THE INVENTION In general, a ferrite material is obtained by mixing an iron compound and another ferrite constituent element compound and calcining the mixture. It is known that in this pre-baking step, the solid-state reaction rate of spinel crystals changes depending on the amounts of S and Cl contained in the ferrite mixed powder. Due to the difference in the reaction rate, a raw material or an intermediate product remains, or a heterogeneous phase is generated due to segregation due to thermal dissociation, and the powder composition becomes non-uniform.

It is also known that the magnetic properties are affected by the amounts of S and Cl remaining in the powder obtained by calcining the powder after the preliminary firing. S and Cl are contained in the ferrite constituent element compound.

The present inventors have conducted studies based on such findings, and found that by regulating the specific surface area of the nickel compound and the content of the S component in the ferrite material, it was possible to increase the density without using an additive. And found a ferrite material having a small temperature characteristic despite its high density.

The ferrite material of the present invention will be specifically described below. First, a ferrite constituent element compound, for example, Fe
₂ O ₃ , NiO, CuO, ZnO, and MgO are used as starting materials, weighed to obtain a desired composition after firing, and wet-mixed with pure water by a ball mill or the like.

The wet mixture is dried with a spray drier or the like, and then calcined. The calcined product is wet-pulverized together with pure water by a ball mill or the like. The wet pulverized product is dried by a spray dryer or the like,
A ferrite powder is obtained. At this time, as for the nickel compound, a raw material having a specific surface area of 1.0 to 10 m ² / g and a sulfur component content of 100 to 1000 ppm in terms of S is used.

The specific surface area of the nickel compound is 1.0 m ² /
In the case of less than g, the nickel compound does not form a solid solution even after calcination, the ferrite constituent element compound remains, and the value of the sintered body density becomes lower than the sintered body density 4.85 g / cm ³ that guarantees moisture resistance. . On the other hand, if it exceeds 10 m ² / g, the powder is poorly handled and is light when mixed with water, so that it floats on the surface and has poor mixing properties. Therefore, the dispersion of the nickel compound in the powder after the wet mixing is poor, so that the nickel compound is hardly dissolved in the solid after calcination, the ferrite constituent element compound remains, and the sintered body density becomes lower than 4.85 g / cm ^3. , Moisture resistance is not guaranteed.

Further, even if the specific surface area is 1.0 to 10 m ² / g, if the S component is less than 100 ppm, the density of the sintered body becomes low, and the moisture resistance is not guaranteed. Also 1000pp
m, the density of the sintered body increases, but Ag diffusion and C
The segregation of u increases, and the inductance and temperature characteristics deteriorate.

Here, the temperature characteristic is a rate of change when inductances at 25 ° C. and 85 ° C. are measured and 25 ° C. is used as a reference. The temperature characteristic must be within ± 3%, more preferably ± 2%, so that the temperature characteristic is ± 2% and the sintered body density sufficiently satisfies 4.85 g / cm ^3. Means that the specific surface area of the nickel compound is ² to 5 m ² /
g and sulfur component content is 250-700p in S conversion
pm is more preferred.

The specific surface area may be measured by the BET method. The sulfur content is determined by oxidizing and burning a nickel compound as a raw material in an oxygen atmosphere, and
₂ can be analyzed with an infrared detector.

In order to determine the optimum calcining temperature in the calcining of the mixed powder, the calcined powder at a different temperature is measured with an X-ray diffractometer and the calcining temperature at which the spinel synthesis rate is the highest is determined. You just have to select

Here, the spinel synthesis rate refers to the peak intensity (Isp311) of the (311) plane of the spinel type ferrite in powder X-ray diffraction and the (1010) of α-Fe ₂ O ₃ .
4) The peak intensity of the plane (IFe104) and (1) of CuO
11) A value represented by the following equation based on the peak intensity (ICu111) of the plane. In X-ray diffraction, the source is C
u, voltage 40 kV, current 40 mA, scanning speed 2 ° / mi
n.

Spinel synthesis rate = Isp311 / (Isp311 + IFe104)
+ ICu111) × 100 (%) If the spinel synthesis rate is less than 96%, a large amount of ferrite constituent element compound remains, and the density of the sintered body is low. Therefore, 96% or more is preferable. In order to determine the optimum temperature, 99% or more is required. preferable.

The reason for limiting the composition range of ferrite in the present invention is as follows.

When the main component Fe ₂ O ₃ is out of the range of 25 to 52 mol%, the density of the sintered body does not reach 4.85 g / cm ³ and becomes low, and the relative magnetic permeability, Q and insulation resistance IR are reduced. This causes problems such as deterioration.

When ZnO exceeds 40 mol%, Q is lowered, and the Curie temperature becomes 100 ° C. or less, which is not practical.

When CuO exceeds 20 mol%, Q is reduced. Further, when used in a composite laminated component, CuO or ZnO precipitates on the joint surface with a different material such as a capacitor material, and the IR is reduced.

If the content of NiO exceeds 65 mol%, sintering is not performed below the melting point of Ag. If NiO is less than 1%, the insulation resistance IR deteriorates.

When a part of NiO is replaced by MgO, the temperature characteristics are improved while maintaining the sintered body density and the relative magnetic permeability.
If it exceeds 15 mol%, the density of the sintered body and the relative magnetic permeability deteriorate, so that it is preferably less than this.

In addition, oxides such as Co and Mn may be contained in an amount of about 2 wt% or less of the whole. These C
Although o and Mn do not improve the density of the sintered body, Co improves Q and Mn improves the insulation resistance IR.

One embodiment of the present invention will be described below. The composition after firing is as follows: Fe ₂ O ₃ = 49.0 mol%, NiO = 2
5.0 mol%, CuO = 12.0 mol%, ZnO = 1
It was weighed so as to be 4.0 mol%, wet-mixed with pure water by a ball mill, and dried by a spray drier. At this time, nickel oxide as a raw material having a specific surface area of 1 to 71 m ² / g and a sulfur component content of 0 to 1130 ppm in terms of S was used.

Next, the mixed powder was heated at 700 to 800 ° C. for 1 hour.
It was calcined for 0 hours. Thereafter, the calcined powder was wet-pulverized together with pure water by a ball mill and dried by a spray drier. Then, 10 parts by weight of polyvinyl alcohol was added to 100 parts by weight of the obtained pulverized powder to obtain granules, which were press-formed into a toroidal shape.

The compact was fired at 880 ° C. for 2 hours to obtain a sintered body. The density of the sintered body was calculated from the weight and size of the sintered body. The relative magnetic permeability μi and Q were measured by measuring the inductance and Q at a measurement frequency of 10 MHz and a measurement current of 0.5 mA with an LCR meter by winding a copper wire 20 turns in a toroidal manner.
Was measured, and the relative magnetic permeability μi was determined using the following equation.

Specific magnetic permeability μi = (le × L) / (μo × Ae × N ² ) le: magnetic path length L: inductance of sample μo:
Magnetic permeability in vacuum Ae: Cross-sectional area of sample N: Number of turns of coil Next, a multilayer chip inductor was prepared. 4 parts by weight of ethyl cellulose and 78 parts by weight of terpineol were added to 100 parts by weight of the pulverized powder, and kneaded with a three-roll mill to prepare a magnetic paste. On the other hand, the average particle size is 0.6
2.5 parts by weight of ethyl cellulose and 40 parts by weight of terpineol were added to 100 parts by weight of Ag of μm, and kneaded with a three-roll mill to prepare an internal electrode paste.
After alternately printing and laminating such a paste for a magnetic layer and a paste for an internal electrode, firing was performed at 850 ° C. for 2 hours to obtain a laminated chip inductor.

The 3216 type (having a vertical and horizontal dimension of 3.2
× 1.6 mm) of the multilayer chip inductor is 3.2
mm × 1.6 mm × 1.2 mm, and the number of turns was 5.5 turns. Next, an external electrode was formed by baking at an end of the above-mentioned laminated chip inductor at 600 ° C., and the inductances L and Q were measured using a LCR meter at a measurement frequency of 10 MHz and a measurement current of 0.1 mA.

The temperature characteristics of the inductance of the toroidal and the multilayer chip inductor are measured at 25 ° C. and 85 ° C. at a measurement frequency of 1 MHz, and the rate of change based on 25 ° C.

Table 1 shows the results.

[0039]

[Table 1]

As is clear from Table 1, unless the specific surface area of the nickel compound is 1.0 to 10 m ² / g and the content of the sulfur component is not in the range of 100 to 1000 ppm in terms of S, it is clear from Comparative Examples 1 to 6. As described above, the sintered body density is 4.85 g / cm ^{3 for} toroidal, and 5.85 for chip inductor.
It is less than 15 g / cm ³ , and the moisture resistance cannot be guaranteed.

The nickel compound has an S component of 1000 p
When the temperature exceeds pm, as shown in Comparative Example 7, the density of the sintered body reaches a density at which moisture resistance can be guaranteed, but the temperature characteristic is ± 3.
It shows a large value exceeding%.

If the ferrite material is within the scope of the present invention, the density of the sintered body is 4.85 g / cm ³ for the toroid and 5.15 g / cm ³ or more for the chip inductor, and the temperature characteristics are kept within ± 3%. It is understood that it is possible.

Particularly, the specific surface area of the nickel compound is 2 to 5 m.
² / g and the content of sulfur component is 250 to 70 in S conversion.
In the case of 0 ppm, as shown in Examples 3, 4, 5, 7, and 8, a sintered body having better density and temperature characteristics can be obtained.

Next, the ferrite material of the present invention, Fe ₂ O ₃ =
49 mol%, ZnO = 25 mol%, CuO = 9 mol%,
An LC composite laminated component using NiO = 17 mol% will be described with reference to FIG.

The LC composite component 1 shown in FIG. 1 has a capacitor section 2 formed by laminating a ceramic dielectric layer 21 and an internal electrode layer 22, and a lamination of a ceramic magnetic layer 31 and an internal conductor 32. The external electrode 41 is formed on the surface of the integrated inductor unit 3.

The capacitor section 2 and the inductor section 3 are
The structure may be a conventionally known structure, and the outer shape is usually a substantially rectangular parallelepiped. The dimensions of the LC composite component 1 are not particularly limited, and can be appropriately set according to the application.
0.0mm × 0.8-15.0mm × 1.0-5.0m
m.

The ceramic magnetic layer 31 of the inductor section 3
Is composed of the ferrite material of the present invention. That is, the magnetic material layer paste obtained by kneading the ferrite material of the present invention with a binder such as ethyl cellulose and a solvent such as terpineol or butyl carbitol is alternately printed and laminated with the internal electrode paste to form the inductor portion 3. can do. The contents of the binder and the solvent in the magnetic layer paste are not limited. For example, the content of the binder is 1 to 5% by weight, and the content of the solvent is 10 to 5%.
It can be set in the range of about 0% by weight.

The inductor section 3 can also be formed using a ceramic magnetic layer sheet. That is, the slurry obtained by kneading the ferrite material of the present invention in a ball mill together with a binder containing polyvinyl butyral or acrylic as a main component and a solvent such as toluene and xylene,
It is applied on a polyester film or the like by a doctor blade method or the like and dried to obtain a magnetic layer sheet. The content of the binder in the magnetic layer sheet is not limited.
It can be set in a range of about 5% by weight.

There is no particular limitation on the conductive material constituting the internal electrode 32 of the inductor portion 3. However, in order to obtain a practical Q as an inductor, the inductor may be formed using a conductive material mainly composed of Ag having a small resistivity. preferable. Usually, Ag, Ag alloy, Cu, Cu alloy and the like are used. Each layer of the internal electrode 32 is oval, and each layer of the adjacent internal electrode 32 is
Since conduction is ensured in a spiral shape, the internal electrode 3
Reference numeral 2 denotes a closed magnetic circuit coil (winding pattern), and external electrodes 41 are connected to both ends of the coil.

In such a case, the winding pattern of the internal conductor 32, that is, the shape of the closed magnetic circuit, may be various patterns, and the number of turns may be appropriately selected according to the application.
The dimensions of each part of the inductor part 3 are not limited, and may be appropriately selected according to the application.

The thickness of the internal conductor 32 is usually 3 to 5
0 μm, winding pitch is usually about 10-400 μm,
The number of turns is usually about 1.5 to 50.5 turns. The base thickness of the magnetic layer 31 is usually 100 to 500 μm, and the thickness of the magnetic layer between the internal conductors 32 is usually about 10 to 100 μm.

Ceramic dielectric layer 21 of capacitor section 2
There is no particular limitation on the material used for the above, and various dielectric materials may be used. However, it is preferable to use a titanium oxide-based dielectric because the firing temperature is low. In addition, a titanate-based composite oxide, a zirconate-based composite oxide, or a mixture thereof can be used. Glass such as borosilicate glass may be contained in order to lower the firing temperature.

Specifically, as the titanium oxide, NiO, CuO, Mn ₃ O ₄ , Al ₂ O ₃ , Mg
O, SiO _{2 and the} like, particularly TiO ₂ containing CuO, etc., are used as titanate-based composite oxides such as BaTiO ₃ and SrTiO.
₃ , CaTiO ₃ , MgTiO ₃ and mixtures thereof
BaZrO ₃ , Sr
ZrO ₃ , CaZrO ₃ , MgZrO _3, and mixtures thereof are used. When a mixed material is not used, for example, nonmagnetic Zn ferrite or the like can be used.

Ceramic dielectric layer 21 of capacitor section 2
Can be formed by alternately printing and laminating a paste for a dielectric layer obtained by kneading the materials used for the above with various binders and a solvent and a paste for an internal electrode. The contents of the binder and the solvent in the dielectric layer paste are not limited. For example, the content of the binder may be set in the range of about 1 to 5% by weight, and the content of the solvent may be set in the range of about 10 to 50% by weight. it can.

Also, it can be formed using a dielectric layer sheet. That is, a slurry obtained by kneading a dielectric material together with various binders and a solvent in a ball mill is applied onto a polyester film or the like by a doctor blade method or the like and dried to obtain a dielectric layer sheet. This dielectric layer sheet can be formed by alternately laminating the paste for internal electrodes. The content of the binder in the dielectric layer sheet is not limited, and can be set, for example, in a range of about 1 to 5% by weight.

Internal electrode layer 22 constituting capacitor section 2
Is not particularly limited, and Ag, Pt, P
d, Au, Cu, Ni or, for example, an Ag-Pd alloy, etc.
In particular, Ag and Ag alloys such as Ag-Pd alloy are suitable.

The dimensions of each part of the capacitor part 2 are not particularly limited, and may be appropriately selected according to the use and the like. The number of stacked dielectric layers 21 is 1 to 100, the thickness of one dielectric layer is 10 to 150 μm, and the thickness of one internal electrode layer 22 is 3 to 30 μm.

The conductor material used for the external electrode 41 is not particularly limited, and may be selected from Ag, Pt, Pd, Au, Cu, Ni, and an alloy containing one or more of these, such as an Ag-Pd alloy. The shape and dimensions of the external electrode 41 are not particularly limited, and may be appropriately determined depending on the purpose and application. The thickness is usually about 3 to 200 μm.

The paste for the internal conductor, the paste for the internal electrode, and the paste for the external electrode are respectively composed of the above-mentioned various conductive metals, alloys, or various oxides, organometallic compounds, resinates, etc. which become the above-mentioned conductive materials after firing. It is prepared by kneading the various binders and solvents described above.

In manufacturing the LC composite component 1, for example, first, a paste for the magnetic layer and a paste for the internal conductor are laminated and printed on a substrate such as PET (polyethylene terephthalate) to form the inductor portion 3. The dielectric layer paste and the internal electrode paste are laminated and printed thereon to form the capacitor section 2. Or capacitor part 2
May be formed first, and the inductor portion 3 may be formed thereon.

A green sheet is formed using a magnetic layer paste or a dielectric layer paste, and an internal conductor paste or an internal electrode layer paste is printed thereon. Then, these are laminated to form a green chip. It may be formed. In this case, the dielectric layer adjacent to the magnetic layer may be printed directly.

Next, the paste for the external electrode is printed or transferred onto a green chip, and the paste for the magnetic layer, the paste for the internal conductor, the paste for the dielectric layer, the paste for the internal electrode layer, and the paste for the external electrode are simultaneously fired.

Alternatively, the green chip may be baked first, and then the external electrode paste may be printed or transferred and baked.

The firing temperature is 800 to 930 ° C., especially 850.
The temperature is preferably set to 900 ° C. The firing temperature is 800 ° C
If the temperature is lower than 930 ° C., the firing may be insufficient. On the other hand, if the temperature is higher than 930 ° C., the internal electrode material may diffuse into the ferrite material to significantly lower the electromagnetic characteristics. The firing time is 0.0
It is preferably 5 to 5 hours, particularly preferably 0.1 to 3 hours. The calcination is performed at an oxygen partial pressure PO ₂ = 1 to 100%.

The firing temperature for baking the external electrodes is usually about 500 to 700 ° C.
The firing is usually performed in air.

In the present invention, it is preferable that the heat treatment is performed in an atmosphere containing oxygen in excess of the atmosphere during and after firing.

By performing a heat treatment in an oxygen-excess atmosphere, a substance deposited in the form of a metal such as Cu or Zn or an oxide having a low resistance such as Cu ₂ O or Zn ₂ O or a substance that has been deposited is
It can be deposited in the form of an oxide having high resistance such as CuO and ZnO and having no harm.

The heat treatment is preferably performed at the time of firing and after the firing.

For example, in the case where firing of the green chip and firing for firing the external electrode are performed simultaneously, the firing for firing the external electrode is performed during and after the firing, and in the case where the firing for firing the external electrode is performed after firing the green chip. It is preferable to perform a predetermined heat treatment when the external electrodes are baked or after the external electrodes are baked. When the baking is performed twice as in the latter case, a heat treatment may be further performed at the time of firing the green chip and after the firing.

The oxygen partial pressure ratio in the heat treatment atmosphere is 20.8
-100%, more preferably 50-100%, particularly preferably 100%.

If the oxygen partial pressure ratio is less than 20.8%, the ability to suppress the precipitation of Cu, Zn, Cu ₂ O, Zn ₂ O, etc. is reduced.

Since such a heat treatment in an oxygen-excess atmosphere is usually carried out simultaneously with the firing and the baking of the external electrodes, various conditions such as the heat treatment temperature and the holding time are the same as those of the baking conditions and the external electrode baking conditions. However, when only the heat treatment is performed alone, the heat treatment temperature is 550 to 900 ° C., particularly 650 to 800 ° C., and the holding time is 0.5 to 2 hours, particularly 1 hour.
It is preferable to set it to 1.5 hours.

In the case of a composite laminated component other than the LC composite component, it may be manufactured as described above.

The composite laminated component such as the LC composite component manufactured as described above is mounted on a printed circuit board or the like by performing soldering or the like on external electrodes, and is used for various electronic devices and the like.

Fe ₂ O ₃ , NiO, Cu in the magnetic layer
The composition of O, ZnO, and MgO can be measured by X-ray fluorescence analysis using a glass beat method.

[0076]

According to the present invention, the following effects can be obtained.

(1) In the nickel-based ferrite material, the specific surface area of the nickel compound as a raw material is 1.0 to 1
0 m ² / g and the sulfur component content is 100 in S conversion.
By using a raw material having a concentration of about 1000 ppm, it is possible to provide a ferrite material that can achieve high density without using additives and obtain ferrite having a small temperature characteristic despite high density. . The laminated chip component or ferrite core made of this ferrite material has a high density and therefore has good moisture resistance and excellent temperature characteristics.

(2) In the nickel-based ferrite material, the specific surface area of the nickel compound as a raw material is 1.0 to 1
0 m ² / g and the sulfur component content is 100 in S conversion.
To 1000 ppm, and the composition of the ferrite material is Fe
₂ O ₃ = 25-52 mol%, ZnO = 0-40 mol%,
CuO = 0-20 mol%, NiO = 1-65 mol%, M
A ferrite material in which gO is the remainder can provide a ferrite material that can be densified without using additives, has excellent temperature characteristics despite high density, and can be sintered even at or below the melting point of Ag. be able to. The laminated chip component and the ferrite core made of this ferrite material also have similar excellent characteristics.

(3) A chip component constituted by laminating a ferrite magnetic layer and an internal conductor, wherein the ferrite magnetic layer has a specific surface area of a nickel compound of 1.0 to 1.0.
10 m ² / g and the content of sulfur component is 100 in S conversion.
Ni-based ferrite material using a raw material having a concentration of about 1000 ppm or a nickel compound as a raw material having a specific surface area of 1.
0 to 10 m ² / g and the content of sulfur component is 1 in S conversion.
Its composition with use of raw material is 00~1000ppm is Fe ₂ O ₃ = 25~52 mol%, ZnO = 0 to 4
0 mol%, CuO = 0-20 mol%, NiO = 1-65
By providing a Ni-based ferrite material composed of mol% and the remainder of MgO, a chip inductor or chip bead component which has a small temperature characteristic despite being high in density and which can be sintered even at a melting point of Ag or less is provided. be able to.

(4) Product of ferrite magnetic layer and internal conductor
Composite having at least an inductor portion composed of layers
This ferrite magnetic layer is a laminated component,
The specific surface area of the nickel compound is 1.0 to 10 m^Two/ G and a
The content of the au component is 100 to 1000 ppm in S conversion.
Ni-based ferrite material using a certain raw material or raw material
Specific surface area of the nickel compound is 1.0 to 10 m^Two/ G
The sulfur component content is 100-1000pp in S conversion
m and the composition is Fe _TwoO_Three=
25-52 mol%, ZnO = 0-40 mol%, CuO =
0-20 mol%, NiO = 1-65 mol%, MgO balance
Made of Ni-based ferrite material composed of
The temperature characteristics are reduced despite the high density.
Providing composite laminated parts that can be sintered even under the melting point of mosquito Ag
can do.

(5) Ni-based ferrite obtained by using a raw material in which the core of the ferrite core has a specific surface area of a nickel compound of 1.0 to 10 m ² / g and a sulfur component content of 100 to 1000 ppm in terms of S The specific surface area of the nickel compound as the material or the raw material is 1.0 to 10 m ² / g, and the content of the sulfur component is 100 to 1000 pp in S conversion.
m and the composition is Fe ₂ O ₃ =
25-52 mol%, ZnO = 0-40 mol%, CuO =
By using a Ni-based ferrite material composed of 0 to 20 mol%, NiO = 1 to 65 mol%, and the remainder of MgO, the material has a small temperature characteristic despite its high density and sinters even at a temperature lower than the melting point of Ag. A possible ferrite core can be provided.

[Brief description of the drawings]

FIG. 1 is an example of a composite laminated component using a ferrite material for a ceramic inductor of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 LC composite component 2 Capacitor part 3 Inductor part 21 Ceramic dielectric layer 22 Internal electrode 31 Ceramic magnetic layer 32 Internal conductor 41 External electrode

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takashi Suzuki 1-1-13 Nihonbashi, Chuo-ku, Tokyo TDK Corporation (72) Inventor Takahiro Sato 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDK F term in reference (reference) 4G018 AA01 AA07 AA23 AA24 AA25 5E041 AA17 AA19 BD01 CA01 NN01

Claims (5)

[Claims] In a Ni-based ferrite material, a nickel compound as a raw material has a specific surface area of 1.0 to 10 m ² / g and a sulfur component content of 100 to 1000 pp in terms of S.
A ferrite material characterized by using a raw material of m. 2. The composition of the Ni-based ferrite material is Fe ₂
O ₃ = 25 to 52 mol%, ZnO = 0 to 40 mol%, C
uO = 0 to 20 mol%, NiO = 1 to 65 mol%, Mg
2. The ferrite material according to claim 1, wherein O comprises the remainder. 3. A chip component formed by laminating a ferrite magnetic layer and an internal conductor, wherein the ferrite magnetic layer has a specific surface area of a nickel compound as a raw material of 1.0 to 10 m.
² / g and the content of sulfur component is 100 to 10 in S conversion.
Ni-based ferrite material using a raw material that is 00 ppm,
Alternatively, the specific surface area of the raw material nickel compound is 1.0 to 1
0 m ² / g and the content of sulfur component is 100 to
A raw material of 1000 ppm is used, and its composition is composed of 25 to 52 mol% of Fe ₂ O ₃ , 0 to 40 mol% of ZnO, 0 to 20 mol% of CuO, 1 to 65 mol% of NiO, and the balance of MgO. A chip inductor or chip bead part, which is made of a Ni-based ferrite material. 4. A composite laminated component having at least an inductor portion formed by laminating a ferrite magnetic layer and an internal conductor, wherein the ferrite magnetic layer has a specific surface area of a raw material nickel compound of 1.0 to 10 m. Ni-based ferrite material using a raw material having a content of ² / g and a sulfur component of 100 to 1000 ppm in terms of S, or a nickel compound as a raw material having a specific surface area of 1.0 to 10 m ² / g and containing a sulfur component A raw material having an amount of 100 to 1000 ppm in terms of S was used, and the composition was Fe ₂ O ₃ = 25 to
52 mol%, ZnO = 0-40 mol%, CuO = 0-2
A composite laminated component comprising a Ni-based ferrite material composed of 0 mol%, NiO = 1 to 65 mol%, and the balance of MgO. 5. A Ni-based ferrite material in which the core of the ferrite core is made of a raw material having a specific surface area of a nickel compound of 1.0 to 10 m ² / g and a sulfur component content of 100 to 1000 ppm in terms of S. Alternatively, a raw material having a specific surface area of a nickel compound of 1.0 to 10 m ² / g and a sulfur component content of 100 to 1000 ppm in terms of S is used, and the composition is Fe ₂ O ₃ = 25 to
52 mol%, ZnO = 0-40 mol%, CuO = 0-2
A ferrite core comprising a Ni-based ferrite material comprising 0 mol%, NiO = 1 to 65 mol%, and the remainder of MgO.