JPH04284612A - Composite laminated component - Google Patents

Composite laminated component

Info

Publication number
JPH04284612A
JPH04284612A JP7400291A JP7400291A JPH04284612A JP H04284612 A JPH04284612 A JP H04284612A JP 7400291 A JP7400291 A JP 7400291A JP 7400291 A JP7400291 A JP 7400291A JP H04284612 A JPH04284612 A JP H04284612A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
formed
layers
cu
ceramic
zn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7400291A
Inventor
Atsushi Nakano
Takeshi Nomura
Original Assignee
Tdk Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Abstract

PURPOSE: To restrain that a metal such as Cu, Zn or the like and a low-resistance oxide such as Cu2O, Zn2O or the like are precipitated locally at the bonding interface between a ceramic magnetic layer and a ceramic dielectric layer and to obtain a composite laminated component whose circuit resistance is high by a method wherein, after the bonding interface between the ceramic magnetic layer and the ceramic dielectric layer has been formed to be a recessed and protruding shape, the layers are fired.
CONSTITUTION: A capacitor chip body 2 constituted by laminating ceramic dielectric layers 21 and internal electrode layers 25 and an inductor chip body 3 constituted by laminating ceramic magnetic layers 31 and internal conductors 35 are united; external electrodes 51 are formed on the surface. Thereby, an LC composite component 1 is formed. At this time, the surface closest to the side of the capacitor chip body 2 out of the ceramic magnetic layers 31 and/or the surface closest to the side of the inductor chip body 3 out of the ceramic dielectric layers 21 are formed so as to be recessed and protruding; after that, the component is fired. Thereby, it is possible to restrain that Cu or Cu oxide and Zn or a Zn oxide or the like are precipitated locally at their interface, and it is possible to prevent that a layer whose electric resistance is low is formed.
COPYRIGHT: (C)1992,JPO&Japio
JP7400291A 1991-03-13 1991-03-13 Composite laminated component Pending JPH04284612A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7400291A JPH04284612A (en) 1991-03-13 1991-03-13 Composite laminated component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7400291A JPH04284612A (en) 1991-03-13 1991-03-13 Composite laminated component

Publications (1)

Publication Number Publication Date
JPH04284612A true true JPH04284612A (en) 1992-10-09

Family

ID=13534436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7400291A Pending JPH04284612A (en) 1991-03-13 1991-03-13 Composite laminated component

Country Status (1)

Country Link
JP (1) JPH04284612A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007112689A (en) * 2005-10-24 2007-05-10 Tdk Corp Method of manufacturing dielectronic powder, composite electronic component, and method of manufacturing the same
US7291235B2 (en) * 2004-04-16 2007-11-06 Kemet Electronics Corporation Thermal dissipating capacitor and electrical component comprising same
JPWO2009136661A1 (en) * 2008-05-09 2011-09-08 太陽誘電株式会社 Laminated inductor and a method for manufacturing the same
US8207810B2 (en) 2007-12-07 2012-06-26 Murata Manufacturing Co., Ltd. Multilayer electronic component
KR101282025B1 (en) * 2008-07-30 2013-07-04 다이요 유덴 가부시키가이샤 Laminated inductor, method for manufacturing the laminated inductor, and laminated choke coil

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7291235B2 (en) * 2004-04-16 2007-11-06 Kemet Electronics Corporation Thermal dissipating capacitor and electrical component comprising same
JP2007112689A (en) * 2005-10-24 2007-05-10 Tdk Corp Method of manufacturing dielectronic powder, composite electronic component, and method of manufacturing the same
KR100804925B1 (en) * 2005-10-24 2008-02-20 티디케이가부시기가이샤 Producing method of dielectric powder, composite electronic part and producing method thereof
US8207810B2 (en) 2007-12-07 2012-06-26 Murata Manufacturing Co., Ltd. Multilayer electronic component
JPWO2009136661A1 (en) * 2008-05-09 2011-09-08 太陽誘電株式会社 Laminated inductor and a method for manufacturing the same
KR101282025B1 (en) * 2008-07-30 2013-07-04 다이요 유덴 가부시키가이샤 Laminated inductor, method for manufacturing the laminated inductor, and laminated choke coil
JP5281090B2 (en) * 2008-07-30 2013-09-04 太陽誘電株式会社 Laminated inductor, a method of manufacturing the same, and laminating the choke coil
US8587400B2 (en) 2008-07-30 2013-11-19 Taiyo Yuden Co., Ltd. Laminated inductor, method for manufacturing the laminated inductor, and laminated choke coil

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