JP2004247386A - Composite electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a composite electronic component that has a resistor in an element and can obtain large electrostatic capacitance. <P>SOLUTION: The main body 20 of the element is provided with a capacitor constitution part constituted by alternately laminating dielectric layers 7 and internal electrode layers upon another, and a resistor constitution part in which a substantial resistor is formed. The internal electrode layers are composed of first and second internal electrode layers 21 and 25 alternately laminated upon another with the dielectric layers 7 between. The first internal electrode layers 21 have protruded sections exposed on a first external electrode side, and the second internal electrode layers 25 have connections exposed on a second external electrode side and connected to a second external electrode. The substantial resistor has an inlet protruded section and an outlet protruded section exposed on the first external electrode side. The inlet protruded section is connected to a first external electrode, and the outlet protruded section is connected to the protruded sections of the first internal electrode layers through a connecting electrode section. The connecting electrode section is insulated from the first external electrode by an insulating film 65. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a composite electronic component, and more particularly to a composite electronic component in which a resistor is added inside the element body of a multilayer ceramic capacitor.
[0002]
[Prior art]
[Patent Document 1] Japanese Patent Publication No. 2001-511607
Multilayer ceramic electronic components such as capacitors, inductors, thermistors, and varistors are used in various electronic devices due to their small volume, high robustness, and high reliability. Miniaturization and high performance are required.
[0004]
Among such multilayer ceramic electronic components, for example, a multilayer ceramic capacitor usually has a laminate in which dielectric layers and internal electrode layers are alternately laminated, and a pair of laminates provided on opposing side surfaces of the laminate. The structure has an external electrode. Such a multilayer ceramic capacitor is used, for example, as a smoothing capacitor constituting an output smoothing circuit.
[0005]
However, the multilayer ceramic capacitor has a problem that the equivalent series resistance (ESR) is very low, a signal in a circuit loops, an oscillation phenomenon occurs, and as a result, noise occurs. That is, when a multilayer ceramic capacitor having a low ESR is used as the smoothing capacitor, the secondary-side smoothing circuit is equivalently composed of only the L and C components, and the phase components existing in the circuit are ± 90 ° and 0 °. ° only, and there is no phase margin, and oscillation occurs easily.
[0006]
For this reason, various composite electronic components (CR composite devices) have been proposed in which a resistance component is added to a multilayer ceramic capacitor to increase the ESR. For example, Japanese Unexamined Patent Application Publication No. 2001-511607 (Patent Document 1) discloses a CR composite element of a type in which a resistance component is formed inside a multilayer ceramic capacitor, the tip of an internal electrode alternately laminated via a dielectric layer. A composite electronic component having a structure in which a resistor is formed in each part is disclosed (Patent Document 1). Thus, in the type in which the resistor is formed inside the element, the sheet area can be increased, which is advantageous in withstand voltage. In addition, there is an advantage that there is very little risk of fluctuation of the resistance value due to plating. Furthermore, since the resistor exists inside the element body, there is an advantage that the resistor is not damaged during mounting.
[0007]
[Problems to be solved by the invention]
However, in the above-described conventional composite electronic component (Patent Literature 1), an overlapping portion occurs at the joint between the tip of the internal electrode and the resistor, which is an advantageous form for obtaining a large capacitance. It can not be said.
[0008]
The present invention was devised on the basis of such an actual situation, and an object of the present invention is to provide a composite electronic component having a resistor inside the element, which has a larger electrostatic capacity than the type disclosed in the related art. It is to provide a composite electronic component capable of obtaining a capacity.
[0009]
[Means for Solving the Problems]
In order to achieve such an object, the present invention provides a composite electronic component having an element body, and a pair of first external electrodes and a second external electrode formed on opposite end faces of the element body, The element body includes a capacitor component in which dielectric layers and internal electrode layers are alternately stacked, and a resistor component in which a substantial resistor is formed, and the internal electrode layer is a dielectric layer. A first internal electrode layer and a second internal electrode layer that are alternately stacked through the first internal electrode layer, the first internal electrode layer having a protruding portion exposed to the first external electrode side, and the second internal electrode layer The layer has a connection exposed on the second external electrode side, the connection is connected to the second external electrode, and the substantial resistor has an entrance protrusion exposed on the first external electrode. Part and an outlet protrusion, and the inlet protrusion and the outlet protrusion are In addition to being electrically connected inside other than the outlet, the inlet protrusion is connected to a first external electrode, and the outlet protrusion and the protrusion of the first internal electrode layer are connected by a connection electrode portion. The connection electrode portion is configured to be covered with an insulating film and insulated from the first external electrode.
[0010]
Further, as a preferred aspect of the present invention, the substantial resistor has a resistor portion and a conductor portion arranged to sandwich the resistor portion, and the conductor is arranged to sandwich the resistor portion. The portions are configured to include an inlet protrusion and an outlet protrusion exposed on the first external electrode side, respectively.
[0011]
In a preferred aspect of the present invention, a joint area between the resistor portion and the conductor portion is formed at an entrance projection exposed at the first external electrode side and at an exit projection exposed at the first external electrode side. It is formed so as to be larger than the joint area.
[0012]
In a preferred embodiment of the present invention, the substantial resistor is configured to include only a resistor portion.
[0013]
In a preferred aspect of the present invention, the inlet projection is configured to be connected to a first external electrode via a connection electrode portion.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to FIGS.
[0015]
FIG. 1 is a perspective view showing one embodiment of the composite electronic component 1 of the present invention, and FIG. 2 is a schematic perspective view showing an essential part of the element body 20 (laminated body 20) shown in FIG. is there. 3 to 5 are schematic perspective views of the element body for explaining the formation of the predetermined structure on the first external electrode side over time. FIG. 6 is a drawing for explaining a predetermined structure inside the first external electrode side according to the present invention, and is a cross-sectional equivalent view taken along the line AA in FIG. 1 (see the direction AA in FIG. 2). ).
[0016]
As shown in FIG. 1, a composite electronic component 1 of the present invention includes an element main body 20 shown in a substantially rectangular parallelepiped shape in the drawing, and a pair of first external parts formed on opposite end surfaces of the element main body 20. It has an electrode 11 and a second external electrode 15. The size of the element body 20 can be, for example, about (0.6 to 5.6 mm) × (0.3 to 5.0 mm) × (0.3 to 2.5 mm).
[0017]
As shown in FIG. 2, the element body 20 includes a capacitor component (C) in which the dielectric layers 7 and the internal electrode layers 21 and 25 are alternately stacked, and a substantial resistor (layer) 5. (R). Since it is difficult to distinguish between the laminated resistor and the internal electrode layer in the drawings, for convenience, in the drawings of the present application, a portion indicating the resistor is provided with a grain (dot) for easy understanding.
[0018]
The internal electrode layers 21 and 25 in the present invention are composed of the first internal electrode layer 21 and the second internal electrode layer 25 alternately stacked with the dielectric layer 7 interposed therebetween. In FIG. 2, a sheet body 71 having a dielectric layer 7 and a first internal electrode layer 21 and a sheet body 75 having a dielectric layer 7 and a second internal electrode layer 25 are sequentially and repeatedly laminated in multiple layers.
[0019]
In the present embodiment, the sheet body 50 on which the dielectric layer 7 and the substantial resistor (layer) 5 are disposed is further above the internal electrode layers 21 and 25 in consideration of the convenience of production, capacitance and the like. However, the position where the sheet body 50 is provided in the laminate may be changed as needed.
[0020]
The first internal electrode layer 21 to be laminated has a protruding portion 21a exposed on the first external electrode 11 side as shown in FIG. As shown in FIG. 2, the first internal electrode layer 21 has only a protruding portion 21a (more precisely, an end of the protruding portion) exposed from the outer peripheral frame of the dielectric layer 7 in relation to the dielectric layer 7. Part only).
[0021]
On the other hand, the laminated second internal electrode layers 25 each have a connection portion 25a exposed to the second external electrode 15 side as shown in FIG. It is connected. As shown in FIG. 2, the second internal electrode layer 25 has a connection portion 25a (more precisely, an end of the connection portion 25a) exposed from the outer peripheral frame of the dielectric layer 7 in relation to the dielectric layer 7. Part only).
[0022]
The substantial resistor 5 has a substantially U-shape as shown in FIG. 2, and has an inlet protrusion 51 a exposed on the first external electrode 11 side and an outlet protrusion 58 a exposed on the same first external electrode 11 side. have. The inlet protrusion 51a and the outlet protrusion 58a are electrically connected to each other inside other than the protrusions 51a and 55a (for example, realized by forming a substantially U-shape as illustrated).
[0023]
The preferred substantial resistor 5 shown in FIG. 2 has a resistor portion 55 and conductor portions 51, 58 arranged to sandwich the resistor portion 55, and is arranged to sandwich. The conductive portions 51 and 58 have an entrance projection 51a exposed on the first external electrode 11 side and an exit projection 58a exposed on the first external electrode 11 side, respectively.
[0024]
With such a configuration, the joint area between the resistor portion 55 and the conductor portions 51 and 58 (the portion joined with the length L) is larger than the joint area at the protrusions 51a and 58a. Can be formed. As shown in the figure, the withstand voltage can be improved by increasing the joining area of the portion joined with the length L. The resistor portion 55 is formed of a so-called resistor composition, and the conductor portions 51 and 58 may be formed of a material having a lower resistance than the resistor portion 55, for example, a material equivalent to the internal electrode layer. In the sense of including the combination of such composite members, in the present invention, it is called "substantial resistor". Of course, all of the conductor portions 51 and 58 may be replaced with resistor portions and integrated with the same material.
[0025]
In the present invention, the outlet projecting portion 58a of the resistor shown in FIG. 2 and the projecting portion 21a of the first internal electrode layer 21 are laminated and then connected to one end face of the element body as shown in FIG. The edge appears within a predetermined width region in substantially the same vertical direction. Then, as shown in FIG. 4, the outlet projecting portion 58a of the resistor and the projecting portion 21a of the first internal electrode layer 21 are integrally covered by a connection electrode portion 45 formed thereon. Connected.
[0026]
As shown in FIG. 4, it is desirable that the entrance protrusion 51 a of the resistor is also covered by the independent connection electrode portion 41. This is to ensure connection with the first external electrode 11.
[0027]
Next, as shown in FIG. 5, the connection electrode portion 45 is further covered with an insulating film 65. The presence of the insulating film 65 ensures insulation between the connection electrode portion 45 and the first external electrode 11 formed on the entire one-side end surface of the element body 20. On the other hand, the entrance protrusion 51 a of the resistor is connected to the first external electrode 11 directly or via the connection electrode portion 41.
[0028]
Under such a configuration, a substantial resistor (layer) 5 is provided between the first external electrode 11 and the connection electrode portion 45 between the terminals of the first external electrode 11 and the second external electrode 15. , And a substantial capacitor component (C) is formed between the connection electrode portion 45 and the second external electrode 15.
[0029]
Next, members constituting the composite electronic component 1 of the present invention described above will be described.
[0030]
[External electrodes 11, 15]
The external electrodes 11 and 15 constituting the composite electronic component of the present invention use at least one kind of metal such as Pd, Ag, Au, Cu, Pt, Rh, Ru, Ir, or an alloy thereof as a conductive material. be able to. The thickness of the external electrode is not particularly limited, and may be, for example, about 1 to 100 μm, particularly about 5 to 50 μm.
[0031]
Further, the external electrode may contain glass for the purpose of improving the sinterability of the conductive material and ensuring the adhesiveness to the laminate.
[0032]
[Internal electrode layers 21, 25]
The conductive material used for the internal electrode layer constituting the composite electronic component of the present invention is not particularly limited, but the use of an inexpensive base metal by using a material having reduction resistance as a constituent material of the dielectric layer. Can be. The base metal used as the conductive material is preferably, for example, Ni or a Ni alloy. As the Ni alloy, an alloy of one or more of Mn, Cr, Co, Al and the like and Ni is preferable, and the Ni content in the alloy is preferably 95% by weight or more. In addition, various trace components such as P may be contained in Ni or Ni alloy in an amount of about 0.1% by weight or less. The thickness of the internal electrode layer can be appropriately set according to the use of the composite electronic component and the like, and can be, for example, about 0.5 to 5 μm, particularly about 0.5 to 2.5 μm.
[0033]
[Resistor (part) 55]
The resistor constituting the composite electronic component of the present invention is formed of a material containing a conductive oxide and an insulating oxide. The conductive oxide is not particularly limited, and preferably contains, for example, at least one of ruthenium oxide, a ruthenium oxide compound, and graphite. Examples of the ruthenium oxide include RuO ₂ , Bi ₂ Ru ₂ O ₇ , SrRuO ₃ , CaRuO ₃ , Pb ₂ Ru ₂ O ₆ , BaRuO _{3 and the} like. In addition, graphite carbon can be used as graphite.
[0034]
Further, the insulating oxide is not particularly limited, but it is preferable to select glass in order to control the resistance value, secure the sinterability with the conductive material, and secure the adhesiveness with the connection member. The composition of the glass does not need to be particularly limited, and can be appropriately set in consideration of ease of controlling the resistance value and required characteristics.
[0035]
Further, a metal oxide can be added to the resistor in order to adjust the resistance value or control other electrical characteristics required for the resistor. Further, when a resistance of 0.1Ω or less is required, the resistor may be composed of a metal and an insulating oxide.
[0036]
The resistance value of the resistor can be controlled by adjusting the mixing ratio of the conductive oxide and the insulating oxide, and the resistance value can also be controlled by the thickness of the resistor.
[0037]
[Dielectric layer 7]
The dielectric material used for the dielectric layer constituting the composite electronic component of the present invention is not particularly limited, and various dielectric materials can be used. For example, a titanium oxide-based composite, a titanate-based composite oxide, or a mixture thereof can be used. Examples of the titanium oxide include TiO ₂ containing NiO, CuO, Mn ₃ O ₄ , Al ₂ O ₃ , MgO, SiO _{2 and the} like in a total amount of about 0.001 to 30% by weight as needed. . Further, as the titanate-based composite oxide, barium titanate (BaTiO ₃ ) or the like can be given.
[0038]
The atomic ratio of Ba / Ti is preferably in the range of 0.95 to 1.20, the barium _{titanate, MgO, CaO, Mn 3 O} 4, Y 2 O 3, V 2 O 5, ZnO, ZrO 2, Nb ₂ O ₅ , Cr ₂ O ₃ , Fe ₂ O ₃ , P ₂ O ₅ , SrO, Na ₂ O, K ₂ O and the like may be contained in a total amount of about 0.001 to 30% by weight. Further, glass such as (BaCa) SiO ₃ glass may be contained for adjusting the firing temperature, the coefficient of linear expansion, and the like.
[0039]
The thickness of one dielectric layer is not particularly limited, but can be set to, for example, about 0.5 to 20 μm. Further, the number of stacked dielectric layers can be generally about 2 to 300.
[0040]
[Connection electrode parts 41 and 45]
In joining the elements, a connection electrode portion member (joining member) is used in order to ensure the reliability of the joining.
[0041]
The members of the connection electrode portions 41 and 45 used in the present invention use at least one kind of metal such as Pd, Ag, Au, Cu, Pt, Rh, Ru, Ir, or an alloy thereof as a conductive material. Can be. Further, the connection member may contain glass for the purpose of improving the sinterability of the conductive material and ensuring the adhesiveness to the laminate and the resistor. The thickness of the connecting member is not particularly limited, and may be, for example, about 0.5 to 30 μm, particularly about 5 to 20 μm.
[0042]
As described above, the connection between the second external electrode 15 and the connection portion 25a of the second internal electrode layer 25 in the present invention may be performed via the connection electrode portion (joining member).
[0043]
[Insulating member constituting insulating film 65]
Further, the insulating member constituting the insulating film 65 in the present invention can be formed using an insulating material as conventionally used for composite electronic components. For example, glass, resin, a low-temperature fired ceramic material, or the like can be selected in order to secure sinterability and adhesiveness with the conductive material of the external electrode and the connection member. The composition of the glass used does not need to be particularly limited, and can be appropriately set in consideration of the required insulating properties.
[0044]
Method for manufacturing composite electronic component Next, a method for manufacturing the composite electronic component of the present invention will be described.
[0045]
In the composite electronic component 1 of the present invention, for example, first, a green chip body including a resistor is manufactured by a normal printing method or a sheet method using a paste to form a laminate. Next, the connection electrode portion paste is printed or transferred so as to connect the outlet protrusion of the resistor and the protrusion of the first internal electrode layer, which are exposed on one end face of the laminate on the side of the external electrode. Forming part. Further, an insulating film is formed by printing or transferring a paste for an insulating member (insulating film) so as to cover the connection electrode portion. An external electrode paste is printed or transferred onto both opposing end surfaces of the laminate. As a result, the entrance projection of the resistor is connected to the first external electrode, and the connection of the second internal electrode layer is connected to the second external electrode. Thereafter, the composite electronic component can be manufactured by firing.
[0046]
Hereinafter, a specific example of the composition of the paste will be described.
[0047]
<Paste for dielectric layer>
As the paste for the dielectric layer, a paste obtained by kneading and dispersing a dielectric material and an organic vehicle can be used.
[0048]
The composition of the dielectric material can be appropriately selected in consideration of the use of the composite electronic component to be manufactured. For example, when barium titanate is used as the titanate-based composite oxide, a method of mixing an auxiliary component material with BaTiO ₃ synthesized by a hydrothermal synthesis method or the like can be used. Further, a dry synthesis method in which a mixture of BaCO ₃ , TiO _2, and an auxiliary component is preliminarily fired and solid-phase reacted may be used, or a hydrothermal synthesis method may be used. Alternatively, a mixture of a precipitate obtained by a coprecipitation method, a sol-gel method, an alkaline hydrolysis method, a precipitation mixing method, and the like and an auxiliary component raw material may be preliminarily calcined for synthesis. In addition, as the auxiliary component raw material, an oxide or various compounds that become an oxide upon firing, for example, at least one of a carbonate, an oxalate, a nitrate, a hydroxide, and an organometallic compound can be used.
[0049]
The average particle size of the dielectric material can be determined according to the target average crystal particle size of the dielectric layer. Usually, a powder having an average particle size of about 0.1 to 5 μm is used. The content of the dielectric material in the dielectric layer paste is usually about 30 to 80% by weight.
[0050]
The organic vehicle used for the dielectric layer paste is obtained by dissolving a binder in an organic solvent. As the binder, for example, known resin binders such as ethyl cellulose, a copolymer of polyvinyl butyral and methacrylic acid ester, and an acrylate-based copolymer can be used. Further, as an organic solvent for dissolving the binder, an organic solvent such as terpineol, butyl carbitol, acetone, and toluene can be used. The content of such a binder or an organic solvent in the dielectric layer paste is not particularly limited, and usually, the binder can be about 1 to 5% by weight and the organic solvent can be about 10 to 50% by weight.
[0051]
<Paste for internal electrode layer>
The internal electrode layer paste is obtained by kneading and dispersing the above-described various conductive metals and alloys, or various oxides and organometallic compounds which become the above-described conductive materials after firing, and the above-described organic vehicle. Prepare.
[0052]
<Paste for external electrode>
The external electrode paste uses at least one kind of metal such as Pd, Ag, Au, Cu, Pt, Rh, Ru, Ir, or an alloy thereof as a conductive material, or an alloy thereof, and is similar to the above-described internal electrode layer paste. And prepared.
[0053]
The various pastes described above may optionally contain additives selected from various dispersants, plasticizers, dielectrics, insulators, and the like. The total content of these is preferably 10% by weight or less.
[0054]
<Paste for resistor>
The resistor paste is prepared by kneading and dispersing the various conductive oxides and insulating oxides described above and the organic vehicle as described above.
[0055]
<Insulating material paste>
The insulating member paste is prepared by kneading and dispersing the various insulating materials described above and the organic vehicle as described above.
[0056]
[Preparation of green chip body including resistor layer]
When the printing method is used, the paste for the dielectric layer, the paste for the resistor, and the paste for the internal electrode layer are laminated and printed on a support such as polyethylene terephthalate. At this time, the first and second internal electrode layers 21 and 25 are printed so as to obtain a predetermined form on the outer frame of the dielectric layer paste as shown in FIG. The resistor (layer) 5 is also printed on the outer frame of the dielectric layer paste so as to obtain a predetermined form as shown in FIG. After lamination printing in this manner, it is cut into a predetermined shape to form chips, and separated from the support to obtain a green chip body.
[0057]
When the sheet method is used, a green sheet is formed using a dielectric layer paste, and a green sheet is printed thereon in the same manner as described above using a resistor paste and an internal electrode layer paste. It is cut into a shape to obtain a green chip body.
[0058]
[Binder removal process]
The green chip body manufactured as described above is preferably subjected to a binder removal treatment before firing. The conditions of the binder removal treatment can be appropriately set in consideration of the used material and the like. For example, when a base metal such as Ni or a Ni alloy is used as the conductive material of the internal electrode layer, the conditions are particularly set as follows. Is preferred.
[0059]
Debinding process conditions Temperature rising rate: 5 to 300 ° C / hour, especially 10 to 100 ° C / hour Holding temperature: 200 to 400 ° C, especially 250 to 300 ° C
Temperature holding time: 0.5 to 24 hours, especially 5 to 20 hours Atmosphere: in air
[Firing step]
The firing of the green chip body can be appropriately set in consideration of the resistor material of the resistor paste, the dielectric material in the dielectric paste, the type of electrode material in the internal electrode layer paste, and the like. When a base metal such as Ni or a Ni alloy is used as the conductive material of the internal electrode layer, the firing atmosphere is mainly composed of N ₂ , the H ₂ content is 1 to 10% by volume, and is obtained by the steam pressure at 10 to 35 ° C. A mixture of H ₂ O gas is preferable. The oxygen partial pressure is preferably set to 10 ⁻³ to 10 ⁻⁸ Pa. If the oxygen partial pressure is less than the above range, the conductive material of the internal electrode layer may abnormally sinter and be interrupted. If the oxygen partial pressure exceeds the above range, the internal electrode layer may be oxidized.
[0061]
The firing temperature is preferably 1100 to 1400 ° C, particularly preferably 1200 to 1300 ° C. When the holding temperature is lower than 1100 ° C., the densification is insufficient, and when the holding temperature is higher than 1400 ° C., the internal electrode layer is easily broken. Further, the temperature holding time during firing is preferably 0.5 to 8 hours, particularly preferably 1 to 3 hours.
[0062]
[Annealing process]
When firing in a reducing atmosphere, the laminate is preferably annealed. Annealing is a process for reoxidizing the dielectric layer, which can significantly increase the accelerated life of the insulation resistance.
[0063]
The oxygen partial pressure in the annealing atmosphere is preferably 10 ⁻³ Pa or more, particularly preferably 10 ⁻³ to 10 ⁻¹ Pa. When the oxygen partial pressure is less than the above range, it is difficult to reoxidize the dielectric layer, and when the oxygen partial pressure exceeds the above range, the internal electrode layer may be oxidized.
[0064]
The holding temperature for annealing is preferably 1100 ° C. or lower, particularly preferably 500 to 1000 ° C. If the holding temperature is lower than 500 ° C., re-oxidation of the dielectric layer becomes insufficient, and the accelerated life of insulation resistance is shortened. If it exceeds 1100 ° C., the internal electrode layer is oxidized and the capacitance is lowered. Reacts with the dielectric substrate and shortens the accelerated life. Note that the annealing step may be configured only by raising and lowering the temperature. In this case, it is not necessary to take a temperature holding time, and the holding temperature is synonymous with the maximum temperature. Further, the temperature holding time is preferably 0 to 20 hours, particularly preferably 2 to 10 hours. It is preferable to use N ₂ and humidified H ₂ gas as the atmosphere gas.
[0065]
In addition, in each of the above-described steps of the binder removal processing, firing, and annealing, for example, a wetter can be used to humidify N ₂ , H ₂ , a mixed gas, or the like. The water temperature in this case is preferably about 5 to 75C.
[0066]
The steps of binder removal processing, firing, and annealing may be performed continuously or independently. When performing these steps continuously, after removing the binder, the atmosphere is changed without cooling, and then the temperature is raised to the holding temperature for firing, and firing is performed. It is preferable to perform annealing by changing the atmosphere when the temperature has reached.
[0067]
In the case where these steps are performed independently, in the binder removal processing step, the temperature is raised to a predetermined holding temperature, held for a predetermined time, and then lowered to room temperature. At that time, the atmosphere for removing the binder is the same as that in the case where the process is continuously performed. Further, in the annealing step, the temperature is raised to a predetermined holding temperature, held for a predetermined time, and then lowered to room temperature. The annealing atmosphere at that time is the same as in the case where the annealing is performed continuously. Further, the binder removal step and the firing step may be performed continuously, and only the annealing step may be performed independently. Alternatively, only the binder removal step may be performed independently, and the firing step and the annealing step may be performed continuously. You may go.
[0068]
[Formation of connection electrode part]
The connection electrode portion paste is printed or transferred so as to connect the outlet protrusion of the resistor and the protrusion of the first internal electrode layer, which are exposed on one end face of the laminate on the side of the external electrode, and then fired, An electrode portion is formed.
[0069]
[Formation of insulating film]
An insulating member (insulating film) paste is printed or transferred so as to cover the connection electrode portion, and then baked to form an insulating film.
[0070]
[External electrode formation]
The external electrode paste is printed or transferred to both opposing end surfaces of the chip body (laminated body) manufactured as described above. Thereafter, firing is performed to form an external electrode. As a result, the entrance projection of the resistor is connected to the first external electrode, and the connection of the second internal electrode layer is connected to the second external electrode.
[0071]
The firing conditions for the external electrode paste are preferably, for example, about 600 minutes to about 800 ° C. for about 10 minutes to about 1 hour in a reducing atmosphere such as a mixed gas of N ₂ and H ₂ .
[0072]
The composite electronic component of the present invention manufactured as described above is provided with lead wires as necessary, and mounted on a printed circuit board or the like by soldering or the like for use.
[0073]
【Example】
Next, the present invention will be described in more detail with reference to specific examples.
[0074]
(1) Preparation of composite electronic component 1 [Preparation of paste for dielectric layer]
BaCO ₃ (average particle size 2.0 μm) and TiO ₂ (average particle size 2.0 μm) were prepared as main raw materials of the dielectric layer. The atomic ratio of Ba / Ti was 1.00. This the main raw material to 100 parts by weight, 5 parts by weight of BaTiO _3, 1 part by weight of MnCO _3, 1 part by weight of MgCO _3, 2 parts by weight of Y 2 _{O 3,} was added 3 parts by weight of (BaCa) SiO ₃ The mixture was wet-mixed in an underwater ball mill and dried.
[0075]
The obtained mixed powder was calcined at 1250 ° C. for 2 hours. This calcined powder was pulverized with an underwater ball mill and dried. To 100 parts by weight of the obtained calcined powder, 5 parts by weight of an acrylic resin as an organic binder and 80 parts by weight of ethyl acetate as an organic solvent were added and mixed by a ball mill to obtain a dielectric layer paste.
[0076]
[Preparation of paste for internal electrode layer]
To 8 parts by weight of ethyl cellulose resin dissolved in 92 parts by weight of terpineol, 4 parts by weight of 100 parts by weight of Ni particles having an average particle size of 0.4 μm were added and kneaded with a three-roll mill to prepare a paste for an internal electrode layer. did.
[0077]
[Preparation of paste for external electrode and connection electrode part (connection member)]
As a conductive material, a mixed powder of 30% by weight of Ag powder (average particle size of 5.0 μm) and 70% by weight of Pd powder (average particle size of 1.0 μm) was prepared. Then, 2 parts by weight of an acrylic resin, 18 parts by weight of terpineol and 5 parts by weight of a zinc-based glass frit having an average particle size of 2.0 μm were added and kneaded with a three-roll mill to prepare a paste for an external electrode layer.
[0078]
[Preparation of paste for resistor]
44.4 parts by weight of RuO ₂ powder (average particle size: 0.2 μm) as a conductive material, 52.0 parts by weight of Ca-based glass frit (average particle size: 2.0 μm) as a glass material, and CuO (average particle size) as an additive A mixed powder consisting of 3.6 parts by weight (particle size: 2.0 μm) was prepared, and 5.4 parts by weight of ethyl cellulose and 67.4 parts by weight of terpineol were added to 100 parts by weight of the mixed powder, and the mixture was added to a three-roll mill. And kneaded to prepare a resistor paste.
[0079]
[Preparation of insulating material paste]
Eight parts by weight of ethylcellulose resin dissolved in 92 parts by weight of terpineol, 40 parts by weight of Ca-based glass frit having an average particle size of 2.0 μm, and kneading with three rolls to prepare a paste for an insulating member. did.
[0080]
[Formation of laminated body]
Using a polyethylene terephthalate film having a thickness of 50 μm as a support, the paste for a dielectric layer was applied on the support by a doctor blade method and dried at 60 ° C. to form a dielectric green sheet having a thickness of 5 μm.
[0081]
Next, the above-mentioned internal electrode paste is printed in a predetermined form on the dielectric green sheet by screen printing as indicated by reference numeral 21 in FIG. 2 and dried at 80 ° C. to form a 1 μm-thick first internal electrode paste. A layer was formed. Next, a second internal electrode paste layer was formed in a predetermined manner in the same manner as indicated by reference numeral 25 in FIG.
[0082]
Also, the resistor paste is printed on the dielectric green sheet in a predetermined form by screen printing as shown by reference numeral 5 in FIG. 2 and dried at 80 ° C. to form a resistor paste layer having a thickness of 5 μm. did.
[0083]
Next, a dielectric green sheet on which a paste layer serving as a first internal electrode layer is formed (reference numeral 71 in FIG. 2) and a dielectric green sheet on which a paste layer serving as a second internal electrode layer is formed (see FIG. 2) Reference numeral 75) is alternately stacked, and a dielectric green sheet (reference numeral 50 in FIG. 2) on which a resistor paste layer is formed is stacked on the laminated body. The body green sheets 7 were laminated and subjected to thermocompression bonding (120 ° C., 1 ton / cm ² , pressing time 10 minutes). Thereafter, the laminated body after firing was cut so as to have a length of 2.0 mm × width 1.2 mm × thickness 1.2 mm to obtain a green chip body, and the green chip body was subjected to binder removal processing under the following conditions. .
[0084]
(Binder removal processing conditions)
Heating rate: 30 ° C / hour Holding temperature: 260 ° C
Temperature holding time: 8 hours Atmosphere: in air
Next, the above-mentioned green chip body was fired and annealed under the following conditions to obtain a laminated body serving as an element body.
[0086]
(Firing conditions)
Holding temperature: 1300 ° C
Temperature holding time: 3 hours Atmosphere: Humidified N ₂ + H ₂ (H ₂ : 3% by volume)
[0087]
(Annealing conditions)
Holding temperature: 1000 ° C
Temperature holding time: 2 hours Atmosphere: Oxygen partial pressure of 10 ⁻² Pa containing humidified H ₂ gas
[Production of composite electronic components]
After polishing the end surface in the longitudinal direction (the surface on which the external electrodes 11 and 15 are formed) of the laminate obtained by the above-mentioned firing by sandblasting, the resistor exposed on the first external electrode side end surface of the laminate is obtained. The connection electrode portion paste was applied so as to connect the outlet protrusion portion of No. 1 and the protrusion portion of the first internal electrode layer, and then dried to form a connection electrode portion. Next, an insulating member (insulating film) paste was applied so as to cover the connection electrode portion, and then dried to form an insulating film. The above-mentioned external electrode layer paste was applied to the two end surfaces, such as the first external electrode side end surface and the other second external electrode side end surface, and dried.
[0089]
Next, a binder removal treatment was performed under the following conditions, followed by firing to produce the composite electronic component 1 of the present invention.
[0090]
(Binder removal processing conditions)
Heating rate: 30 ° C / hour Holding temperature: 300 ° C
Temperature holding time: 5 hours Atmosphere: in air
(Firing conditions)
Holding temperature: 950 ° C
Temperature holding time: 10 minutes Atmosphere: N ₂ + H ₂ atmosphere
【The invention's effect】
As described above in detail, the composite electronic component of the present invention has an advantage that the resistor is formed inside the element body, so that the composite electronic component has excellent withstand voltage characteristics and a small variation in the resistance value. In addition to the advantage that damage is not caused, the resistor (layer) inside the element and the internal electrode layer have a structure that does not overlap. An extremely excellent effect that a capacity can be obtained is exhibited. The resistance value can be easily adjusted by selecting various resistors to be used. In the present invention, the shape can be the same as that of an existing chip (there is no need to provide a side electrode).
By the way, in comparison between composite electronic components of the same size, the capacitance of the composite electronic component 1 of the present invention produced in the above embodiment is the same as that of the conventional composite electronic component disclosed in Patent Document 1 of the prior art. It has been confirmed that the capacity is improved by about 200% compared to the capacity.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of a composite electronic component 1 according to the present invention.
FIG. 2 is a schematic perspective view showing an exploded main part of an element body 20 (laminated body 20) shown in FIG.
FIG. 3 is a schematic perspective view of an element main body for explaining formation of a predetermined structure on a first external electrode side with time.
FIG. 4 is a schematic perspective view of an element main body for explaining formation of a predetermined structure on a first external electrode side with time.
FIG. 5 is a schematic perspective view of an element main body for explaining formation of a predetermined structure on a first external electrode side with time.
6 is a view for explaining a predetermined structure inside the first external electrode side according to the present invention, and is a cross-sectional equivalent view taken along the line AA of FIG. 1 (A- FIG. 2); A direction).
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Composite electronic component 7 ... Dielectric layers 11 and 15 ... External electrodes 20 ... Element main body 21 ... 1st internal electrode layer 25 ... 2nd internal electrode layers 31 and 35 ... Side electrodes 41 and 45 ... Connection electrode part 5 ( 55) Resistor 65 Insulating film

Claims (5)

A composite electronic component having an element main body and a pair of first external electrodes and a second external electrode formed on opposite end surfaces of the element main body,
The element body includes a capacitor component in which dielectric layers and internal electrode layers are alternately stacked, and a resistor component in which a substantial resistor is formed,
The internal electrode layer includes a first internal electrode layer and a second internal electrode layer alternately stacked with a dielectric layer interposed therebetween,
The first internal electrode layer has a protrusion exposed on the first external electrode side,
The second internal electrode layer has a connection exposed on the second external electrode side, and the connection is connected to the second external electrode;
The substantial resistor has an entrance projection and an exit projection exposed on the first external electrode side,
The inlet protrusion and the outlet protrusion are electrically connected to each other inside other than the protrusions, and the inlet protrusion is connected to a first external electrode,
The outlet projection and the projection of the first internal electrode layer are connected by a connection electrode portion, and the connection electrode portion is covered with an insulating film to be insulated from the first external electrode. Electronic components. The substantial resistor has a resistor portion and a conductor portion arranged to sandwich the resistor portion, and the conductor portion arranged to sandwich the resistor portion is connected to the first external electrode side. The composite electronic component according to claim 1, further comprising an entrance projection and an exit projection exposed to the outside. The junction area between the resistor portion and the conductor portion is larger than the junction area at the entrance projection exposed at the first external electrode side and at the exit projection exposed at the first external electrode side. The composite electronic component according to claim 2, wherein the composite electronic component is formed. The composite electronic component according to claim 1, wherein the substantial resistor includes only a resistor portion. The composite electronic component according to claim 1, wherein the entrance protrusion is connected to a first external electrode via a connection electrode portion.

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