CN104811029A - Composite electronic assembly and board provided with composite electronic assembly - Google Patents

Abstract

The invention provides a composite electronic assembly and a board provided with the composite electronic assembly. The composite electronic assembly comprises a composite body, input terminals, output terminals, and a grounding terminal. The composite body is provided with a capacitor and an inductor, wherein the capacitor and the inductor are in conjunction with one another in the composite body. The input terminal is arranged on the first-end surface, the first side surface and the second side surface of the composite body. The output terminals are composed of first output terminals arranged on the second-end surface, the first side surface and the second side surface of the composite body, and second output terminals arranged on the second side surface of the composite body. The grounding terminal is arranged on the first side surface of the composite body. The length of the composite body is defined as L, and the width of the input terminals along the length direction of the composite body is defined as a. When a/L is within the range of 0.05-0.30, the capacitor and the inductor are vertically combined. A magnetic sheet is inserted between the inductor and the capacitor.

Description

Combined electronical assembly and be provided with the plate of this combined electronical assembly

This application claims and be submitted to the rights and interests of the 10-2014-0009383 korean patent application of Korean Intellectual Property Office on January 27th, 2014, the content of this korean patent application is contained in this by reference.

Technical field

The disclosure relate to a kind of comprise multiple passive component combined electronical assembly and a kind of plate it being provided with this combined electronical assembly.

Background technology

According to the trend of the recently compact and slim electronic installation of deflection and the multifunction to electronic installation, there is the demand of the electronic installation to miniaturized and multifunction.

Electronic installation as above can comprise the power management integrated circuits based on power semiconductor (PMIC) for the limited battery resource of control and management effectively, to meet various demand for services.

But, because electronic installation has multi-functional, so the quantity being included in direct current (the DC)/DC transducer in PMIC increases, and the quantity that should be included in the passive component in the power input terminals of PMIC and power output terminal also increases.

In this case, because the area being provided with the assembly of electronic installation wherein can inevitably increase, the miniaturization of electronic installation can be restricted.

Further, the wiring pattern of PMIC and peripheral circuit thereof can produce noise significantly.

In order to solve the problem, the combined electronical assembly with inductor and the capacitor be bonded to each other along vertical direction be studied, make it possible to the area of the assembly reducing to be provided with electronic installation, and can the generation of restraint speckle.

But, when inductor as above and capacitor vertically arrange, can parasitic capacitance be produced between inductor and capacitor, make self-resonant frequency (SRF) to move to low-frequency region.

Meanwhile, according to the miniaturization of combined electronical assembly, stop that the internal magnetization layer in the magnetic field of inductor is also thinned, thus result in the deterioration of Q factor.

[correlation technique file]

(patent document 1) 2003-0014586 Korea Patent Laid is open.

Summary of the invention

One side of the present disclosure can provide a kind of needs the combined electronical assembly of the erection space reduced in driving power supply system and a kind of plate it being provided with this combined electronical assembly.

One side of the present disclosure also can provide a kind of can suppress the combined electronical assembly of the appearance of noise in driving power supply system and a kind of plate it being provided with this combined electronical assembly.

According to one side of the present disclosure, combined electronical assembly can comprise: composite host, there is the capacitor and inductor that are bonded to each other in composite host, capacitor comprises ceramic main body, multiple dielectric layer and facing with each other and make dielectric layer be placed in electrode and the second inner electrode in first between them to be stacked on ceramic main body, inductor comprises the magnetic body with coil portion; Input terminal, to be arranged on the first end surface of composite host, the first side surface and the second side surface and to be connected to the coil portion of inductor; Lead-out terminal, comprise be arranged on composite host the second end surfaces, the first side surface and the second side surface on and on the first lead-out terminal being connected to the coil portion of inductor and the second side surface being arranged on composite host and be connected to capacitor first in the second lead-out terminal of electrode; Earth terminal, the first side surface being arranged on composite host is connected to the second inner electrode of capacitor, wherein, when the length of composite host is defined as L, and when the width of the length direction along composite host of input terminal is defined as a, then a/L (0.05≤a/L≤0.30) in the scope of 0.05 to 0.30, capacitor and inductor combine each other vertically, and magnetic sheet is inserted between inductor and capacitor.

When the width of the length direction along composite host by earth terminal is defined as b, b/L can in the scope of 0.05 to 0.30 (0.05≤b/L≤0.30).

Magnetic sheet can have the thickness of 50 μm to 300 μm.

Magnetic sheet can comprise at least one selected from the group be made up of pure iron, iron (Fe) based metal powder, nickel (Ni) and chromium (Cr).

Magnetic body can have and stackingly have multiple magnetospheric form being provided with conductive pattern, and conductive pattern forms coil portion.

Capacitor can have the form of film that magnetic body comprises dielectric base and is arranged on the coil at least one surface of dielectric base.

Magnetic body can have the form being provided with core and the winding coil around core winding.

Inductor can be power inductor.

According to another aspect of the present disclosure, a kind of combined electronical assembly can comprise: composite host, there is the capacitor and inductor that are bonded to each other in composite host, capacitor comprises ceramic main body, multiple dielectric layer and facing with each other and make dielectric layer be placed in electrode and the second inner electrode in first between them to be stacked on ceramic main body, inductor comprises the magnetic body with coil portion; Input terminal, the part being arranged on the first end surface of composite host is connected to the coil portion of inductor; Lead-out terminal, in the part comprising the second end surfaces being arranged on composite host and on the first lead-out terminal being connected to the coil portion of inductor and the second side surface being arranged on composite host and be connected to capacitor first in the second lead-out terminal of electrode; Earth terminal, the first side surface being arranged on composite host is connected to the second inner electrode of capacitor, wherein, when the width of composite host is defined as W, and when the width of the Width along composite host of input terminal is defined as c, then c/W (0.15≤c/W≤0.90) in the scope of 0.15 to 0.90, capacitor and inductor combine each other vertically, and magnetic sheet is inserted between inductor and capacitor.

When the length of composite host is defined as L, and when the width of the length direction along composite host of earth terminal is defined as b, then b/L can in the scope of 0.05 to 0.30 (0.05≤b/L≤0.30).

Magnetic sheet can have the thickness of 50 μm to 300 μm.

Magnetic body can have and stackingly have multiple magnetospheric form being provided with conductive pattern, and conductive pattern forms coil portion.

Inductor can have the form of film that magnetic body comprises dielectric base and is arranged on the coil at least one surface of dielectric base.

Magnetic body can have the form being provided with core and the winding coil around core winding.

Inductor can be power inductor.

According to another aspect of the present disclosure, a kind of plate it being provided with combined electronical assembly can comprise: printed circuit board (PCB), and three or more electrode pads are arranged on a printed circuit; Combined electronical assembly as above is on a printed circuit installed; Weld part, connecting electrode pad and combined electronical assembly.

Accompanying drawing explanation

By the detailed description of carrying out below in conjunction with accompanying drawing, above-mentioned and other side, other advantage of characteristic sum of the present disclosure will be more clearly understood, in the accompanying drawings:

Figure 1A and Figure 1B is the perspective view of the combined electronical assembly schematically shown respectively according to exemplary embodiment of the present disclosure;

Fig. 2 is the cutaway view of the first example illustrated along the combined electronical assembly in Figure 1B of A-A' line intercepting;

Fig. 3 is the cutaway view of the second example illustrated along the combined electronical assembly in Figure 1B of A-A' line intercepting;

Fig. 4 is the cutaway view of the 3rd example illustrated along the combined electronical assembly in Figure 1B of A-A' line intercepting;

Fig. 5 is the decomposition diagram of the stacking form of the first example being shown schematically in the combined electronical assembly shown in Figure 1B;

Fig. 6 is the plane graph of the interior electrode that the multilayer ceramic capacitor being applied to the combined electronical assembly shown in Figure 1B is shown;

Fig. 7 is the equivalent circuit diagram of the combined electronical assembly shown in Figure 1B;

Fig. 8 is the perspective view of the combined electronical assembly schematically shown according to another exemplary embodiment of the present disclosure;

Fig. 9 is the diagram that the driving power supply system by battery and power management block, driving power being fed to the predetermined terminal needing driving power is shown;

Figure 10 is the diagram that the layout being provided with driving power supply system is shown;

Figure 11 is the circuit diagram of the combined electronical assembly according to exemplary embodiment of the present disclosure;

Figure 12 illustrates the diagram being provided with and using according to the layout of the driving power supply system of the combined electronical assembly of exemplary embodiment of the present disclosure;

Figure 13 illustrates that the combined electronical assembly of Figure 1A is mounted the perspective view of form on a printed circuit;

Figure 14 is the curve chart of the change of the self-resonant frequency (SRF) illustrated according to invention example and comparative examples;

Figure 15 is the curve chart of the change of the Q factor illustrated according to invention example and comparative examples.

Embodiment

Exemplary embodiment of the present disclosure is specifically described now with reference to accompanying drawing.

But the disclosure can illustrate in many different forms, and should not be construed as limited to the specific embodiment of setting forth herein.On the contrary, provide these embodiments to make the disclosure to be thoroughly with complete, and these embodiments fully will convey to those skilled in the art the scope of the present disclosure.

In the accompanying drawings, for clarity, can exaggerate the shape and size of element, identical label will be used to indicate same or analogous element all the time.

combined electronical assembly

Figure 1A and Figure 1B is the perspective view of the combined electronical assembly schematically shown respectively according to exemplary embodiment of the present disclosure.

Fig. 2 is the cutaway view of the first example illustrated along the combined electronical assembly in Figure 1B of A-A' line intercepting.

Fig. 3 is the cutaway view of the second example illustrated along the combined electronical assembly in Figure 1B of A-A' line intercepting.

Fig. 4 is the cutaway view of the 3rd example illustrated along the combined electronical assembly in Figure 1B of A-A' line intercepting.

Fig. 5 is the decomposition diagram of the stacking form of the first example being shown schematically in the combined electronical assembly shown in Figure 1B.

Fig. 6 is the plane graph of the interior electrode that the multilayer ceramic capacitor being applied to the combined electronical assembly shown in Figure 1B is shown.

With reference to Figure 1A and Figure 1B, according in the combined electronical assembly of exemplary embodiment of the present disclosure, " length direction " represents " L " direction in Fig. 1, and " Width " represents " W " direction in Fig. 1, and " thickness direction " represents " T " direction in Fig. 1.Herein, " thickness direction " may be used for having the concept identical with the dielectric layer direction of stacked capacitor, i.e. " stacking direction ".

Meanwhile, the length direction of combined electronical assembly, Width and thickness direction may be defined as identical with thickness direction with the length direction of the capacitor that will be described below and inductor, Width.

In addition, in an exemplary embodiment of the disclosure, combined electronical assembly can have upper surface respect to one another and lower surface, and the first side surface upper surface and lower surface are connected to each other and the second side surface and first end surface and the second end surfaces.The shape of combined electronical assembly is not particularly limited, but can be as directed hexahedral shape.

In addition, the first side surface of combined electronical assembly, the second side surface, first end surface and the second end surfaces can be defined as identical with the second end surfaces with the first side surface of the capacitor that will be described below and inductor, the second side surface, first end surface.

Meanwhile, combined electronical assembly can have the form that capacitor and inductor are bonded to each other.When inductor is attached to capacitor, the upper surface of combined electronical assembly represents the upper surface of inductor, and the lower surface of combined electronical assembly represents the lower surface of capacitor.

In addition, first side surface and the second side surface represent combined electronical assembly along Width surfaces opposite to each other, first end surface and the second end surfaces represent the alongst surfaces opposite to each other of combined electronical assembly, upper surface and lower surface represent combined electronical assembly along thickness direction surfaces opposite to each other.

With reference to Figure 1A to Fig. 6, combined electronical assembly 100 according to exemplary embodiment of the present disclosure can comprise composite host 130, composite host 130 has the capacitor 110 and inductor 120 that are bonded to each other wherein, and capacitor 110 comprises the stacking multiple dielectric layer 11 and facing with each other and make dielectric layer 11 be placed in the ceramic main body of electrode 31 and the second inner electrode 32 in first between them of having; Inductor 120 comprises the magnetic body containing coil portion 140.

In an exemplary embodiment of the disclosure, composite host 130 can have upper surface respect to one another and lower surface, and the first side surface that upper surface and lower surface are connected to each other and the second side surface and first end surface and the second end surfaces.

The shape of composite host 130 is not specifically limited, but can be the hexahedral shape as illustrated in the exemplary embodiment.

Composite host 130 is formed by making capacitor 110 and inductor 120 be bonded to each other.But the method forming composite host 130 is not specifically limited.

Such as, by utilizing conductive adhesive, resin or analog the capacitor 110 formed independently and inductor 120 be bonded to each other and form composite host 130, or form composite host 130 by the ceramic main body of sequentially stacking formation capacitor 110 and the magnetic body that forms inductor 120.But the method forming composite host 130 is not limited thereto.

Specifically, can be such as epoxy resin for binding agent that capacitor 110 and inductor 120 are bonded to each other or resin, but be not limited thereto.

Conductive adhesive or resin etc. is used the method that capacitor 110 and inductor 120 are bonded to each other to be not particularly limited.That is, capacitor 110 and inductor 120 are by being coated to the mating surface of capacitor 110 or inductor 120 by conductive adhesive or resin etc., then heat it and solidify and be bonded to each other.

Meanwhile, according to exemplary embodiment of the present disclosure, inductor 120 can be arranged on capacitor 110, but is not limited thereto.That is, inductor 120 can be arranged in a variety of manners.

That is, capacitor 110 also can be arranged on inductor 120.

Hereinafter, the capacitor 110 and inductor 120 that form composite host 130 will be described in detail.

According to exemplary embodiment of the present disclosure, the magnetic body forming inductor 120 can comprise coil portion 140.

Inductor 120 is not particularly limited, but can be such as multilayer type inductor, thin-film electro sensor or takeup type inductor.Except above-mentioned inductor, the spiral inductor of laser also can be used as inductor 120.

Multilayer type inductor can manufacture as follows: print electrode thickly on thin ferrite or glass ceramics sheet, and stacking several are printed with the sheet of coil pattern, and are connected to each other by inside conductor by through hole.

Thin-film electro sensor can manufacture as follows: form conductive coil wire on a ceramic substrate by thin film sputtering method or plating method, then perform the filling of Ferrite Material.

Takeup type inductor is by manufacturing around core winding cables (conductive coil wire).

The spiral inductor of laser can manufacture as follows: on ceramic spool, form electrode layer by sputtering method or plating method, by laser spiralization coil shape, utilizes external protection film resin to cover coil shape, then forms external terminal.

With reference to Fig. 2, in the first example of the combined electronical assembly of exemplary embodiment of the present disclosure, inductor 120 can be multilayer type inductor.

More particularly, magnetic body can have the stacking form of multiple magnetosphere 21 it being formed with conductive pattern 41, and conductive pattern 41 can form coil portion 140.

With reference to Fig. 3, in the second example of the combined electronical assembly of exemplary embodiment of the present disclosure, inductor 120 can be thin-film electro sensor.

Exemplarily, inductor 120 can have form of film, in this form of film, and the coil that magnetic body comprises dielectric base 123 and is formed at least one surface of dielectric base 123.

Magnetic body by adopt magnetic material 122 fill its at least one be formed with the dielectric base 123 of coil on the surface upper and lower formed.

With reference to Fig. 4, in the 3rd example of the combined electronical assembly of exemplary embodiment of the present disclosure, inductor 120 can be takeup type inductor.

Exemplarily, inductor 120 can have the form that magnetic body comprises core 123 and the winding coil around core 124 winding.

Magnetosphere 21 and magnetic material 122 can be formed by Ni-Cu-Zn sill, Ni-Cu-Zn-Mg sill or Mn-Zn ferrite sill, but are not limited thereto.

According to exemplary embodiment of the present disclosure, inductor 120 can be the power inductor that can be applied in a large amount of electric current.

Power inductor can be when changing the efficient electric sensor changed lower than the inductance of normal inductor to inductance during its applying direct current (DC).That is, can think that power inductor comprises the function of DC biasing characteristic (when applying DC electric current to it inductance change) and normal inductor.

Namely, can be used in power management integrated circuits (PMIC) according to the combined electronical assembly of exemplary embodiment of the present disclosure, and can power sensor be comprised, that is, when changing the efficient electric sensor changed lower than the inductance of normal inductor to inductance during its applying DC electric current.

Hereinafter, the situation that inductor 120 in combined electronical assembly is the multilayer type inductors according to first embodiment of the present disclosure in the of the present disclosure first to the 3rd example will be described in greater detail in.

Magnetic body can manufacture as follows: be printed on by conductive pattern 41 on multiple corresponding magnetic raw cook 21b to 21j, stacking multiple magnetic raw cook 21b to 21j it being formed with conductive pattern 41, respectively magnetic raw cook 21a to 21k is stacked on the top of magnetic raw cook 21b and the bottom of magnetic raw cook 21j, sinters magnetic raw cook 21a to 21k afterwards.

With reference to Fig. 5, by printing on magnetic raw cook 21b to 21j and dry conductive pattern 41, the upper and lower then magnetic raw cook 21a to 21k being stacked on magnetic raw cook 21b to 21j forms magnetic body.

Conductive pattern 41 can comprise along stacking direction stacking with the multiple conductive pattern 41a to 41f forming coil pattern.

Conductive pattern 41 is formed by the electroconductive paste comprised by predetermined thickness printing as the silver (Ag) of key component.

Conductive pattern 41 length direction that can be electrically connected to along combination electrode assembly is formed in input terminal 151 on two ends of combined electronical assembly and lead-out terminal.

Conductive pattern 41 can comprise the lead portion being electrically connected to input terminal 151 and lead-out terminal.

A conductive pattern 41a and another conductive pattern 41b of the conductive pattern 41 arranged together with the magnetic raw cook 21b of insertion magnetosphere 21 are therebetween electrically connected to each other by the through hole electrode be formed on magnetic raw cook 21b, and can form coil pattern along stacking direction.

In an exemplary embodiment of the disclosure, coil pattern is not particularly limited, but can design according to the induction coefficient with inductor.

Namely, second conductive pattern 41b to the 5th conductive pattern 41e can be stacked between the first conductive pattern 41a of the lead portion with the second end surfaces being exposed to composite host and the 6th conductive pattern 41f of lead portion with the first end surface being exposed to composite host with coil form, and as mentioned above, each conductive pattern is connected to each other by the through hole electrode be formed in each magnetic raw cook.

Although shown in Fig. 5 is the situation that the order of the second conductive pattern 41b to the 4th conductive pattern 41d is repeated twice, the disclosure is not limited thereto.That is, the quantity of number of repetition is unrestricted and can change along with object of the present disclosure.

Simultaneously, the ceramic main body forming capacitor 110 is formed by the stacking multiple dielectric layers be made up of dielectric layer 11a to 11d, and multiple interior electrode 31 and 32 (in set gradually first electrode and the second inner electrode) can be arranged to separated from one another and dielectric layer is placed between interior electrode in ceramic main body.

Dielectric layer 11 is formed by sintering the ceramic green sheet comprising ceramic powders, organic solvent and organic bond.Ceramic powders as high-g value can be barium titanate (BaTiO ₃) sill or strontium titanates (SrTiO ₃) sill etc., but be not limited thereto.

Simultaneously, according to exemplary embodiment of the present disclosure, interior electrode can comprise the lead portion 31a with the first side surface being exposed to composite host 130 first in electrode 31 and there is the second inner electrode 32 of lead portion 32a of the second side surface of the second side surface being exposed to composite host 130, but be not limited thereto.

According to exemplary embodiment of the present disclosure, in first, electrode 31 and the second inner electrode 32 can utilize the electroconductive paste comprising conducting metal to be formed.

Conducting metal can be nickel (Ni), copper (Cu), palladium (Pd) or their alloy, but is not limited thereto.

In first, electrode 31 and the second inner electrode 32 can utilize electroconductive paste to be printed on the ceramic green sheet of formation dielectric layer 11 by the printing process of such as silk screen print method or woodburytype.

The ceramic green sheet with the interior electrode be printed thereon is alternately stacking and sinter, thus forms ceramic main body.

Although Fig. 6 shows the pattern form of electrode 31 and the second inner electrode 32 in first, pattern form is not limited to the example shown in Fig. 6, but can differently change.

Capacitor can be used for the voltage controlling to supply from power management integrated circuits (PMIC).

Combined electronical assembly 100 according to exemplary embodiment of the present disclosure can comprise: input terminal 151, to be formed on the first end surface of composite host 130, the first side surface and the second side surface and to be connected to the coil portion 140 of inductor 120; Lead-out terminal, comprise be formed in composite host 130 the second end surfaces, the first side surface and the second side surface on and on the first lead-out terminal 152a being connected to the coil portion 140 of inductor 120 and the second side surface being formed in composite host 130 and be connected to capacitor 110 first in the second input terminal 152b of electrode 31; And earth terminal 153, the first side surface being formed in composite host 130 is connected to the second inner electrode 32 of capacitor 110.

Input terminal 151 and the first lead-out terminal 152a can be connected to the coil portion 140 of inductor 120, and they are used as inductor in combined electronical assembly thus.

In addition, the second lead-out terminal 152b can be connected to capacitor 110 first in electrode 31, and the second inner electrode 32 of capacitor 110 can be connected to earth terminal 153, and they are used as capacitor in combined electronical assembly thus.

Input terminal 151, lead-out terminal and earth terminal 153 can utilize the electroconductive paste comprising conducting metal to be formed.

Conducting metal can be nickel (Ni), copper (Cu), tin (Sn) or their alloy, but is not limited thereto.

Electroconductive paste also can comprise insulating material.Insulating material can be such as glass, but is not limited thereto.

The method forming input terminal 151, lead-out terminal and earth terminal 153 is not particularly restricted.That is, input terminal 151, lead-out terminal and earth terminal 153 is formed by infused ceramic main body, or is formed by other method of such as printing process and coating method etc.

Fig. 7 is the equivalent circuit diagram of the combined electronical assembly shown in Figure 1B.

With reference to Fig. 7, different from the situation of correlation technique, the inductor 120 and capacitor 110 that are bonded to each other can be comprised according to the combined electronical assembly of exemplary embodiment of the present disclosure.Therefore, inductor 120 and capacitor 110 can be designed to have the shortest distance between which, thus can be used in noise decrease.

In addition, inductor 120 and capacitor 110 can be bonded to each other, and the area installing inductor 120 and capacitor 110 can be significantly reduced, thus be conducive to guaranteeing installing space in PMIC.

In addition, installation inductor 120 and the cost needed for capacitor 110 can reduce.

Meanwhile, along with the multifunction of electronic installation, the quantity being included in direct current (the DC)/DC transducer in PMIC increases, and the quantity needing to be included in the passive component in the power input terminals of PMIC and power output terminal also increases.

In this case, because the area being provided with the assembly of electronic installation can inevitably increase, thus the miniaturization of electronic installation may be made to be restricted.

In addition, due to the wiring pattern of PMIC and peripheral circuit thereof, noise may be produced significantly.

In order to address the aforementioned drawbacks, carry out the research to the combined electronical assembly with inductor and the capacitor be bonded to each other along vertical direction, the area of the assembly being provided with electronic installation can have been reduced thus, and can the generation of restraint speckle.

But, when vertically arranging inductor and capacitor as described above, can parasitic capacitance be produced between inductor and capacitor, making self-resonant frequency (SRF) to move to low-frequency region.

When self-resonant frequency (SRF) is in low-frequency region as described above, can be used on and may reduce according to the frequency field of the inductor in the combined electronical assembly of exemplary embodiment of the present disclosure.

Namely, because the function of inductor does not display in the high-frequency region being equal to or higher than self-resonant frequency (SRF), so when self-resonant frequency (SRF) is in low-frequency region, available frequency field can be restricted.

But, according to exemplary embodiment of the present disclosure, magnetic sheet 121 can be inserted between inductor 120 and capacitor 110, thus can reduce the impact of inductor on electrode in capacitor significantly, prevents the change of self-resonant frequency (SRF) thus.

Namely, according to exemplary embodiment of the present disclosure, because inductor 120 and capacitor 110 can be designed to make the distance between them the shortest, noise can be reduced thus, and the change of self-resonant frequency (SRF) can be prevented, thus the scope that can be used in the inductor in low-frequency region can not be restricted.

Meanwhile, along with the miniaturization of combined electronical assembly, stop that the internal magnetization layer in the magnetic field of inductor is also thinning, thus cause the reduction of Q factor.

Q factor can represent the loss of element or the reduction of efficiency of element, according to the increase of Q value, can reduce the loss of element and can improve the efficiency of element.

According to exemplary embodiment of the present disclosure, magnetic sheet 121 can be inserted between inductor 120 and capacitor 110, makes influencing each other and can reduce significantly between corresponding assembly thus, thus prevents the deterioration of Q factor.

The detailed description of self-resonant frequency (SRF) and Q factor will be provided below.

According to exemplary embodiment of the present disclosure, as mentioned above, capacitor 110 and inductor 120 combine each other vertically, and magnetic sheet 121 can be inserted between inductor 120 and capacitor 110.

When the thickness of magnetic sheet 121 is defined as tm, the thickness tm of magnetic sheet 121 can be 50 μm to 300 μm, but is not limited thereto.

As mentioned above, because the thickness tm being placed in the magnetic sheet 121 between inductor 120 and capacitor 110 is 50 μm to 300 μm, so inductor can reduce significantly on the impact of electrode in capacitor, prevent the change of self-resonant frequency (SRF) thus.

In addition, influencing each other between corresponding assembly can reduce significantly, thus can prevent the reduction of the Q factor of assembly.

When the thickness tm of the magnetic sheet 121 be placed between inductor 120 and capacitor 110 is less than 50 μm, owing to being difficult to reduce the impact of inductor on electrode in capacitor significantly, so self-resonant frequency (SRF) can move to low-frequency region, the scope of available inductors can be made thus to reduce.

In addition, the magnetic flux produced in inductor can affect capacitor, and Q factor can be made thus to reduce.

Simultaneously, when the thickness tm of the magnetic sheet 121 be placed between inductor 120 and capacitor 110 is greater than 300 μm, the Thickness Ratio of magnetic sheet and standard combined electronical assembly can exceedingly increase, and makes possibly cannot reach the target inductance of inductor and the target capacitance of capacitor.

Magnetic sheet can comprise at least one such as selected from the group be made up of ferrite, iron (Fe) based metal powder, nickel (Ni) and chromium (Cr), but is not limited thereto.

Specifically, the material being greater than the magnetic permeability of the material of the magnetic body except the coil portion 140 of inductor 120 in sheet magnetic material by the magnetic permeability had is formed, more excellent effect can be obtained.

Meanwhile, with reference to Figure 1B, when the length of composite host 130 is defined as L, and when the width of the length direction along composite host 130 of input terminal 151 is defined as a, a/L can in the scope of 0.05 to 0.30 (0.05≤a/L≤0.30).

In the scope of 0.05 to 0.30 (0.05≤a/L≤0.30) is adjusted by the width a of the length direction along composite host 130 by input terminal 151 and the ratio a/L of the length L of composite host 130, the erection space in power management integrated circuits (PMIC) can be reduced significantly, can contribute to thus guaranteeing installing space.

When the width a of the length direction along composite host 130 of input terminal 151 is less than 0.05 with the ratio a/L of the length L of composite host 130, the width of the length direction along composite host of input terminal is too small, and when being installed onboard by combined electronical assembly, input terminal may the electrode pad of contact plate.

When the width a of the length direction along composite host 130 of input terminal 151 is greater than 0.30 with the ratio a/L of the length L of composite host 130, the width of the length direction along composite host of input terminal is excessive, and the short circuit with lead-out terminal or earth terminal may occur.

In addition, when the width of the length direction along composite host 130 by earth terminal 153 is defined as b, b/L can in the scope of 0.05 to 0.30 (0.05≤b/L≤0.3).

In the scope of 0.05 to 0.30 (0.05≤b/L≤0.30) is adjusted by the width b of the length direction along composite host 130 by earth terminal 153 and the ratio b/L of the length L of composite host 130, the erection space in power management integrated circuits (PMIC) can be reduced significantly, can contribute to thus guaranteeing installing space.

When the width b of the length direction along composite host 130 of earth terminal 153 is less than 0.05 with the ratio b/L of the length L of composite host 130, the width of the length direction along composite host of earth terminal is too small, and when being installed onboard by combined electronical assembly, earth terminal may the electrode pad of contact plate.

When the width b of the length direction along composite host 130 of earth terminal 153 is greater than 0.30 with the ratio b/L of the length L of composite host 130, the width of the length direction along composite host of earth terminal is excessive, and the short circuit with lead-out terminal or earth terminal may occur.

Fig. 8 is the perspective view of the combined electronical assembly schematically shown according to another exemplary embodiment of the present disclosure.

With reference to Fig. 8, combined electronical assembly 100' according to another exemplary embodiment of the present disclosure can comprise: composite host 130', there is the capacitor 110' and capacitor 120' that are bonded to each other wherein, capacitor 110' comprises ceramic main body, multiple dielectric layer and facing with each other and make dielectric layer be placed in electrode and the second inner electrode in first between them to be stacked on ceramic main body, inductor 120' comprises the magnetic body containing coil portion; Input terminal 151', the part being formed in the first end surface of composite host 130' is connected to the coil portion of inductor 120'; Lead-out terminal, in the part comprising the second end surfaces being formed in composite host 130' and on the first lead-out terminal 152'a being connected to the coil portion of inductor 120' and the second side surface being formed in composite host 130' and be connected to capacitor 110' first in the second lead-out terminal 152'b of electrode; Earth terminal 153', the first side surface being formed in composite host 130' is connected to the second inner electrode of capacitor 110', wherein, when the width of composite host 130' being defined as W and the width of the Width along composite host 130' of input terminal 151' being defined as c, c/W is (0.15≤c/W≤0.90) in the scope of 0.15 to 0.90, capacitor 110' and inductor 120' combines each other vertically, and magnetic sheet 121' can be inserted between inductor 120' and capacitor 110'.

When the length of composite host being defined as L and the width of the length direction along composite host of earth terminal being defined as b, b/L can in the scope of 0.05 to 0.30 (0.05≤b/L≤0.30).

The thickness of magnetic sheet can be 50 μm to 300 μm.

Magnetic body can have the form making multiple magnetosphere it comprising conductive pattern stacking, and conductive pattern can form coil portion.

Inductor can have the form of film that magnetic body comprises dielectric base and is formed in the coil at least one surface of dielectric base.

Magnetic body can comprise core and the winding coil around core winding.

Inductor can be power inductor.

With reference to Fig. 8, when the width of composite host 130' being defined as W and the width of the Width along composite host 130' of input terminal 151' is defined as c, c/W can in the scope of 0.15 to 0.90 (0.15≤c/W≤0.90).

In the scope of 0.15 to 0.90 (0.05≤a/W≤0.30) is adjusted by the width a of the Width along composite host 130' by input terminal 151' and the ratio a/W of the width W of composite host 130', the erection space in power management integrated circuits (PMIC) can be reduced significantly, can contribute to thus guaranteeing installing space.

When the width a of the Width along composite host 130' of input terminal 151' is less than 0.15 with the ratio a/W of the width W of composite host 130', due to the part being exposed to outside of the coil portion fully covering inductor may be difficult to, the defect so may be short-circuited, and when being installed onboard by combined electronical assembly, input terminal 151' possibly cannot contact electrode pad.

When the width a of the Width along composite host 130' of input terminal 151' is greater than 0.90 with the ratio a/W of the width W of composite host 130, because the width c of the Width along composite host 130' of input terminal 151' is excessive, so may be difficult to reduce erection space significantly.

Because the further feature of combined electronical assembly 100' is identical with its feature of base of the combined electronical assembly according to exemplary embodiment of the present disclosure, so by their detailed description of omission to avoid repeated description.

Fig. 9 is the diagram that the driving power supply system by battery and power management block, driving power being fed to the predetermined terminal needing driving power is shown.

With reference to Fig. 9, driving power supply system can comprise battery 300, first power stability unit 400, power management block 500 and the second power stability unit 600.

Battery 300 can supply power to power management block 500.Here, the power being fed to power management block 500 by battery 300 will be defined as the first power.

First power stability unit 400 can make the first power V1 stablize and the first power after stable is fed to power management block.By way of example, the first power stability unit 400 can comprise the capacitor C1 between splicing ear and ground being formed in battery 300 and power management block 500.Capacitor C1 can reduce to be included in the fluctuation in the first power.

In addition, capacitor C1 can be filled with electric charge.In addition, capacitor C1 can discharge the electric charge be filled with wherein when power management block 500 consumes a large amount of electric current instantaneously, thus suppresses the change in voltage of power management block 500.

Capacitor C1 can be the stacking high capacitance capacitors having 300 or more dielectric layers.

The power transfer be input in electronic equipment can be the power being suitable for electronic equipment by power management block 500, and distributes, is filled with and controls this power.Therefore, power management block 500 can comprise DC/DC transducer usually.

In addition, power management block can be embodied as power management integrated circuits (PMIC).

First power V1 can be converted to the second power V2 by power management block 500.Second power V2 can be required for the active device of such as integrated circuit (IC) etc., and this active device is connected to the lead-out terminal of power management block 500 to accept the driving power from power management block 500.

Second power stability unit 600 can make the second power V2 stablize and the second power after stable is fed to lead-out terminal Vdd.The active device receiving driving power from power management block 500 of such as integrated circuit (IC) etc. can be connected to lead-out terminal Vdd.

By way of example, the second power stability unit 600 can comprise the inductor L1 be connected in series between power management block 500 and lead-out terminal Vdd.In addition, the second power stability unit 600 can comprise the capacitor C2 between splicing ear and ground be formed between power management block 500 and lead-out terminal Vdd.

Second power stability unit 600 can reduce to be included in the noise in the second power V2.

In addition, power is provided to lead-out terminal Vdd by the second power stability unit 600 Absorbable organic halogens ground.

Capacitor L1 can be the power inductor that can apply a large amount of electric current.

Power inductor can be the efficient electric sensor that inductance change is less than the inductance change of normal inductor when applying direct current (DC) to it.That is, can think that power inductor comprises the function of DC biasing characteristic (when applying DC electric current to it inductance change) and normal inductor.

In addition, capacitor C2 can be high capacitance capacitors.

Figure 10 is the diagram that the layout being provided with driving power supply system is shown.

With reference to Figure 10, the layout being provided with power management block 500, power inductor L1 and the second capacitor C2 can be determined.

Usually, power management block 500 can comprise several to dozens of DC/DC transducers.In addition, in order to realize the function of DC/DC transducer, each DC/DC transducer can required power inductor and high capacitance capacitors.

With reference to Figure 10, power management block 500 can have predetermined terminal N1 and N2.Power management block 500 can receive the power from battery and utilize DC/DC transducer to change supplied power.In addition, power management block 500 supplies the power after conversion by the first terminal N1.Second terminal N2 can be earth terminal.

Here, due to inductor L1 and the second capacitor C2 can receive the power from the first terminal N1 and make supplied power stability with by the 3rd terminal N3 supply driving power, so inductor L1 and the second capacitor C2 can be used as the second power stability unit.

The function performed due to the 4th terminal N4 shown in Figure 10 to the 6th terminal N6 is identical to the function of the 3rd terminal N3 with the first terminal N1, will omit the detailed description to them.

Material facts in the layout of design driven power supply system are, power management block, power inductor and high capacitance capacitors need to be set to close to each other as much as possible.In addition, power line may be needed to be designed to short and thick wiring.

The reason done like this is: when meeting above-described needs, can reduce area for the layout of assembly and can the generation of restraint speckle.

When the quantity of the lead-out terminal of power management block 500 is little, power inductor and high capacitance capacitors can be contributed to be set to close to each other.But when needing the various lead-out terminal using power management block 500, power inductor and high capacitance capacitors can not normally can be arranged due to the increase of the density of assembly.In addition, the priority according to power can be there is and make power inductor and high capacitance capacitors need to be arranged on the situation of non-optimal state.

Such as, because the size of power inductor and high capacitance capacitors is large, so the actual situation inevitably increasing the length of power line and holding wire when arranging power inductor and high capacitance capacitors may be appeared at.

When power inductor and high capacitance capacitors are arranged on non-optimal state, the interval between power inductor and high capacitance capacitors and the length of power line can increase, and there will be noise thus.Noise can have negative effect to driving power supply system.

Figure 11 is the circuit diagram of the combined electronical assembly according to exemplary embodiment of the present disclosure.

With reference to Figure 11, combined electronical assembly can comprise input terminal unit A (input terminal), power stability unit, lead-out terminal unit B (lead-out terminal) and earth terminal unit C (earth terminal).

Power stability unit can comprise power inductor L1 and the second capacitor C2.

Combined electronical assembly can be the device that can be used as the second power stability unit.

Input terminal unit A can receive the power changed by power management block 500.

Power stability unit can make the power stability supplied from input terminal unit A.

Power after stable can be fed to lead-out terminal Vdd by lead-out terminal unit B.

Power stability unit can be connected to ground by earth terminal unit C.

Meanwhile, power stability unit can comprise the power inductor L1 be connected between input terminal unit A and lead-out terminal unit B and the second capacitor C2 be connected between earth terminal unit C and lead-out terminal unit B.

With reference to Figure 11, power sensor L1 and the second capacitor C2 common output subelement B each other, thus the interval between power inductor L1 and the second capacitor C2 can be reduced.

As mentioned above, combined electronical assembly is by being embodied as single component to be formed by the power inductor be arranged in the power output terminal of power management block 500 and high capacitance capacitors.Therefore, in combined electronical assembly, the integrated level of element can be improved.

Figure 12 illustrates the diagram being provided with and using according to the layout of the driving power supply system of the combined electronical assembly of exemplary embodiment of the present disclosure.

With reference to Figure 12, what was certain was that, the second capacitor C2 shown in Figure 10 and power inductor L1 by the combined electronical assembly according to exemplary embodiment of the present disclosure substitute.

As mentioned above, combined electronical assembly can be used as the second power stability unit.

In addition, by substituting the second capacitor C2 and power inductor L1 with the combined electronical assembly according to exemplary embodiment of the present disclosure, length of arrangement wire can be reduced significantly.In addition, the quantity of the device of setting can be reduced, thus optimally element can be set.

That is, according to exemplary embodiment of the present disclosure, power management block, power inductor and high capacitance capacitors can be set to close to each other as much as possible, and power line can be designed to short and thick wiring with noise decrease thus.

Meanwhile, electronic equipment set manufacturer has been devoted to the size reducing the printed circuit board (PCB) (PCB) comprised in the electronic device, to satisfy the demands of consumers.Therefore, the integrated level improving the IC be arranged on PCB has been required.As according in the combined electronical assembly of disclosure exemplary embodiment, multiple device is implemented as single composite component, thus can meet this demand.

In addition, according to exemplary embodiment of the present disclosure, two assemblies (the second capacitor and power inductor) are implemented as single combined electronical assembly, thus can reduce them and be installed in area on PCB.According to exemplary embodiment of the present disclosure, arrange compared with layout with existing, the area of installation component can reduce about 10% to 30%.

In addition, according to exemplary embodiment of the present disclosure, driving power is supplied to IC by the shortest wiring by power management block 500.

In addition, according in the combined electronical assembly of disclosure exemplary embodiment, by magnetic sheet to be inserted between inductor and capacitor or inductor is designed to have the thickness of increase with capacitor adjacent cover layer, the impact of inductor on electrode in capacitor can be reduced significantly, thus prevent the change of self-resonant frequency (SRF).

In addition, according in the combined electronical assembly of exemplary embodiment of the present disclosure, by inserting magnetic sheet or be designed to the cover layer adjacent with capacitor of inductor to have the thickness of increase between inductor and capacitor, the reduction of the Q factor of assembly can be prevented.

it is provided with the plate of combined electronical assembly

Figure 13 illustrates that the combined electronical assembly of Figure 1A is mounted the perspective view of form on a printed circuit.

With reference to Figure 13, it is provided with and can comprises according to the plate 200 of the combined electronical assembly 100 of exemplary embodiment of the present disclosure: printed circuit board (PCB) 210, combined electronical assembly 100 is installed on the printed circuit board 210; Three or more electrode pads 221 to 223, are formed on the upper surface of printed circuit board (PCB) 210.

Electrode pad can be made up of the first to the third electrode pad 221 to 223 being connected respectively to the input terminal 151 of combined electronical assembly, lead-out terminal and earth terminal 153.

In this case, the input terminal 151 of combined electronical assembly 100, lead-out terminal and earth terminal 153 are electrically connected to printed circuit board (PCB) 210 by weld part 230, and they are set to contact with the first to third electrode pad 221 to 223 respectively simultaneously.

In addition, the combined electronical assembly installed on a printed circuit can be the combined electronical assembly according to another exemplary embodiment of the present disclosure, in order to avoid repeated description, will omit detailed description.

Following table 1 shows Q factor according to the thickness of the magnetic sheet be inserted between inductor with capacitor and the change of frequency of combined electronical assembly with inductor and the capacitor be combined vertically each other.

[table 1]

Thickness (μm)/frequency of magnetic sheet	1MHz	3MHz	6MHz	9MHz
					0	25.1	22.6	16.9	16.7
50	26.6	23.2	17.2	16.8
					100	31.3	24.6	18.4	17.0
200	36.4	27.3	19.0	17.1
					300	36.5	27.4	19.0	17.1

With reference to table 1, be understood that Q factor is higher than the situation not inserting magnetic sheet when the thickness being inserted in the magnetic sheet between inductor and capacitor is 50 μm to 300 μm.

In particular, be understood that when magnetic sheet is inserted low-frequency region, improve the better effects if of Q factor.

Figure 14 is the curve chart of the change of the self-resonant frequency (SRF) illustrated according to invention example and comparative examples.

With reference to Figure 14, invention example 1 is corresponding to being inserted with the combined electronical assembly that thickness is the magnetic sheet of 100 μm, invention example 2 is corresponding to being inserted with the combined electronical assembly that thickness is the magnetic sheet of 200 μm, invention example 3 is corresponding to being inserted with the combined electronical assembly that thickness is the magnetic sheet of 300 μm, comparative examples 1 is corresponding to the combined electronical assembly being used alone power inductor, and comparative examples 2 corresponds to the combined electronical assembly not inserting magnetic sheet.

With reference to this curve chart, be understood that when inserting the invention example 1 to 3 of magnetic sheet, self-resonant frequency (SRF) is almost equal with the self-resonant frequency of the comparative examples 1 being used alone power inductor.

On the other hand, be understood that, when not inserting comparative examples 2 of magnetic sheet, self-resonant frequency (SRF) moves to low-frequency region, thus can reduce the scope of available inductors.

Figure 15 is the curve chart of the change of the Q factor illustrated according to invention example and comparative examples.

With reference to Figure 15, example 1 is corresponding to being inserted with the combined electronical assembly that thickness is the magnetic sheet of 100 μm, invention example 2 is corresponding to being inserted with the combined electronical assembly that thickness is the magnetic sheet of 200 μm, invention example 3 is corresponding to being inserted with the combined electronical assembly that thickness is the magnetic sheet of 300 μm, comparative examples 1 is corresponding to the combined electronical assembly being used alone power inductor, and comparative examples 2 corresponds to the combined electronical assembly not inserting magnetic sheet.

With reference to this curve chart, be understood that when inserting the invention example 1 to 3 of magnetic sheet, Q factor is almost equal with the Q factor of the comparative example 1 being used alone power inductor.

On the other hand, be understood that when not inserting comparative examples 2 of magnetic sheet, compare with the comparative examples 1 being used alone power inductor with the invention example 1 to 3 inserting magnetic sheet, Q factor reduces.

As mentioned above, according to exemplary embodiment of the present disclosure, can be provided in driving power supply system the combined electronical assembly needing the erection space reduced and the plate it being provided with this combined electronical assembly.

In addition, according to exemplary embodiment of the present disclosure, the combined electronical assembly that the noise in driving power supply system can be suppressed to produce and the plate it being provided with this combined electronical assembly can be provided.

In addition, according in the combined electronical assembly of exemplary embodiment of the present disclosure, by inserting magnetic sheet or be designed to the cover layer adjacent with capacitor of inductor to have the thickness of increase between inductor and capacitor, the magnetic flux that can reduce significantly to produce in inductor on the impact of electrode in capacitor, thus prevents the change of self-resonant frequency (SRF).

In addition, according in the combined electronical assembly of exemplary embodiment of the present disclosure, by inserting magnetic sheet or be designed to the cover layer adjacent with capacitor of inductor to have the thickness of increase between inductor and capacitor, the reduction of the Q factor of assembly can be prevented.

Although illustrate and describe exemplary embodiment above, it will be obvious to those skilled in the art that when do not depart from as defined by the appended claims spirit and scope of the present disclosure, can modify and change.

Claims (17)

1. a combined electronical assembly, described combined electronical assembly comprises:

Composite host, there is the capacitor and inductor that are bonded to each other in composite host, capacitor comprises ceramic main body, in multiple dielectric layer and facing with each other first, electrode and the second inner electrode are stacked in ceramic main body, wherein, dielectric layer is placed in first between electrode and the second inner electrode, and inductor comprises the magnetic body with coil portion;

Input terminal, is arranged on the first end surface of composite host, the first side surface and the second side surface, and is connected to the coil portion of inductor;

Lead-out terminal, comprise be arranged on composite host the second end surfaces, the first side surface and the second side surface on and on the first lead-out terminal being connected to the coil portion of inductor and the second side surface being arranged on composite host and be connected to capacitor first in the second lead-out terminal of electrode;

Earth terminal, the first side surface being arranged on composite host is connected to the second inner electrode of capacitor,

Wherein, when the length of composite host being defined as L and the width of the length direction along composite host of input terminal being defined as a, a/L is in the scope of 0.05 to 0.30, and capacitor and inductor combine each other vertically, and magnetic sheet is inserted between inductor and capacitor.

2. combined electronical assembly as claimed in claim 1, wherein, when the width of the length direction along composite host by earth terminal is defined as b, b/L is in the scope of 0.05 to 0.30.

3. combined electronical assembly as claimed in claim 1, wherein, magnetic sheet has the thickness of 50 μm to 300 μm.

4. combined electronical assembly as claimed in claim 1, wherein, magnetic sheet comprises at least one selected from the group be made up of ferrite, iron-based metal powder, nickel and chromium.

5. combined electronical assembly as claimed in claim 1, wherein, magnetic body has and stackingly has multiple magnetospheric form being provided with conductive pattern, and conductive pattern forms coil portion.

6. combined electronical assembly as claimed in claim 1, wherein, inductor has the form of film that magnetic body comprises dielectric base and is formed in the coil at least one surface of dielectric base.

7. combined electronical assembly as claimed in claim 1, wherein, composite host comprises core and the winding coil around core winding.

8. combined electronical assembly as claimed in claim 1, wherein, inductor is power inductor.

9. a combined electronical assembly, described combined electronical assembly comprises:

Composite host, there is the capacitor and inductor that are bonded to each other in composite host, capacitor comprises ceramic main body, in multiple dielectric layer and facing with each other first, electrode and the second inner electrode are stacked in ceramic main body, wherein, dielectric layer is placed in first between electrode and the second inner electrode, and inductor comprises the magnetic body with coil portion;

Input terminal, the part being arranged on the first end surface of composite host is connected to the coil portion of inductor;

Lead-out terminal, in the part comprising the second end surfaces being arranged on composite host and on the first lead-out terminal being connected to the coil portion of inductor and the second side surface being arranged on composite host and be connected to capacitor first in the second lead-out terminal of electrode;

Earth terminal, the first side surface being arranged on composite host is connected to the second inner electrode of capacitor,

Wherein, when the width of composite host being defined as W and the width of the Width along composite host of input terminal being defined as c, c/W is in the scope of 0.15 to 0.90, and capacitor and inductor combine each other vertically, and magnetic sheet is inserted between inductor and capacitor.

10. combined electronical assembly as claimed in claim 9, wherein, when the length of composite host being defined as L and the width of the length direction along composite host of earth terminal being defined as b, b/L is in the scope of 0.05 to 0.30.

11. combined electronical assemblies as claimed in claim 9, wherein, magnetic sheet has the thickness of 50 μm to 300 μm.

12. combined electronical assemblies as claimed in claim 9, wherein, magnetic body has and stackingly has multiple magnetospheric form being provided with conductive pattern, and conductive pattern forms coil portion.

13. combined electronical assemblies as claimed in claim 9, wherein, inductor has the form of film that magnetic body comprises dielectric base and is formed in the coil at least one surface of dielectric base.

14. combined electronical assemblies as claimed in claim 9, wherein, composite host comprises core and the winding coil around core winding.

15. combined electronical assemblies as claimed in claim 9, wherein, inductor is power inductor.

16. 1 kinds of plates being provided with combined electronical assembly, described plate comprises:

Printed circuit board (PCB), three or more electrode pads are arranged on a printed circuit;

Combined electronical assembly as claimed in claim 1, installs on a printed circuit;

Weld part, connecting electrode pad and combined electronical assembly.

17. 1 kinds of plates being provided with combined electronical assembly, described plate comprises:

Printed circuit board (PCB), three or more electrode pads are arranged on a printed circuit;

Combined electronical assembly as claimed in claim 9, installs on a printed circuit;

Weld part, connecting electrode pad and combined electronical assembly.