JPH0428435U - - Google Patents

Info

Publication number
JPH0428435U
JPH0428435U JP1990069661U JP6966190U JPH0428435U JP H0428435 U JPH0428435 U JP H0428435U JP 1990069661 U JP1990069661 U JP 1990069661U JP 6966190 U JP6966190 U JP 6966190U JP H0428435 U JPH0428435 U JP H0428435U
Authority
JP
Japan
Prior art keywords
shape
wiring board
printed wiring
circuit pattern
pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1990069661U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990069661U priority Critical patent/JPH0428435U/ja
Publication of JPH0428435U publication Critical patent/JPH0428435U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Multi-Conductor Connections (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図および第２図は本考案プリント配線板の
第１実施例を示し、第１図はプリント配線板の要
部の斜視図、第２図は回路パターンの接合部とパ
ツドの拡大平面図、第３図〜第１０図は本考案の
プリント配線板の第２実施例を示す回路パターン
の接合部とパツドとの拡大平面図、第１１図は従
来のプリント配線板の要部の斜視図である。 １……基板、２……回路パターン、３、３１，
３２，３３，３４，３５，３６，３７，３８……
パツド、４……チツプ素子、５……ボンデイング
ワイヤ、６，６１，６２，６３，６４，６５，６
６，６７，６８……接合部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 片面あるいは両面に回路パターンを有し、外部
    素子との接続用のパツドを形成したプリント配線
    板において、前記回路パターンの前記パツドとの
    接合部の端部形状を凹型、凸型あるいは波型等の
    非直線形状に形成したことを特徴とするプリント
    配線板。
JP1990069661U 1990-06-29 1990-06-29 Pending JPH0428435U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990069661U JPH0428435U (ja) 1990-06-29 1990-06-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990069661U JPH0428435U (ja) 1990-06-29 1990-06-29

Publications (1)

Publication Number Publication Date
JPH0428435U true JPH0428435U (ja) 1992-03-06

Family

ID=31605163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990069661U Pending JPH0428435U (ja) 1990-06-29 1990-06-29

Country Status (1)

Country Link
JP (1) JPH0428435U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183451A (ja) * 2003-12-16 2005-07-07 Fujikura Ltd 接合体およびその製造方法
JP2005183588A (ja) * 2003-12-18 2005-07-07 Fujikura Ltd 接合体およびその製造方法
WO2017038667A1 (ja) * 2015-08-31 2017-03-09 シャープ株式会社 光源ユニット、照明装置及び表示装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005183451A (ja) * 2003-12-16 2005-07-07 Fujikura Ltd 接合体およびその製造方法
JP4526813B2 (ja) * 2003-12-16 2010-08-18 株式会社フジクラ 接合体の製造方法
JP2005183588A (ja) * 2003-12-18 2005-07-07 Fujikura Ltd 接合体およびその製造方法
JP4526814B2 (ja) * 2003-12-18 2010-08-18 株式会社フジクラ 接合体の製造方法
WO2017038667A1 (ja) * 2015-08-31 2017-03-09 シャープ株式会社 光源ユニット、照明装置及び表示装置

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