JPH0227758U - - Google Patents

Info

Publication number
JPH0227758U
JPH0227758U JP10611688U JP10611688U JPH0227758U JP H0227758 U JPH0227758 U JP H0227758U JP 10611688 U JP10611688 U JP 10611688U JP 10611688 U JP10611688 U JP 10611688U JP H0227758 U JPH0227758 U JP H0227758U
Authority
JP
Japan
Prior art keywords
soldering
pattern parts
pattern
chips
end side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10611688U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10611688U priority Critical patent/JPH0227758U/ja
Publication of JPH0227758U publication Critical patent/JPH0227758U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】
第1図は、本考案のチツプの半田付けパターン
を説明する説明図、第2図は、従来のパターンの
説明図である。 1a〜1f……パターン、2a,2b……接続
パターン、3a,3b,3c……電気素子(チツ
プ)。

Claims (1)

    【実用新案登録請求の範囲】
  1. 小型電子機器のチツプ(電気素子)のリフロー
    半田付けにおいて、半田付けパターン部同志を接
    続する接続パターンを、半田付けパターン部の外
    端側に配置した事を特徴とする、半田付け基板。
JP10611688U 1988-08-11 1988-08-11 Pending JPH0227758U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10611688U JPH0227758U (ja) 1988-08-11 1988-08-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10611688U JPH0227758U (ja) 1988-08-11 1988-08-11

Publications (1)

Publication Number Publication Date
JPH0227758U true JPH0227758U (ja) 1990-02-22

Family

ID=31339340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10611688U Pending JPH0227758U (ja) 1988-08-11 1988-08-11

Country Status (1)

Country Link
JP (1) JPH0227758U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015174202A1 (ja) * 2014-05-13 2017-04-20 株式会社村田製作所 樹脂封止型モジュール

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2015174202A1 (ja) * 2014-05-13 2017-04-20 株式会社村田製作所 樹脂封止型モジュール
US10251277B2 (en) 2014-05-13 2019-04-02 Murata Manufacturing Co., Ltd. Resin-sealed module

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