JPH04279039A - Wire-bonding method and device - Google Patents

Wire-bonding method and device

Info

Publication number
JPH04279039A
JPH04279039A JP3041622A JP4162291A JPH04279039A JP H04279039 A JPH04279039 A JP H04279039A JP 3041622 A JP3041622 A JP 3041622A JP 4162291 A JP4162291 A JP 4162291A JP H04279039 A JPH04279039 A JP H04279039A
Authority
JP
Japan
Prior art keywords
torch electrode
tip
discharge
movement range
capillary tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3041622A
Other languages
Japanese (ja)
Inventor
Kazuyuki Hayashi
一幸 林
Fumiaki Sato
文昭 佐藤
Kazuhiro Kawabata
川端 数博
Mitsuhiro Ishizuka
石塚 充洋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP3041622A priority Critical patent/JPH04279039A/en
Publication of JPH04279039A publication Critical patent/JPH04279039A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/78268Discharge electrode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009Pre-treatment of the connector or the bonding area
    • H01L2224/8503Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable a process time to be reduced and prevent bonding failure. CONSTITUTION:A rotary axis 13 is rotated by a step motor 31, thus enabling a torch electrode 25 to be stopped at a waiting position A and a discharge position B. Discharging is performed between a tip portion 29 of a metal thin wire 28 and a discharge portion 26 of a torch electrode 25 at the discharge position B for forming the tip portion 29 in spherical shape and then the torch electrode 25 is moved to the waiting position A and then a capillary tool 27 is lowered, thus enabling the tip portion 29 to be crimped against an object to be crimped which is not illustrated. Therefore, the torch electrode 25 can be moved at high speed and so that it does not generate shock.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】この発明は、例えば半導体チップ
の表面電極と外部リード電極との間を金属細線で接続す
るワイヤボンディング方法及び装置に関するものである
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding method and apparatus for connecting, for example, a surface electrode of a semiconductor chip and an external lead electrode using a thin metal wire.

【0002】0002

【従来の技術】図2,図3は、従来のワイヤボンディン
グ装置を示すもので図2は斜視図、図3は図2の右方か
ら見て示す側面図である。これらの図において、11は
本体、12は本体11に嵌め込まれたころがり軸受、1
3は2個のころがり軸受12により回動自在に支持され
た丸棒状の回動軸である。14は回動軸13の手前側の
端部に固着されたレバー、15は左ストッパ、16は右
ストッパであり、左ストッパ15、右ストッパ16にて
レバー14の回動角度位置を規制する。17はレバー1
4と支持板18との間に圧縮されて挿入されレバー14
を反時計方向に押圧するコイルばねである。19は本体
11に設けられた取付板、20はプッシュプルソレノイ
ドであり、取付板19に固着されたソレノイド本体21
とレバー14の上方部に連結されたプランジャ22とを
有している。
2 and 3 show a conventional wire bonding apparatus, with FIG. 2 being a perspective view and FIG. 3 being a side view seen from the right side of FIG. In these figures, 11 is a main body, 12 is a rolling bearing fitted into the main body 11, and 1 is a rolling bearing fitted into the main body 11.
Reference numeral 3 denotes a round rod-shaped rotation shaft rotatably supported by two rolling bearings 12. 14 is a lever fixed to the front end of the rotation shaft 13, 15 is a left stopper, and 16 is a right stopper. The left stopper 15 and the right stopper 16 regulate the rotation angle position of the lever 14. 17 is lever 1
The lever 14 is compressed and inserted between the support plate 18 and the lever 14.
It is a coil spring that presses counterclockwise. 19 is a mounting plate provided on the main body 11, 20 is a push-pull solenoid, and the solenoid main body 21 is fixed to the mounting plate 19.
and a plunger 22 connected to the upper part of the lever 14.

【0003】23は回動軸13の左方の端部に固着され
たL型の支持金具、24は支持金具23に固定されたL
型の絶縁板、25は絶縁板24により支持金具23と絶
縁されるとともに絶縁板24,支持金具23を介して回
動軸13に片持ち腕状に回動自在に支持されたトーチ電
極、26はトーチ電極25の放電部であり、次に述べる
金属細線28の先端部29との間で放電をさせる。27
は図示しない上下駆動装置により上下方向に駆動され移
動線ML上を直線状に所定の移動域内を移動するキャピ
ラリツールであり、その内部の貫通細孔(図示を省略)
中へ金属細線28が挿通され、先端部29が若干突き出
した状態とされている。
Reference numeral 23 indicates an L-shaped support fitting fixed to the left end of the rotating shaft 13, and 24 indicates an L-shaped support fitting fixed to the support fitting 23.
A torch electrode 26 is insulated from the supporting metal fitting 23 by the insulating plate 24 and rotatably supported on the rotating shaft 13 in the form of a cantilever arm via the insulating plate 24 and the supporting metal fitting 23. is a discharge part of the torch electrode 25, and a discharge is caused between it and the tip part 29 of a thin metal wire 28, which will be described next. 27
is a capillary tool that is driven in the vertical direction by a vertical drive device (not shown) and moves linearly within a predetermined movement range on a movement line ML, and has a through hole (not shown) inside it.
A thin metal wire 28 is inserted into it, with a tip 29 slightly protruding.

【0004】次に動作について説明する。装置が待機状
態のとき、金属細線28はその先端部29がキャピラリ
ツール27から突き出るようにされて図示しない把持手
段に把持されており、プシュプルソレノイド20は励磁
されていないのでレバー14はコイルばね17により押
され反時計方向に回動されて右ストッパ16に当接して
停止しており、同時に回動軸13に支持されたトーチ電
極25の放電部26は図2の一点鎖線で示される位置(
以下待機位置という)Aに在り、キャピラリツール27
の移動域外へ退避してキャピラリツール27の移動に干
渉しない状態にある。
Next, the operation will be explained. When the device is in a standby state, the thin metal wire 28 has its tip 29 protruding from the capillary tool 27 and is held by a gripping means (not shown), and the push-pull solenoid 20 is not energized, so the lever 14 is held by the coil spring 17. The discharge portion 26 of the torch electrode 25 supported by the rotation shaft 13 is at the position shown by the dashed line in FIG.
The capillary tool 27 is located at A (hereinafter referred to as the standby position).
The capillary tool 27 is in a state where it is retracted outside the movement range and does not interfere with the movement of the capillary tool 27.

【0005】プシュプルソレノイド20を励磁するとプ
ランジャ22が吸引されてレバー14はコイルばね17
の押圧力に抗して時計方向に回動してその下部が左スト
ッパ15に衝突して停止する。このとき、回動軸13に
支持されたトーチ電極25の放電部26は待機位置Aか
ら矢印R方向に回動してキャピラリツール27の移動域
内の所定の位置(以下放電位置という)Bに停止する。
When the push-pull solenoid 20 is energized, the plunger 22 is attracted and the lever 14 is activated by the coil spring 17.
It rotates clockwise against the pressing force of , and its lower part collides with the left stopper 15 and stops. At this time, the discharge part 26 of the torch electrode 25 supported by the rotation shaft 13 rotates from the standby position A in the direction of arrow R and stops at a predetermined position (hereinafter referred to as the discharge position) B within the movement range of the capillary tool 27. do.

【0006】その後、金属細線28の先端部29と放電
部26との間で図示しない電源装置により放電を発生さ
せて先端部29を球状に成形する。次に、プシュプルソ
レノイド20の励磁を切りコイルばね17のばね力によ
りレバー14を押圧し回動軸13を反時計方向に回動さ
せ、放電部26を待機位置Aへ戻し、先端部29をキャ
ピラリツール27により移動線ML上を下方へ押し下げ
、被圧着物の所定の電極(図示せず)へ圧着する。続い
て、被圧着物を所定距離だけ移動させ、結線されるべき
次の電極がキャピラリツール27の真下(移動線ML上
)に来るようにして、再びキャピラリツール27を下降
させて金属細線28を圧着し、図示しない把持手段であ
るクランパ装置により金属細線28を挟みキャピラリツ
ール27及びクランパ装置を上昇させて金属細線28を
引きちぎり、キャピラリツール27を上方の所定の位置
へ戻して、一工程が終了する。
[0006] Thereafter, an electrical discharge is generated between the tip 29 of the thin metal wire 28 and the discharge portion 26 by a power supply device (not shown), thereby forming the tip 29 into a spherical shape. Next, the push-pull solenoid 20 is de-energized, the lever 14 is pressed by the spring force of the coil spring 17, the rotation shaft 13 is rotated counterclockwise, the discharge part 26 is returned to the standby position A, and the tip part 29 is connected to the capillary. The tool 27 pushes down the moving line ML to press the object to a predetermined electrode (not shown). Next, the object to be crimped is moved a predetermined distance so that the next electrode to be connected is directly below the capillary tool 27 (on the moving line ML), and the capillary tool 27 is lowered again to connect the thin metal wire 28. The capillary tool 27 and the clamper device are lifted to tear the thin metal wire 28 by pinching the thin metal wire 28 using a clamper device (not shown) as a gripping means, and the capillary tool 27 is returned to a predetermined position above. finish.

【0007】[0007]

【発明が解決しようとする課題】従来のワイヤボンディ
ング装置は以上のように構成され、上記のような方法に
てワイヤボンディングが行われていたので、トーチ電極
25の放電部26を放電位置Bへ移動して停止させるの
にレバー14を左ストッパ15へ衝突させて行っている
ので、衝撃が発生するとともにトーチ電極25の放電部
26が振動する。従って、放電部26の振動が収まるま
で次の放電を発生させる工程の開始を待たねばならず工
程時間が長くなるという問題点があった。また、上述の
衝撃のために図示しない把持手段によって把握された金
属細線28が変形することがあり、このため放電により
金属細線28の先端部29を球状に成形する工程におい
て、球状径のばらつき、あるいは放電ミスが生じ、ワイ
ヤボンディングの不良が発生するなどの問題点があった
[Problems to be Solved by the Invention] Since the conventional wire bonding apparatus is constructed as described above and wire bonding is performed by the method described above, it is necessary to move the discharge portion 26 of the torch electrode 25 to the discharge position B. Since the lever 14 is moved and stopped by colliding with the left stopper 15, an impact is generated and the discharge portion 26 of the torch electrode 25 vibrates. Therefore, it is necessary to wait until the vibration of the discharge section 26 subsides before starting the process of generating the next discharge, resulting in a problem that the process time becomes longer. In addition, the above-mentioned impact may deform the thin metal wire 28 held by the gripping means (not shown). Therefore, in the process of forming the tip 29 of the thin metal wire 28 into a spherical shape by electric discharge, variations in the spherical diameter, Alternatively, there are problems such as discharge errors and wire bonding defects.

【0008】この発明は上記のような問題点を解消する
ためになされたもので、工程時間が短くワイヤボンディ
ングの不良を防止できるワイヤボンディング方法及び装
置を得ることを目的とする。
The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a wire bonding method and apparatus that can shorten the process time and prevent defects in wire bonding.

【0009】[0009]

【課題を解決するための手段】この発明に係るワイヤボ
ンディング方法は、(1)トーチ電極を支持した回動軸
を回転する回転駆動手段によって回動させてトーチ電極
を金属細線が挿通されたキャピラリツールの移動域内の
所定の位置へ移動させる工程と、(2)トーチ電極と金
属細線の先端部との間で放電させて先端部を球状にする
工程と、(3)回動軸を回動させてトーチ電極をキャピ
ラリツールの移動域外へ退避させる工程とを備えたもの
である。
[Means for Solving the Problems] A wire bonding method according to the present invention includes: (1) rotating a rotating shaft supporting a torch electrode by a rotational drive means to connect a torch electrode to a capillary through which a thin metal wire is inserted; The process of moving the tool to a predetermined position within the movement range, (2) the process of causing an electric discharge between the torch electrode and the tip of the thin metal wire to make the tip spherical, and (3) rotating the rotation axis. The torch electrode is moved out of the moving range of the capillary tool.

【0010】また、この発明に係るワイヤボンディング
装置は、トーチ電極を支持し回転する回転駆動手段によ
って駆動され上記トーチ電極をキャピラリツールの移動
域外の所定の位置及びキャピラリツールの移動域内の所
定の位置に停止させる回動軸を備えたものである。
Further, the wire bonding apparatus according to the present invention is driven by a rotary drive means that supports and rotates the torch electrode, and moves the torch electrode to a predetermined position outside the movement range of the capillary tool and to a predetermined position within the movement range of the capillary tool. It is equipped with a rotating shaft that allows it to stop at any time.

【0011】[0011]

【作用】この発明におけるワイヤボンディング方法にお
いては、トーチ電極は回転駆動手段によって駆動される
回動軸の回動によってキャピラリツールの移動域内へ移
動及び移動域外への退避を行うので衝撃を発生せずに迅
速に動作が可能である。特に、トーチ電極を移動域内の
所定の位置へ移動させたときに、トーチ電極が振動しな
いので直ちに次工程のトーチ電極と金属細線の先端部と
の間で放電を開始できるので、全体の工程時間を短縮で
き、また衝撃を受けて把持された金属細線が変形するこ
とがないのでボンディングの不良を防止できる。
[Operation] In the wire bonding method of the present invention, the torch electrode is moved into and out of the movement range of the capillary tool by the rotation of the rotation shaft driven by the rotation drive means, so no impact is generated. It is possible to operate quickly. In particular, when the torch electrode is moved to a predetermined position within the movement range, since the torch electrode does not vibrate, discharge can immediately begin between the torch electrode and the tip of the thin metal wire in the next process, which reduces the overall process time. In addition, since the thin metal wire gripped is not deformed by impact, defective bonding can be prevented.

【0012】また、この発明に係るワイヤボンディング
装置においては、回転する回転駆動手段によって回動軸
を回動させてキャピラリツールの移動域内の所定の位置
及び移動域外の所定の位置に停止させるようにしている
ので、停止時に衝撃が発生せず、金属細線を把持してい
る把持手段も衝撃を受けないので金属細線を変形させる
恐れもないし、動作も高速に行える。
Further, in the wire bonding apparatus according to the present invention, the rotating shaft is rotated by the rotating rotation drive means and stopped at a predetermined position within the movement range of the capillary tool and at a predetermined position outside the movement range. Therefore, no impact is generated when the device is stopped, and the gripping means that grips the thin metal wire is not subjected to impact, so there is no risk of deforming the thin metal wire, and the operation can be performed at high speed.

【0013】[0013]

【実施例】図1はこの発明の一実施例を示すワイヤボン
ディング装置の斜視図であり、図において、31は回動
軸13に直結され回動軸13を駆動する回転駆動手段で
あるステップモータ、32は回動軸13に取り付けられ
た遮光円板であり、その外周上の所定の位置に二つの切
り欠き33,34が設けられている。35は回動軸13
の他方の軸端に嵌合された絶縁物製のブッシュであり、
トーチ電極25が図のように片持ち腕状に固着されてい
る。なお、トーチ電極25の腕は慣性を小さくするため
薄肉パイプを使用し、トーチ電極25の放電部26の上
面、すなわち金属細線28の先端部29との間で放電す
る部分には放電時の損耗を軽減するために白金製の薄板
36を貼り付けている。37は本体11に取り付けられ
たフォトセンサであり、遮光円板32の切り欠き33,
34の位置を光学的に検出する。
[Embodiment] FIG. 1 is a perspective view of a wire bonding apparatus showing an embodiment of the present invention. In the figure, reference numeral 31 denotes a step motor which is directly connected to the rotation shaft 13 and is rotation driving means for driving the rotation shaft 13. , 32 is a light-shielding disc attached to the rotating shaft 13, and two notches 33 and 34 are provided at predetermined positions on its outer periphery. 35 is the rotation axis 13
is an insulating bushing fitted to the other shaft end of the
A torch electrode 25 is fixed in the form of a cantilever arm as shown in the figure. Note that the arms of the torch electrode 25 are made of thin-walled pipes to reduce inertia, and the upper surface of the discharge part 26 of the torch electrode 25, that is, the part where discharge occurs between the tip 29 of the thin metal wire 28, is not damaged during discharge. A thin plate 36 made of platinum is attached to reduce this. 37 is a photosensor attached to the main body 11, and the notch 33 of the light-shielding disc 32,
The position of 34 is optically detected.

【0014】次に動作について説明する。トーチ電極2
5は待機状態では図2に示された従来例と同様キャピラ
リツール27の移動域外の待機位置Aに退避している。 このとき回動軸13は所定の第一の角度位置にある。ス
テップモータ31に所定数のパルスを与えて所定角度分
回転させて回動軸13を第二の角度位置へ回動してトー
チ電極25の放電部26をキャピラリツール27の移動
域内の放電位置Bへ移動させる。このとき、遮光円板3
2の切り欠き34がフォトセンサ37の検出位置へ来る
ので、位置の確認ができる。続いて、金属細線28の先
端部29と放電部26の薄板36との間で図示しない電
源から電力を供給して放電をさせ先端部29を球状に成
形する。先端部29の球状の成形が終了するとステップ
モータ31に先程とは逆方向に回転するように所定数の
パルスを与え、回動軸13を元の第一の角度位置へ回動
させてトーチ電極25の放電部26を待機位置Aへ戻す
。このとき、フォトセンサ37により遮光円板32の切
り欠き33を検出してトーチ電極25が待機位置Aに戻
ったことを確認する。その他の動作については図2の従
来の装置と同様である。
Next, the operation will be explained. Torch electrode 2
In the standby state, the capillary tool 5 is retracted to a standby position A outside the movement range of the capillary tool 27, similar to the conventional example shown in FIG. At this time, the rotation shaft 13 is at a predetermined first angular position. A predetermined number of pulses are given to the step motor 31 to rotate it by a predetermined angle, and the rotation shaft 13 is rotated to the second angular position, thereby moving the discharge portion 26 of the torch electrode 25 to the discharge position B within the movement range of the capillary tool 27. Move to. At this time, the light shielding disc 3
Since the notch 34 of No. 2 comes to the detection position of the photosensor 37, the position can be confirmed. Subsequently, electric power is supplied from a power source (not shown) between the tip 29 of the thin metal wire 28 and the thin plate 36 of the discharge section 26 to cause discharge, thereby shaping the tip 29 into a spherical shape. When the shaping of the tip 29 into a spherical shape is completed, a predetermined number of pulses are given to the step motor 31 so that it rotates in the opposite direction to the previous one, and the rotation shaft 13 is rotated to the original first angular position, thereby removing the torch electrode. 25 is returned to the standby position A. At this time, the photo sensor 37 detects the notch 33 of the light-shielding disk 32 to confirm that the torch electrode 25 has returned to the standby position A. Other operations are similar to those of the conventional device shown in FIG.

【0015】なお、トーチ電極25の通常時の動作は上
述の通りであるが、ステップモータ31に与えるパルス
の数を制御することにより任意の位置に停止させること
が可能であるので、金属細線28をキャピラリツール2
7に挿通する場合などに必要に応じて放電部26を大き
く退避させて作業性を良くすることができる。
The normal operation of the torch electrode 25 is as described above, but it can be stopped at any position by controlling the number of pulses applied to the step motor 31. capillary tool 2
7, the discharge portion 26 can be retracted largely as needed to improve workability.

【0016】さらに、トーチ電極25の放電部26には
白金製の薄板36を貼り付けているので、耐放電寿命が
大幅に向上する。もちろん、薄板36の代わりに白金メ
ッキを施しても良いし、薄板36を白金以外の耐アーク
性を有する金属材料にしたり、あるいは放電部20全体
を耐アーク性の材料で製作しても良い。また、ステップ
モータ31を用いて回動軸13の回動角度位置を制御す
る場合、遮光円板32,フォトセンサ37は不可欠では
ないが、位置検出の後備として設けたものである。なお
、ステップモータ31の代わりに、直流電動機、誘導電
動機あるいは油圧モータ等の回転する回転駆動手段と遮
光円板32,フォトセンサ37とを組み合わせても同様
の効果を奏する。
Furthermore, since a platinum thin plate 36 is attached to the discharge portion 26 of the torch electrode 25, the discharge life is greatly improved. Of course, the thin plate 36 may be plated with platinum, the thin plate 36 may be made of an arc-resistant metal material other than platinum, or the entire discharge section 20 may be made of an arc-resistant material. Further, when controlling the rotation angle position of the rotation shaft 13 using the step motor 31, the light shielding disk 32 and the photosensor 37 are not essential, but are provided as a backup for position detection. Note that, in place of the step motor 31, a similar effect can be obtained by combining a rotating drive means such as a DC motor, an induction motor, or a hydraulic motor with the light-shielding disk 32 and the photosensor 37.

【0017】[0017]

【発明の効果】以上のようにこの発明によれば、トーチ
電極を支持させた回動軸を回転駆動手段により回動させ
るので工程時間を短縮できるとともにボンディングの不
良を防止できるワイヤボンディング方法及び装置を提供
できる。
As described above, according to the present invention, there is provided a wire bonding method and apparatus that can shorten the process time and prevent bonding defects since the rotating shaft supporting the torch electrode is rotated by the rotation drive means. can be provided.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】この発明の一実施例のワイヤボンディング装置
を示す斜視図である。
FIG. 1 is a perspective view showing a wire bonding apparatus according to an embodiment of the present invention.

【図2】従来のワイヤボンディング装置を示す斜視図で
ある。
FIG. 2 is a perspective view showing a conventional wire bonding device.

【図3】従来のワイヤボンディング装置を図2の右方よ
り見て示す側面図である。
FIG. 3 is a side view of a conventional wire bonding apparatus viewed from the right side of FIG. 2;

【符号の説明】[Explanation of symbols]

13  回動軸 25  トーチ電極 26  放電部 27  キャピラリツール 28  金属細線 29  先端部 31  ステップモータ A    待機位置 B    放電位置 ML  移動線 13 Rotation axis 25 Torch electrode 26 Discharge part 27 Capillary tool 28 Thin metal wire 29 Tip 31 Step motor A Standby position B Discharge position ML moving line

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】  所定の移動域を移動しうるようにされ
たキャピラリツールに金属細線を把持して挿通してその
先端部を突出させておき、トーチ電極と上記先端部との
間で放電させて上記先端部を球状に成形して被圧着物に
圧着するワイヤボンディング方法において、次の工程を
備えたことを特徴とするワイヤボンディング方法。 (1)回転する回転駆動手段によって上記トーチ電極を
支持させた回動軸を回動させて上記トーチ電極を上記キ
ャピラリツールの移動域内へ移動させる工程(2)移動
させた上記トーチ電極と上記キャピラリツールとの間で
放電させて上記先端部を球状にする工程(3)上記回転
駆動手段によって上記回動軸を回動させて上記トーチ電
極を上記キャピラリツールの移動域外へ退避させる工程
[Claim 1] A thin metal wire is held and inserted into a capillary tool that is movable in a predetermined movement range so that its tip protrudes, and a discharge is caused between a torch electrode and the tip. A wire bonding method in which the tip is formed into a spherical shape and crimped onto an object to be crimped, the wire bonding method comprising the following steps. (1) A step of moving the torch electrode into the movement range of the capillary tool by rotating a rotating shaft supporting the torch electrode by a rotating rotation drive means (2) The moved torch electrode and the capillary (3) A step of rotating the rotating shaft by the rotary drive means to retract the torch electrode out of the movement range of the capillary tool.
【請求項2】  所定の移動域内を移動しうるようにさ
れ把持手段により把持された金属細線の先端部が挿通さ
れるキャピラリツールと、トーチ電極を支持し回転する
回転駆動手段によって駆動され上記トーチ電極を上記移
動域外の所定の位置と上記移動域内の所定の位置とに停
止させるようにされた回動軸と、上記キャピラリツール
に挿通された上記金属細線の先端部と上記トーチ電極と
の間で放電を発生させる電源装置とを備えたワイヤボン
ディング装置。
2. The torch is driven by a capillary tool which is movable within a predetermined movement range and into which the tip of a thin metal wire held by a gripping means is inserted, and a rotary drive means which supports and rotates the torch electrode. a rotating shaft configured to stop the electrode at a predetermined position outside the movement range and at a predetermined position within the movement range, and between the tip of the thin metal wire inserted into the capillary tool and the torch electrode; A wire bonding device equipped with a power supply device that generates a discharge.
JP3041622A 1991-03-07 1991-03-07 Wire-bonding method and device Pending JPH04279039A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3041622A JPH04279039A (en) 1991-03-07 1991-03-07 Wire-bonding method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3041622A JPH04279039A (en) 1991-03-07 1991-03-07 Wire-bonding method and device

Publications (1)

Publication Number Publication Date
JPH04279039A true JPH04279039A (en) 1992-10-05

Family

ID=12613433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3041622A Pending JPH04279039A (en) 1991-03-07 1991-03-07 Wire-bonding method and device

Country Status (1)

Country Link
JP (1) JPH04279039A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6491203B2 (en) * 1999-11-30 2002-12-10 Kabushiki Kaisha Shinkawa Wire bonding apparatus
US6739493B2 (en) * 2002-07-19 2004-05-25 Esec Trading Sa Device with an electrode for the formation of a ball at the end of a wire
EP2101350A1 (en) * 2008-03-12 2009-09-16 F&K Delvotec Bondtechnik GmbH Method and wire bonder for producing a gold wire bond connection

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6491203B2 (en) * 1999-11-30 2002-12-10 Kabushiki Kaisha Shinkawa Wire bonding apparatus
US6739493B2 (en) * 2002-07-19 2004-05-25 Esec Trading Sa Device with an electrode for the formation of a ball at the end of a wire
CN100419979C (en) * 2002-07-19 2008-09-17 Esec贸易公司 Apparatus for forming wire ball at the wire end with electrode
EP2101350A1 (en) * 2008-03-12 2009-09-16 F&K Delvotec Bondtechnik GmbH Method and wire bonder for producing a gold wire bond connection
DE102008013756B4 (en) * 2008-03-12 2019-08-22 F&K Delvotec Bondtechnik Gmbh Method and wire bonder for making a gold wire bond

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