JPH0427023B2 - - Google Patents
Info
- Publication number
- JPH0427023B2 JPH0427023B2 JP62006389A JP638987A JPH0427023B2 JP H0427023 B2 JPH0427023 B2 JP H0427023B2 JP 62006389 A JP62006389 A JP 62006389A JP 638987 A JP638987 A JP 638987A JP H0427023 B2 JPH0427023 B2 JP H0427023B2
- Authority
- JP
- Japan
- Prior art keywords
- press
- pin
- caulking
- fit
- layer material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 25
- 238000002788 crimping Methods 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62006389A JPS63173623A (ja) | 1987-01-14 | 1987-01-14 | 多層板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62006389A JPS63173623A (ja) | 1987-01-14 | 1987-01-14 | 多層板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63173623A JPS63173623A (ja) | 1988-07-18 |
| JPH0427023B2 true JPH0427023B2 (enEXAMPLES) | 1992-05-08 |
Family
ID=11637018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62006389A Granted JPS63173623A (ja) | 1987-01-14 | 1987-01-14 | 多層板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63173623A (enEXAMPLES) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01241893A (ja) * | 1988-03-24 | 1989-09-26 | Alps Electric Co Ltd | 金属ベース積層板の製造方法 |
| GB0614087D0 (en) | 2006-07-14 | 2006-08-23 | Airbus Uk Ltd | Composite manufacturing method |
| CN105392304B (zh) * | 2015-10-21 | 2017-12-05 | 胜宏科技（惠州）股份有限公司 | 一种线路板压合方法 |
-
1987
- 1987-01-14 JP JP62006389A patent/JPS63173623A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63173623A (ja) | 1988-07-18 |
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