JPH0426202B2 - - Google Patents

Info

Publication number

JPH0426202B2

JPH0426202B2 JP2671584A JP2671584A JPH0426202B2 JP H0426202 B2 JPH0426202 B2 JP H0426202B2 JP 2671584 A JP2671584 A JP 2671584A JP 2671584 A JP2671584 A JP 2671584A JP H0426202 B2 JPH0426202 B2 JP H0426202B2

Authority

JP

Japan

Prior art keywords

ceramic

molded body

holes

ceramic molded

ceramic capacitor

Prior art date

1984-02-15

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000000919 ceramic Substances 0.000 claims description 26
• 239000003985 ceramic capacitor Substances 0.000 claims description 15
• 239000003990 capacitor Substances 0.000 description 6
• 239000002184 metal Substances 0.000 description 5
• ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
• 238000004519 manufacturing process Methods 0.000 description 3
• 238000000034 method Methods 0.000 description 3
• 238000003825 pressing Methods 0.000 description 3
• CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
• GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
• DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
• 239000003989 dielectric material Substances 0.000 description 2
• 239000012212 insulator Substances 0.000 description 2
• ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Chemical compound O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 description 2
• 229910002929 BaSnO3 Inorganic materials 0.000 description 1
• 229910004774 CaSnO3 Inorganic materials 0.000 description 1
• 229910002976 CaZrO3 Inorganic materials 0.000 description 1
• 229910003781 PbTiO3 Inorganic materials 0.000 description 1
• 229910002367 SrTiO Inorganic materials 0.000 description 1
• 239000000654 additive Substances 0.000 description 1
• 229910021523 barium zirconate Inorganic materials 0.000 description 1
• 239000011230 binding agent Substances 0.000 description 1
• 238000001035 drying Methods 0.000 description 1
• 230000000694 effects Effects 0.000 description 1
• 239000002003 electrode paste Substances 0.000 description 1
• 238000001125 extrusion Methods 0.000 description 1
• 238000010304 firing Methods 0.000 description 1
• 238000009413 insulation Methods 0.000 description 1
• JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
• 238000003475 lamination Methods 0.000 description 1
• MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum oxide Inorganic materials [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 description 1
• 239000002075 main ingredient Substances 0.000 description 1
• 239000000463 material Substances 0.000 description 1
• 238000002844 melting Methods 0.000 description 1
• 230000008018 melting Effects 0.000 description 1
• 239000000203 mixture Substances 0.000 description 1
• 238000000465 moulding Methods 0.000 description 1
• KTUFCUMIWABKDW-UHFFFAOYSA-N oxo(oxolanthaniooxy)lanthanum Chemical compound O=[La]O[La]=O KTUFCUMIWABKDW-UHFFFAOYSA-N 0.000 description 1
• 239000004014 plasticizer Substances 0.000 description 1
• 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
• 239000011148 porous material Substances 0.000 description 1
• 238000004886 process control Methods 0.000 description 1
• 239000002994 raw material Substances 0.000 description 1
• 239000004065 semiconductor Substances 0.000 description 1
• 238000005245 sintering Methods 0.000 description 1
• 239000002904 solvent Substances 0.000 description 1