JPH04261718A - Positioning device for substrate - Google Patents

Abstract

PURPOSE:To mount a chip on a substrate correctly by providing a moving means which moves a camera for observing the substrate and the substrate in an XY direction relatively, in order to position this camera and substrate at the upper part of the recognition mark formed on the substrate, based on the signal of a 2nd sensor. CONSTITUTION:A 1st sensor 11 and 2nd sensor 12 detecting the substrate 2 transferred to a conveyor 1 are provided. When this 1st sensor 11 detects the substrate 2, it is stopped with a motor 13 driving the conveyor 1 being stopped. Then the stop position of the substrate 2 is detected by the 2nd sensor 12. Then a camera 5 is moved to the upper part of the substrate 2, based on the detection signal of this 2nd sensor 12, the substrate 2 is observed by this camera 5 and the stop position error in the XY direction of the substrate 2 is detected. Then on the substrate 2 a tip 3 is mounted by a transfer head 7, while correcting the dislocation thereof.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate positioning device, and more particularly to a device for stopping a substrate at a predetermined position, which is conveyed by a conveyor to a chip mounting stage.

0002

2. Description of the Related Art FIG. 2 shows a conventional substrate positioning device. In the figure, 1 is a conveyor, 2 is a substrate, 3 is a chip mounted on the substrate 2 with cream solder 4 in the previous process, 5 is a camera for observing the substrate, 6 is a means for moving the camera 5,
7 is a transfer head for sucking the chip 3 onto a nozzle 8 and mounting it on the substrate 2; 9 is a cylinder; and 10 is its rod. Next, the operation will be explained.

When the substrate 2 is conveyed by the conveyor 1, the rod 10 of the cylinder 9 protrudes onto the conveyor 1 to stop the substrate 2, and a clamp member (not shown) clamps the substrate 2.
to position the substrate 2. Next, the recognition mark formed on the substrate 2 is observed by the camera 5, and a positional shift of the substrate 2 in the XYθ directions is detected. Next, the transfer head 7 mounts the chip 3 on the substrate 2 while moving in the X and Y directions.

0004

In the above-mentioned conventional means, the rod 10 is used as a stopper, and the substrate 2 is positioned on the chip 3 mounting stage by colliding with the rod 10.

However, the conveyance speed of the substrate 2 is quite fast (
For example, 200 millimeters per second), this generates a considerable impact upon collision, and this impact tends to cause the chip 3 mounted on the substrate 2 with the cream solder 4 in the previous process to shift position.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a substrate positioning device that solves the problems of the conventional means as described above.

[0007]

[Means for Solving the Problems] The present invention provides a conveyor,
A motor that drives this conveyor, a first sensor that detects the substrate conveyed by this conveyor and stops driving the motor based on the detection signal, and a second sensor that detects the stop position of the substrate. and a moving means for relatively moving the camera and the substrate in the X and Y directions in order to position the substrate observation camera above the recognition mark formed on the substrate, based on the signal from the second sensor. It constitutes a substrate positioning device.

[0008]

[Operation] In the above structure, when the first sensor detects a substrate being conveyed to the conveyor, the motor stops driving after a certain period of time or after rotating a certain amount. In this state, the second sensor detects the stop position of the substrate. Next, a camera moves relative to the substrate in the XY directions based on the signal from the second sensor, and the camera observes the recognition mark on the substrate to detect a stop position error of the substrate in the XYθ directions. Next, the chip is mounted on the substrate by the transfer head while correcting the positional deviation.

[0009]

Embodiments Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a side view of a substrate positioning device. A belt conveyor 1 conveys the substrate 2 to a chip mounting stage. 3 is a chip, which is mounted on the substrate 2 with cream solder 4 in the previous process. The board 2 has not yet been reflowed and the cream solder 4 is in paste form, so that when the board 2 receives a shock, the chips 3 are likely to be displaced. A first sensor 11 and a second sensor 12 detect characteristic parts such as the front end of the substrate 2.

13 is a motor that drives the conveyor 1; 14 is a motor that drives the conveyor 1;
is the control section. When the first sensor 11 detects the substrate 2 conveyed by the conveyor 1, the drive of the motor 13 is stopped after a predetermined period of time or after the motor 13 has further rotated by a predetermined amount. Further, the second sensor 12 detects the stop position of the substrate 2. The stop position of the board 2 varies, and even if the stop position of the board 2 varies within a certain range, the second sensor 1 is used so that the front end of the board 2 can be detected.
2, a linear sensor having a considerable length in the direction of conveyance of the substrate 2 is adopted.

Reference numeral 6 denotes a moving means consisting of an XY table, on which a substrate observation camera 5 and a transfer head 7 are mounted. 8 is a nozzle that sucks the chip 3.

The camera 5 moves above the substrate 2 and
The recognition mark detected in is detected, and the positional shift of the substrate 2 in the XYθ directions is detected. Further, the transfer head 7 moves in the XY directions and mounts the chip 3 on the substrate 2. XY of board 2
The positional deviation in the direction is corrected by adjusting the movement stroke of the transfer head 7. Also, the positional deviation in the θ direction is
Correction is made by rotating the nozzle 8 by θ.

The present apparatus has the above-mentioned configuration, and its operation will be explained next. When the substrate 2 is conveyed by the conveyor 1, the first sensor 11 detects the substrate 2. Then, based on the detection signal, the motor 13 stops driving after a predetermined period of time or after rotating by a predetermined amount. Next, the substrate 2 is clamped and positioned by a clamp member (not shown), and in this state, the second sensor 12 detects the substrate 2.
The stop position of is detected.

Next, the moving means 6 is driven based on the detection signal of the sensor 12, and the camera 5 is moved above the recognition mark on the substrate 2 (see the chain line in FIG. 1). Next, the camera 5 observes the recognition mark and detects the error in the stop position of the substrate 2 in the XYθ directions. Next, the transfer head 7 picks up the chip, and the chip 3 is mounted on the substrate 2 while correcting the positional deviation of the substrate 2 in the XYθ directions.

[0016] This means stops the board 2 without applying an impact to the board 2, detects the error in the stop position of the board 2 caused by this with the camera 5, and then mounts the chip 3 on the board 2. Since this stopping position error is corrected during the process, the chip 3 mounted on the substrate 2 in the previous step will not be displaced due to the impact when the substrate is stopped, unlike in the conventional means described above.

The above embodiment has been described with reference to a case where the camera 5 and the transfer head 7 are moved in the X and Y directions with respect to the fixed substrate 2. 2 on the XY table, and
While moving the substrate 2 in the X and Y directions using the Y table,
It can also be applied to mounting equipment that observes boards and mounts chips.

[0018]

[Effects of the Invention] As explained above, the present invention detects a conveyor, a motor that drives this conveyor, and a substrate conveyed by this conveyor, and stops driving the motor based on the detection signal. a first sensor, a second sensor that detects the stop position of the board, and a board observation camera that is positioned above the recognition mark formed on the board based on the signal of the second sensor; Since this camera and a moving means for moving the board relatively in the X and Y directions constitute a board positioning device, it is possible to stop the board on the mounting stage without giving any impact to the board, and to correctly mount the chip on the board. Can be done.

[Brief explanation of the drawing]

FIG. 1 is a side view of a substrate positioning device of the present invention.

[Figure 2]
Side view of conventional example

[Explanation of symbols]

1 Conveyor 2 Board 3 Chip 5. Camera 6. Means of transportation 7 Transfer head 11 First sensor 12 Second sensor 13 Motor

Claims (1)

[Claims] 1. A conveyor, a motor for driving the conveyor, a first sensor for detecting a substrate conveyed by the conveyor and stopping driving of the motor based on a detection signal, and a first sensor for stopping the substrate. A second sensor detects the position, and based on the signal from the second sensor, the camera and the board are moved relative to each other in the XY direction in order to position the board observation camera above the recognition mark formed on the board. 1. A substrate positioning device comprising a moving means for moving a substrate in a direction.