JPH0426158A - Solid image pickup element - Google Patents
Solid image pickup elementInfo
- Publication number
- JPH0426158A JPH0426158A JP2131854A JP13185490A JPH0426158A JP H0426158 A JPH0426158 A JP H0426158A JP 2131854 A JP2131854 A JP 2131854A JP 13185490 A JP13185490 A JP 13185490A JP H0426158 A JPH0426158 A JP H0426158A
- Authority
- JP
- Japan
- Prior art keywords
- filter
- resin
- case
- semiconductor chip
- pair
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007787 solid Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 239000000126 substance Substances 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 3
- 239000004840 adhesive resin Substances 0.000 abstract description 16
- 229920006223 adhesive resin Polymers 0.000 abstract description 16
- 238000001444 catalytic combustion detection Methods 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Landscapes
- Optical Filters (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は固体撮像素子に関し、 成に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a solid-state image sensor, Regarding development.
特に組立上の横
従来より固体撮像素子（以後その代表としてＣＣＤと記
す）は（１）染色フィルタを通過した光を半導体チップ
に照射し、（２）その光が染色フィルタの透過率に応じ
て重みづけされ、（３）各画素がそれぞれの光のエネル
ギーを光電変換し、（４）その結果束じた電気エネルギ
ーをＣＲＴ等のモニタ上で絵として再現させるという機
能をもっている。したがってカラーカメラの場合はＣＣ
Ｄチップ表面には染色フィルタを設けることが必須であ
る。In particular, from the perspective of assembly, solid-state imaging devices (hereinafter referred to as CCDs) have (1) irradiated light that has passed through a dyed filter onto a semiconductor chip, and (2) caused the light to change depending on the transmittance of the dyed filter. (3) Each pixel photoelectrically converts the energy of each light, and (4) the resulting bundled electrical energy is reproduced as a picture on a monitor such as a CRT. Therefore, in the case of a color camera, CC
It is essential to provide a dyed filter on the surface of the D chip.
現在ウェーハ状態で直接染色フィルタ（以後フィルタと
記す）を形成するいわゆるオンチップフィルタ方式が実
用化されはじめている。しかし−方ガラス基板に有機染
色層を設けて作成されたフィルタを半導体チップ表面に
接着する接着方式も多用されている。この接着方式は第
３図の平面模式図および第３図のＸ−Ｘ線断面図である
第４図に示すような構造をもつ。すなわち半導体チップ
１とフィルタ２との間にフィルタ接着樹脂（以後接着樹
脂と記す）３を挟み、フィルタ２の両端をケース７にフ
ィルタ固定樹脂（以後固定樹脂と記す）４で固定する方
式である。Currently, a so-called on-chip filter method in which dyed filters (hereinafter referred to as filters) are directly formed in a wafer state is beginning to be put into practical use. However, an adhesion method is also frequently used in which a filter made by providing an organic dye layer on a glass substrate is adhered to the surface of a semiconductor chip. This adhesion system has a structure as shown in FIG. 3, which is a schematic plan view, and FIG. 4, which is a cross-sectional view taken along the line X--X in FIG. In other words, a filter adhesive resin (hereinafter referred to as adhesive resin) 3 is sandwiched between the semiconductor chip 1 and the filter 2, and both ends of the filter 2 are fixed to the case 7 with filter fixing resin (hereinafter referred to as fixed resin) 4. .
上述した従来のＣＣＤにおいては接着樹脂、固定樹脂そ
れぞれが固化する時にｖ３張率や収縮率が異なることや
、固化後の温度変化によって、両者に強い機械的応力が
加わることになる。なぜなら（１，）ＣＣＤの特性を十
分引き出すために接着樹脂と固定樹脂を同一物質としが
たいこと。（２）ＣＣＤの特性を十分引き出すために接
着樹脂は厚さを１０μｍ以上にできないこと。したつが
って一般的に、第４図に示す接着樹脂の厚み（は固定樹
脂の厚みＬより薄くなること。（３）半導体チップやケ
ースの形状や寸法のばらつきにより接着樹脂と固定樹脂
の厚さを正確にコントロールすることが困難であること
による。以上のような理由により固定樹脂と接着樹脂と
の間に膨張量あるいは収縮量で差ができる。In the above-mentioned conventional CCD, strong mechanical stress is applied to both the adhesive resin and the fixed resin due to the difference in v3 elongation and shrinkage rate when solidified, and due to temperature changes after solidification. This is because (1) it is difficult to use the same material for the adhesive resin and the fixing resin in order to fully bring out the characteristics of the CCD. (2) In order to fully bring out the characteristics of the CCD, the thickness of the adhesive resin must not exceed 10 μm. Therefore, in general, the thickness of the adhesive resin (shown in Figure 4) is thinner than the thickness L of the fixing resin. (3) The thickness of the adhesive resin and the fixing resin may vary due to variations in the shape and dimensions of semiconductor chips and cases. This is because it is difficult to accurately control the amount of expansion or contraction between the fixing resin and the adhesive resin for the reasons described above.
今、仮に２つの樹脂が固化した時固定樹脂の収縮量の方
が大きい状態でフィルタが固定されたとしてその状態を
第５図に示す、この状態で温度が上昇すると、固定樹脂
の厚みが接着樹脂より厚いこともあって固定樹脂の膨張
量が大きくなる。更にこの現象が進むと接着樹脂にかか
る応力が大きくなり、ついには図５の円で囲んだＡ部の
拡大図である第６図の矢印の部分のように半導体チップ
端部においてフィルタと接着樹脂との間にはがれが生じ
る。このためその間隙に空気が侵入し、他の領域とは屈
折率が変化する。したがって青空のような−様な面を撮
影しても、モニタ上の一部にシミ状の不良パターンが発
生するという欠点があった。Now, suppose that when the two resins solidify, the fixed resin shrinks more and the filter is fixed.The situation is shown in Figure 5.If the temperature rises in this state, the thickness of the fixed resin will become bonded. Since it is thicker than the resin, the amount of expansion of the fixed resin increases. As this phenomenon progresses further, the stress applied to the adhesive resin increases, and eventually the filter and the adhesive resin are damaged at the edge of the semiconductor chip, as shown by the arrow in Figure 6, which is an enlarged view of the circled area A in Figure 5. Peeling occurs between the two. Therefore, air enters the gap, and the refractive index changes from that of other regions. Therefore, even if a negative-looking surface such as a blue sky is photographed, a defective pattern such as a stain appears on a portion of the monitor.
本発明の固体撮像素子は、ガラス板表面に染色物質ある
いは遮光物質を設けてなるフィルタがその対向する一対
の辺の大部分が半導体チップ上に存在し、他の対の辺が
前記半導体チップ上に存在しないように接着されており
、前記フィルタをケースに固定するフィルタ固定樹脂が
少なくとも前記フィルタの他の対の辺に側部に存在して
いるというものである。In the solid-state imaging device of the present invention, most of the pair of opposing sides of the filter, which is formed by providing a dyed substance or a light-shielding substance on the surface of a glass plate, are on the semiconductor chip, and the other pair of sides are on the semiconductor chip. The filter fixing resin for fixing the filter to the case is present on at least the other pair of sides of the filter.
次に、本発明について図面を参照して説明する。図１は
本発明の第１の実施例の縦断面図である。なお同一物質
については従来例と同一番号をつけた。Next, the present invention will be explained with reference to the drawings. FIG. 1 is a longitudinal sectional view of a first embodiment of the invention. The same substances are given the same numbers as in the conventional example.
長方形のフィルタ２が、対向する一対の長辺の大部分が
半導体チップ１上に存在し、他の対の短辺は半導体チッ
プ上に存在せす、短辺の側部が固定樹脂４によりケース
の側壁に接着されている。A rectangular filter 2 has a pair of opposing long sides mostly on the semiconductor chip 1 and the other pair of short sides on the semiconductor chip. is glued to the side wall of the
従来と異なり固定樹脂４はフィルタ端の側部とケース側
壁との間に充填されていて、フィルタ端のフィルタ下面
とケースの間には存在しない。従って固定樹脂による接
着樹脂３に対するＺ方向へのストレスが軽減される。Unlike the conventional case, the fixed resin 4 is filled between the side of the filter end and the side wall of the case, and is not present between the lower surface of the filter at the end of the filter and the case. Therefore, stress in the Z direction on the adhesive resin 3 due to the fixed resin is reduced.
第２図は本発明の第２の実施例の縦断面図である。FIG. 2 is a longitudinal sectional view of a second embodiment of the invention.
本実施例は従来例と第１の実施例の考え方を発展させた
もので、フィルタ固定樹脂４をフィルタ端部下面および
側部に充填したものである。第１の実施例においては固
定樹脂４．充填樹脂３が固化する時に、ｘ、ｙ方向にず
れる恐れがあるが、第２の実施例は、フィルタ側部に充
填した固定樹脂により接着樹脂に対する２方向へのスト
レスを緩和しかつフィルタ端下面に存在する固定樹脂に
より半導体チップとフィルタのｘ、ｙ方向への位置ずれ
、及びフィルタはがれを防止できる。This embodiment is a development of the concept of the conventional example and the first embodiment, in which the filter fixing resin 4 is filled in the lower surface and side portion of the filter end. In the first embodiment, the fixed resin 4. When the filled resin 3 solidifies, there is a risk that it may shift in the x and y directions. However, in the second embodiment, the fixed resin filled in the sides of the filter relieves the stress in two directions on the adhesive resin, and the lower surface of the filter end The fixing resin present can prevent the semiconductor chip and the filter from shifting in the x and y directions and from peeling off the filter.
フィルタはがれ発生率は、従来例で１．８％（１８／１
０００１、第２の実施例で０．２％（２／１０００）で
あった。The filter peeling rate is 1.8% (18/1) in the conventional example.
0001, and 0.2% (2/1000) in the second example.
以上説明したように本発明は、フィルタ端部をケース側
壁に固定樹脂で接着することにより、樹脂の固化時の収
縮、膨張や固化後の温度変化による収縮、膨張による接
着樹脂（フィルタを半導体チップに接着する）への応力
を緩和し、フィルタの変形やはがれを防止てき、固体撮
像素子の歩留り、品質が改善される効果がある。As explained above, the present invention allows the end portion of the filter to be bonded to the side wall of the case with a fixed resin, thereby making it possible to bond the filter to the side wall of the case using the adhesive resin (filter attached to a semiconductor chip). This has the effect of reducing the stress on the filter (which is adhered to the filter), preventing deformation and peeling of the filter, and improving the yield and quality of solid-state imaging devices.
第１図は本発明の第１の実施例の縦断面図、第２図は本
発明の第２の実施例の縦断面図、第３図は従来例の平面
模式図、第４図は第３図のＸ−Ｘ線断面図、第５図は従
来例で接着樹脂に応力がかかっていることを説明するた
めの断面図、第６図は第５図のＡ部拡大図でフィルタは
がれが生じていることを示す図である。
１・・・半導体チップ、２・・・フィルタ、３・・・接
着樹脂、４・・・固定樹脂、５・・・キャップ、６・・
・シール材、７・・・ケース、８・・・リードビン。
代理人 弁理士 内 原 晋
第２図
第３図
Ｌ−−χ
第４図
第６図FIG. 1 is a vertical cross-sectional view of a first embodiment of the present invention, FIG. 2 is a vertical cross-sectional view of a second embodiment of the present invention, FIG. 3 is a schematic plan view of a conventional example, and FIG. Figure 3 is a cross-sectional view taken along the line X-X, Figure 5 is a cross-sectional view of the conventional example to explain stress being applied to the adhesive resin, and Figure 6 is an enlarged view of part A in Figure 5, showing that the filter has peeled off. It is a diagram showing what is occurring. DESCRIPTION OF SYMBOLS 1...Semiconductor chip, 2...Filter, 3...Adhesive resin, 4...Fixing resin, 5...Cap, 6...
・Sealing material, 7... Case, 8... Lead bin. Agent Patent Attorney Susumu UchiharaFigure 2Figure 3L--χ Figure 4Figure 6
Claims (1)
るフィルタがその対向する一対の辺の大部分が半導体チ
ップ上に存在し、他の対の辺が前記半導体チップ上に存
在しないように接着されており、前記フィルタをケース
に固定するフィルタ固定樹脂が少なくとも前記フィルタ
の他の対の辺の側部に存在していることを特徴とする固
定撮像素子。A filter comprising a dyed substance or a light-shielding substance provided on the surface of a glass plate is bonded so that most of its pair of opposing sides are on the semiconductor chip and the other pairs of sides are not on the semiconductor chip. A fixed image pickup device, wherein a filter fixing resin for fixing the filter to a case is present at least on the sides of the other pair of sides of the filter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2131854A JPH0426158A (en) | 1990-05-22 | 1990-05-22 | Solid image pickup element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2131854A JPH0426158A (en) | 1990-05-22 | 1990-05-22 | Solid image pickup element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426158A true JPH0426158A (en) | 1992-01-29 |
Family
ID=15067677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2131854A Pending JPH0426158A (en) | 1990-05-22 | 1990-05-22 | Solid image pickup element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426158A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017161862A (en) * | 2016-03-11 | 2017-09-14 | 旭化成エレクトロニクス株式会社 | Filter member and optical sensor |
-
1990
- 1990-05-22 JP JP2131854A patent/JPH0426158A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017161862A (en) * | 2016-03-11 | 2017-09-14 | 旭化成エレクトロニクス株式会社 | Filter member and optical sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI394269B (en) | Electronic element wafer module, method for manufacturing an electronic element wafer module, electronic element module, and electronic information device | |
| JP4469781B2 (en) | Solid-state imaging device and manufacturing method thereof | |
| US5079190A (en) | Method of eliminating uneven refractive index in resin of a resin encapsulated photoelectric converting device | |
| TWI467747B (en) | Solid photographic apparatus and method of manufacturing the same | |
| CN102738189A (en) | Solid-state imaging apparatus, method for manufacturing same, and electronic system | |
| JPH04334056A (en) | Solid state image sensing device and its manufacture | |
| JP4528879B2 (en) | Solid-state imaging device and manufacturing method thereof | |
| JP2011187482A (en) | Solid-state imaging apparatus, module for optical device, and method of manufacturing solid-state imaging apparatus | |
| JPS59228755A (en) | Solid state image sensor | |
| JPH0426158A (en) | Solid image pickup element | |
| JPH04343470A (en) | Solid-state image pickup device | |
| JPH03122614A (en) | Production of microlens | |
| JPS60136254A (en) | Solid-state image pickup device and manufacture thereof | |
| JPH01246505A (en) | Solid state image pickup element | |
| JP4521938B2 (en) | Imaging device | |
| JP2001021715A (en) | Color filter and manufacture thereof | |
| JP3108475B2 (en) | Manufacturing method of micro lens | |
| JPH05299625A (en) | Solid-state image sensing element and manufacture thereof | |
| JPH04114456A (en) | Photoelectric converter | |
| JPH05191733A (en) | Solid-state image pickup device | |
| JP3022818B2 (en) | Solid-state imaging device and method of manufacturing the same | |
| JPH02230768A (en) | Solid-state image sensing element | |
| JP2001298172A (en) | Solid-state image pickup device | |
| JP2002100751A (en) | Solid-state image pickup device | |
| JPH04286159A (en) | Solid-state image sensing device |