JPH04259298A - Electronic parts attracting device - Google Patents
Electronic parts attracting deviceInfo
- Publication number
- JPH04259298A JPH04259298A JP3020742A JP2074291A JPH04259298A JP H04259298 A JPH04259298 A JP H04259298A JP 3020742 A JP3020742 A JP 3020742A JP 2074291 A JP2074291 A JP 2074291A JP H04259298 A JPH04259298 A JP H04259298A
- Authority
- JP
- Japan
- Prior art keywords
- taping
- tape
- electronic component
- electronic parts
- tap member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000000630 rising effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、電子部品をプリント基
板に実装する部品挿入装置に用いる電子部品吸着装置に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component suction device used in a component insertion device for mounting electronic components on a printed circuit board.
【0002】0002
【従来の技術】最近、電子部品のチップ化が進むととも
に、種々の形状,寸法の部品が存在し、寸法が1ミリ程
度しかない小型部品も、吸着により、プリント基板に実
装することが必要となってきた。[Background Art] Recently, as electronic components have become more and more chip-based, components of various shapes and sizes have come into existence, and even small components with dimensions of only about 1 mm need to be mounted on printed circuit boards by suction. It has become.
【0003】以下に図面を参照しながら、従来の技術を
説明する。図2に従来の電子部品吸着装置の構成を示す
。図に示すように電子部品1はノズル2により吸着され
る。電子部品1はテーピング3により支持され、テーピ
ング3はパーツカセット4より供給される。パーツカセ
ット4には弾性部材6で押圧されたテープ押え部材が設
けられていて、テーピング3に支持された電子部品1は
トップテープ7で覆われていて、部品1がノズル2に吸
着される直前にトップテープ7は、巻取りリール8によ
り巻取られる。つぎに以上のように構成された電子部品
吸着装置の動作を説明する。まず、トップテープ7が、
巻取りリール8によって巻取られたのちテーピング3に
支持された電子部品1は、パーツカセット4の本体に支
持され弾性部材6によって押圧されたテープ押え部材5
の下面で、立ち上がりを規制されながら吸着位置まで移
動されていき、最後に、上方より下降する吸着ノズル2
によって吸い上げられる。一般的に支持する電子部品の
大きさによって、テーピングの厚みは種々異なっている
。従って従来では、これらの大きさの異なった部品に対
応するために、テープ押え部材の取付高さをそれぞれ変
える必要があった。[0003] The conventional technology will be explained below with reference to the drawings. FIG. 2 shows the configuration of a conventional electronic component suction device. As shown in the figure, the electronic component 1 is attracted by the nozzle 2. The electronic component 1 is supported by taping 3, and the taping 3 is supplied from a parts cassette 4. The parts cassette 4 is provided with a tape pressing member pressed by an elastic member 6, and the electronic component 1 supported by the taping 3 is covered with a top tape 7, and the electronic component 1 is covered with a top tape 7 immediately before the component 1 is sucked into the nozzle 2. The top tape 7 is then wound up by a take-up reel 8. Next, the operation of the electronic component suction device configured as above will be explained. First, top tape 7 is
The electronic component 1 supported by the taping 3 after being wound up by the take-up reel 8 is supported by the main body of the parts cassette 4 and pressed by the tape pressing member 5 by the elastic member 6.
The suction nozzle 2 is moved to the suction position while its rise is restricted from the bottom surface, and finally the suction nozzle 2 descends from above.
sucked up by Generally, the thickness of the taping varies depending on the size of the electronic component to be supported. Therefore, in the past, it was necessary to change the mounting height of the tape holding member to accommodate these different sized parts.
【0004】0004
【発明が解決しようとする課題】しかし、このような従
来の構成では、大きさの異なる電子部品1を支持するた
めにテーピング3の厚みが異なり、このテーピング3に
対応するために取付高さの異なるテープ押え部材5を何
種類も用意する必要があった。また、テープ押え部材5
の加工精度によって、テープ押え部材5と、テーピング
3の上面との間にすきまが発生し、このすき間のために
、電子部品が振動によって立ち上がる可能性が大きく、
従って、常に安定して、電子部品を供給することが困難
であるという問題点を有していた。[Problems to be Solved by the Invention] However, in such a conventional configuration, the thickness of the taping 3 is different in order to support electronic components 1 of different sizes, and the mounting height has to be adjusted to accommodate the taping 3. It was necessary to prepare many types of different tape pressing members 5. In addition, the tape pressing member 5
Due to the machining accuracy, a gap is generated between the tape holding member 5 and the top surface of the taping 3, and this gap has a high possibility that the electronic components will stand up due to vibration.
Therefore, there has been a problem in that it is difficult to constantly and stably supply electronic components.
【0005】本発明は、このような課題を解決するもの
で、テーピングの厚さが変わっても、また、テープ押え
部材の平面度が出ていなくても、テープ押え部材を用い
て安定して電子部品を供給することができる電子部品吸
着装置を提供することを目的とするものである。The present invention solves these problems, and even if the thickness of the taping changes or even if the tape pressing member is not flat, the tape pressing member can be used stably. It is an object of the present invention to provide an electronic component suction device capable of supplying electronic components.
【0006】[0006]
【課題を解決するための手段】この課題を解決するため
に本発明の電子部品吸着装置は、電子部品を吸着するノ
ズルと、前記電子部品を収納するテーピングと、前記テ
ーピングを吸着位置へ供給するパーツカセットと、前記
パーツカセット内に設けられ、前記テーピングに略水平
に当接するテープ押え部材と、上下に移動可能な長孔と
を前記テーピングの厚さに対応して前記押え部材が上下
に移動するようにしたものである。[Means for Solving the Problem] In order to solve this problem, an electronic component suction device of the present invention includes a nozzle for suctioning an electronic component, a taping for storing the electronic component, and supplying the taping to a suction position. A parts cassette, a tape holding member provided in the parts cassette and in contact with the taping substantially horizontally, and a vertically movable elongated hole, the holding member moving up and down in accordance with the thickness of the taping. It was designed to do so.
【0007】[0007]
【作用】この構成により、電子部品をテーピングから吸
着する際、厚さの異なるテーピングの上面を少なくとも
1つのテープ押え部材を密着して押圧することにより、
厚さの異なるテーピングのテーピング内に収納された、
電子部品とテープ押え部材との間に生じるクリアランス
を一定にすることが可能となり、その結果、電子部品を
安定して供給することができることとなる。[Operation] With this configuration, when picking up electronic components from taping, at least one tape pressing member is pressed tightly against the top surface of taping of different thickness.
Housed within taping of different thicknesses,
It becomes possible to keep the clearance generated between the electronic component and the tape pressing member constant, and as a result, the electronic component can be stably supplied.
【0008】[0008]
【実施例】以下に本発明の一実施例の電子部品吸着装置
の構成を図1に示す。図1において、図2の従来の構成
と同一部分については同一番号を付して説明を省略する
。図1に示すように、テープ押え部材5は、弾性部材6
により、常に矢印A方向に付勢され、テーピング3の上
面に当接している。9は、テープ押え部材5の回動支点
11は長孔9により支持されていて、この長孔9の中を
回動支点11が上下に移動することにより、テーピング
との当接面10は、テーピング3の厚みに応じてBまた
はC方向に略垂直に移動することができる。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows the structure of an electronic component suction device according to an embodiment of the present invention. In FIG. 1, parts that are the same as those in the conventional configuration shown in FIG. 2 are given the same reference numerals, and description thereof will be omitted. As shown in FIG. 1, the tape pressing member 5 includes an elastic member 6
Therefore, it is always urged in the direction of arrow A and is in contact with the upper surface of the taping 3. 9, a pivot point 11 of the tape pressing member 5 is supported by an elongated hole 9, and as the pivot point 11 moves up and down in the elongated hole 9, the contact surface 10 with the taping is Depending on the thickness of the taping 3, it can move approximately perpendicularly to the B or C direction.
【0009】以上のように本実施例によれば、電子部品
1を供給する際、テープ押え部材5の回動支点を支持す
るように設けられた長孔9の中を回動支点11が移動し
、テープ押え部材5が上下に移動可能になる。この構成
により、トップテープ7を剥離したテーピング3の上面
をテープ押え部材5で規制し、テーピング3に収納され
た、電子部品の立ち上がりや、とび出しをなくし、また
、弾性部材6によって、テーピング3自体の浮き上がり
もなくすことができ、その結果として安定して電子部品
1を供給することができる。As described above, according to this embodiment, when the electronic component 1 is fed, the rotation fulcrum 11 moves in the elongated hole 9 provided to support the rotation fulcrum of the tape holding member 5. Then, the tape pressing member 5 becomes movable up and down. With this configuration, the upper surface of the taping 3 from which the top tape 7 has been peeled off is restricted by the tape pressing member 5, thereby preventing the electronic components stored in the taping 3 from standing up or protruding. It is also possible to eliminate lifting of the electronic component 1, and as a result, the electronic component 1 can be stably supplied.
【0010】0010
【発明の結果】以上の実施例の説明からも明らかなよう
に本発明によれば、電子部品を収納したテーピングをパ
ーツカセットで供給する際に、テーピングの厚みに対応
してテープ押え部材が移動可能となるように、長孔が設
けられているため、テーピング厚みの違いによってテー
プ押え部材を変える必要がない。また、テープ押え部材
のテーピング当接部の平面度などの精度が出ていなくて
も、テーピング上面に密着したまま安定して、テーピン
グ上面を押圧することができるという著しい効果が得ら
れる。[Results of the Invention] As is clear from the above description of the embodiments, according to the present invention, when a tape containing electronic components is supplied using a parts cassette, the tape pressing member moves in accordance with the thickness of the taping. Since the elongated hole is provided to make this possible, there is no need to change the tape pressing member depending on the difference in taping thickness. Further, even if the flatness of the taping contact portion of the tape pressing member is not accurate, a remarkable effect can be obtained in that the tape pressing member can stably press the taping top surface while remaining in close contact with the taping top surface.
【図1】本発明の一実施例の電子部品吸着装置の構成図
FIG. 1 is a configuration diagram of an electronic component suction device according to an embodiment of the present invention.
【図2】従来の電子部品吸着装置の構成図[Figure 2] Configuration diagram of a conventional electronic component suction device
1 電子部品 2 ノズル 3 テーピング 4 パーツカセット 5 テープ押え部材 9 長孔 11 回動支点 1 Electronic parts 2 Nozzle 3 Taping 4 Parts cassette 5 Tape holding member 9 Long hole 11 Rotation fulcrum
Claims (1)
品を収納するテーピングと、前記テーピングを吸着位置
へ供給するパーツカセットと、前記パーツカセット内に
設けられ、前記テーピングに略水平に当接するテープ押
え部材と、上下に移動可能な長孔とを備え前記テーピン
グの厚さに対応して前記押え部材が上下に移動する電子
部品吸着装置。1. A nozzle for suctioning an electronic component, a taping for storing the electronic component, a parts cassette for supplying the taping to a suction position, and a nozzle provided in the parts cassette and abutting the taping substantially horizontally. An electronic component suction device comprising a tape holding member and a vertically movable elongated hole, wherein the holding member moves up and down in accordance with the thickness of the taping.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3020742A JPH04259298A (en) | 1991-02-14 | 1991-02-14 | Electronic parts attracting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3020742A JPH04259298A (en) | 1991-02-14 | 1991-02-14 | Electronic parts attracting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04259298A true JPH04259298A (en) | 1992-09-14 |
Family
ID=12035651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3020742A Pending JPH04259298A (en) | 1991-02-14 | 1991-02-14 | Electronic parts attracting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04259298A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112153888A (en) * | 2016-06-15 | 2020-12-29 | 万润科技股份有限公司 | Element bonding method and device for bonding process |
-
1991
- 1991-02-14 JP JP3020742A patent/JPH04259298A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112153888A (en) * | 2016-06-15 | 2020-12-29 | 万润科技股份有限公司 | Element bonding method and device for bonding process |
CN112153888B (en) * | 2016-06-15 | 2022-03-22 | 万润科技股份有限公司 | Element bonding method and device for bonding process |
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