JPH04259234A - Method for measuring semiconductor device - Google Patents
Method for measuring semiconductor deviceInfo
- Publication number
- JPH04259234A JPH04259234A JP2061091A JP2061091A JPH04259234A JP H04259234 A JPH04259234 A JP H04259234A JP 2061091 A JP2061091 A JP 2061091A JP 2061091 A JP2061091 A JP 2061091A JP H04259234 A JPH04259234 A JP H04259234A
- Authority
- JP
- Japan
- Prior art keywords
- base
- emitter
- collector
- measurement
- measuring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 10
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 238000005259 measurement Methods 0.000 claims abstract description 42
- 239000000523 sample Substances 0.000 claims abstract description 12
- 230000015556 catabolic process Effects 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 2
- 238000012545 processing Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012937 correction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は半導体装置の製造方法に
係り,特にバイポーラデバイスの製造におけるモニタ素
子の測定方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device, and more particularly to a method of measuring a monitor element in the manufacture of bipolar devices.
【0002】近年の半導体デバイスの性能向上のために
プロセスの再現性が要求される。しかし現状ではプロセ
スのゆらぎ等によるウエハ間の素子特性のバラツキは十
分な余裕を確保しておらず,そのためすべてのウエハに
設けられたモニタ素子をすべて自動測定して評価するよ
う要求されている。Process reproducibility is required to improve the performance of recent semiconductor devices. However, at present, there is not enough margin for variations in device characteristics between wafers due to process fluctuations, etc., and therefore there is a demand for automatic measurement and evaluation of all monitor elements provided on all wafers.
【0003】バイポーラデバイスも同様にすべてのウエ
ハにモニタ素子が設けられているが,ベース開放のコレ
クタ/エミッタ間耐圧 VCEO の測定が,ベースに
接続された測定系の容量やリーク電流等により正確に行
うことができなかった。Bipolar devices are similarly provided with monitor elements on all wafers, but the measurement of the collector/emitter breakdown voltage (VCEO) with an open base is not accurate due to the capacitance and leakage current of the measurement system connected to the base. I couldn't do it.
【0004】本発明はベース開放のコレクタ/エミッタ
間耐圧 VCEO の正確な値を安定して測定できる方
法として利用できる。The present invention can be used as a method for stably measuring the accurate value of the collector-emitter breakdown voltage VCEO with an open base.
【0005】[0005]
【従来の技術】バイポーラトランジスタのベース開放の
コレクタ/エミッタ間耐圧 VCEO はコレクタ/エ
ミッタ間耐圧の一番厳しい条件としてトランジスタの最
大定格として規定されている。2. Description of the Related Art The collector-emitter breakdown voltage VCEO of a bipolar transistor with an open base is defined as the maximum rating of the transistor as the most severe condition for the collector-emitter breakdown voltage.
【0006】周知のように, ベース/エミッタ間抵抗
RBEを0から∞まで変化させるとコレクタ/エミッ
タ間耐圧 VCER は漸次低下し RBE=∞ で
最小となる。このときの値が VCEO となる。As is well known, when the base-emitter resistance RBE is changed from 0 to ∞, the collector-emitter breakdown voltage VCER gradually decreases and reaches a minimum when RBE=∞. The value at this time becomes VCEO.
【0007】従来の VCEO の測定はモニタ素子の
エミッタ, ベース, コレクタの3端子にプローブを
立て,測定器の中でベース/エミッタ間の接続を断にし
て測定していた。[0007] Conventionally, VCEO was measured by placing probes on the emitter, base, and collector terminals of the monitor element, and disconnecting the base/emitter in the measuring instrument.
【0008】この場合,前記のようにベースに接続され
た測定系の容量やリーク電流等により正確な値が得られ
ないため,自動測定をあきらめ手動測定により測定系の
ベース配線を取り外して正確に測定していた。In this case, as mentioned above, accurate values cannot be obtained due to the capacitance, leakage current, etc. of the measurement system connected to the base, so give up on automatic measurement and perform manual measurement by removing the base wiring of the measurement system. was measuring.
【0009】[0009]
【発明が解決しようとする課題】従来例ではモニタ素子
の自動測定ができず,マニュアル測定による工数の増加
や,データを測定してもその他の自動測定のデータと同
様に取り扱うためにはデータの加工が必要となるという
問題が生じていた。[Problems to be Solved by the Invention] In the conventional example, automatic measurement of monitor elements is not possible, and manual measurement increases man-hours. A problem has arisen in that processing is required.
【0010】ここで,マニュアル測定によるデータをそ
の他の自動測定のデータと同様に取り扱うために行うデ
ータの加工とは,自動測定により得たデータをコンピュ
ータで統計処理(平均値,標準偏差,推移,相関等)や
グラフ表示する場合, VCEO はマニュアル測定デ
ータを基に,コンピュータに修正入力しなければならな
いことを言う。[0010] Here, the data processing performed in order to treat data obtained by manual measurement in the same manner as other data obtained by automatic measurement refers to statistical processing (average value, standard deviation, trend, When displaying graphs (correlation, etc.), VCEO means that corrections must be input into the computer based on manually measured data.
【0011】本発明はベース開放のコレクタ/エミッタ
間耐圧 VCEO を自動測定でき,かつ安定して正確
に測定できる方法の提供を目的とする。The object of the present invention is to provide a method that can automatically measure the collector-emitter breakdown voltage VCEO with an open base, and can do so stably and accurately.
【0012】0012
【課題を解決するための手段】上記課題の解決は,1)
半導体基板表面に形成され,コレクタ電極に接続するコ
レクタ測定端子とエミッタ電極に接続するエミッタ測定
端子を有し,ベース電極に接続するベース測定端子を有
しないバイポーラトランジスタからなるモニタ素子を用
い, 該コレクタ測定端子と該エミッタ測定端子を測
定器に接続してベース開放のコレクタ/エミッタ間耐圧
VCEO を測定する工程を有することを特徴とする
半導体装置の測定方法,あるいは2)特性測定用モニタ
素子の測定に用いたコレクタプローブ,ベースプローブ
,エミッタプローブを用い,これらのプローブのうちコ
レクタプローブとエミッタプローブをそれぞれ前記コレ
クタ測定端子と前記エミッタ測定端子に接触させてVC
EO を測定する前記1)記載の半導体装置の測定方法
により達成される。[Means for solving the problem] The solution to the above problem is 1)
Using a monitor element formed on the surface of a semiconductor substrate and consisting of a bipolar transistor that has a collector measurement terminal connected to a collector electrode and an emitter measurement terminal connected to an emitter electrode, but does not have a base measurement terminal connected to a base electrode, the collector A method for measuring a semiconductor device, comprising the step of connecting a measuring terminal and the emitter measuring terminal to a measuring instrument and measuring the collector/emitter withstand voltage VCEO with an open base, or 2) measuring a monitor element for measuring characteristics. Using the collector probe, base probe, and emitter probe used in
This is achieved by the method for measuring a semiconductor device described in 1) above, which measures EO.
【0013】[0013]
【作用】本発明はベース開放のコレクタ/エミッタ間耐
圧 VCEO を測定する専用のモニタ素子のベースに
測定系が接続されないため,測定系の容量やリーク電流
等による影響を除去して,正確に自動測定できるように
したものである。[Operation] Since the measurement system of the present invention is not connected to the base of the monitor element dedicated to measuring the collector-emitter withstand voltage (VCEO) with the base open, the effects of the capacitance and leakage current of the measurement system are removed, allowing accurate automatic measurement. It is designed to be measurable.
【0014】[0014]
【実施例】図1は本発明の一実施例を説明する平面図で
ある。図において,(1) は VCEO 測定専用の
モニタトランジスタであり,ベースに測定系に接続する
配線を行わないようにしている。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a plan view illustrating an embodiment of the present invention. In the figure, (1) is a monitor transistor dedicated to VCEO measurement, and the base is not wired to connect to the measurement system.
【0015】(2) は通常の特性測定用の従来のモニ
タトランジスタで,ベースに測定系に接続する配線を行
っている。図中の符号は以下のものを表し,符号中の数
字 1,2 は上記モニタトランジスタの(1),(2
)に対応する。[0015] (2) is a conventional monitor transistor for normal characteristic measurement, and the base is wired to connect to the measurement system. The symbols in the figure represent the following, and the numbers 1 and 2 in the symbols are (1) and (2) of the monitor transistors mentioned above.
) corresponds to
【0016】C1, C2はコレクタ電極, E1,
E2はエミッタ電極, B1, B2はベース電極,
C1P, C2Pはコレクタの測定用パッド, EPは
共通のエミッタの測定用パッド, B2P はベースの
測定用パッドである。C1, C2 are collector electrodes, E1,
E2 is the emitter electrode, B1 and B2 are the base electrodes,
C1P and C2P are collector measurement pads, EP is a common emitter measurement pad, and B2P is a base measurement pad.
【0017】VCEO 測定専用のモニタトランジスタ
(1) を従来のモニタトランジスタ(2) とともに
ウエハ上の適宜な位置に形成しておけば,自動測定装置
の従来のモニタトランジスタの測定に用いるプローブを
そのまま利用して VCEO を正確に安定して測定で
きる。If a monitor transistor (1) dedicated to VCEO measurement is formed at an appropriate position on the wafer together with a conventional monitor transistor (2), the probe used for measuring the conventional monitor transistor of an automatic measuring device can be used as is. VCEO can be measured accurately and stably.
【0018】実施例の効果を見るために或る製造ロット
を測定したところ,従来例ではVCEO =0〜25
V とばらついていたのが, 実施例によれぱ VC
EO = 5〜8 V の範囲内に入っていた。このこ
とはは,従来例では見掛けの値を測定していたことを示
している。When measuring a certain manufacturing lot to see the effect of the embodiment, it was found that in the conventional example, VCEO = 0 to 25
According to the example, the variation with VC was
EO was within the range of 5 to 8 V. This indicates that in the conventional example, an apparent value was measured.
【0019】[0019]
【発明の効果】ベース開放のコレクタ/エミッタ間耐圧
VCEO を安定して正確に自動測定できるようにな
った。[Effects of the Invention] It has become possible to stably and accurately automatically measure the collector/emitter breakdown voltage VCEO with an open base.
【0020】この結果, 従来の手動測定とそのデータ
加工を省略でき工数の節減に寄与することができた。As a result, the conventional manual measurement and data processing thereof can be omitted, contributing to a reduction in man-hours.
【図1】 本発明の一実施例を説明する平面図[Fig. 1] Plan view explaining one embodiment of the present invention
C1, C2 コレクタ電極 E1, E2 エミッタ電極 B1, B2 ベース電極 C1, C2 Collector electrode E1, E2 Emitter electrode B1, B2 Base electrode
Claims (2)
電極に接続するコレクタ測定端子とエミッタ電極に接続
するエミッタ測定端子を有し,ベース電極に接続するベ
ース測定端子を有しないバイポーラトランジスタからな
るモニタ素子を用い, 該コレクタ測定端子と該エミ
ッタ測定端子を測定器に接続してベース開放のコレクタ
/エミッタ間耐圧 VCEO を測定する工程を有する
ことを特徴とする半導体装置の測定方法。[Claim 1] A monitor element formed on the surface of a semiconductor substrate and consisting of a bipolar transistor that has a collector measurement terminal connected to a collector electrode and an emitter measurement terminal connected to an emitter electrode, but does not have a base measurement terminal connected to a base electrode. 1. A method for measuring a semiconductor device, comprising the step of: connecting the collector measurement terminal and the emitter measurement terminal to a measuring device to measure a collector-emitter breakdown voltage VCEO with an open base.
コレクタプローブ,ベースプローブ,エミッタプローブ
を用い,これらのプローブのうちコレクタプローブとエ
ミッタプローブをそれぞれ前記コレクタ測定端子と前記
エミッタ測定端子に接触させて VCEO を測定する
ことを特徴とする請求項1記載の半導体装置の測定方法
。2. Using a collector probe, a base probe, and an emitter probe used for measuring the monitor element for characteristic measurement, the collector probe and the emitter probe of these probes are brought into contact with the collector measurement terminal and the emitter measurement terminal, respectively. 2. The method for measuring a semiconductor device according to claim 1, wherein VCEO is measured using the following steps.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2061091A JPH04259234A (en) | 1991-02-14 | 1991-02-14 | Method for measuring semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2061091A JPH04259234A (en) | 1991-02-14 | 1991-02-14 | Method for measuring semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04259234A true JPH04259234A (en) | 1992-09-14 |
Family
ID=12032035
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2061091A Pending JPH04259234A (en) | 1991-02-14 | 1991-02-14 | Method for measuring semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04259234A (en) |
-
1991
- 1991-02-14 JP JP2061091A patent/JPH04259234A/en active Pending
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