JPH04254396A - Manufacture of high density mounted board - Google Patents
Manufacture of high density mounted boardInfo
- Publication number
- JPH04254396A JPH04254396A JP974091A JP974091A JPH04254396A JP H04254396 A JPH04254396 A JP H04254396A JP 974091 A JP974091 A JP 974091A JP 974091 A JP974091 A JP 974091A JP H04254396 A JPH04254396 A JP H04254396A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- pattern
- printed
- connection
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 229910000679 solder Inorganic materials 0.000 claims abstract description 75
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- 230000008018 melting Effects 0.000 claims abstract description 4
- 238000002844 melting Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 238000007639 printing Methods 0.000 abstract description 7
- 238000005476 soldering Methods 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 150000002736 metal compounds Chemical class 0.000 abstract 2
- 238000010276 construction Methods 0.000 abstract 1
- 238000007650 screen-printing Methods 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は、情報機器分野における
各種高密度実装基板特に、半導体および電気部品の接続
にハンダ印刷方法を用いた高密度実装基板の製造方法。FIELD OF INDUSTRIAL APPLICATION The present invention relates to various high-density mounting boards in the field of information equipment, particularly a method for manufacturing high-density mounting boards using a solder printing method for connecting semiconductors and electrical components.
【0002】0002
【従来の技術】プリント配線基板に数多くの各種半導体
および電気部品を実装した高密度実装基板が民生用また
は産業用分野を問わず用いられている。具体例としては
、ビデオムービ,携帯電話,パソコンなどがある。テレ
ビジョン受像機においても、従来の映像・音響回路に付
加機能として、文字放送,衛生放送の受信回路ブロック
を内蔵したダイプが商品化されている。このため、テレ
ビジョン受像機も4〜6層のガラス・エポキシ多層基板
を使用し、電解コンデンサや、チップ抵抗などの各種表
面実装部品を自動実装している。2. Description of the Related Art High-density mounting boards, in which a large number of various semiconductors and electrical components are mounted on printed wiring boards, are used in both consumer and industrial fields. Specific examples include video movies, mobile phones, and personal computers. For television receivers as well, TV receivers have been commercialized that have built-in receiving circuit blocks for text broadcasting and satellite broadcasting as additional functions in addition to conventional video/audio circuits. For this reason, television receivers also use glass/epoxy multilayer boards with four to six layers, and various surface-mounted components such as electrolytic capacitors and chip resistors are automatically mounted on them.
【0003】また、0.8〜0.5mmピッチのQFP
タイプ半導体と1〜2mmピッチのSOタイプ半導体も
同時に実装している。[0003] Also, QFP with a pitch of 0.8 to 0.5 mm
type semiconductors and SO type semiconductors with a pitch of 1 to 2 mm are also mounted at the same time.
【0004】以下に図面を参照しながら、本発明の一実
施例である高密度実装基板の製造方法を説明する。ここ
では、QFPタイプの半導体を片面のプリント配線基板
上に接続する製造方法について説明する。図4は、従来
のプリント配線基板上の半導体接続パターンに、図3の
ハンダ版を用いてハンダペーストパターンをスクリーン
印刷した基板の一例を示す。図4に示すように、プリン
ト配線基板15上に半導体接続パターン16と、ハンダ
ペーストパターン17が形成されている。プリント配線
基板15はガラス・エポキシ基板やセラミック基板など
の片面または両面基板でもよく、さらに、4〜6層の多
層基板が用途によって使用される。半導体接続パターン
16は、プリント配線基板1上に積層した銅箔をエッチ
ング法によって形成してあり、実装する半導体部品の足
の寸法に対応している。図4に示すように、スクリーン
印刷したハンダペーストパターン17の寸法は、一般に
半導体接続パターン16より小さくてもよい。しかも、
図4に示すように、半導体接続パターン16とハンダペ
ーストパターン17がそれぞれ分離しており、精度よく
印刷することが必要である。ハンダペーストパターン1
7は、Sn/Pbの共晶ハンダからなる材料を用いてい
る。A method of manufacturing a high-density mounting board, which is an embodiment of the present invention, will be described below with reference to the drawings. Here, a manufacturing method for connecting a QFP type semiconductor onto a single-sided printed wiring board will be described. FIG. 4 shows an example of a board in which a solder paste pattern is screen printed on a semiconductor connection pattern on a conventional printed wiring board using the solder plate shown in FIG. As shown in FIG. 4, a semiconductor connection pattern 16 and a solder paste pattern 17 are formed on a printed wiring board 15. The printed wiring board 15 may be a single-sided or double-sided board such as a glass epoxy board or a ceramic board, and a multilayer board with 4 to 6 layers may be used depending on the purpose. The semiconductor connection pattern 16 is formed by etching copper foil laminated on the printed wiring board 1, and corresponds to the dimensions of the legs of the semiconductor component to be mounted. As shown in FIG. 4, the dimensions of screen printed solder paste pattern 17 may generally be smaller than semiconductor connection pattern 16. Moreover,
As shown in FIG. 4, the semiconductor connection pattern 16 and the solder paste pattern 17 are separated from each other, and it is necessary to print them with high precision. Solder paste pattern 1
No. 7 uses a material made of Sn/Pb eutectic solder.
【0005】一方、図3にハンダペーストパターン17
のスクリーン印刷に使用するスクリーン版11の構成を
示す。版枠12の内側にステンレスの薄版を張着してな
るメタル13に、エッチング法により図4に示すハンダ
ペーストパターン17材料をスクリーン印刷時に通過さ
せるための複数の孔14が設けられている。スクリーン
印刷機にスクリーン版11とプリント配線基板15を精
度よく位置合わせて固定し、所定の印刷条件でハンダペ
ーストを印刷してハンダペーストパターン17を形成さ
せる。On the other hand, FIG. 3 shows a solder paste pattern 17.
The structure of the screen plate 11 used for screen printing is shown. A plurality of holes 14 are provided in a metal 13 formed by pasting a thin stainless steel plate on the inside of a plate frame 12 by an etching method through which a material for a solder paste pattern 17 shown in FIG. 4 passes during screen printing. A screen plate 11 and a printed wiring board 15 are accurately aligned and fixed to a screen printing machine, and solder paste is printed under predetermined printing conditions to form a solder paste pattern 17.
【0006】[0006]
【発明が解決しようとする課題】しかしながら、上記の
ような構成でスクリーン印刷する製造方法では、プリン
ト配線基板15上に実装する各種の半導体の接続パター
ンのピッチのファイン化に対して、ハンダ印刷がそれに
対応できなくなってきている。さらに、現状の半導体接
続パターン7の接続ピッチ0.8〜0.65mmでも、
ハンダペーストパターン7の印刷不良が多発している。
このようなプリント配線基板15に半導体を実装して、
リフロー法などで加熱接合すると、ハンダボールやハン
ダブリッジなどの不良が発生して接続不良になるという
問題点を有していた。一方、設備面では自動認識付きの
高精度スクリーン印刷機が必要となり、設備投資費用が
高く、生産性も悪かった。[Problems to be Solved by the Invention] However, in the manufacturing method of screen printing with the above-described configuration, solder printing is difficult to achieve in order to fine the pitch of the connection patterns of various semiconductors mounted on the printed wiring board 15. It is becoming impossible to cope with it. Furthermore, even with the connection pitch of the current semiconductor connection pattern 7 of 0.8 to 0.65 mm,
Printing defects of solder paste pattern 7 occur frequently. A semiconductor is mounted on such a printed wiring board 15,
When heat bonding is performed using a reflow method or the like, defects such as solder balls and solder bridges occur, resulting in poor connection. On the other hand, in terms of equipment, a high-precision screen printing machine with automatic recognition was required, resulting in high equipment investment costs and poor productivity.
【0007】本発明は、このような問題を解決するもの
で、ハンダ接続の信頼性と生産性を改善した精度の高い
ハンダ印刷方法を用いた高密度実装基板の製造方法を提
供することを目的とするものである。[0007] The present invention solves these problems, and aims to provide a method for manufacturing high-density mounting boards using a highly accurate solder printing method that improves the reliability and productivity of solder connections. That is.
【0008】[0008]
【課題を解決するための手段】上記課題を解決するため
に、本発明の高密度実装基板の製造方法は、各種の半導
体および電気部品を接続する接続パターン上に、各接続
パターン全体を覆うようにハンダペーストを印刷し、そ
の後、ハンダの融点以上に加熱してハンダを溶融し、接
続パターンに選択的にハンダパターンを形成するもので
ある。また、ハンダ材料として、有機ハンダまたは低温
ハンダを使用したものである。[Means for Solving the Problems] In order to solve the above-mentioned problems, the method for manufacturing a high-density mounting board of the present invention provides a method for manufacturing a high-density mounting board of the present invention. A solder paste is printed on the solder, and then the solder is heated above the melting point of the solder to melt the solder and selectively form a solder pattern on the connection pattern. Furthermore, organic solder or low-temperature solder is used as the solder material.
【0009】[0009]
【作用】本発明は、上記の高密度実装基板のハンダ印刷
方法によって、前記の各種半導体および電気部品とプリ
ント配線基板上の接続パターンとを確実に信頼性高く、
また、生産性よく接続することができる。このため、高
品質で映像情報機器の各種高密度実装基板からなる回路
を駆動させることができる。[Operation] The present invention uses the above-described high-density mounting board solder printing method to reliably and reliably connect the various semiconductors and electrical components to the connection patterns on the printed wiring board.
In addition, it is possible to connect with high productivity. Therefore, circuits made of various high-density mounting boards of video information equipment can be driven with high quality.
【0010】0010
【実施例】以下に本発明の一実施例の高密度実装基板の
製造方法を図面を参照しながら説明する。図1,図2に
本発明の一実施例の高密度実装基板の製造方法の構成を
示す。図1に示すように、ハンダ版枠1に張着されてい
るステンレス薄板2に、QFPタイプの半導体に対応す
る4つの長方形の孔3が設けられている。この孔3は、
エッチング法またはレーザ加工法によってステンレス薄
板2が加工される。このステンレス薄板2の厚みは、0
.2mm以下のものが望ましい。つぎに、図2では図1
のハンダ版4を使用して、ハンダペーストをプリント配
線基板5上の半導体接続パターン6の上にスクリーン印
刷した状態を示している。図2に示すように、有機ハン
ダまたは低温ハンダを長方形ハンダペーストパターン7
に印刷しており、これらのハンダペーストパターン7の
厚みは、数〜数10ミクロン程度に設定している。上記
のハンダ材料である有機ハンダ材料としては、高級脂肪
酸のスズ化合物を用いる。また、低温ハンダとしては従
来のSn/Pbの共晶ハンダに対して、本実施例ではS
n/Pb/InまたはSn/Pb/Biを用いる。図2
の状態のハンダペーストパターン7を印刷した基板5上
に所定の半導体を固定し、リフロー炉に入れてハンダを
溶融して電気的に接続させる。DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing a high-density mounting board according to an embodiment of the present invention will be described below with reference to the drawings. FIGS. 1 and 2 show the structure of a method for manufacturing a high-density mounting board according to an embodiment of the present invention. As shown in FIG. 1, a thin stainless steel plate 2 attached to a soldering plate frame 1 is provided with four rectangular holes 3 corresponding to QFP type semiconductors. This hole 3 is
The thin stainless steel plate 2 is processed by an etching method or a laser processing method. The thickness of this thin stainless steel plate 2 is 0.
.. A thickness of 2 mm or less is desirable. Next, in Figure 2, Figure 1
The solder paste is screen-printed onto the semiconductor connection pattern 6 on the printed wiring board 5 using the solder plate 4 of FIG. As shown in Figure 2, organic solder or low temperature solder is applied to a rectangular solder paste pattern 7.
The thickness of these solder paste patterns 7 is set to about several to several tens of microns. As the organic solder material which is the solder material mentioned above, a tin compound of higher fatty acid is used. In addition, as for the low-temperature solder, unlike the conventional Sn/Pb eutectic solder, this example uses S
n/Pb/In or Sn/Pb/Bi is used. Figure 2
A predetermined semiconductor is fixed onto the substrate 5 on which the solder paste pattern 7 in the state shown in FIG.
【0011】これらのハンダ材料のうち、有機ハンダは
、リフロー炉内で200℃以上の高温で加熱して、接続
パターン6を形成するCuとハンダのSnが金属間化合
物をつくり接続できる。低温ハンダ材料を用いた場合も
同様に金属間化合物をつくる。Among these solder materials, organic solder can be heated in a reflow oven at a high temperature of 200° C. or higher to form an intermetallic compound between the Cu forming the connection pattern 6 and the Sn of the solder to form a connection. Intermetallic compounds are similarly created when using low-temperature solder materials.
【0012】従来のSn/Pbの共晶ハンダの接続原理
も本実施例と同じであるがハンダ材料の溶融時の表面張
力が小さいため、図1に示すように接続パターン6全体
を覆って印刷したとき、溶融時に接続パターン6に対し
て分離してつくることができない。本発明のハンダ材料
を用いたときは、高温加熱によりハンダが溶融して接続
パターンに対する濡れ性が大幅に向上するため、前記接
続パターンに選択的に接続が確実に達成できる。The connection principle of the conventional Sn/Pb eutectic solder is the same as that of this embodiment, but since the surface tension of the solder material is small when it is melted, the connection pattern 6 is printed to cover the entire connection pattern 6 as shown in FIG. In this case, it cannot be formed separately from the connection pattern 6 during melting. When the solder material of the present invention is used, the solder is melted by high temperature heating and the wettability to the connection pattern is greatly improved, so that selective connection to the connection pattern can be reliably achieved.
【0013】なお、本実施例は半導体を実装する例であ
るが、電気部品例えば、電解コンデンサでも2つの接続
パターンに分離せず、上記の有機ハンダまたは低温ハン
ダをスクリーン印刷してもよい。Although this embodiment is an example in which a semiconductor is mounted, an electrical component such as an electrolytic capacitor may not be separated into two connection patterns, but the above-mentioned organic solder or low-temperature solder may be screen printed.
【0014】[0014]
【発明の効果】以上の実施例の説明からも明らかなよう
に、本発明によれば、細かなピッチの接続パターンに精
度よくハンダペーストを印刷する必要がなくなり、版枠
のスクリーンのハンダ通過のための孔形状が簡単になり
、ハンダ版の製作日数も短くなり、コストが安くなる。
さらに、基板の生産性が高くなり、ハンダ接続不良がほ
とんど無くなり歩留りが向上する。このため、今後さら
に細かくなる接続パターンのファイン化にも対応できる
こととなる。Effects of the Invention As is clear from the above description of the embodiments, according to the present invention, it is no longer necessary to accurately print solder paste on a connection pattern with a fine pitch, and the solder passes through the screen of the frame. The shape of the hole for soldering becomes simpler, the time required to produce the soldering plate is shortened, and the cost is reduced. Furthermore, the productivity of the board is increased, and there are almost no solder connection defects, which improves the yield. Therefore, it will be possible to support even finer connection patterns that will become more detailed in the future.
【図1】本発明の一実施例のハンダ版の平面図[Fig. 1] A plan view of a solder plate according to an embodiment of the present invention.
【図2】
同ハンダペーストをスクリーン印刷したプリント配線基
板の平面図[Figure 2]
Top view of a printed wiring board screen-printed with the same solder paste
【図3】従来のハンダ版の平面図[Figure 3] Plan view of conventional solder plate
【図4】同ハンダペーストをスクリーン印刷したプリン
ト配線基板の平面図[Figure 4] Plan view of a printed wiring board screen-printed with the same solder paste
1 ハンダ版枠 2 ステンレス薄板 3 孔 4 ハンダ版 5 プリント配線基板 6 半導体接続パターン 7 ハンダペーストパターン 1 Solder plate frame 2 Stainless steel thin plate 3 holes 4 Solder version 5 Printed wiring board 6 Semiconductor connection pattern 7 Solder paste pattern
Claims (3)
の半導体および電気部品の接続パターン上に前記接続パ
ターン全体を覆うようにハンダペーストを印刷し、ハン
ダペーストの融点以上に加熱して接続パターン上に選択
的にハンダパターンを形成する高密度実装基板の製造方
法。1. Solder paste is printed on the connection patterns of a plurality of semiconductors and electrical components formed on a printed wiring board so as to cover the entire connection patterns, and is heated to a temperature higher than the melting point of the solder paste to form the connection patterns. A method for manufacturing a high-density mounting board by selectively forming a solder pattern thereon.
ン全体を覆うように印刷するハンダペースト材料として
請求項1記載の高密度実装基板の製造方法。2. The method of manufacturing a high-density mounting board according to claim 1, wherein the solder paste material is printed to cover the entire connection patterns of a plurality of semiconductors and electrical components.
ン全体を覆うように印刷するハンダペースト材料として
請求項1記載の高密度実装基板の製造方法。3. The method of manufacturing a high-density mounting board according to claim 1, wherein the solder paste material is printed to cover the entire connection patterns of a plurality of semiconductors and electrical components.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP974091A JPH04254396A (en) | 1991-01-30 | 1991-01-30 | Manufacture of high density mounted board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP974091A JPH04254396A (en) | 1991-01-30 | 1991-01-30 | Manufacture of high density mounted board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04254396A true JPH04254396A (en) | 1992-09-09 |
Family
ID=11728712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP974091A Pending JPH04254396A (en) | 1991-01-30 | 1991-01-30 | Manufacture of high density mounted board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04254396A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1301044C (en) * | 2003-09-30 | 2007-02-14 | 三洋电机株式会社 | Circuit device |
-
1991
- 1991-01-30 JP JP974091A patent/JPH04254396A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1301044C (en) * | 2003-09-30 | 2007-02-14 | 三洋电机株式会社 | Circuit device |
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