JPH0425354B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a partial plating device for band-shaped plated objects, and particularly to a partial plating device with improved positioning accuracy.

<Prior Art> Various partial plating devices have been proposed in the past that perform intermittent partial plating continuously on band-shaped plated materials, such as coil-shaped, ribbon-shaped, tape-shaped materials, etc.
Although some of them have been implemented, to the best of the applicant's knowledge, most of them have complicated overall structures and are not very efficient.

Therefore, the present applicant has previously proposed a simple and efficient partial plating device for band-shaped objects using a rotating wheel (see Japanese Patent Laid-Open No. 181887/1987).
This partial plating device is equipped with a rotating wheel, a rotating masking band, and a nozzle body, and the strip-shaped plating material is guided into a usage area formed in an arc near the top of the rotating wheel and fixed inside the rotating wheel. The plating liquid is injected from the nozzle body, and the plating target part of the strip-shaped object facing the plating liquid injection opening formed in the rotating wheel is plated. According to the partial plating device proposed in the future, efficient partial plating can be performed intermittently and continuously on a strip-shaped plated object, and for this purpose, the plating liquid injection holes formed in the rotating wheel and The placement of the strip-shaped plated object led thereto with the part to be plated is performed by engaging pins erected on the rotating wheel side with a plurality of small holes provided in advance in the longitudinal direction of the strip-shaped plated object. was.

<Problem to be solved by the invention> However, although the above-mentioned positioning work between the pin and the small hole requires accuracy of a few tenths of a millimeter, it cannot be avoided with current manufacturing technology. ,... (a) Error in the drilling position of small holes when manufacturing a strip-shaped plated object, (b) Error in the position of the numerous pins provided on the rotating wheel of the partial plating device, (c) Changes in the set temperature of the partial plating device In relation to the temperature expansion and
Due to a combination of conditions such as changes in their relative positions caused by contraction, some of the pins installed on the rotating wheel (only a few out of multiple pins)
However, there was a possibility that a small positional shift would occur with the small hole of the band-shaped plated material, making it impossible to engage with it.

This invention was made by focusing on such conventional technology, and even if the small hole of the band-shaped plated object and a part of the pin of the rotating wheel are misaligned, the engagement with the small hole of the band-shaped plated object is not successful. An object of the present invention is to provide a partial plating device for a band-shaped plated object, which can easily correct the positional deviation of the pin.

<Means for Solving the Problems> In order to achieve the above-mentioned object, the partial plating device for strip-shaped plated objects according to the present invention divides the rotary wheel of the partial plating device into a plurality of parts in the so-called circumferential direction, and rotates each other. It is composed of a plurality of concentrically rotating nozzle bodies that can freely adjust the spacing between the tips in different directions.

<Function> The rotating wheel of the partial plating device is composed of a plurality of nozzle bodies that rotate concentrically with the interval freely adjustable in the rotational direction. Even if there is something that cannot be engaged due to misalignment, it is easy to make the pin smaller by adjusting the position of the nozzle body and the pin in the direction that eliminates the misalignment. It can be engaged into the hole.

<Example> The present invention will be explained below based on the drawings.

1 to 3 are diagrams showing one embodiment of the present invention. This partial plating device 1 has a rotary wheel 2
, a rotating masking band 3, and a cathode means 4, which will be explained in order below. First, the rotary wheel 2 has a plurality of nozzle bodies 6 made of synthetic resin with a tip 5 having an arcuate surface.
are attached at equal intervals around a disk portion 8 which is rotatably supported by the main body 7 of the device, and has a shape similar to that of a disk-shaped rotating wheel 2 divided into equal angles. The entire device is rotatable in the direction of arrow A in FIG. 1 by a known drive means.
The head 6a of the nozzle body 6 on which the tip 5 is located is attached with a screw, and by removing the screw, only the head 6a can be removed and replaced. Grooves 10 for receiving band-shaped plating materials 9 are provided in the tip portions 5 of the head portions 6a. The groove 10 is sized to have a width and a depth such that it can receive the rotating masking band 3 and the band-shaped plating material 9 together, as shown in FIG. The bottom surface 11 of the groove 10 of each nozzle body 6 is provided with one plating liquid injection opening 13 corresponding to the plating target portion 12 of the band-shaped plating object 9. Further, a pin 14 is set near the plating liquid injection hole 13, and by engaging this pin 14 with a plurality of small holes 15 provided in advance in the longitudinal direction of the strip-shaped plating object 9, the nozzle body 6 plating liquid injection hole 1
3 and the plating target portion 12 of the band-shaped plating object 9 is accurately and reliably aligned.

The nozzle body 6 also has an inlet flow path 1 for the plating liquid M that extends from the plating liquid injection opening 13 toward the inside.
6a and an outlet channel 16b are formed, and the inlet channel 16a and the outlet channel 16b are connected to the nozzle body 6.
It communicates with an inlet pipe 17a and an outlet pipe 17b provided at the base end of the pipe. Inlet pipe 17a and outlet pipe 17 of this nozzle body 6
b is fitted into the disk portion 8 with strong force. Therefore, this nozzle body 6 does not move during normal operation or when you try to move it by hand, but when necessary, the inlet/outlet pipe 17
a, 17b can be moved only slightly in the direction of rotation or in the opposite direction of rotation. In addition, the plating liquid injection opening 1 of the inlet flow path 16a
An insoluble anode 18 is incorporated near 3.

The disk portion 8 to which this nozzle body 6 is attached has one inlet/outlet pipe 17a, 17
One inlet/outlet distribution channel 19a, 19 for b
b are provided continuously with the inlet and outlet distribution channels 19a and 19b, respectively. In other words, the nozzle body 6
Inlet/outlet distribution channels 19a, 19b are formed on both sides of the disk portion 8 in a number corresponding to . And these inlet/outlet distribution channels 19a, 19b
The inlet/outlet openings 20a, 20b, which are the ends of the disc part 8, are formed on the side surface of the tip end of the rotating shafts 21a, 21b of the disk part 8, at equal intervals in the rotational direction.

Of the outer periphery of the rotary wheel 2 formed by the tip 5 of the nozzle body 6, an arcuate portion of an arbitrary angle near the top is a plating processing zone, or "use area" 22, and is the above-mentioned input/output side. Opening hole 20
Of the parts a and 20b, only the inlet and outlet openings 20a and 20b located in this "use area" 22 are provided with a supply channel 23a and a discharge channel for the plating liquid M, which are pre-formed inside the device main body 7. 23b.

The rotating masking band 3 is used to press the band-shaped plating material 9 into the groove 10 of the "use area" 22 of the rotating wheel 2, and as shown in FIG.
It has an endless shape suspended by d.

A pair of cathode rollers 4 as "cathode means" are disposed on at least one of the inlet and outlet sides of the rotating wheel 2 (in the illustrated example, only the inlet side as shown in FIG. 1). By passing the strip-shaped plated material 9 in contact between the cathode rollers 4 of the cathode rollers 4, the strip-shaped plated material 9 is efficiently turned into a cathode. Of course, the "cathode means" is not limited to this cathode roller 4, and a known cathode brush or other means may be employed.

Next, the effect will be explained. Either the rotary wheel 2 or the rotary masking band 3 is driven to rotate, or the strip-shaped plated material 9 is pulled in the horizontal direction, and the strip-shaped plated material 9 is turned into a cathode by the cathode roller 4 while the rotating wheel 2 is moved in the direction of arrow A. Let it move in a rotating manner. Then, the band-shaped plated object 9 is pressed and held in the groove 10 at the tip of the nozzle body 6 by the rotating masking band 3 between the "use areas" 22, and the pins 14 engage with the corresponding small holes 15. Then, the plating target portion 12 of the band-shaped plating object 9 is accurately positioned to the plating liquid injection opening 13 of the nozzle body 6. And this “use area” 2
2, the inlet opening 20 of the inlet distribution channel 19a in the nozzle body 6
a is the plating liquid M supply channel 23a of the apparatus main body 7;
At the same time, the outlet opening 20b and the discharge channel 23b of the device main body 7 also communicate with each other, so that only the nozzle body 6 located within this "use area" 22 has a constant flow rate to the supply channel 23a of the device main body 7. The plating liquid M sent under pressure first flows through the supply channel 23a → inlet opening 20a → inlet distribution channel 19a → inlet pipe 17
a→inlet flow path 16a. Ions are supplied by the anode 18 facing near the plating liquid injection hole 13 side of the inlet flow path 16a and reach the plating liquid injection hole 13. As described above, the plurality of plating target parts 12 of the band-shaped plating object 9 are aligned with the plurality of plating liquid injection holes 13 formed in the bottom surface 11 of the groove 10, and the upper side is completely covered by the rotating masking band 3. Since it is in a masked state, the plating liquid M flows back to the outlet flow path 16b at the plating liquid injection aperture 13, and at this time, the strip-shaped plating liquid M exposed from the plating liquid injection aperture 13 The plating liquid M comes into contact with the plating target portion 12 of the plating object 9, and the plating process is performed. The plating liquid M is supplied with necessary and sufficient ions when passing through the anode 18 portion, but these ions are consumed as the plating liquid M comes into contact with the plating target area 12 of the band-shaped plating object 9, and the ions are The consumed Metsuki liquid M is
It is discharged in the order of outlet flow path 16b → outlet pipe 17b → outlet distribution flow path 19b → outlet opening 20b → discharge flow path 23b. On the other hand, at this time, the nozzle body 6 other than the "use area" 22 has the inlet and outlet openings 20a of the inlet and outlet distribution channels 19a and 19b, respectively.
20b are to be blocked by the device main body 7, so that the plating liquid M sent at a constant pressure to the supply passage 23a will not leak from these nozzle main bodies 6.

In addition, this partial plating device 1 adjusts the tension of the rotating masking band 3 while adjusting the position of the tension rollers 24a to 24b, so that the rotating masking band 3 deeply covers the rotating wheel 2 and comes into contact with the rotating wheel 2. The angle of the circular arc part can be made large, that is, the "use area" 22 can be set long, or conversely, the angle of the adjacent circular arc part can be made small to make the "use area" 22 longer.
It is also possible to set 22 to a shorter value.
In this way, it is rotated by both the rotary wheel 2 and the rotary masking band 3, and although the band-shaped plating object 9 is formed into an arc shape in the "use area" 22, it becomes almost horizontal as a whole, so these states While this continues, a plurality of platings of sizes and shapes suitable for the plating liquid injection openings 13 are intermittently and continuously applied to the band-shaped plated object 9 at portions corresponding to the length of the "use area" 22. become.

If the rotating wheel 2 or the band-shaped plating object 9 expands or contracts due to a change in the set temperature of the partial plating device 1 itself, or for some other reason, the band-shaped plating object 9 is removed from the pin 14 of the nozzle body 6. If there is a slight positional misalignment with the small hole 15 that makes it impossible to engage, move only the nozzle body 6 where the pin 14 that has caused the misalignment is installed in a direction that eliminates the misalignment. The position (pitch p with respect to the adjacent nozzle body 6) may be adjusted by moving the nozzle body 6 by any means.
Furthermore, even if the pin 14 or the like is damaged, it is sufficient to replace only the damaged nozzle body 6 or the head 6a of the nozzle body 6 without replacing the entire rotating wheel 2.

FIG. 4 is a diagram showing another embodiment of the present invention.

In this embodiment, the nozzle body 25 is of a "plating liquid injection type". An injection chamber 26 for plating liquid M is formed inside the nozzle body 25, and plating is carried out from a nozzle 27 connected to the inlet flow path 16a to a band-shaped plating object 28 in the groove 10 of the head 25a. This is to inject liquid M. An anode 29 is provided at the tip of the nozzle 27, and the plating liquid M receives ions from the anode 29 to perform a plating process on the band-shaped plating object 28. And this injection chamber 26
is communicated with the outlet flow path 16b at the base end of the nozzle body 25, so the plating liquid M after the plating process is discharged to the outside through the outlet flow path 16b. Other configurations, functions, and effects are the same as those of the previous embodiment, and redundant explanation thereof will be omitted.

FIG. 5 is a diagram showing still another embodiment of the present invention. This partial plating device 30 uses two disk portions 31 and 32 and has a large number of nozzle bodies 33 arranged in an elliptical shape. By doing so, the "use area" 34 can be made longer, and therefore more strip-shaped plating objects 35 can be plated more quickly. The other configurations and operations are almost the same as those of the previous embodiment, so redundant explanation thereof will be omitted.

<Effects> Since the device for partial plating of a band-shaped plated object according to the present invention has the content as explained above, it is possible to perform partial plating of a band-shaped plated object in a simple and efficient manner. Even if the small holes of the plating object are misaligned, the misalignment can be easily and reliably corrected, improving the efficiency of plating processing and the accuracy of partial plating. There is an effect. Furthermore, even if a part of the rotating wheel of the partial plating device is damaged due to an unexpected accident or the like, it is only necessary to replace the nozzle body of the damaged part, which is advantageous in terms of maintenance.

[Brief explanation of drawings]

FIG. 1 is a schematic front view of a partial plating device showing one embodiment of the present invention, FIG. 2 is a schematic cross-sectional view taken along the arrow - line in FIG. 1, and FIG. 3 is a portion shown in FIG. 1. FIG. 4 is an enlarged perspective view showing the nozzle body of the plating device, FIG. 4 is a sectional view of the nozzle body showing another embodiment of the invention, and FIG. It is a schematic front view. DESCRIPTION OF SYMBOLS 1, 30... Partial plating device, 2... Rotating wheel, 3... Rotating masking band, 4... Cathode roller, [cathode means], 5... Tip part, 6, 25,
33... Nozzle body, 9, 28, 35... Band-shaped plating object, 10... Groove, 11... Bottom surface, 13... Plating liquid injection hole, 14... Pin, 15... Small hole, 18, 29... Anode, 22, 34... Area of use.

Claims (1)

[Scope of Claims] 1. A groove for receiving a band-shaped plated object having a plating liquid injection hole in the bottom surface, and a positioning pin that can freely engage a plurality of small holes formed in advance in the longitudinal direction of the band-shaped plated object. a rotary wheel for concentrically rotating a plurality of nozzle bodies, each having a plurality of nozzle bodies each having an anode disposed thereon, while freely adjusting the distance between the respective tips in the direction of rotation; and each tip of the plurality of nozzle bodies. An endless rotating masking band that presses the band-shaped plated material into the groove in this usage area, and 1. An apparatus for partially plating a strip-shaped plated article, comprising a cathode means for cathodizing the strip-shaped plated article, which is disposed on at least one of the outlet sides.