JPH0313314B2 - - Google Patents
Info
- Publication number
- JPH0313314B2 JPH0313314B2 JP57062356A JP6235682A JPH0313314B2 JP H0313314 B2 JPH0313314 B2 JP H0313314B2 JP 57062356 A JP57062356 A JP 57062356A JP 6235682 A JP6235682 A JP 6235682A JP H0313314 B2 JPH0313314 B2 JP H0313314B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- shaped
- band
- groove
- plating liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 66
- 239000007788 liquid Substances 0.000 claims description 28
- 230000000873 masking effect Effects 0.000 claims description 17
- 238000002347 injection Methods 0.000 claims description 14
- 239000007924 injection Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000009751 slip forming Methods 0.000 claims 1
- 238000011084 recovery Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
この発明は帯状メツキ物の部分メツキ装置に関
するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a device for partially plating a band-shaped object to be plated.
帯状メツキ物、例えばコイル状、リボン状、テ
ープ状等の素材に間欠的な部分メツキを連続して
施す部分メツキ装置が従来より種々提案され且つ
その内の幾つかは実施化されているけれども、本
発明者の知り得る範囲ではそれらの殆んどのもの
は全体の構造が複雑で効率もそれ程良好のもので
はなかつた。 Various partial plating devices have been proposed in the past for continuously applying intermittent partial plating to band-shaped plated materials, such as coil-shaped, ribbon-shaped, tape-shaped materials, etc., and some of them have been put into practice. As far as the present inventors know, most of them have complicated overall structures and are not very efficient.
そこで、この発明は構造簡潔にして操作し易く
効率の良い部分メツキ装置を提供せんとするもの
で、具体的には、この発明に係かる部分メツキ装
置は、回転ホイールの円筒状のフランジ部の外周
面にメツキ対象とする帯状のメツキ物をマスキン
グバンドにて押圧・挟持し、同フランジ部の内周
面側よりメツキ液を噴射して施し、予めフランジ
部に円周方向で間欠的に設けたメツキ液噴射開孔
内で下向き状態で露出している帯状メツキ物の複
数のメツキ部位ごとに、回転ホイールとマスキン
グバンドと帯状メツキ物とを各々移動させつつ、
効率的に部分メツキすることを内容とするもので
ある。 Therefore, it is an object of the present invention to provide a partial plating device that has a simple structure, is easy to operate, and has high efficiency. Specifically, the partial plating device according to the present invention is designed to provide a partial plating device that has a simple structure, is easy to operate, and has high efficiency. A band-shaped plating object to be plated on the outer circumferential surface is pressed and clamped with a masking band, and the plating liquid is sprayed from the inner circumferential side of the flange section, and is applied intermittently in the circumferential direction on the flange section in advance. While moving the rotary wheel, the masking band, and the strip-shaped plating object for each of the plurality of plating parts of the strip-shaped plating object exposed downward in the plating liquid injection opening,
The purpose is to perform partial plating efficiently.
以下、この発明の詳細を図面に示す実施例に基
づいて説明する。この部分メツキ装置は主に回転
ホイール１と、回転マスキングバンド２と、そし
てノズル体３とで主に構成されている。回転ホイ
ール１は、図示の例では、全体が角Ｃ字形状を有
し、縦方向のデイスク部４の中央が軸支されて全
体が回転自在とされている。デイスク部４の周辺
には横方向に、円筒状のフランジ部５があり、フ
ランジ部５以外は開放部分１ａとしてある。そし
てこのフランジ部５の外周面６に溝７が円周方向
に連続的に設けてある。溝７は少くとも帯状メツ
キ物８を受入れるのに十分な幅W1と深さを備え、
図示の如く回転マスキングバンド２を帯状メツキ
物８と併せて受入れることのできるような幅及び
深さのものにしてもよい。この溝７の底にはピン
７ａが複数立設され、帯状メツキ物８に予め規則
正しい間隔で形成してある小孔８ａとちようど係
合できるようにしてある。このようにして、第１
図に於いて水平に送つている帯状メツキ物８の進
行方向に位置ズレが発生せぬようにしてあるが、
ピン７ａに代えて溝７の底に樹脂系のスベリ止め
材を施してもよい。尚第２図に於いて横方向へ位
置ズレが生ぜぬよう帯状メツキ物８には溝７内で
安定した確実な位置決めが行なわれる必要があ
り、この意味で溝７の幅W1は帯状メツキ物８の
幅W2とほぼ相応させてある。 Hereinafter, details of the present invention will be explained based on embodiments shown in the drawings. This partial plating device is mainly composed of a rotating wheel 1, a rotating masking band 2, and a nozzle body 3. In the illustrated example, the rotary wheel 1 has an angular C-shape as a whole, and the center of a longitudinal disk portion 4 is pivotally supported, so that the entire rotary wheel 1 is rotatable. A cylindrical flange portion 5 is provided in the lateral direction around the disk portion 4, and the portion other than the flange portion 5 is an open portion 1a. A groove 7 is continuously provided in the outer peripheral surface 6 of the flange portion 5 in the circumferential direction. The groove 7 has a width W 1 and depth sufficient to receive at least the strip-shaped plated object 8,
As shown, the width and depth of the rotating masking band 2 may be such that it can be received together with the band-shaped plating 8. A plurality of pins 7a are erected at the bottom of the groove 7, so that they can be engaged with small holes 8a that are previously formed in the strip-shaped plating 8 at regular intervals. In this way, the first
In the figure, the strip-shaped plated material 8 is fed horizontally so that no positional deviation occurs in the traveling direction.
A resin-based anti-slip material may be applied to the bottom of the groove 7 instead of the pin 7a. In addition, as shown in FIG. 2, it is necessary that the band-shaped plated object 8 is stably and reliably positioned within the groove 7 so as not to be misaligned in the lateral direction. It is made to correspond approximately to the width W 2 of object 8.
溝７の底には他側へ貫通させたメツキ液噴射開
孔９が全周にわたり間欠的に設けられる。これら
各メツキ液噴射開孔９は帯状メツキ物８の下面に
メツキ部位８ｂを決めるもので、所望のメツキ形
状、サイズを併せ規制するものである。そして、
この下向き状態となつているメツキ部位８ｂを正
確なものとするために、前記のピン７ａ、小孔８
ａ、幅W1等が活用される。１０は傾斜開口部で、
各メツキ液噴射開孔９に対するフランジ部５の内
周面側に、内方へ向け拡開状のものとして形成さ
れている。尚、図示の例で、傾斜開口部１０は、
フランジ部５の内周面側でその周方向の全体にわ
たり連続して形成してあるが、各メツキ液噴射開
孔９ごとに対応独立させて傾斜開口部１０を形成
してもよい。このような傾斜開口部１０はノズル
体３より噴射されたメツキ液１１ａがそのアノー
ドイオンを消費しだいすぐに新しいメツキ液１１
ｂと交換でき且つ回収され易いように適度の拡開
度をもつて形成されるものである。 At the bottom of the groove 7, plating liquid injection holes 9 penetrating to the other side are provided intermittently over the entire circumference. Each of these plating liquid injection holes 9 determines a plating portion 8b on the lower surface of the band-shaped plated object 8, and controls the desired plating shape and size. and,
In order to make the plating part 8b facing downwards accurate, the pin 7a and the small hole 8
a, width W 1 , etc. are utilized. 10 is an inclined opening;
They are formed on the inner peripheral surface side of the flange portion 5 with respect to each plating liquid injection hole 9 in a shape that expands inward. In the illustrated example, the inclined opening 10 is
Although the inclined openings 10 are formed continuously over the entire circumferential direction on the inner peripheral surface side of the flange portion 5, the inclined openings 10 may be formed independently corresponding to each plating liquid injection opening 9. Such an inclined opening 10 is provided with a new plating liquid 11 as soon as the plating liquid 11a sprayed from the nozzle body 3 consumes the anode ions.
It is formed with an appropriate degree of expansion so that it can be exchanged with b and can be easily recovered.
回転マスキングバンド２は複数の回転兼テンシ
ヨン付与ローラ１２ａ〜１２ｄに懸回された全体
がエンドレス状のもので、常時回転ホイール１、
具体的にはそのフランジ部５、の頂部近辺の円弧
部分に接触している。第１図で示すようにこの円
弧部分は「使用区域」１３となるもので回転ホイ
ール１と回転マスキングバンド２との相対的な位
置関係により調整した任意の円弧長さが「使用区
域」１３として用いられ、この「使用区域」１３
では帯状メツキ物８が常時回転マスキングバンド
２にて回転ホイール１側へ押圧され溝７内に押付
けられるようにしてある。 The rotating masking band 2 is entirely endless and is suspended around a plurality of rotating and tensioning rollers 12a to 12d.
Specifically, it is in contact with an arcuate portion near the top of the flange portion 5. As shown in Fig. 1, this arc portion becomes the "use area" 13, and the arbitrary arc length adjusted according to the relative positional relationship between the rotating wheel 1 and the rotating masking band 2 is the "use area" 13. This “use area” 13
In this case, the strip-shaped plating material 8 is constantly pressed toward the rotary wheel 1 side by the rotating masking band 2 so as to be pressed into the groove 7.
ノズル体３は回転ホイール１の内側に固定され
るもので、上記の「使用区域」１３と相応するノ
ズル口１４にアノード１５を臨ませた全体が扇形
状のものとしてある。アノード１５としては溶
性、不溶性いずれのアノードでも採用できるが、
図示の例ではpt／Tiの不溶性アノードとしてあ
り、ノズル口１４の全体を囲撓する状態にアノー
ド１５が配置してあつて恰もアノード１５間に扇
形状のスリツトが形成された状態を呈している。
１６はメツキ液の供給パイプで、図示せぬメツキ
液管理槽とポンプを介して接続されている。尚、
１７は回収槽で、回収パイプ１８にて同じく図示
せぬメツキ液管理槽と接続してある。又１９はカ
ソードローラを示す。 The nozzle body 3 is fixed inside the rotating wheel 1, and has a fan-like shape as a whole, with an anode 15 facing a nozzle opening 14 corresponding to the above-mentioned "use area" 13. As the anode 15, either a soluble or an insoluble anode can be used.
In the illustrated example, the anode is an insoluble PT/Ti anode, and the anode 15 is arranged to surround the entire nozzle opening 14, so that a fan-shaped slit is formed between the anodes 15. .
Reference numeral 16 denotes a plating liquid supply pipe, which is connected to a plating liquid management tank (not shown) via a pump. still,
Reference numeral 17 denotes a recovery tank, which is connected via a recovery pipe 18 to a plating liquid management tank, also not shown. Further, 19 indicates a cathode roller.
次に作用を説明する。回転ホイール１又は回転
マスキングバンド２のいずれかを回転駆動し、或
は帯状メツキ物８を水平方向で引つ張つて移行せ
しめる。すると帯状メツキ物８は「使用区域」１
３の間で回転マスキング２によつて回転ホイール
１、具体的にはフランジ部５、の溝７内に押付け
られ且つ挟持された状態となり、且つピン７ａが
それぞれの小孔８ａに係入して位置ズレを防止
し、ノズル体３からメツキ液１１ａ，１１ｂが噴
射されればこのメツキ液１１ａ，１１ｂはフラン
ジ部５に形成してあるメツキ液噴射開孔９内に露
呈されている帯状メツキ物８のメツキ部位８ｂと
接触し、この帯状メツキ物８がカソードローラ１
９その他により予めカソード化されているのでそ
こに所望にメツキ処理が行なわれる。アノードイ
オンを消費したメツキ液１１ａは傾斜開口部１０
を利用して第３図中の矢示方向へ流れそして円筒
状のフランジ部５以外の回転ホイール１の開放部
分１ａより第２図中矢示方向へ流れ且つ回収槽１
７及び回収パイプ１８にて図示せぬメツキ液管理
槽へと瞬時に戻されてゆく。この間、回転ホイー
ル１及び回転マスキングバンド２の双方は回転さ
れ且つ帯状メツキ物８は「使用区域」１３で円弧
状されるものの全体としてはほぼ水平に移行して
ゆく。従つて、これらの状態が続く間、「使用区
域」１３の円弧長さに応じた部分で帯状メツキ物
８にはメツキ液噴射開孔９に見合うサイズ、形状
のメツキが複数、間欠的に連続して施されてゆく
ことになる。 Next, the effect will be explained. Either the rotary wheel 1 or the rotary masking band 2 is driven to rotate, or the band-shaped plating material 8 is pulled and transferred in the horizontal direction. Then, the band-shaped plated object 8 becomes the "use area" 1.
3, the rotary masking 2 presses and clamps the rotary wheel 1, specifically the flange portion 5, into the groove 7, and the pins 7a engage in the respective small holes 8a. If the plating liquids 11a, 11b are sprayed from the nozzle body 3 while preventing the positional shift, the plating liquids 11a, 11b will be applied to the strip-shaped plating object exposed in the plating liquid injection opening 9 formed in the flange portion 5. 8, and this strip-shaped plating material 8 contacts the plating portion 8b of the cathode roller 1.
9, etc., so that the plating process can be performed as desired. The plating liquid 11a that has consumed the anode ions is removed from the inclined opening 10.
3, and from the open portion 1a of the rotary wheel 1 other than the cylindrical flange portion 5 in the direction of the arrow in FIG.
7 and a recovery pipe 18, it is instantly returned to a plating liquid management tank (not shown). During this time, both the rotary wheel 1 and the rotary masking band 2 are rotated, and the band-shaped plating 8, although arcuate in the "use area" 13, becomes generally horizontal. Therefore, while these conditions continue, a plurality of platings of a size and shape suitable for the plating liquid injection holes 9 are continuously and intermittently formed on the band-shaped plating object 8 in a portion corresponding to the arc length of the "use area" 13. It will be carried out accordingly.
以上説明したきたように、この発明によれば、
回転ホイールの円筒状のフランジ部に帯状メツキ
物受入れ用の溝、間欠的なメツキ液噴射開孔、及
びこのメツキ液噴射開孔と対応させた拡開状の傾
斜開口部を各々設け、この回転ホイールにそのフ
ランジ部の頂部近辺の円弧部分で接触し「使用区
域」を形成するようにエンドレス状の回転マスキ
ングバンドを配置して溝内へ帯状メツキ物を押付
けるものとし、更に溝内に押付けられている帯状
メツキ物の各メツキ液噴射開孔内で下向き状態で
露出しているメツキ部位にメツキ液をノズル体よ
り噴射して施すようにしたので、回転ホイールの
回転、回転マスキングバンドの回転そして帯状メ
ツキ物の移行、「使用区域」間での帯状メツキ物
の押付け・挟持、同「使用区域」に在る複数のメ
ツキ液噴射開孔に対するノズル体からのメツキ液
の噴射によつて、帯状メツキ物に対して効率の良
い部分メツキを連続して施すことができる。しか
もこの部分メツキ装置は主に回転ホイールと回転
マスキングバンドとそしてノズル体の三要素で構
成されており全体の構造が簡潔な上にメツキ処理
のための装置としての駆動は回転ホイールの回転
と回転マスキングバンドの回転だけでよく、更に
回転ホイールと回転マスキングバンドの相対的位
置調整で容易に帯状メツキ物の押付けと挟持の状
態並びに「使用区域」の円弧長さを調整できて非
常に扱い易く、加えて、ノズル体は回転ホイール
の内側、即ち円筒状のフランジ部の内周面側で回
転ホイールの開放部分に設けてあるので、メツキ
液の戻りが迅速に行なわれるという効果もある。 As explained above, according to this invention,
The cylindrical flange of the rotating wheel is provided with a groove for receiving a band-shaped plating object, an intermittent plating liquid injection hole, and an expanded inclined opening corresponding to the plating liquid injection hole, and this rotation An endless rotating masking band shall be arranged so as to contact the wheel at the arcuate part near the top of the flange part to form a "use area" and press the band-shaped plated material into the groove, and further press it into the groove. Since the plating liquid is sprayed from the nozzle body onto the plating parts exposed downward in each plating liquid injection hole of the band-shaped plating object, the rotation of the rotating wheel and the rotation of the rotating masking band are easy. Then, by transferring the strip-shaped plating object, pressing and clamping the strip-shaped plating object between the "use areas", and spraying the plating liquid from the nozzle body to the plurality of plating liquid injection holes in the "use area", It is possible to continuously perform efficient partial plating on a band-shaped plated object. Moreover, this partial plating device mainly consists of three elements: a rotating wheel, a rotating masking band, and a nozzle body.The overall structure is simple, and the drive as a device for plating is the rotation of the rotating wheel. All you have to do is rotate the masking band, and by adjusting the relative position of the rotating wheel and rotating masking band, you can easily adjust the pressing and clamping conditions of the band-shaped plated object as well as the arc length of the "use area", making it extremely easy to handle. In addition, since the nozzle body is provided inside the rotary wheel, that is, at the open portion of the rotary wheel on the inner peripheral surface side of the cylindrical flange, there is also the effect that the plating liquid is quickly returned.
第１図はこの発明に係かる部分メツキ装置の一
実施例を示す概略正面図、第２図は第１図中の
−線に沿う断面図、第３図はその要部の拡大斜
視図、第４図は帯状メツキ物の部分斜視図、そし
て第５図はノズル体の概略斜視図を示すものであ
る。
１……回転ホイール、２……回転マスキングバ
ンド、３……ノズル体、５……円筒状のフランジ
部、７……溝、８……帯状メツキ物、９……メツ
キ液噴射開孔、１０……傾斜開口部、１１ａ，１
１ｂ……メツキ液、１３……使用区域、１５……
アノード。
FIG. 1 is a schematic front view showing an embodiment of a partial plating device according to the present invention, FIG. 2 is a sectional view taken along the line - in FIG. 1, and FIG. 3 is an enlarged perspective view of the main parts thereof. FIG. 4 is a partial perspective view of the strip-shaped plated material, and FIG. 5 is a schematic perspective view of the nozzle body. DESCRIPTION OF SYMBOLS 1... Rotating wheel, 2... Rotating masking band, 3... Nozzle body, 5... Cylindrical flange part, 7... Groove, 8... Band-shaped plating object, 9... Plating liquid injection opening, 10 ... Inclined opening, 11a, 1
1b...Metsuki liquid, 13...Area of use, 15...
anode.
Claims (1)
の外周面に帯状メツキ物受入用の溝を連続的に、
又溝の底には他側へ貫通させたメツキ液噴射開孔
を間欠的にそれぞれ周方向に向け、更に各メツキ
液噴射開孔のフランジ部内周面側には内方へ向け
拡開状の傾斜開口部を設けた回転ホイールと、 常時上記フランジ部の頂部近辺の円弧部分を使
用区域とし、この使用区域に於ける上記溝内へ帯
状メツキ物のメツキ部位を下向きにした状態で押
付けるエンドレス状の回転マスキングバンドと、
そして、 回転ホイールの内側に固定され、上記使用区域
に相応するノズル口にアノードを臨ませた全体が
ほぼ扇形状のノズル体とを備えて成る帯状メツキ
物の部分メツキ装置。[Scope of Claims] 1. A cylindrical flange portion, and a groove for receiving a band-shaped plated material is continuously formed on the outer peripheral surface of the flange portion,
In addition, at the bottom of the groove, plating liquid injection holes penetrated to the other side are intermittently oriented in the circumferential direction, and furthermore, on the inner peripheral surface side of the flange part of each plating liquid injection hole, there are inwardly expanding holes. A rotary wheel with an inclined opening, and an endless ring that always uses the arcuate part near the top of the flange as its usage area, and presses the plated part of the band-shaped plating object into the groove in this usage area with the plating part facing downward. a rotating masking band in the shape of a
and a device for partially plating a strip-shaped article, comprising a nozzle body fixed to the inside of a rotating wheel and having a substantially fan-shaped overall shape with an anode facing a nozzle opening corresponding to the use area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6235682A JPS58181887A (en) | 1982-04-16 | 1982-04-16 | Apparatus for partially plating strip like material to be plated |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6235682A JPS58181887A (en) | 1982-04-16 | 1982-04-16 | Apparatus for partially plating strip like material to be plated |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58181887A JPS58181887A (en) | 1983-10-24 |
| JPH0313314B2 true JPH0313314B2 (en) | 1991-02-22 |
Family
ID=13197746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6235682A Granted JPS58181887A (en) | 1982-04-16 | 1982-04-16 | Apparatus for partially plating strip like material to be plated |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58181887A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6398372U (en) * | 1986-12-12 | 1988-06-25 | ||
| JP5788218B2 (en) * | 2011-05-23 | 2015-09-30 | Jx日鉱日石金属株式会社 | Spot plating apparatus and backup member for spot plating apparatus |
| JP6009795B2 (en) * | 2012-03-30 | 2016-10-19 | Ｊｘ金属株式会社 | Spot plating equipment |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51945A (en) * | 1974-06-20 | 1976-01-07 | Matsushita Electric Ind Co Ltd | Kameranadono jidorokoseigyosochi |
-
1982
- 1982-04-16 JP JP6235682A patent/JPS58181887A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51945A (en) * | 1974-06-20 | 1976-01-07 | Matsushita Electric Ind Co Ltd | Kameranadono jidorokoseigyosochi |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58181887A (en) | 1983-10-24 |
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