JPH0425355B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a partial plating device for band-shaped plated objects, and particularly to a partial plating device with improved positioning accuracy.

<Prior Art> Various partial plating devices have been proposed in the past that perform intermittent partial plating continuously on band-shaped plated materials, such as coil-shaped, ribbon-shaped, tape-shaped materials, etc.
Although some of them have been implemented, to the best of the applicant's knowledge, most of them have complicated overall structures and are not very efficient.

Therefore, the present applicant has previously proposed a simple and efficient partial plating device for band-shaped objects using a rotating wheel (see Japanese Patent Laid-Open No. 181887/1987).
This partial plating device is equipped with a rotating wheel, a rotating masking band, and a nozzle body, and the strip-shaped plating material is guided into a usage area formed in an arc near the top of the rotating wheel and fixed inside the rotating wheel. The plating liquid is injected from the nozzle body, and the plating target part of the strip-shaped object facing the plating liquid injection opening formed in the rotating wheel is plated. According to the partial plating device proposed in the future, efficient partial plating can be performed intermittently and continuously on a band-shaped plated object, and for this purpose, the plating liquid injection holes formed in the rotating wheel, The positioning of the strip-shaped plated object led thereto with the part to be plated is performed by engaging a pin set upright on the rotating wheel side with a plurality of small holes previously provided in the longitudinal direction of the strip-shaped plated object. .

<Problems to be Solved by the Invention> However, although the above-mentioned positioning work of pins and small holes requires accuracy of a few tenths of a millimeter, it cannot be avoided with current manufacturing technology. ,... (a) Error in the drilling position of small holes when manufacturing a strip-shaped plated object, (b) Error in the position of the numerous pins provided on the rotating wheel of the partial plating device, (c) Changes in the set temperature of the partial plating device In relation to the temperature expansion and
Due to a combination of conditions such as changes in their relative positions caused by contraction, some of the pins installed on the rotating wheel (only a few out of multiple pins)
However, there was a possibility that a small positional shift would occur with the small hole in the band-shaped plated material, making it impossible to engage with it.

In addition, the spacing (pitch) of each small hole for positioning differs depending on the type of band-shaped plated objects, so if you are going to perform plating processing on different types of band-shaped plated objects, you may have to take the trouble to There was also a disadvantage in terms of cost, as a rotating wheel had to be prepared to match the band-shaped plated material.

This invention has been made by focusing on such conventional technology, and even if the small hole of the band-shaped plated object and a part of the pin of the rotating wheel are misaligned, the engagement with the small hole of the band-shaped plated object is prevented. If things don't go well,
It is possible to easily correct the misalignment of the pins, and it is also possible to partially plate a band-shaped plated item without having to replace the entire rotary wheel even when plating a band-shaped plated item with a different pitch between small positioning holes. The purpose is to provide equipment.

<Means for Solving the Problems> In order to achieve the above object, the device for partially plating a strip-shaped object according to the present invention includes a plurality of plating liquid injection parts forming a rotating wheel of the partially plating device. The gist is that the rotary wheel can move forward and backward in the center and radial directions, and the arc length of the outer peripheral surface of the rotary wheel can be adjusted.

<Function> The plurality of rotary liquid injection parts forming the rotary wheel of the partial plating device are made to move forward and backward in the circular center and radial directions of the rotary wheel, and the arc length of the outer peripheral surface of the rotary wheel is made freely adjustable. Therefore, even if one of the pins installed in one of the plating liquid injection parts becomes misaligned with the small hole of the band-shaped plating object and cannot be engaged, the pin that caused the misalignment will be replaced. By moving the plating liquid spraying part forward and backward in the circular direction or radial direction of the rotating wheel, the arc length of the outer circumferential surface of the rotating wheel can be arbitrarily adjusted according to the pitch of the small holes of the strip-shaped plating object. ie the pitch between each nozzle body can be adjusted to ensure accurate engagement of the pins into the small holes.

<Example> The present invention will be explained below based on the drawings.

1 to 3 are diagrams showing one embodiment of the present invention. This partial plating device 1 has a rotary wheel 2
, a rotating masking band 3, and a cathode means 4, which will be explained in order below. First, the rotary wheel 2 has a plurality of nozzle bodies 6 made of synthetic resin with a tip 5 having an arcuate surface.
are mounted at equal intervals around a disk portion 8 which is rotatably supported by the main body 7 of the device, and has a shape similar to a windmill, and the whole is driven by a known drive means as shown in Fig. 1. It is rotatable in the direction of arrow A. The nozzle body 6 includes a plating liquid supply section 9 on the proximal end that is directly attached and fixed to the disk section 8;
The distal end side is engaged with a plurality of guide bars 10, 10 provided upright in the plating liquid supply section 9 via guide holes 11, 11, and is movable in both the circular direction and the radial direction of the rotary wheel 2. It consists of a plating liquid injection section 12.

Grooves 14 for receiving strip-shaped objects 13 to be plated are provided in the distal ends 5 of the plating liquid injection parts 12, respectively. The groove 14 is sized to have a width and a depth such that it can receive the rotating masking band 3 and the band-shaped plating material 13 together, as shown in FIG. The bottom surface 15 of the groove 14 of each plating liquid injection part 12 is provided with a strip-shaped plating liquid injection opening 1 corresponding to the plating target area 16 of the strip-shaped plating object 13.
One 7 is provided for each (some have more than one). In addition, pins 18 are set up near each of the plating liquid injection holes 17, and by engaging the pins 18 with a plurality of small holes 19 provided in advance in the longitudinal direction of the strip-shaped plating object 13, The plating liquid injection opening 17 of the plating liquid injection part 12 and the plating target part 16 of the band-shaped plating object 13 are accurately and reliably aligned.

Further, in this plating liquid injection part 12, an inlet flow path 20a and an outlet flow path 20b on the tip side of the plating liquid M are formed from the plating liquid injection opening 17 toward the inside thereof, and the inlet side Flow path 20a, outlet flow path 2
The end portions of 0b have an inlet insertion port 21a and an outlet insertion port 21a on the base end side, respectively. Further, an insoluble anode 22 is provided near the plating liquid injection opening 17 of the inlet flow path 20a. On the other hand, the plating liquid supply section 9 has an inlet pipe 23.
a, an outlet pipe 23b is provided, and the inlet pipe 23a and the outlet pipe 23b are fitted into the disk portion 8 with strong force. It should be noted that the plating liquid injection section together with the plating liquid supply section 9 can be moved only slightly in the direction of rotation or in the opposite direction of rotation around the inlet/outlet pipes 23a, 23b.

Further, the plating liquid supply section 9 has an inlet/outlet flow path 24 on the plating liquid supply section 9 side from the inlet/outlet pipes 23a, 23b toward the inside of the plating liquid supply section 9.
a and 24b are formed in an L shape, and this input
Inlet/outlet insertion ports 25a, 25b, which are the ends of the outlet flow paths 24a, 24b, are formed at positions facing the input/outlet insertion ports 21a, 21b. The inlet/outlet insertion ports 21a, 21b on the plating liquid injection section 12 side and the inlet/outlet insertion ports 25a, 25b on the plating liquid supply section 9 side are telescopic and flexible plating liquid supply/discharge ports. pipe 2
6a and 26b are connected and communicated. and,
Furthermore, inside the disk portion 8, one inlet/outlet distribution channel 27a, 27b is provided for one inlet/outlet pipe 23a, 23b, respectively. In other words, the number of inlet and outlet distribution channels 27 on both sides of the disk section 8 corresponds to the number of plating liquid injection sections 12.
a, 27b are formed. The inlet/outlet pipes 23 of the inlet/outlet distribution channels 27a, 27b
a, the other end other than 23b,
The outlet openings 28a, 28b are formed on the side surface of the tip of the rotating portions 29a, 29b of the disk portion 8 at equal intervals in the rotational direction.

Further, among the outer circumferential portion of the rotary wheel 2 formed by the tip 5 of the plating liquid injection part 12, a circular arc portion at an arbitrary angle near the top is a plating processing zone, that is, a "use area" 30, and the upper This "use area" of the entry/exit openings 28a and 28b
Inlet/outlet openings 28a, 2 of the portion located within 30
8b is communicated with a supply flow path 31a and a discharge flow path 31b for the plating liquid M that are previously formed inside the apparatus main body 7.

The rotating masking band 3 is for pressing the band-shaped plating material 13 into the groove 14 of the "use area" 30 of the rotating wheel 2, and as shown in FIG.
It has an endless shape suspended over 2d.

A pair of cathode rollers 4 as "cathode means" are disposed on at least one of the inlet and outlet sides of the rotating wheel 2 (in the illustrated example, only the inlet side as shown in FIG. 1). By passing the strip-shaped plated material 13 in contact between the cathode rollers 4 of the cathode rollers 4, the strip-shaped plated material 13 is efficiently turned into a cathode. Of course, the "cathode means" is not limited to this cathode roller 4, and a known cathode brush or other means may be employed.

Next, the effect will be explained. Either the rotary wheel 2 or the rotary masking band 3 is driven to rotate, or the strip-shaped plated material 13 is pulled in the horizontal direction, and the strip-shaped plated material 13 is turned into a cathode by the cathode roller 4 while the rotating wheel 2 is moved in the direction of arrow A. Let it move in a rotating manner. Then, the strip-shaped plated material 13 is pressed and held in the groove 14 at the tip of the nozzle body 6 by the rotating masking band 3 between the "use areas" 30, and the pins 18 are engaged with the corresponding small holes 19. Then, the plating target portion 16 of the band-shaped plating object 13 is accurately positioned to the plating liquid injection opening 17 of the plating liquid injection part 12. and,
In the rotary liquid injection part 12 located in this "use area" 30, the inlet opening 28a of the inlet distribution flow path 27a communicates with the plating liquid M supply flow path 31a of the apparatus main body 7, At the same time, the outlet opening 28b and the discharge passage 31b of the apparatus main body 7 are also communicated, so that only the plating liquid injection part 12 located within this "use area" 30 is supplied with a constant pressure to the supply passage 31a of the apparatus main body 7. The sent plating liquid M first passes through the supply channel 31.
a → Inlet opening 28a → Inlet distribution flow path 27a → Inlet pipe 23a → Inlet flow path 24a (plating liquid supply section 9 side) → Inlet insertion port 25a (plating liquid supply section 9 side) → Supply pipe 26a → Inlet side insertion port 21
a (on the plating liquid injection section 12 side)→inlet flow path 20a (on the plating liquid injection section 12 side). Ions are supplied by the anode 22 facing near the plating liquid injection hole 17 side of the inlet flow path 20a and reach the plating liquid injection hole 17.

Plural plating target parts 16 of band-shaped plating object 13
are aligned with the plurality of plating liquid injection holes 17 formed in the bottom surface 15 of the groove 14 as described above, and the upper side thereof is completely masked by the rotating masking band 3. The plating liquid M is applied to this plating liquid injection opening 1.
The plating target portion 16 of the strip-shaped plating object 13 flows into the outlet flow path 20b so as to turn back at the 7th part, and is exposed from the plating liquid injection opening 17 at this time.
The plating liquid M comes into contact with the plating process.
The plating liquid M is supplied with necessary and sufficient ions when passing through the anode 22 portion, but these ions are consumed as the plating liquid M comes into contact with the plating target area 16 of the strip-shaped object 13, and the ions are The plating liquid M that has consumed the
(Metting liquid injection part 12 side) → Output side insertion port 21
b (plating liquid injection part 12 side) → discharge pipe 26b
→Output side inlet port 25b (plating liquid supply section 12 side)
The liquid is discharged in the following order: → Outlet channel 24b (on the plating liquid supply section 12 side) → Outlet pipe 23b → Outlet distribution channel 27b → Outlet opening 28b → Discharge channel 31b.
On the other hand, at this time, each of the plating liquid injection parts 12 other than the "use area" 30 has an input/output distribution channel 27.
Since the inlet and outlet openings 28a and 28b of holes 28a and 27b are to be closed by the main body 7 of the apparatus, the plating liquid M sent at a constant pressure to the supply flow path 31a is supplied to these "use areas". There is no leakage from plating liquid injection parts 12 other than 30.

In addition, this partial plating device 1 adjusts the tension of the rotating masking band 3 while adjusting the position of the tension rollers 32a to 32b, so that the rotating masking band 3 deeply covers the rotating wheel 2 and comes into contact with the rotating wheel 2. The angle of the circular arc part can be made larger, that is, the "use area" 30 can be set longer, or conversely, the angle of the adjacent arc part can be made smaller to make the "use area" 30 longer.
It is also possible to set the value shorter than 30.
In this way, both the rotating wheel 2 and the rotating masking band 3 are rotated, and the band-shaped plating object 13 is rotated.
Although it is formed into an arc shape in the "use area" 30, it becomes almost horizontal as a whole, so while these conditions continue, the strip-shaped plated material 13 is formed in a portion corresponding to the length of the "use area" 30. Metsuki liquid injection hole 1
Multiple platings of sizes and shapes suitable for 7 will be applied successively intermittently.

If the rotating wheel 2 or the strip-shaped plating object 13 expands or contracts due to a change in the set temperature of the partial plating device 1 itself, or for other reasons, the strip-shaped plating object may If there is a slight positional misalignment with the small hole 19 of 13 and the pin 18 cannot be engaged, move the plating liquid injection part 12, which is provided with the misaligned pin 18, to the circle of the rotating wheel 2. By adjusting the arc length of the outer periphery of the rotary wheel 2 by moving it in the center direction or radial direction, the spacing [pitch p] between the plating liquid injection parts 12 can be changed and the positional deviation can be eliminated. It is. At this time, the plating liquid injection section 12 is connected to the plating liquid supply section 9.
The pitch p may also be adjusted by slightly moving the rotating wheel 2 in the rotational direction or in the opposite rotational direction.

Also, when plating different types of band-shaped plating objects 13 that have the same width but differ only in the pitch of the small holes 18, the plating liquid injection unit 1
The length of the outer circumference of the rotary wheel 2 is adjusted by moving the rotary wheel 2 forward and backward in the circular direction or radial direction of the rotary wheel 2, and the small hole 19 of the band-shaped plated material 13 is adjusted.
The pin 18 of the rotating wheel 1 may be engaged accurately with the pin 18 of the rotating wheel 1. At this time plating liquid injection part 12
To calculate the fixing position of
The interval length d of the small holes 19 is determined, and since the interval length x the number of plating liquid injection parts = outer circumference length, the fixed position of the plating liquid injection part 12 can be determined by finding the radius from this outer circumference length. decide. In addition, even if the pin 18 or other parts are damaged, there is no need to replace the entire rotating wheel 2.
It is sufficient to replace only the damaged plating liquid injection section 12.

FIG. 4 is a diagram showing another embodiment of the present invention. In this embodiment, the nozzle body 33 is of a "plating liquid injection type". An injection chamber 35 for plating liquid M is formed inside the plating liquid injection part 34, and the plating liquid M is injected from a nozzle 36 connected to the supply pipe 26a onto the band-shaped plated object 37 in this injection chamber 35. An anode 38 is provided at the tip of the nozzle 36, and the plating liquid M receives ions from the anode 38 to perform a plating process on the band-shaped plating object 37. Since the injection chamber 35 is connected to the discharge pipe 26b at the bottom, the plating liquid M after the plating process is discharged to the outside through the discharge pipe 26b. The other configurations, functions, and effects are the same as those of the previous embodiment, so redundant explanation will be omitted.

FIG. 5 is a diagram showing still another embodiment of the present invention. This partial plating device 39 uses two disk portions 40 and 41 and has a large number of nozzle bodies 42 arranged in an elliptical shape. By doing so, the "use area" 43 can be made longer, and therefore more strip-shaped plating objects 44 can be plated more quickly. The other configurations and operations are almost the same as those of the previous embodiment, so redundant explanation thereof will be omitted.

<Effects> Since the device for partial plating of a band-shaped plated object according to the present invention has the content as explained above, it is possible to perform partial plating of a band-shaped plated object in a simple and efficient manner. Even if the small holes of the plating object are misaligned, the misalignment can be easily and reliably corrected, improving the efficiency of plating processing and the accuracy of partial plating. There is an effect. Furthermore, since the length of the outer periphery can be adjusted, there is no need to replace the entire rotating wheel even when using different types of band-shaped plating materials with different hole spacings, and the plating fluid can be adjusted. By moving the injection part forward and backward in the circular direction and radial direction of the rotating wheel, the outer circumferential length can be adjusted so that the pin accurately engages the small hole, and also prevents part of the rotating wheel of the partial plating device from accidentally Even if it is damaged due to an accident or other reason, only the damaged part of the plating liquid injection part needs to be replaced, which is advantageous in terms of maintenance.

[Brief explanation of drawings]

FIG. 1 is a schematic front view of a partial plating device showing one embodiment of the present invention, FIG. 2 is a schematic cross-sectional view taken along the arrow - line in FIG. 1, and FIG. 3 is a portion shown in FIG. 1. FIG. 4 is an enlarged perspective view showing the plating liquid injection part of the plating device, FIG. 4 is a cross-sectional view of the nozzle body showing another embodiment of the present invention, and FIG. FIG. 2 is a schematic front view corresponding to the figure. DESCRIPTION OF SYMBOLS 1, 39... Partial plating device, 2... Rotating wheel, 3... Rotating masking band, 4... Cathode roller [cathode means], 5... Tip part, 6, 33,
42... Nozzle body, 9... Plating liquid supply section, 12,
34... Plating liquid injection part, 13, 37, 44... Band-shaped plated object, 14... Groove, 15... Bottom surface, 17... Plating liquid injection hole, 18... Pin, 19... Small hole, 22, 3
8... Anode, 30, 43... Usage area.

Claims (1)

[Scope of Claims] 1. A groove for receiving a band-shaped plated object having a plating liquid injection hole in the bottom surface, and a positioning pin that can freely engage a plurality of small holes formed in advance in the longitudinal direction of the band-shaped plated object. A rotating wheel is formed by collecting a plurality of plating liquid injection parts, each of which is provided at the tip thereof and connected to the plating liquid supply part by a flexible plating liquid supply/discharge pipe, so as to freely rotate concentrically; A circular arc portion of an arbitrary angle on the outer periphery of the rotating wheel formed by the tip of the liquid injection part is used as a usage area, and a band-shaped plating material can be freely pressed into the groove in this usage area with an endless rotating masking band, The plating liquid is applied to the cathodized belt-shaped plating object from the plating liquid injection opening of each plating liquid injection part; A device for partially plating a strip-shaped object, characterized in that the arc length of the outer circumferential surface of the rotating wheel is freely adjustable.