JPH0425253U - - Google Patents

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Publication number
JPH0425253U
JPH0425253U JP6594990U JP6594990U JPH0425253U JP H0425253 U JPH0425253 U JP H0425253U JP 6594990 U JP6594990 U JP 6594990U JP 6594990 U JP6594990 U JP 6594990U JP H0425253 U JPH0425253 U JP H0425253U
Authority
JP
Japan
Prior art keywords
hole
thickness
peripheral wall
metal package
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6594990U
Other languages
English (en)
Japanese (ja)
Other versions
JP2511136Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990065949U priority Critical patent/JP2511136Y2/ja
Publication of JPH0425253U publication Critical patent/JPH0425253U/ja
Application granted granted Critical
Publication of JP2511136Y2 publication Critical patent/JP2511136Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)
JP1990065949U 1990-06-21 1990-06-21 電子部品用メタルパッケ―ジ Expired - Lifetime JP2511136Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990065949U JP2511136Y2 (ja) 1990-06-21 1990-06-21 電子部品用メタルパッケ―ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990065949U JP2511136Y2 (ja) 1990-06-21 1990-06-21 電子部品用メタルパッケ―ジ

Publications (2)

Publication Number Publication Date
JPH0425253U true JPH0425253U (enrdf_load_stackoverflow) 1992-02-28
JP2511136Y2 JP2511136Y2 (ja) 1996-09-18

Family

ID=31598245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990065949U Expired - Lifetime JP2511136Y2 (ja) 1990-06-21 1990-06-21 電子部品用メタルパッケ―ジ

Country Status (1)

Country Link
JP (1) JP2511136Y2 (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011176068A (ja) * 2010-02-24 2011-09-08 Shinko Electric Ind Co Ltd 半導体パッケージ
JP2011228591A (ja) * 2010-04-22 2011-11-10 Kyocera Corp 素子収納用パッケージ、およびこれを備えた電子装置
JP2012038837A (ja) * 2010-08-05 2012-02-23 Toshiba Corp パッケージおよびその作製方法
JP2012156345A (ja) * 2011-01-27 2012-08-16 Kyocera Corp 半導体素子収納用パッケージ、およびこれを備えた半導体装置
JP2015082527A (ja) * 2013-10-21 2015-04-27 株式会社東芝 半導体パッケージ
JP2016086126A (ja) * 2014-10-28 2016-05-19 京セラ株式会社 半導体素子パッケージおよび半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0228350A (ja) * 1988-06-10 1990-01-30 Nec Yamagata Ltd 高周波半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0228350A (ja) * 1988-06-10 1990-01-30 Nec Yamagata Ltd 高周波半導体装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011176068A (ja) * 2010-02-24 2011-09-08 Shinko Electric Ind Co Ltd 半導体パッケージ
JP2011228591A (ja) * 2010-04-22 2011-11-10 Kyocera Corp 素子収納用パッケージ、およびこれを備えた電子装置
JP2012038837A (ja) * 2010-08-05 2012-02-23 Toshiba Corp パッケージおよびその作製方法
JP2012156345A (ja) * 2011-01-27 2012-08-16 Kyocera Corp 半導体素子収納用パッケージ、およびこれを備えた半導体装置
JP2015082527A (ja) * 2013-10-21 2015-04-27 株式会社東芝 半導体パッケージ
JP2016086126A (ja) * 2014-10-28 2016-05-19 京セラ株式会社 半導体素子パッケージおよび半導体装置

Also Published As

Publication number Publication date
JP2511136Y2 (ja) 1996-09-18

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EXPY Cancellation because of completion of term