JPH0424986A - Manufacture of electric laminate - Google Patents

Manufacture of electric laminate

Info

Publication number
JPH0424986A
JPH0424986A JP12510290A JP12510290A JPH0424986A JP H0424986 A JPH0424986 A JP H0424986A JP 12510290 A JP12510290 A JP 12510290A JP 12510290 A JP12510290 A JP 12510290A JP H0424986 A JPH0424986 A JP H0424986A
Authority
JP
Japan
Prior art keywords
prepreg
permitivity
sheets
laminate
stacking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12510290A
Other languages
Japanese (ja)
Other versions
JPH0691301B2 (en
Inventor
Tomohiko Nishida
西田 友彦
Yukio Matsushita
幸生 松下
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP2125102A priority Critical patent/JPH0691301B2/en
Publication of JPH0424986A publication Critical patent/JPH0424986A/en
Publication of JPH0691301B2 publication Critical patent/JPH0691301B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To realize free design of permitivity, by stacking a plurality of prepreg sheets, stacking a plurality of other prepreg sheets whose permitivity is different from the former ones, stacking both of the prepreg sheets, stacking metal foils on the prepreg sheets, and laminating them in a unified body. CONSTITUTION:For example, four prepreg sheets la of one sort and four prepreg sheets 1b of other sort are vertically stacked, and thereon metal foils 2 are stacked. These sheets are heated with pressure, and molded in a laminated body, thereby obtaining a laminate for electric use. When glass cloth substratum fluororesin prepreg (permitivity 2.7) is used as the four prepreg sheets 1a, and glass cloth substratum epoxy resin prepreg (permitivity 4.8) is used as the four prepreg sheets 1b, the following laminate is manufactured; the permitivity at the laminated part of the laminate for electric use is equal to about (2.7X4+4.8X4)divided by 8=3.7-3.8. Hence the permitivity at the laminated part can be set to be an arbitrary value, by selecting the combination of the number and the sort of the prepreg sheets of different permitivity.

Description

【発明の詳細な説明】[Detailed description of the invention] 【産業上の利用分野】[Industrial application field]

本発明は、プリント配線板に加工して使用される電気用
積層板の製造方法に関するものである。
The present invention relates to a method for manufacturing an electrical laminate that is processed into a printed wiring board.

【従来の技術】[Conventional technology]

電気機器や電子機器等に用(・られるプリント配線板は
、金属箔を貼った電気用積層板を加工することによって
作成される。すなわち、複数枚のプリプレグを重ねると
共に、これにさらにその片面あるいは両面に銅箔等の金
属箔を重ね、これを加熱加圧して積層成形することによ
って、電気用積層板を製造することができる。そしてこ
の電気用積層板の金属箔をエツチング処理して回路パタ
ーンを作成する等の加工をおこなうことによって、プリ
ント配線板に仕上げることができる。 このようなプリント配線板において、最近では回路を微
細でち密に設けるファインパターン化の要求が高くなっ
ているが、ファインパターンでは回路間の間隔が狭くな
っているために、パターン間のインピーダンスが低くな
ってノイズ障害が生じる等の問題がある。そしてプリン
ト配線板を作成した電気用積層板のき電率が高いとイン
ピーダンスが低くなってノイズ障害等が大きく発生する
ために、誘電率の低い電気用積層板を使用することが検
討されている。 ここで、電気用積層板において誘電率はその積層板を構
成する基材と樹脂とによって支配されるものであり、す
なわち基材に樹脂を含浸して形成されるプリプレグによ
って誘電率は支配されることになる。例えば、各種プリ
プレグにおいて誘雪率(ε)は ・紙基材7エ/−ル酊脂プリプレグ  ・・・4.3・
紙基材エポキシ樹脂プリプレグ   ・・・4.3・γ
ラス布基材エポキシ樹脂プリプレグ・・・4.8・〃ラ
ス布基材ポリイミドプリプレグ ・・・4.5・プラス
布基材ポリフェニレンオキ サイドプリプレグ          ・・・3.5・
〃ラス布基材7ツ素樹脂プリプレグ ・・・2.7であ
り、これらのプリプレグを用いて作成した電気用積層板
はそれぞれのプリプレグに特定の誘電率を有することに
なる6従って、ファインノくターンで回路形成する場合
には、f!誘電率低I−1プリプレグを用いて作成した
電気用積層板を使用することによって、回路間にノイズ
障害等が発生することを低減することができることにな
る。 しかし、誘電率の小さいプリプレグは一般的に高価であ
るために、例えば、特に高い7アインノ(ターンで回路
を形成する必要がある場合には誘電率が2,7のγラス
布基材7ツ素樹脂プリプレグを、中程度のファインパタ
ーンで回路を形成する場合には誘電率が3.5のがラス
布基材ボリフェニレンオ斗サイドプリプレグを、ファイ
ンノ(ターンの程度があまり高くないものではその他の
プリプレグをそれぞれ使用すると(・うように、ファイ
ンパターンの度合に応じて使用するプリプレグを選択す
るようにしている。
Printed wiring boards used in electrical and electronic equipment are made by processing electrical laminates covered with metal foil.In other words, by stacking multiple sheets of prepreg, one side or An electrical laminate can be manufactured by layering metal foil such as copper foil on both sides and laminating them by heating and pressing.Then, the metal foil of this electrical laminate is etched to form a circuit pattern. It is possible to finish a printed wiring board by performing processing such as creating a printed wiring board.In recent years, there has been an increasing demand for fine patterns in which circuits are formed in minute and dense patterns in such printed wiring boards. Since the spacing between circuits in the patterns is narrow, there are problems such as low impedance between the patterns and noise disturbances.Also, if the feeding rate of the electrical laminate used to make the printed wiring board is high, The use of electrical laminates with a low dielectric constant is being considered because the impedance becomes low and noise disturbances occur significantly.Here, in an electrical laminate, the dielectric constant is the property of the laminate. The dielectric constant is controlled by the base material and the resin, that is, the dielectric constant is controlled by the prepreg formed by impregnating the base material with the resin.For example, the snow dielectric constant (ε) of various prepregs is Paper base material 7/-le alcohol prepreg...4.3.
Paper-based epoxy resin prepreg...4.3・γ
Lath fabric base material epoxy resin prepreg...4.8・〃Lath fabric base material polyimide prepreg...4.5・Plus fabric base material polyphenylene oxide prepreg...3.5・
〃Russ cloth base material 7 core resin prepreg...2.7, and electrical laminates made using these prepregs have a specific dielectric constant for each prepreg6. When forming a circuit with turns, f! By using an electrical laminate made using low dielectric constant I-1 prepreg, it is possible to reduce the occurrence of noise disturbances between circuits. However, prepregs with a low dielectric constant are generally expensive, so for example, if it is necessary to form a circuit with turns, a prepreg with a dielectric constant of 2.7 can be used. When forming a circuit with a medium-fine pattern using basic resin prepreg, use lath cloth base polyphenylene side prepreg with a dielectric constant of 3.5, or use fine resin prepreg (for those with a not very high degree of turn, use other materials). When using each prepreg, the prepreg to be used is selected according to the degree of fine pattern.

【発明が解決しようとする課題] しかしながら、各プリプレグの誘電率は特定の数値であ
るために、プリプレグを用(1て作成した電気用積層板
の誘電率もプリプレグに応じた特定の数値のものしか得
られないものであり、ファインパターンの程度に応じて
電気用積層板の誘電率を自由に設計することができなり
・とり・う問題があった。 本発明は上記の点に鑑みて為されたものであり、電気用
積層板の誘電率の自由な設計が可能になる電気用積層板
の製造方法を提供することを目的とするものである。 【ts題を解決するための手段] 本発明に係る電気用積層板の製造方法は、複数枚のプリ
プレグを重ねると共にこのプリプレグと誘電率が異なる
他の複数枚のプリプレグを重ね、この両者をさらに重ね
ると共にこれに金属箔をさらに重ねてこれらを積層−像
化することを特徴とするものである。 プリプレグは紙やガラス布等の基材に各種の熱硬化性樹
脂(場合によっては熱可塑性樹脂)のワニスを含浸させ
て乾燥することによって作成されるものであり、既述の
ようにプリプレグの誘電率はその基材と樹脂の種類等に
よって所定の数値に設定される。そしてこのプリプレグ
を複数枚重ねると共に、この片面もしくは両面に銅箔な
どの金属箔を重ね、これを加熱加圧して積層成形するこ
とによって、片面もしくは両面に金属箔が張られた電気
用積層板を得ることができる。 ここで本発明においては、複数枚のプリプレグとして誘
電率の異なるものを組み合わせて用いるものであり、例
えば8枚のプリプレグを用いる場合には、ある種類のプ
リプレグを4枚重ねると共に他の種類のプリプレグを4
枚重ね、さらにこれらを重ねるようにして用いるもので
ある。例えば第1図に示すように、ある種類のプリプレ
グ1aを4枚重ねると共に他の種類のプリプレグ1bを
4枚重ね、これを上下に重ねてさらに金属M2を重ね、
これらを加熱加圧して積層成形することによって電気用
積層板を得ることができる。らちろんプリプレグ1a、
1bの枚数はこれに限定されるものではなく、例えば1
2図のように8枚のうちプリプレグ1aを5枚、プリプ
レグ1bを3枚用いるようにしてもよい。また、プリプ
レグはこのように2種類だけでなく、3種類あるいはさ
らに多くの種類を組み合わせて用いるようにしIよい。 例えばプリプレグとして総て〃ラス布基材フッ素樹脂プ
リプレグを使用すれば、電気用積層板の積層板部分の誘
電率(E)はこのプリプレグの誘電率と同じ2.7にな
り、またプリプレグとして総て7y5ス布基材エポキシ
樹脂プリプレグを使用すれば、電気用積層板の積層板部
分の誘電率はこのプリプレグの誘電率と同じ4.8にな
るが、第1図のように4枚のプリプレグ1aとしてガラ
ス布基材フッ素樹脂プリプレグを、4枚のプリプレグ】
bとして〃ラス布基材エポキシ樹脂プリプレグをそれぞ
れ使用して電気用積層板を製造すると、この電気用積層
板の積層板部分の誘電率はほば(27X4+4,8x4
)÷8=3.7〜3.8になる。また、第2図のように
5枚のプリプレグ1aとして〃ラス布基材7ツ素樹脂プ
リプレグ、3枚のプリプレグ1bとして〃ラス布基材エ
ポキシ樹脂プリプレグを用いると、電気用積層板の積層
板部分の誘電率はほぼ(2,’7xs+4.8X3)−
、−8=3.5となる。従って、誘電率の異なる各種の
プリプレグのうちどの種類のものを何枚ずつ組み合わせ
て使用するかで、電気用積層板の積層板部分の誘電率を
任意の数値に設定することができ、回路形成の7フイン
パターンの程度に合わせた誘電率の設計の自由度が大き
くなるものである。 【実施例1 以下本発明を実施例によって例証する。 K1九り 厚み0.1.5mmのグラス布に乾燥後の樹脂量が50
%になるようにエポキシ樹脂を含浸し、乾燥することに
よって誘電率が4.8の〃ラス布基材エポキシ樹脂プリ
プレグを得た。また厚み0.151のガラス布にポリフ
ェニレンオキサイド(PPO)を乾燥後の樹脂量が50
%になるように含浸し、乾燥することによって誘電率が
3.5のガラス布基材ポリフェニレンオキサイドプリプ
レグを得た。 次に第1図の配置で4枚のがラス布基材エポキシ樹脂プ
リプレグと4枚のガラス布基材ポリフェニレンオキサイ
ドプリプレグとを重ねると共に、さらに両面に厚み0.
0351iIIの銅箔を重ね、これを30kg/c11
2.180℃、90分の条件で加熱加圧して積層成形す
ることによって、厚み1゜6mff1の電気用積層板を
得た。この電気用積層板の誘電率は約4.1であった。 聚迷JLL 実施例1で得たがラス布基材エポキシ樹脂プリプレグの
みを8枚用い、あとは同様に積層成形することによって
、厚み1.61の電気用積層板を得た。この電気用積層
板の誘電率は4.8であった。 従来例2 実施例1で得たガラス布基材ポリフェニレンオキサイド
プリプレグのみを8枚用ν1、あとは同様に積層成形す
ることによって、厚み1.6mmの電気用積層板を得た
。この電気用積層板の誘電率は3.5であった。 ス1」[ζ 厚み0.15a+mのガラス布にポリイミドを乾燥後の
樹脂量が50%になるように含浸し、乾燥することによ
って誘電率が4.5の〃ラス布基材ポリイミドプリプレ
グを得た。 次に第2図の配置で実施例1で得た5枚のガラス布基材
ポリフェニレンオキサイドプリプレグと3枚の〃ラス布
基材ごリイミドプリプレグとを重ね、あとは同様に積層
成形することによって、厚み1.611+6の電気用積
層板を得た。この電気用積層板の誘電率は約3.9であ
った。 従」(例メし 実施例1で得た〃ラス布基材ポリイミドプリプレグのみ
を8枚用い、あとは同様に積層成形することによって、
厚み1.6II!sの電気用積層板を得た。この電気用
積層板の誘電率は4.5であった。 【発明の効果] 上述のように本発明にあっては、複数枚のプリプレグを
重ねると共にこのプリプレグと誘電率が異なる他の複数
枚のプリプレグを重ね、この両者をさらに重ねると共に
これに金属箔をさらに重ねてこれらを積層−像化するよ
うにしたので、誘電率の異なる各種のプリプレグのうち
どの種類のらのを何枚づつ組み合わせて使用するかによ
って、電気用積層板の誘電率を任意の数値に設定するこ
とができ、回路形成のファインパターンの程度に合わせ
た誘電率の設計の自由度が大きくなるものである。
[Problem to be solved by the invention] However, since the dielectric constant of each prepreg is a specific value, the dielectric constant of the electrical laminate made using prepreg (1) also has a specific value depending on the prepreg. However, the dielectric constant of the electrical laminate cannot be freely designed depending on the degree of fine patterning.The present invention has been developed in view of the above points. The purpose of this invention is to provide a method for manufacturing an electrical laminate that enables free design of the dielectric constant of the electrical laminate. [Means for solving the TS problem] The method for manufacturing an electrical laminate according to the present invention includes stacking a plurality of prepregs, stacking a plurality of other prepregs having different dielectric constants from this prepreg, stacking these two further, and further stacking a metal foil on top of the prepreg. It is characterized by laminating and forming these into an image.Prepreg is made by impregnating a base material such as paper or glass cloth with a varnish of various thermosetting resins (or thermoplastic resins in some cases) and drying it. As mentioned above, the dielectric constant of the prepreg is set to a predetermined value depending on the base material and the type of resin, etc. Then, multiple sheets of this prepreg are stacked and copper is coated on one or both sides. By stacking metal foils such as foils and laminating them by heating and pressing, it is possible to obtain an electrical laminate with metal foils on one or both sides.Here, in the present invention, a plurality of Prepregs with different dielectric constants are used in combination. For example, when using 8 sheets of prepreg, 4 sheets of one type of prepreg are stacked and 4 sheets of another type of prepreg are stacked.
They are used by stacking them and then stacking them again. For example, as shown in FIG. 1, four sheets of prepreg 1a of a certain type are stacked, four sheets of prepreg 1b of another type are stacked, these are stacked one above the other, and then metal M2 is stacked,
An electrical laminate can be obtained by heating and pressurizing these to form a laminate. Rachiron prepreg 1a,
The number of sheets 1b is not limited to this, for example, 1
As shown in FIG. 2, of the eight sheets, five prepregs 1a and three prepregs 1b may be used. Further, it is preferable to use not only two types of prepreg but also a combination of three or more types. For example, if a fluororesin prepreg with a lath fabric base is used as the prepreg, the dielectric constant (E) of the laminate portion of the electrical laminate will be 2.7, which is the same as the dielectric constant of this prepreg, and the total If a 7y5 cloth base epoxy resin prepreg is used, the dielectric constant of the laminate part of the electrical laminate will be 4.8, which is the same as the dielectric constant of this prepreg, but if four sheets of prepreg are used as shown in Figure 1, Glass cloth base material fluororesin prepreg as 1a, 4 prepregs]
When an electrical laminate is manufactured using lath cloth base epoxy resin prepreg as b, the dielectric constant of the laminate part of this electrical laminate is approximately (27X4+4, 8x4
)÷8=3.7 to 3.8. In addition, as shown in Fig. 2, if five prepregs 1a are made of lath cloth base 7-carbon resin prepregs, and three prepregs 1b are lath cloth base epoxy resin prepregs, the laminates of electrical laminates The dielectric constant of the part is approximately (2,'7xs+4.8x3)-
, -8=3.5. Therefore, the dielectric constant of the laminate part of the electrical laminate can be set to any value by selecting which type and how many prepregs are used in combination among various types of prepregs with different dielectric constants, and forming circuits. This increases the degree of freedom in designing the dielectric constant according to the degree of the seven-fin pattern. Example 1 The invention will now be illustrated by way of example. The amount of resin after drying is 50% on the K19 glass cloth with a thickness of 0.1.5mm.
% and dried to obtain a lath cloth base epoxy resin prepreg having a dielectric constant of 4.8. In addition, the amount of resin after drying polyphenylene oxide (PPO) on a glass cloth with a thickness of 0.151 is 50.
% and dried to obtain a glass cloth base polyphenylene oxide prepreg having a dielectric constant of 3.5. Next, in the arrangement shown in FIG. 1, four sheets of lath cloth-based epoxy resin prepreg and four sheets of glass cloth-based polyphenylene oxide prepreg are stacked, and a thickness of 0.5 mm is added on both sides.
0351iII copper foil is layered, and this is 30kg/c11
2. An electrical laminate having a thickness of 1°6 mff1 was obtained by heating and pressing under the conditions of 180° C. and 90 minutes to form a laminated sheet. The dielectric constant of this electrical laminate was approximately 4.1. Jumayo JLL An electrical laminate having a thickness of 1.61 mm was obtained by using only 8 sheets of the lath cloth base epoxy resin prepreg obtained in Example 1 and then performing lamination molding in the same manner. The dielectric constant of this electrical laminate was 4.8. Conventional Example 2 An electrical laminate having a thickness of 1.6 mm was obtained by laminating only the glass cloth base polyphenylene oxide prepreg obtained in Example 1 using ν1 for 8 sheets and the rest in the same manner. The dielectric constant of this electrical laminate was 3.5. A glass cloth with a thickness of 0.15a + m is impregnated with polyimide so that the amount of resin after drying is 50%, and by drying, a lath cloth base polyimide prepreg with a dielectric constant of 4.5 is obtained. Ta. Next, in the arrangement shown in Figure 2, the five glass cloth-based polyphenylene oxide prepregs obtained in Example 1 and the three glass cloth-based polyimide prepregs were stacked, and the rest was laminated in the same manner. An electrical laminate having a thickness of 1.611+6 was obtained. The dielectric constant of this electrical laminate was approximately 3.9. By using only 8 sheets of the lath fabric base polyimide prepreg obtained in Example 1 and laminating the rest in the same manner,
Thickness 1.6II! An electrical laminate of No. s was obtained. The dielectric constant of this electrical laminate was 4.5. [Effects of the Invention] As described above, in the present invention, a plurality of prepregs are stacked, a plurality of other prepregs having different dielectric constants are stacked, and both are further stacked and a metal foil is applied to this. Since these are further layered and imaged, the dielectric constant of the electrical laminate can be adjusted to any desired value depending on which prepregs with different dielectric constants are used in combination. It can be set to a numerical value, which increases the degree of freedom in designing the dielectric constant in accordance with the degree of fine pattern of circuit formation.

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図は積層成形の際のプリプレグの配置を
示す分解図である。 1 a、 1 bはプリプレグ、2は金属箔である。
FIGS. 1 and 2 are exploded views showing the arrangement of prepregs during lamination molding. 1 a and 1 b are prepregs, and 2 is a metal foil.

Claims (1)

【特許請求の範囲】[Claims] (1)複数枚のプリプレグを重ねると共にこのプリプレ
グと誘電率が異なる他の複数枚のプリプレグを重ね、こ
の両者を重ねると共にこれに金属箔をさらに重ねてこれ
らを積層一体化することを特徴とする電気用積層板の製
造方法。
(1) It is characterized by stacking a plurality of sheets of prepreg, stacking a plurality of other prepregs having different dielectric constants from this prepreg, stacking both, and further stacking a metal foil on top of this to form a laminated body. Method for manufacturing electrical laminates.
JP2125102A 1990-05-15 1990-05-15 Method for manufacturing electrical laminate Expired - Lifetime JPH0691301B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2125102A JPH0691301B2 (en) 1990-05-15 1990-05-15 Method for manufacturing electrical laminate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2125102A JPH0691301B2 (en) 1990-05-15 1990-05-15 Method for manufacturing electrical laminate

Publications (2)

Publication Number Publication Date
JPH0424986A true JPH0424986A (en) 1992-01-28
JPH0691301B2 JPH0691301B2 (en) 1994-11-14

Family

ID=14901902

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2125102A Expired - Lifetime JPH0691301B2 (en) 1990-05-15 1990-05-15 Method for manufacturing electrical laminate

Country Status (1)

Country Link
JP (1) JPH0691301B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07117174A (en) * 1993-10-26 1995-05-09 Matsushita Electric Works Ltd Metal-foiled laminated plate and manufacture thereof
WO2012172776A1 (en) * 2011-06-17 2012-12-20 パナソニック株式会社 Metal-clad laminated plate and printed wiring board
WO2021166548A1 (en) * 2020-02-18 2021-08-26 オムロン株式会社 Substrate with built-in component and power supply device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5375285A (en) * 1976-12-15 1978-07-04 Matsushita Electric Works Ltd Manufacture of synthetic resin laminate
JPS5375284A (en) * 1976-12-15 1978-07-04 Matsushita Electric Works Ltd Manufacture of synthetic resin laminate
JPS5418885A (en) * 1977-07-14 1979-02-13 Fujitsu Ltd Laminate sheet
JPS5574874A (en) * 1978-11-30 1980-06-05 Mitsubishi Gas Chemical Co Method of making coated composite sheet and copperrcoated laminated sheet
JPS6210112A (en) * 1985-07-05 1987-01-19 Mitsubishi Petrochem Co Ltd Ethylene copolymer and its production
JPS6335418A (en) * 1986-07-31 1988-02-16 Chlorine Eng Corp Ltd Concentration of yttrium solution
JPH02184096A (en) * 1989-01-11 1990-07-18 Ibiden Co Ltd Electronic circuit board

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5375285A (en) * 1976-12-15 1978-07-04 Matsushita Electric Works Ltd Manufacture of synthetic resin laminate
JPS5375284A (en) * 1976-12-15 1978-07-04 Matsushita Electric Works Ltd Manufacture of synthetic resin laminate
JPS5418885A (en) * 1977-07-14 1979-02-13 Fujitsu Ltd Laminate sheet
JPS5574874A (en) * 1978-11-30 1980-06-05 Mitsubishi Gas Chemical Co Method of making coated composite sheet and copperrcoated laminated sheet
JPS6210112A (en) * 1985-07-05 1987-01-19 Mitsubishi Petrochem Co Ltd Ethylene copolymer and its production
JPS6335418A (en) * 1986-07-31 1988-02-16 Chlorine Eng Corp Ltd Concentration of yttrium solution
JPH02184096A (en) * 1989-01-11 1990-07-18 Ibiden Co Ltd Electronic circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07117174A (en) * 1993-10-26 1995-05-09 Matsushita Electric Works Ltd Metal-foiled laminated plate and manufacture thereof
WO2012172776A1 (en) * 2011-06-17 2012-12-20 パナソニック株式会社 Metal-clad laminated plate and printed wiring board
TWI558544B (en) * 2011-06-17 2016-11-21 Panasonic Ip Man Co Ltd Metal clad laminate, and printed wiring board
US10009997B2 (en) 2011-06-17 2018-06-26 Panasonic Intellectual Property Management Co., Ltd. Metal-clad laminate and printed wiring board
WO2021166548A1 (en) * 2020-02-18 2021-08-26 オムロン株式会社 Substrate with built-in component and power supply device

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