JPH04248703A - Package for microwave band integrated circuit - Google Patents

Abstract

PURPOSE:To reduce the effect of a cavity resonator formed by a package to accommodate the microwave band integrated circuit air-tightly. CONSTITUTION:A sealing metal cap 11 covers air-tightly a metallic header 12 mounted on a base 13. A resistor 14 is brazed to an inner face of the sealing metallic cap 11, and the said resistor 14 is formed by forming a resistive film 14a onto one side of a plate made of an alumina ceramic and forming a conductive film 14b onto the other side. When a microwave signal flows to the microwave integrated circuit formed on the base 13, resonance is caused in the cavity resonator formed by a seal metallic cap 11 and a metallic header 12, but a loss is caused to the microwave in the cavity resonator by the resistance film 14a of the resistor 14, then the Q is reduced.

Description

[Detailed description of the invention]

0001

[Field of Industrial Application] The present invention relates to a package for a microwave band integrated circuit that airtightly houses a microwave band integrated circuit, and more particularly, to a microwave band integrated circuit package that airtightly houses a microwave band integrated circuit. Relating to packages for integrated circuits.

0002

2. Description of the Related Art FIG. 3 shows a conventional microwave band integrated circuit package in a top view, and FIG. 4 shows a partially cutaway side view.

In the figure, 1 is a sealing metal cap; 2 is a sealing metal cap;
is a metal header, the metal header 2 places a substrate 3 on which a microwave band integrated circuit is formed, and the sealing metal cap 1 airtightly covers the metal header 2 on which the substrate 3 is placed. are doing.

In this configuration, since the metal header 2 and the metal sealing cap 1 form a rectangular cavity resonator, the lowest resonant frequency of the cavity resonator is lower than the frequency band used by the microwave integrated circuit. The dimensions of the microwave band integrated circuit package are determined so that the

[0005]

SUMMARY OF THE INVENTION The conventional microwave band integrated circuit package described above has the following problems. one. When the operating frequency of microwave integrated circuits extends to the millimeter wave band, if the lowest resonant frequency of the cavity resonator for the same frequency band is to be made sufficiently high, the dimensions of the package for microwave integrated circuits must be made extremely small. This makes it difficult to form microwave integrated circuits. two. When configuring a nonlinear circuit such as an oscillator or mixer on a substrate, it is necessary to ensure that the lowest resonant frequency of the cavity resonator is sufficiently high not only for the fundamental wave but also for its harmonics. However, in reality, due to the dimensions of the package, the harmonics can only be made lower than the lowest resonant frequency of the cavity resonator up to two to three times the fundamental wave.

The present invention has been made in view of the above-mentioned problems, and is a microwave band integrated circuit capable of reducing the influence of a cavity resonator formed by a package for airtightly housing a microwave band integrated circuit. The purpose is to provide packages for integrated circuits.

[0007]

[Means for Solving the Problems] In order to achieve the above object, the invention according to claim 1 provides a conductor package for airtightly accommodating a microwave band integrated circuit, in which a resistor film is formed on the surface of a non-conductor substrate. A plate-shaped resistor having a shape formed thereon is attached to the inner circumferential surface of the package.

[0008]

[Operation] In the invention according to claim 1 configured as described above, a plate-like resistor in which a resistor film is formed on the surface of a non-conductor substrate is attached to the inner circumferential surface of the package, and the plate-like resistor is attached to the inner peripheral surface of the package. The microwaves in the resistive band film cause a loss, which lowers the Q of the oscillation frequency in the cavity resonator.

[0009]

Embodiments Hereinafter, embodiments of the present invention will be explained based on the drawings. FIG. 1 shows a partially cutaway side view of a microwave band integrated circuit package according to an embodiment of the present invention. In the same figure, 11 is a metal cap for sealing, 12 is a metal header, the metal header 12 is mounted with a substrate 13 on which a microwave band integrated circuit is formed, and the metal cap 11 for sealing is a metal header on which the substrate 13 is mounted. Placed metal header 12
The top is covered airtight.

A resistor 14 is brazed to the inner surface of the sealing metal cap 11, and the resistor 14 has a resistor film 14a formed on one side of a plate-shaped body made of alumina ceramic, and a conductor on the other side. It is constructed by forming a film 14b.

Next, the operation of this embodiment having the above configuration will be explained. When a microwave signal flows through the microwave integrated circuit formed on the substrate 13, the sealing metal cap 11
Resonance occurs in the cavity resonator formed by the metal header 12. However, since the microwave in the cavity resonator suffers loss due to the resistor film 14a of the resistor 14, the Q value decreases.

Therefore, the resistor film 14 in the resistor 14
By appropriately selecting the sheet resistance of a, the substrate 13
The Q of the square cavity resonator can be lowered to an extent that does not adversely affect the above circuit.

In the above embodiment, the resistor film 14a is formed on one side of the alumina ceramic, but if it is necessary to increase the sheet resistance, it is also possible to form the resistor film 14a on both sides. It is. Further, the resistor 14 is connected to the substrate 13 in the sealing metal cap 11.
The sealing metal cap 11 is provided only on the facing surface of the sealing metal cap 11.
It can also be provided on the inner surface of the side surface to further increase the resistance value.

[0014]

[Effects of the Invention] As explained above, the present invention can reduce the Q against unnecessary oscillation by providing a resistor on the inner surface of the cavity resonator, so that the package can be made so small that it reduces the manufacturability. It is possible to provide a package for a microwave band integrated circuit that is unnecessary and can reduce the adverse effect on harmonics of the fundamental wave even when configuring a nonlinear circuit.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway side view of a microwave band integrated circuit package according to an embodiment of the present invention.

FIG. 2 is a side view of a resistor.

FIG. 3 is a top view of a conventional microwave band integrated circuit package.

FIG. 4 is a partially cutaway side view of a conventional microwave band integrated circuit package.

[Explanation of symbols]

11...Metal cap for sealing 12...Metal header 14...Resistor 14a...Resistor film 14b...Conductor film

Claims (1)

[Claims] Claim 1: In a conductor package that airtightly houses a microwave band integrated circuit, a plate-shaped resistor in which a resistor film is formed on the surface of a non-conductor substrate is attached to the inner peripheral surface of the package. A microwave band integrated circuit package featuring: