JP2998947B2 - Package for microwave circuit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a microwave circuit package containing a material having an electromagnetic wave absorbing function.

[0002]

2. Description of the Related Art FIG. 8 is a view showing the structure of a conventional metal package for a microwave circuit. In this package, a frame 108 is made of a metal 208, and a rectangular cavity portion 708 for mounting a microwave element therein and an insulator substrate on which a signal conductor 808 for inputting and outputting a microwave signal are mounted. 908 are provided, and a lead 608 for inputting / outputting a microwave signal is attached to the outside.

FIG. 9 is a diagram showing the structure of another conventional microwave circuit package. The package includes a frame 109 formed on a metal base 509 and a paste-like metal.
209 and ceramic 309 are alternately laminated, and the surface is coated with a paste-like metal. Also,
Inside the frame 109, a rectangular cavity portion 709 for mounting a microwave element and an insulator substrate 909 on which a signal line conductor 809 for inputting and outputting a microwave signal are mounted.
And a lead 609 for inputting / outputting a microwave signal is attached to the outside. The features of the package are:
The processing cost is smaller than that of the metal package shown in FIG.

The package shown in FIGS. 8 and 9 has a structure in which the frame contains metal and is kept at the same potential, so that the ring resonance generated between the input and output portions of the microwave signal is suppressed. In addition, the isolation between the input and output terminals is sufficiently ensured.

[0005]

Generally, in the rectangular cavity portion in the package shown in FIGS. 8 and 9, a cavity resonance determined by the size of the cavity occurs at both ends of the input / output portion of the microwave signal. There are many modes in the cavity resonance. Among them, FIG. 10 shows the distribution of the electric field and the magnetic field in the cavity of the lowest resonance mode (the frequency is called a cutoff frequency) which occurs at the lowest frequency. Thus, the cutoff frequency,
And at frequencies near that, the energy due to cavity resonance is subtracted from the original microwave signal, hindering good propagation of the microwave signal. FIG. 11 shows a relationship (straight line 11) between the cavity width and the cutoff frequency when the cavity shape in the package is a square.

That is, in the conventional package,
Since the usable frequency band is limited to the cut-off frequency or lower, the cavity size in the package must be reduced in order to increase the usable frequency band. For example, when constructing a package to be used in the frequency band of 40 GHz or more, it is necessary to reduce the cavity width to 5 mm or less and to perform fine pattern processing to attach input / output terminals and leads. However, the dimensions of the microwave circuit element contained in the package,
Considering the processing accuracy of the package and the cost required for the processing, the size of the package is limited to about 5 mm. Therefore, in the conventional package, the frequency band that can be used effectively is at most about 40 GHz.

The present invention has been made in view of the above circumstances, and an electromagnetic wave absorbing material or a powder having an electromagnetic wave absorbing function capable of absorbing electric or magnetic energy is provided on a frame portion of a microwave circuit package. To provide a microwave circuit package that can absorb the resonance energy generated in the cavity by newly inserting the added insulator, suppress the cavity resonance, and dramatically expand the usable frequency band. Aim.

[0008]

In order to solve the above-mentioned problems, the present invention provides a microwave circuit package having a substantially rectangular parallelepiped shape, comprising a metal and an electromagnetic wave absorbing material.
Alternatively, it is characterized by having a structure in which a metal frame, an insulator, and an electromagnetic wave absorbing material are alternately laminated on a metal base, and the package frame has a metal and an electromagnetic wave absorbing function. , And a structure in which these are alternately stacked on a metal base, and the frame of the package is made of a metal of the block and an electromagnetic wave absorbing material of the block, or The block is made of a metal of the block, an insulator of the block and an electromagnetic wave absorbing material of the block, and these are arranged along a frame of the frame on a metal base. Structure made of metal and block insulator to which powder having electromagnetic wave absorption function is added Is, a characterized in that they are arranged along the frame of the frame on a metal base, either an invention relates to a structure of a package that can suppress cavity Lee resonance. That is, in the present invention,
In order to solve the above problem, a package having a conventional structure is newly inserted with an insulator to which an electromagnetic wave absorbing material or a powder having an electromagnetic wave absorbing function is added.

[0009]

According to the above means, an electromagnetic wave absorbing material capable of absorbing electric or magnetic field energy or an insulator to which a powder having an electromagnetic wave absorbing function is added is newly inserted into the frame portion of the microwave circuit package. Therefore, the resonance energy generated in the cavity can be absorbed and the cavity resonance can be suppressed.

[0010]

[Embodiment 1] FIG. 1 is a view for explaining a first embodiment according to the present invention, and shows a structure of a package made of a metal and an electromagnetic wave absorbing material.

As shown in FIG. 1, on a metal base 501,
A sheet-shaped electromagnetic-wave-absorbing material 401 provided with a cavity portion 701 and a mounting portion of a lead 601 serving as a microwave signal input / output portion is formed in advance. Next, a paste-like metal 201 is applied on the electromagnetic wave absorbing material 401 and laminated to a required thickness to form the frame 101. Subsequently, in order to keep the potential of the metal in the frame constant, the surface of the frame is applied with a paste-like metal and fired simultaneously. Finally, an insulator substrate 901 on which a signal line conductor 801 for inputting / outputting a microwave signal is formed, and a lead 60
Complete the package by attaching 1.

When the package having the above structure is used, since the electromagnetic wave absorbing material for absorbing the electric or magnetic field energy is newly used for the frame, the distribution of the electric and magnetic fields in the cavity is shown in FIG. Thus, the resonance phenomenon that occurs in the conventional package does not occur.

As an example of the operation and effect of the present invention, ferrite is used as an electromagnetic wave absorbing material, and a through line whose input and output portions are short-circuited is inserted into a package having a cavity size of 10 mm square to transmit a microwave signal. Input and its insertion characteristics were measured. In the conventional package of the same dimensions, cavity resonance was observed around 20 GHz, and the practically usable frequency band was about 15 GHz, whereas the package according to the present embodiment had a flat surface with no ripple between about 60 GHz. The characteristics are obtained, and the frequency range that can be used as a microwave circuit package is expanded.

In the above example, a package having a cavity size of 10 mm square has been described. However, a package having an arbitrary cavity size may be formed by using an electromagnetic wave absorbing material exhibiting an electromagnetic wave absorbing effect in a frequency band including its cutoff frequency. The same effect can be obtained.

[Embodiment 2] FIG. 2 is a view for explaining a second embodiment according to the present invention, and is a view showing a structure of a package made of metal, ceramic which is an insulator, and an electromagnetic wave absorbing material. It is.

As shown in FIG. 2, on a metal base 502,
A sheet-shaped ceramic 302 provided with a cavity portion 702 and a mounting portion of a lead 602 serving as a microwave signal input / output portion in advance, and a sheet-shaped electromagnetic wave absorbing material
Form 402. Next, a paste-like metal 202 is applied on the ceramic 302 and the electromagnetic wave absorbing material 402, and alternately laminated by a required thickness to form the frame 102.
Is configured. Subsequently, in order to keep the potential of the metal in the frame constant, the surface of the frame is applied with a paste-like metal and fired simultaneously. Finally, the package is completed by attaching the insulator substrate 902 on which the signal line conductor 802 for microwave signal input / output is formed and the leads 602.

The operation and effect of this embodiment are the same as those of the first embodiment.

[Embodiment 3] FIG. 3 is a view for explaining a third embodiment of the present invention, and shows a structure of a package made of ceramic to which metal and a powder having an electromagnetic wave absorbing function are added. FIG.

First, in a ceramic green sheet forming step, a powder having an electromagnetic wave absorbing function is added and uniformly distributed in the sheet to obtain a ceramic 403 having an electromagnetic wave absorbing function. Next, as shown in FIG. 3, a ceramic 403 having a cavity portion 703 and a mounting portion of a lead 603 serving as a micro signal input / output portion is formed on a metal base 503 in advance. The frame 103 is formed by applying a paste-like metal 203 and laminating it to a required thickness.
Subsequently, in order to keep the potential of the metal in the frame constant, the surface of the frame is applied with a paste-like metal and fired simultaneously. Finally, an insulator substrate 903 on which a signal line conductor 803 for input / output of a microwave signal is formed, and a lead 603
To complete the package.

In the present invention, the function and effect when ferrite powder is used as the powder having an electromagnetic wave absorbing function are the same as those in the first embodiment.

[Embodiment 4] FIG. 4 is a view for explaining a fourth embodiment according to the present invention, and shows a structure of a package made of metal and an electromagnetic wave absorbing material.

As shown in FIG. 4, on a metal base 504,
Along the frame of the frame, metal 204 of the block provided with a cavity portion 704 in advance, electromagnetic wave absorbing material 404 of the block, and metal 204 of the block provided with a mounting portion of a lead 604 serving as an input / output portion of a microwave signal in advance. Are alternately arranged to form a frame 104. At this time, the metal base and the block, and between the blocks are bonded with, for example, a conductive paste or an organic adhesive. Subsequently, in order to keep the potential of the metal in the frame constant, the surface of the frame is applied with a paste-like metal and fired simultaneously. Finally, the package is completed by attaching the insulator substrate 904 on which the signal line conductor 804 for inputting / outputting the microwave signal is formed and the lead 604.

The operation and effect of this embodiment are the same as those of the first embodiment.

[Embodiment 5] FIG. 5 is a view for explaining a fifth embodiment according to the present invention, and is a view showing the structure of a package made of metal, ceramic which is an insulator, and an electromagnetic wave absorbing material. It is.

As shown in FIG. 5, on a metal base 505,
Along with the frame of the frame, a block metal 205 in which a cavity portion 705 is previously provided, a ceramic 305, an electromagnetic wave absorbing material 405, and a mounting portion of a lead 605 which is a microwave signal input / output portion are provided in advance. Are alternately arranged to form a frame 105. At this time, the metal base and the block, and between the blocks, are bonded with a conductive paste or an organic adhesive. Subsequently, in order to keep the potential of the metal in the frame constant, the surface of the frame is applied with a paste-like metal and fired simultaneously. Finally, the package is completed by attaching the insulator substrate 905 on which the signal line conductor 805 for input / output of the microwave signal is formed and the leads 605.

The operation and effect of this embodiment are the same as those of the first embodiment.

[Embodiment 6] FIG. 6 is a view for explaining a sixth embodiment of the present invention, and shows a structure of a package made of a metal and a ceramic to which a powder having an electromagnetic wave absorbing function is added. FIG.

First, in a ceramic green sheet forming step, a powder having an electromagnetic wave absorbing function is added and uniformly distributed in the sheet to obtain a ceramic 406 having an electromagnetic wave absorbing function. Next, as shown in FIG. 6, on the metal base 506, along the frame of the frame, the metal 20 of the block provided with the cavity portion 706 in advance.
The frame 106 is formed by alternately arranging the blocks 206 and the ceramics 406 of the block and the metal 206 of the block in which a mounting portion of a lead 606 serving as an input / output portion of a microwave signal is provided in advance. At this time, the metal base and the block, and between the blocks, are bonded with a conductive paste or an organic adhesive. Subsequently, in order to keep the potential of the metal in the frame constant, the surface of the frame is applied with a paste-like metal and fired simultaneously. Finally, the package is completed by attaching the insulator substrate 906 on which the signal line conductor 806 for inputting / outputting the microwave signal is formed and the leads 606.

In this embodiment, the function and effect when ferrite powder is used as the powder having the electromagnetic wave absorbing function are the same as those in the first embodiment.

In the embodiment described above, the method of manufacturing the package is not limited to the above-described method.

In the embodiments described above, it is needless to say that the same effect can be obtained by using an electromagnetic wave absorbing material such as a carbon-based material or a powder having an electromagnetic wave absorbing function as the electromagnetic wave absorbing material.

Further, in the embodiment described above, it is needless to say that the same effect can be obtained by using another insulator such as resin or glass epoxy instead of ceramic.

In the first to third embodiments described above, the metal is in the form of a paste, but a metal in the form of a sheet may be used. In this case, as a method of keeping the potential of the laminated sheet-shaped metal constant, a via conductor may be formed in the frame, in addition to a method of applying the surface of the frame with a paste-like metal.

[0034]

As described above, according to the present invention, cavity resonance can be achieved by newly inserting an electromagnetic wave absorbing material or an insulator added with a powder having an electromagnetic wave absorbing function into a microwave circuit package. A package that can be suppressed can be provided, and the usable frequency band can be dramatically expanded.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view for explaining a first embodiment according to the present invention.

FIG. 2 is a partially cutaway perspective view for explaining a second embodiment according to the present invention.

FIG. 3 is a partially cutaway perspective view for explaining a third embodiment according to the present invention.

FIG. 4 is a perspective view for explaining a fourth embodiment according to the present invention.

FIG. 5 is a perspective view for explaining a fifth embodiment according to the present invention.

FIG. 6 is a perspective view for explaining a sixth embodiment according to the present invention.

FIG. 7 is an explanatory diagram showing an example of distribution of an electric field and a magnetic field in a cavity when cavity resonance is suppressed according to the present invention.

FIG. 8 is a perspective view showing the structure of a conventional microwave circuit package.

FIG. 9 is a partially cutaway perspective view showing the structure of another conventional microwave circuit package.

FIG. 10 is an explanatory diagram showing a distribution of an electric field and a magnetic field in a cavity in a conventional lowest-order resonance mode.

FIG. 11 is a characteristic diagram showing a relationship between a cavity width and a cutoff frequency in a conventional package.

[Explanation of symbols]

101,102,103,104,105,106,108,109 ... frame, 201,20
2,203,209… Paste-like metal, 204,205,206,208… Metal, 302,309… Sheet-like ceramic, 305… Ceramic, 401,402,404,405… Electromagnetic wave absorbing material, 403,406… Ceramic with added powder having electromagnetic wave absorbing function, 50
1,502,503,504,505,506,509… metal base, 601,602,60
3,604,605,606,608,609… lead, 701,702,703,704,70
5,706,708,709… cavity part, 801,802,803,804,80
5,806,808,809 ... signal line conductors for input and output of microwave signals, 901,902,903,904,905,906,908,909 ... insulator substrates,
11 ... Line showing the relationship between cavity width and cutoff frequency.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-237053 (JP, A) JP-A-62-18739 (JP, A) JP-A-2-220496 (JP, A) 163750 (JP, U) Hikaru Hei 2-84398 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 9/00

Claims (4)

(57) [Claims] In a microwave circuit package having a substantially rectangular parallelepiped shape, a frame of the package is made of a metal and an electromagnetic wave absorbing material or a metal and an insulator and an electromagnetic wave absorbing material, which are alternately formed on a metal base. A microwave circuit package having a laminated structure. 2. A microwave circuit package having a substantially rectangular parallelepiped shape, wherein the frame of the package is made of a metal and an insulator to which a powder having an electromagnetic wave absorbing function is added, and these are alternately formed on a metal base. A microwave circuit package having a laminated structure. 3. A microwave circuit package having a substantially rectangular parallelepiped shape, wherein the frame of the package is made of a block metal and a block electromagnetic wave absorbing material, or a block metal and a block insulator and a block electromagnetic wave absorbing material. And a package for a microwave circuit, wherein these are arranged along a frame of a frame on a metal base. 4. A microwave circuit package having a substantially rectangular parallelepiped shape, wherein the frame of the package is formed of a block metal and a block insulator to which a powder having an electromagnetic wave absorbing function is added, and these are made of a metal base. A microwave circuit package, which is alternately arranged along a frame of a frame.