JP2000164745A - Cap for hermetic package and the hermetic package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reinforce a resin base for increasing the apparent mechanical strength of a metal layer, allowing it to be thinned by attaching a resin base, a metal layer and an adhesive layer to a cap of a hermetic package for hermetically housing electronic elements. SOLUTION: One electrode 4 extends via one notch 2 to the surface of a substrate 1, and another electrode 5 runs around the periphery of the substrate 1 to the back of the substrate 1 via another notch 3. A support 6 for a crystal oscillator is made of the same material and with the same thickness as those of the electrodes 4, 5, an insulative frame 7 of the same glass ceramics, etc., as the substrate 1 is overlaid on the substrate 1 having the support 6 and sintered into a single body. The exposed electrodes 4, 5 and the support 6 are plated with Ni/Au to improve the solderability of electronic elements such as crystal oscillator, etc. The substrate 1 and the frame 7 form a hermetic package body, the crystal oscillator and electronic element such as SAW devices are connected and fixed with a conductive adhesive, etc., and a cap for sealing openings is fixed hermetically.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hermetic package cap for hermetically sealing electronic elements such as a quartz oscillator, a quartz oscillator, and a SAW device, and an hermetic package using the same.

[0002]

2. Description of the Related Art A hermetic package for enclosing an electronic element such as a quartz oscillator is a surface-mount type and thinner as electronic devices incorporating the same have become lighter and thinner. An airtight package of this type is disclosed, for example, in Japanese Utility Model Laid-Open No. 6-77328.
No. 6,086,045.

[0003] A typical conventional structure will be described below. FIG. 9 is a plan view of the surface-mount type crystal unit from which the cap is removed, and FIG. 10 is a longitudinal sectional view taken along line EE of FIG. In the figure, reference numeral 61 denotes a rectangular insulating substrate (hereinafter, simply referred to as a substrate) made of alumina ceramic or the like, and has semicircular notches 62 and 63 at both ends in the longitudinal direction. 6
Reference numerals 4 and 65 denote electrodes made of tungsten or the like formed on the upper surface, end surface, and bottom surface of the substrate 61. One electrode 64 is formed to extend to the back surface of the substrate 61 through one notch 62 and the other is formed. The electrode 65 is formed so as to bypass the peripheral portion of the substrate 61 and extend to the back surface of the substrate 61 through the other cutout 63. Reference numeral 66 denotes a support portion called a "pillow" for supporting an electronic element such as a quartz oscillator, and the electrode 64,
65 and the same material. Reference numeral 67 denotes an insulating frame made of alumina ceramic or the like.
And the substrate 61 on which the support portion 66 is formed,
Sintered and integrated. Exposed electrode 64,
The Ni plating and the Au plating are applied to the support 65 and the support portion 66 to improve the solderability of an electronic element such as a quartz oscillator. 68 denotes the substrate 61 or the insulating frame 6
After the electronic element is housed in the package body formed by 7, it is hermetically fixed and sealed with an adhesive 69 such as glass with a cap made of alumina ceramic for sealing the opening. Here, when the electrodes 64 and 65 formed extending on the back surface of the substrate 61 are connected and fixed to a printed board or the like by soldering or the like, electrical connection and mechanical fixing can be performed simultaneously. When power is supplied to the electronic element housed inside through the electrodes 64 and 65, the electronic element operates and its output can be taken out from the electrodes 64 and 65 to the outside.

[0004]

By the way, in the hermetic package using the above-mentioned alumina ceramic cap 68, even if it is attempted to reduce the thickness of the cap in order to reduce the height, the thickness is reduced to 0.1 mm in terms of mechanical strength. The thickness cannot be reduced to 2 mm or less, and therefore, there is a limit in reducing the thickness of the whole hermetic package. Also, it is true that a metal cap can be used to make it thinner than a ceramic cap, but a metal cap can also be made thinner by 0.1 mm or less in terms of mechanical strength. could not.

Accordingly, an object of the present invention is to provide a cap for an airtight package which is thinner than a cap made of ceramic or metal. Another object of the present invention is to provide a thinner airtight package using the above cap.

[0006]

According to a first aspect of the present invention, there is provided a cap for an airtight package for hermetically enclosing an electronic element, comprising a resin base material, a metal layer and an adhesive layer. Which is a cap for an airtight package.

According to a second aspect of the present invention, there is provided a cap for an airtight package for hermetically sealing an electronic element, wherein the resin base material has a thickness of 0.04 mm or less and a resin base material having a thickness of 0.06 mm or less. An airtight package cap having a metal layer and an adhesive layer.

According to a third aspect of the present invention, there is provided a cap for an airtight package for hermetically enclosing an electronic element such as a crystal device, wherein the thickness is selected from an epoxy resin, a polyimide resin and a glass epoxy material. 0.04
mm or less, a metal layer having a thickness of 0.06 mm or less selected from copper foil, copper plating thin film, nickel foil and nickel plating thin film, and solder, low melting point glass and resin adhesive. And an adhesive layer selected from the group consisting of:

According to a fourth aspect of the present invention, there is provided an airtight package for hermetically enclosing an electronic element such as a crystal device, wherein a cap comprising a resin base material, a metal layer and an adhesive layer is attached to the adhesive material. An airtight package characterized by being sealed in a package body with a layer.

According to a fifth aspect of the present invention, there is provided an airtight package for hermetically enclosing an electronic element such as a quartz device, wherein a resin base material having a thickness of 0.04 mm or less and a resin base material having a thickness of 0.06 mm or less are provided. Wherein the cap including the metal layer and the adhesive layer is sealed in the base body.

According to a sixth aspect of the present invention, there is provided an airtight package for hermetically enclosing an electronic element such as a crystal device, wherein a thickness selected from an epoxy resin, a polyimide resin and a glass epoxy material is zero. A resin base material having a thickness of 0.06 mm or less and a thickness selected from a copper foil, a copper plating thin film, a nickel foil and a nickel plating thin film of 0.06
mm, and a cap comprising a solder layer, an adhesive layer selected from a low-melting-point glass and a resin adhesive is sealed to the package body by the adhesive layer. It is an airtight package.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a surface-mounted hermetic package A according to a first embodiment of the present invention with a cap removed.
FIG. 2 is a longitudinal sectional view taken along line AA of FIG. In the figure, reference numeral 1 denotes a rectangular insulating substrate (hereinafter simply referred to as a substrate) made of glass ceramic or the like having a thermal expansion coefficient of about 12 × 10 −6 / ° C. in which ceramic fine particles are mixed in glass.
It has cutouts 2 and 3 in a semicircular arc shape at both ends in the long axis direction.
Reference numerals 4 and 5 denote A formed on the top, end, and bottom surfaces of the substrate 1.
An electrode made of g-Pd or the like having a thickness of about 0.05 mm,
One electrode 4 is formed to extend to the back surface of the substrate 1 through one notch 2, and the other electrode 5 bypasses the peripheral portion of the substrate 1 and passes through the other notch 3 to form the substrate 1. Is formed so as to extend to the back surface. Reference numeral 6 denotes a support portion called a “pillow” for supporting an electronic element such as a quartz oscillator,
5 and the same thickness at the same time. 7
Is an insulating frame made of the same glass ceramic or the like as the substrate 1, and is superposed on the substrate 1 on which the electrodes 4, 5 and the support portion 6 are formed, sintered and integrated. The exposed electrodes 4, 5 and the support 6 are plated with Ni or Au to improve the solderability of an electronic element such as a quartz oscillator. The substrate 1 or the insulating frame 7 forms an airtight package body. Electronic elements (not shown) such as a quartz oscillator, a quartz oscillator, and a SAW device are connected and fixed to the package body formed by the substrate 1 or the insulating frame 7 with a conductive adhesive or the like. Reference numeral 8 denotes a cap that seals the opening of the package body after the electronic element is housed in the package body, and is hermetically fixed and sealed with an adhesive.

As shown in a partially enlarged sectional view of FIG. 2, the cap 8 includes a resin base material 8a selected from an epoxy resin, a polyimide resin and a glass epoxy material, a copper foil, and a copper plating. Three layers of a metal layer 8b selected from a thin film, a nickel foil, and a nickel-plated thin film, and an adhesive layer 8c selected from a solder, a low-melting glass, and a resin adhesive applied to the metal layer 8b It has a structural configuration. The resin base material 8a has a thickness t1 of 0.0
The thickness t2 of the metal layer 8b is 0.06 mm or less, for example, 0.030 mm or less.
mm, and the thickness of the adhesive layer 8c is about 0.04 mm. Therefore, the resin base material 8a and the metal layer 8b
Is about 0.048 mm, which can be reduced to about 1/4 to 1/2 compared to 0.2 mm of a conventional ceramic cap or 0.1 mm of a metal cap. This has the effect. That is, when the thickness is set to 0.1 mm or less only by the metal layer 8b, the metal layer 8b is easily broken even by a slight mechanical impact. Is strengthened. In addition, the elasticity as a whole prevents the sealing portion from peeling off or falling off even when it receives a drop impact or thermal stress.

In the above configuration, when the electrodes 4 and 5 exposed on the back surface of the substrate 1 are connected and fixed to a printed circuit board or the like by soldering or the like, electrical connection and mechanical fixing can be achieved at the same time. When power is supplied to an electronic element such as a quartz oscillator housed therein through the electrodes 4 and 5, the electronic element causes mechanical vibration, and the mechanical vibration can be extracted from the electrodes 4 and 5 as an electric signal.

In the above embodiment, ceramic fine particles are contained in glass instead of the conventional alumina ceramic substrate 61 having a thermal expansion coefficient of about 6 to 7 × 10 −6 / ° C. and the insulating frame 67. 12 × thermal expansion coefficient
Since the substrate 1 and the insulating frame 7 made of glass ceramic at about 10 −6 / ° C. are used, the coefficient of thermal expansion of the hermetic package body is 14 × 1 which is the coefficient of thermal expansion of a quartz oscillator or the like.
Since the temperature is very close to 0-6 / ° C., the airtight package and the crystal may be heated by sealing the cap 8 or by soldering the airtight package to a printed circuit board or under ambient temperature conditions. The stress generated in the electronic element due to the difference in the coefficient of thermal expansion from the electronic element such as the vibrator is extremely small. Therefore, the electrical characteristics such as the frequency characteristic of the electronic element such as the crystal vibrator fluctuate due to this stress. There is an advantage that there is no. When the adhesive layer 8c is made of solder, it is necessary to form a metal frame or a metal layer which is easily wetted with solder on the upper surface of the insulating frame 7.

FIG. 3 is a plan view of a surface-mounted hermetic package B according to a second embodiment of the present invention, from which a cap is removed.
FIG. 4 is a vertical sectional view taken along line BB in FIG. 3. In the figure,
Reference numeral 11 denotes a rectangular insulating substrate (hereinafter, simply referred to as a substrate) made of glass ceramic or the like in which ceramic fine particles are mixed into glass.
13. Reference numeral 14 denotes a step portion provided along the peripheral portion of the substrate 11 and having a height of, for example, about 0.2 mm higher than the central portion.
This serves as a so-called "pillow" in the first embodiment. Reference numerals 15 and 16 denote the upper surface of the step portion 14 and the substrate 1
The first electrode 15 is formed to extend to the back surface of the substrate 11 through one notch 12 and the other electrode 16.
Is formed so as to bypass the step portion 14 formed in the peripheral portion of the substrate 11 and extend to the back surface of the substrate 11 through the other cutout portion 13. Reference numeral 17 denotes an insulating frame made of the same glass ceramic or the like as the substrate 11, which is superposed on the substrate 11 on which the electrodes 15 and 16 are formed, sintered and integrated. The exposed electrodes 15 and 16 are plated with Ni, Au, or the like to improve the solderability of an electronic element such as a quartz oscillator. The substrate 11 or the insulating frame 17 forms an airtight package body. Electronic elements (not shown) such as a quartz oscillator, a quartz oscillator, and a SAW device are connected and fixed to the package body formed by the substrate 11 or the insulating frame 17 with a conductive adhesive or the like. Reference numeral 18 denotes a cap that seals the opening of the package body after the electronic element is stored in the package body.
Sealed and sealed airtight with an adhesive. Since the configuration of the cap 18 is the same as that of the cap 8 of FIG. 1, the description of the configuration and effects will be omitted. This embodiment is different from the embodiment of FIG. 1 in that a step portion 14 integral with the substrate 11 is provided, thin electrodes 15 and 16 are formed thereon, and the electrodes 4 and 5 are formed of the same material. Instead of the support portion 6, the step portion 14
Is used, there is an advantage that the amount of use of expensive electrode material such as Ag-Pd can be reduced and cost can be reduced.

FIG. 5 is a plan view of a surface-mounted hermetic package C according to a third embodiment of the present invention, from which a cap is removed.
FIG. 6 is a vertical sectional view taken along line CC of FIG. 5. In the figure,
Reference numeral 21 denotes a rectangular insulating substrate (hereinafter, simply referred to as a substrate) made of glass ceramic or the like in which ceramic fine particles are mixed in glass, and semicircular notch portions 22, 23, 2 at four corners.
4, 25. Reference numerals 26 and 27 denote projections having a height of, for example, about 0.2 mm provided on the electrode forming portion of the substrate 21 and reference numeral 28 provided on the supporting portion forming portion. In particular, 28 serves as a so-called "pillow". Reference numerals 29 and 30 denote electrodes formed of Ag-Pd or the like formed on the upper surface of the projections 26 to 28, the end surface and the bottom surface of the substrate 21, and one electrode 29 passes through one notch 22 and The other electrode 30 extends around the periphery of the substrate 21 and extends to the back surface of the substrate 21 through the notch 24 located at the diagonal of the notch 22. ing. Reference numeral 31 denotes a conductive layer formed of Ag-Pd or the like formed on the convex portion 28, and forms a supporting portion in combination with the convex portion 28. 3
Reference numeral 2 denotes an insulating frame made of the same glass ceramic or the like as the substrate 21, which is superposed on the substrate 21 on which the electrodes 29, 30 and the conductive layer 31 are formed, sintered and integrated.
The exposed electrodes 29 and 30 and the conductive layer 31 are made of Ni
Plating, Au plating, and the like are performed to improve the solderability of electronic elements such as a quartz oscillator. Substrate 2
The hermetic package body is formed by the 1 to the insulating frame 32. The package body formed by the substrate 21 or the insulating frame 32 includes a quartz oscillator, a quartz oscillator, and an SA.
An electronic element (not shown) such as a W device is connected and fixed with a conductive adhesive or the like. Reference numeral 33 denotes a cap for sealing the opening of the package body after the electronic element is housed in the package body, and is hermetically fixed and sealed with an adhesive. Since the configuration of the cap 33 is the same as that of the cap 8 in FIG. 1, the description of the configuration and the effects is omitted. This embodiment is different from the embodiment of FIG. 1 in that, instead of the electrodes 4 and 5 and the support portion 6 having a predetermined thickness formed of an electrode material such as Ag-Pd, a convex portion integrated with the substrate 21 is provided. Since the thin electrodes 29, 30 and the conductive layer 31 are formed on the electrodes 26, 27, and 28, the use of expensive electrode materials such as Ag-Pd can be reduced, and the cost can be reduced. In this embodiment, the notch 2
A metal layer for fixing can also be formed with an electrode material at the corners on the back surface of the substrate 21 corresponding to the substrates 3 and 25.

FIG. 7 is a plan view of a surface-mounted hermetic package D according to a fourth embodiment of the present invention, from which a cap is removed.
FIG. 8 is a longitudinal sectional view taken along line DD of FIG. 7. In the figure,
Reference numeral 41 denotes a rectangular insulating substrate (hereinafter, simply referred to as a substrate) made of glass ceramic or the like in which ceramic fine particles are mixed into glass, and semicircular arc-shaped cutouts 42, 43, 43 are provided at positions slightly apart from the center in the long axis direction. 44 and 45. 4
Reference numerals 6, 47 and 48, 49 denote convex portions having a height of, for example, about 0.2 mm, which are formed integrally with the substrate 41 at the electrode forming position and the supporting portion forming position on the upper surface of the substrate 41.
49 serves as a so-called "pillow" in the first embodiment of FIG. 50, 51 are the convex portions 46, 47
Formed on the top surface, the end surface and the bottom surface of the substrate 41.
An electrode made of Pd or the like, one electrode 50 is formed to extend to the back surface of the substrate 41 through one notch 42,
The other electrode 51 bypasses the peripheral portion of the substrate 41 and passes through the notch 44 located diagonally to the notch 42 to pass through the substrate 41.
Is formed so as to extend to the back surface. Reference numerals 52 and 53 denote metal layers formed of Ag-Pd or the like on the convex portions 48 and 49, and function as supporting portions in cooperation with the convex portions 48 and 49. Reference numeral 54 denotes an insulating frame made of glass ceramic or the like similar to the substrate 41, and the electrodes 50 and 51 and the metal layer 5
The substrates 2 and 53 are superposed on the substrate 41 and sintered and integrated. The exposed electrodes 50 and 51 and the metal layers 52 and 53 are subjected to Ni plating, Au plating or the like to improve the solderability of an electronic element such as a quartz oscillator. The substrate 41 or the insulating frame 54 forms an airtight package body. Electronic elements (not shown) such as a quartz oscillator, a quartz oscillator, and a SAW device are connected and fixed to the package body formed by the substrate 41 or the insulating frame 54 with a conductive adhesive or the like. 55
Is a cap that seals the opening of the package body after the electronic element is stored in the package body, and is hermetically fixed and sealed with an adhesive. Since the configuration of the cap 55 is the same as that of the cap 8 in FIG. 1, the description of the configuration and the effects will be omitted. This embodiment is different from the embodiment shown in FIG. 1 in which the electrodes 4 and 5 and the supporting portion 6 having a predetermined height are entirely formed of an electrode material such as Ag-Pd. Since the parts 46, 47 and 48, 49, the thin electrodes 50, 51 and the metal layers 52, 53 are provided, the amount of expensive electrode material such as Ag-Pd can be reduced and the cost can be reduced. In this embodiment, a metal layer for fixing can be formed with an electrode material also on the back surface of the substrate 41 corresponding to the notches 43 and 45.

In the above embodiment, both the substrate and the insulating frame were made of glass ceramic having a thermal expansion coefficient of about 12 × 10 ⁻⁶ / ° C. by mixing ceramic fine particles in glass. However, when heating is not performed using a resin adhesive or a conductive resin at the time of sealing the cap or fixing the airtight package to a printed circuit board or the like, a ceramic material such as alumina ceramic may be used.

[0020]

As described above, the airtight package cap of the present invention includes the resin base material, the metal layer, and the adhesive layer, so that the resin base material is reinforced even if the metal layer is thinned. Since the apparent mechanical strength of the metal layer is increased, there is an effect that the thickness can be reduced as compared with a conventional ceramic or metal cap. In addition, the hermetic package of the present invention uses a cap including a resin base material, a metal layer, and an adhesive layer to seal the opening of the package body, so that a conventional ceramic cap or metal cap can be used as a whole. This has the effect of being thinner than the hermetic package used.

[Brief description of the drawings]

FIG. 1 is a plan view of an airtight package A according to a first embodiment of the present invention with a cap removed.

FIG. 2 is a longitudinal sectional view taken along the line AA of FIG. 1;

FIG. 3 is a plan view of a hermetic package B according to a second embodiment of the present invention, from which a cap is removed.

FIG. 4 is a longitudinal sectional view taken along line BB of FIG. 3;

FIG. 5 is a plan view of a hermetic package C according to a third embodiment of the present invention, from which a cap is removed.

FIG. 6 is a longitudinal sectional view taken along the line CC of FIG. 5;

FIG. 7 is a plan view of a hermetic package D according to a fourth embodiment of the present invention with a cap removed.

8 is a longitudinal sectional view taken along line DD of FIG. 7;

FIG. 9 is a plan view of a conventional hermetic package with a cap removed.

10 is a longitudinal sectional view taken along the line EE in FIG. 9;

[Explanation of symbols]

 1,11,21,41 Insulating substrate 4,5,15,16,29,30,50,51 Electrode 6 Supporting part 7,17,32,54 Insulating frame 8,18,33,55 Cap 8a Resin base material 8b Metal layer 8c Adhesive layer 14 Step 26, 27, 28, 46, 47, 48, 49 Convex

Claims (6)

[Claims] An airtight package cap for hermetically enclosing an electronic element, comprising a resin base material, a metal layer and an adhesive layer. 2. A cap for an airtight package for hermetically enclosing an electronic element, comprising a resin base material having a thickness of 0.04 mm or less, a metal layer having a thickness of 0.06 mm or less, and an adhesive layer. A cap for an airtight package, characterized in that: 3. A cap for an airtight package for hermetically enclosing an electronic element, wherein a thickness selected from an epoxy resin, a polyimide resin, and a glass epoxy material is 0.1 mm.
04mm or less resin base material, copper foil, copper plating thin film,
It has a metal layer having a thickness of 0.06 mm or less selected from a nickel foil and a nickel plating thin film, and an adhesive layer selected from a solder, a low-melting glass and a resin adhesive. Cap for airtight package. 4. An airtight package for hermetically enclosing an electronic element, wherein a cap comprising a resin base material, a metal layer and an adhesive layer is sealed in the package body with the adhesive layer. And airtight package. 5. An airtight package for hermetically enclosing an electronic element, comprising a resin base material having a thickness of 0.04 mm or less, a cap comprising a metal layer having a thickness of 0.06 mm or less, and an adhesive layer. An airtight package characterized by being sealed in the main body. 6. An airtight package for hermetically enclosing an electronic element such as a crystal device, wherein the resin base material has a thickness of 0.04 mm or less selected from an epoxy resin, a polyimide resin and a glass epoxy material. A metal layer having a thickness of 0.06 mm or less selected from a copper foil, a copper plating thin film, a nickel foil and a nickel plating thin film, and an adhesive layer selected from a solder, a low melting point glass and a resin adhesive. A hermetic package characterized in that a cap comprising: is sealed in a package body by the adhesive layer.