JPH0424859B2 - - Google Patents
Info
- Publication number
- JPH0424859B2 JPH0424859B2 JP28822785A JP28822785A JPH0424859B2 JP H0424859 B2 JPH0424859 B2 JP H0424859B2 JP 28822785 A JP28822785 A JP 28822785A JP 28822785 A JP28822785 A JP 28822785A JP H0424859 B2 JPH0424859 B2 JP H0424859B2
- Authority
- JP
- Japan
- Prior art keywords
- anisotropic conductive
- overcoat layer
- wiring pattern
- conductive adhesive
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 239000011231 conductive filler Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28822785A JPS62145827A (ja) | 1985-12-20 | 1985-12-20 | 電子部品の接続方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28822785A JPS62145827A (ja) | 1985-12-20 | 1985-12-20 | 電子部品の接続方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62145827A JPS62145827A (ja) | 1987-06-29 |
| JPH0424859B2 true JPH0424859B2 (enrdf_load_html_response) | 1992-04-28 |
Family
ID=17727475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28822785A Granted JPS62145827A (ja) | 1985-12-20 | 1985-12-20 | 電子部品の接続方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62145827A (enrdf_load_html_response) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5386624A (en) * | 1993-07-06 | 1995-02-07 | Motorola, Inc. | Method for underencapsulating components on circuit supporting substrates |
| US5918363A (en) * | 1996-05-20 | 1999-07-06 | Motorola, Inc. | Method for marking functional integrated circuit chips with underfill material |
| JP4191567B2 (ja) * | 2003-09-18 | 2008-12-03 | 株式会社リコー | 導電性接着剤による接続構造体及びその製造方法 |
-
1985
- 1985-12-20 JP JP28822785A patent/JPS62145827A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62145827A (ja) | 1987-06-29 |