JPH04246188A - Method for electroforming stamper for forming optical recording medium - Google Patents

Method for electroforming stamper for forming optical recording medium

Info

Publication number
JPH04246188A
JPH04246188A JP1209191A JP1209191A JPH04246188A JP H04246188 A JPH04246188 A JP H04246188A JP 1209191 A JP1209191 A JP 1209191A JP 1209191 A JP1209191 A JP 1209191A JP H04246188 A JPH04246188 A JP H04246188A
Authority
JP
Japan
Prior art keywords
electroforming
master
conductive ring
stamper
optical recording
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1209191A
Other languages
Japanese (ja)
Inventor
Hitoshi Yoshino
斉 芳野
Hirofumi Kamitakahara
上高原 弘文
Osamu Shikame
修 鹿目
Tetsuya Sato
哲也 佐藤
Hisanori Hayashi
林 久範
Naoki Kushida
直樹 串田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP1209191A priority Critical patent/JPH04246188A/en
Publication of JPH04246188A publication Critical patent/JPH04246188A/en
Pending legal-status Critical Current

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  • Manufacturing Optical Record Carriers (AREA)

Abstract

PURPOSE:To prevent the sticking of an electroformed film 6 to a conductive ring 3 and to obtain the electroformed film uniform in thickness at the time of producing a stamper used for forming an optical recording medium by electroforming. CONSTITUTION:A conductive ring 3 with one end stretched to a specified length and at a specified angle is set between an original disk 1 and an original disk holder 2, a current is applied from the periphery of the original disk, and electroforming is carried out.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は光記録媒体の製造方法に
関し、詳しくは光学的に情報の記録・再生を行なう光記
録媒体製造用スタンパ−の電鋳方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an optical recording medium, and more particularly to a method for electroforming a stamper for manufacturing an optical recording medium for optically recording and reproducing information.

【0002】0002

【従来の技術】従来、各種情報の記録には、磁気テ−プ
、磁気ディスク等の磁気材料、各種半導体メモリ−等が
主として用いられてきた。この様な磁気メモリ−、半導
体メモリ−は情報の書き込みおよび読みだしが容易に行
なえるという利点はあるが、反面、情報の内容を容易に
改ざんされたり、また高密度記録ができないという問題
点があった。かかる問題点を解決するために、多種多様
の情報を効率良く取り扱う手段として、光記録媒体によ
る光学的情報記録方法が提案され、そのための光学的情
報記録担体、記録再生方法、記録再生装置が提案されて
いる。かかる情報記録担体としての光記録媒体は、一般
にレ−ザ−光を用いて情報記録担体上の光記録層の一部
を揮散させるか、反射率の変化を生じさせるか、あるい
は変形を生じせて、光学的な反射率や透過率の差によっ
て情報を記録し、あるいは再生を行なっている。この場
合、光記録層は情報を書き込み後、現像処理などの必要
がなく、「書いた後に直読する」ことのできる、いわゆ
るDRAW(ダイレクト  リ−ド  アフタ−  ラ
イト)媒体であり、高密度記録が可能であり、また追加
書き込みも可能であることから、情報の記録・保存媒体
として有効である。図4は、一般的な光記録媒体(光デ
ィスク、光カ−ド、光テ−プなど)の模式的断面図であ
る。情報の記録・再生は、トラック溝部22の微細な凹
凸を利用してレ−ザ−光の位相差により位置決めをしな
がら行なっている。そしてこのような光記録媒体では、
透明基板21に熱可塑性樹脂であるポリカ−ボネ−ト樹
脂やポリメチルメタクリル樹脂を用いこの樹脂基板に、
トラックや情報に対応する凹凸パタ−ンが記録されてい
るスタンパ−を用いて、その凹凸パタ−ンを転写して溝
部22を形成している。
2. Description of the Related Art Conventionally, magnetic materials such as magnetic tapes and magnetic disks, various semiconductor memories, and the like have been mainly used to record various types of information. Such magnetic memories and semiconductor memories have the advantage that information can be easily written and read, but on the other hand, they have the problem that the information content can be easily tampered with and high-density recording cannot be performed. there were. In order to solve these problems, an optical information recording method using an optical recording medium has been proposed as a means to efficiently handle a wide variety of information, and an optical information recording carrier, a recording/reproducing method, and a recording/reproducing device for this purpose have been proposed. has been done. Such optical recording media as information recording carriers generally use laser light to evaporate a part of the optical recording layer on the information recording carrier, cause a change in reflectance, or cause deformation. Information is recorded or reproduced based on differences in optical reflectance and transmittance. In this case, the optical recording layer is a so-called DRAW (Direct Read After Write) medium that does not require any development treatment after information is written and can be "directly read after writing", and is capable of high-density recording. It is also possible to write additional information, so it is effective as an information recording/storage medium. FIG. 4 is a schematic cross-sectional view of a general optical recording medium (optical disk, optical card, optical tape, etc.). Recording and reproduction of information is performed while positioning is performed using the fine irregularities of the track groove portion 22 and the phase difference of laser beams. And in such optical recording media,
The transparent substrate 21 is made of thermoplastic resin such as polycarbonate resin or polymethyl methacrylic resin, and this resin substrate is made of
A stamper on which a concavo-convex pattern corresponding to the track and information is recorded is used to transfer the concavo-convex pattern to form the groove portion 22.

【0003】このスタンパ−の製造方法としては一般的
には例えば、  図5に示す様に、平面性良く研磨され
たガラスなどの板の上に、レジストや感光性樹脂層32
を形成しそこに所定の深さの凹凸パタ−ン33を形成し
た後に(図5a)、導電化膜34を形成して導電化して
から(図5b)、所定の厚さまで電鋳を行なって電鋳膜
35を成膜して金属スタンパ−を得ている(図5c)。 そして従来の電鋳方法では、以下のことが行われている
。 即ち電鋳を行なうときに、電鋳槽の陽極と陰極の間に邪
魔板を挿入して板厚分布を良くすること。(特開昭59
−177388、同60−17089、同61−279
699)ピンホ−ルの防止のために、電鋳槽に生成する
不溶解性酸化物スライムやスマットなどの異物を予備槽
に取り除いている。(実開昭58−141435)また
、電鋳した時の通電治具跡を紫外線硬化樹脂でシ−ルし
て、研磨時の研磨剤などのしみ込みを防止している。 (特開昭62−209746)ところで電鋳を行なうと
きには図2のA部に示す様に、原盤2の外周部の導電リ
ング3にも電鋳されてしまうため、電鋳膜6が導電リン
グ3とくっついて一体化してしまうという問題点があり
、電鋳後に導電リング3を外す時に原盤2と電鋳膜6と
の間に剥離が生じてしまい、研磨の時に研磨液が染み込
んだり、原盤2と電鋳膜6が剥がれたりするという問題
点がある。そのために前で述べたように通電治具跡を紫
外線硬化樹脂でシ−ルすることも行われているが、樹脂
でシ−ルした箇所が図2B部に示すように  盛り上が
って、研磨後の電鋳したスタンパ−の厚さ分布が不均一
になってしまうという問題点が生じている。
As shown in FIG. 5, the general method for manufacturing this stamper is as follows: A resist or photosensitive resin layer 32 is placed on a well-polished glass plate.
After forming a concavo-convex pattern 33 of a predetermined depth thereon (FIG. 5a), a conductive film 34 is formed to make it conductive (FIG. 5b), and electroforming is performed to a predetermined thickness. An electroformed film 35 is formed to obtain a metal stamper (FIG. 5c). In the conventional electroforming method, the following is performed. That is, when performing electroforming, a baffle plate is inserted between the anode and cathode of the electroforming tank to improve the plate thickness distribution. (Unexamined Japanese Patent Publication No. 59
-177388, 60-17089, 61-279
699) To prevent pinholes, foreign matter such as insoluble oxide slime and smut generated in the electroforming tank is removed into a preliminary tank. (Utility Model Application No. 58-141435) Furthermore, the traces of the energizing jig during electroforming are sealed with ultraviolet curable resin to prevent abrasives from penetrating during polishing. (Japanese Unexamined Patent Publication No. 62-209746) However, when electroforming is performed, the conductive ring 3 on the outer circumference of the master 2 is also electroformed, as shown in part A of FIG. There is a problem that they stick together and become integrated, and when removing the conductive ring 3 after electroforming, separation occurs between the master 2 and the electroformed film 6, and the polishing liquid may seep into the master 2 during polishing. There is a problem that the electroformed film 6 may peel off. For this purpose, as mentioned above, the traces of the current-carrying jig are sometimes sealed with ultraviolet curing resin, but the areas sealed with resin swell up as shown in Figure 2B, causing problems after polishing. A problem arises in that the thickness distribution of the electroformed stamper becomes non-uniform.

【0004】0004

【発明が解決しようとしている課題】本発明は上記の問
題を解決する目的でなされたものであり、記録すべき情
報に対応した凹凸パタ−ンが形成された原盤に電鋳を行
なうことによってスタンパ−を製造する方法において、
、電鋳膜と導電リングのくっつきを防止して、原盤と電
鋳膜の剥がれのない、均一な膜厚を有するスタンパ−の
電鋳方法を提供することを目的とする。
[Problems to be Solved by the Invention] The present invention has been made to solve the above-mentioned problems, and it is possible to create a stamper by electroforming a master disc on which a concave-convex pattern corresponding to the information to be recorded is formed. - in a method of producing
An object of the present invention is to provide a method for electroforming a stamper that prevents the electroformed film from sticking to the conductive ring, prevents the electroformed film from peeling off from the master, and has a uniform film thickness.

【0005】[0005]

【課題を解決するための手段(及び作用)】本発明の電
鋳方法は光記録媒体に予め記録する情報に対応した凹凸
パタ−ンが形成された原盤に電鋳を行なうことによって
光記録媒体を成形するためのスタンパ−の製造方法にお
いて、陰極を形成する原盤と該原盤を保持する原盤ホル
ダ−との間に、所定の長さ、所定の角度で、電鋳液中に
突き出している導電リングを設置して、原盤の外周部か
ら該導電リングで通電を取って電鋳を行なうことを特徴
とする。
[Means for Solving the Problems (and Effects)] The electroforming method of the present invention forms an optical recording medium by performing electroforming on a master disk on which a concavo-convex pattern corresponding to information to be recorded in advance on an optical recording medium is formed. In a method for manufacturing a stamper for forming a cathode, a conductive plate protruding into the electroforming liquid at a predetermined length and at a predetermined angle is placed between a master plate forming a cathode and a master plate holder holding the master plate. The method is characterized in that a ring is installed and electroforming is performed by applying electricity through the conductive ring from the outer periphery of the master.

【0006】本発明者らは導電リング3の原盤2と接す
る部分の先端部が、原盤2から僅かに離れていると電鋳
膜6の導電リング3への付着を避けることができて、原
盤2と電鋳膜6との剥がれをなく電鋳できることを見出
だし本発明を成したものである。即ち、本発明の電鋳方
法を用いることによって、所定の長さ、所定の角度で電
鋳液中に突き出した折り曲げ部を設けた導電リングを用
いることによって、図1のA部に示すように導電リング
3の折り曲げ部4の電鋳膜の膜厚を薄くして電鋳膜の導
電リングへの固着を防ぎ、電鋳膜と原盤の剥がれがなく
かつ、電鋳膜の厚い部分(図2B)のない均一な膜厚の
電鋳スタンパ−を得られるという利点がある。
The present inventors found that if the tip of the conductive ring 3 in contact with the master 2 is slightly separated from the master 2, the electroformed film 6 can be prevented from adhering to the conductive ring 3, and the master can be easily removed. The present invention was made based on the discovery that electroforming can be performed without peeling between the electroformed film 6 and the electroformed film 6. That is, by using the electroforming method of the present invention, by using a conductive ring having a bent portion protruding into the electroforming solution at a predetermined length and at a predetermined angle, as shown in part A of FIG. The thickness of the electroformed film on the bent portion 4 of the conductive ring 3 is reduced to prevent the electroformed film from adhering to the conductive ring, so that the electroformed film does not peel off from the master and the thick part of the electroformed film (Fig. 2B ) is advantageous in that an electroforming stamper with a uniform thickness can be obtained.

【0007】以下、本発明を図を用いて詳細に説明する
。図1は、本発明のスタンパ−の電鋳方法の実施態様を
示す断面図である。原盤2が原盤ホ−ルダ−1に設置さ
れていて、原盤ホ−ルダ−1と原盤2は、一定の角度、
長さの、折り曲げ部4を持つ導電リング3で通電を取ら
れている。本発明の製造方法における導電リング3は、
一定の長さと角度で曲げられた折り曲げ部4を持ってい
る。折り曲げ部4の長さは、折り曲げ部4の下になった
部分の電鋳膜は、他の部分よりも薄くなるので(図1 
 A)、原盤の大きさと電鋳後に使う有効領域の大きさ
によるが、一般に1〜200mmの範囲で用いることが
できる。一般に折り曲げ部4の長さよりも、電鋳膜の薄
くなる部分は長くなるので、より好ましくは10〜50
mmである。折り曲げ部4の曲げ角度は、一般に折り曲
げ部の下(図1  A)の電鋳膜の膜厚を、他の部分よ
りも薄くすることができる角度であれば、いづれの角度
でも用いることができるが、1〜60度の範囲で用いる
ことができる。この角度が小さいと、第1図Aで示した
電鋳膜の薄くなる部分に、他の部分との境に段差を生じ
てしまう。また角度が大きいと、電鋳膜の厚さが不均一
になり易い。そこでより好ましい角度は10〜45度の
範囲である。浅い角度を用いたときには、導電リング3
の折り曲げ部4の先端の原盤2に接する面を粗面にする
と、原盤2と電鋳膜6の剥がれを防ぐことができる。ま
た本発明では、導電リング3の折り曲げ部4の形状は図
1のような形状の他に、2段または3段以上の折り曲げ
を、必要に応じて行なっても良い。そのときには、個々
の折り曲げ部の角度、長さは上記の範囲内であれば自由
に選択することができる。
The present invention will be explained in detail below with reference to the drawings. FIG. 1 is a sectional view showing an embodiment of the stamper electroforming method of the present invention. Master disc 2 is installed in master disc holder 1, and master disc holder 1 and master disc 2 are arranged at a certain angle.
Electricity is supplied through a conductive ring 3 having a long bent portion 4. The conductive ring 3 in the manufacturing method of the present invention is
It has a bent part 4 bent at a certain length and angle. The length of the folded part 4 is determined as the electroformed film in the part below the folded part 4 is thinner than in other parts (Fig. 1).
A) Depending on the size of the master and the size of the effective area used after electroforming, it can generally be used in the range of 1 to 200 mm. Generally, the thinner part of the electroformed film is longer than the length of the bent part 4, so the length is preferably 10 to 50.
It is mm. Generally, the bending angle of the bending part 4 can be any angle as long as the thickness of the electroformed film below the bending part (FIG. 1A) can be made thinner than in other parts. However, it can be used within a range of 1 to 60 degrees. If this angle is small, a step will be created between the thinner part of the electroformed film shown in FIG. 1A and other parts. Moreover, if the angle is large, the thickness of the electroformed film tends to become non-uniform. Therefore, a more preferable angle is in the range of 10 to 45 degrees. When using a shallow angle, conductive ring 3
By making the surface of the tip of the bent portion 4 in contact with the master 2 rough, peeling of the master 2 and the electroformed film 6 can be prevented. Further, in the present invention, the shape of the bent portion 4 of the conductive ring 3 may be bent in two or more stages as required, other than the shape shown in FIG. At that time, the angle and length of each bent portion can be freely selected as long as they are within the above range.

【0008】導電リング3の材質は電鋳液に溶解しない
材料であれば、いづれの材料でも用いることができるが
、好ましくは銅、ステンレスなどである。導電リング3
の原盤2との接触部の長さは、原盤2の厚さのムラを吸
収して通電を取るためには、1mm以上である。より好
ましくは3〜10mmの範囲である。同様に導電リング
3と原盤ホ−ルダ−1との接触部の長さは1mm以上で
ある。原盤ホ−ルダ−1の端面からの電鋳液の侵入を防
止するためには、導電リング3は原盤ホ−ルダ−1の端
面まであるのが好ましい。次に電鋳の方法について図3
を用いて説明すると導電リング3を原盤2と原盤ホ−ル
ダ−1の上に設置したら、上蓋5でしっかり固定する。 導電リング3と原盤2との間に電鋳液が混入しないこと
が、必要である。原盤2と導電リング3を設置した原盤
ホ−ルダ−1からなる陰極11は、電鋳槽13中では陽
極12と対向する位置に置かれている。陰極11は下側
を向きながらモ−タ−14で軸を中心にして回転してい
る。回転数によって導電リング3の折り曲げ部4の効果
は多少異なる。このため、好ましい回転数は20〜15
0rpmである。電流値は電鋳膜に反りや応力が発生し
ない範囲で選択することができる。電流値によって、導
電リング3の折り曲げ部4の効果は多少異なる。 一般的には200〜2000A/m2、好ましくは、3
00〜800A/m2の範囲で用いることができる。
The conductive ring 3 may be made of any material as long as it does not dissolve in the electroforming solution, but copper, stainless steel, etc. are preferable. Conductive ring 3
The length of the contact portion with the master disc 2 is 1 mm or more in order to absorb unevenness in the thickness of the master disc 2 and conduct electricity. More preferably, it is in the range of 3 to 10 mm. Similarly, the length of the contact portion between the conductive ring 3 and the master holder 1 is 1 mm or more. In order to prevent the electroforming liquid from entering from the end face of the master holder 1, it is preferable that the conductive ring 3 extends up to the end face of the master holder 1. Next, the method of electroforming is shown in Figure 3.
To explain using , after the conductive ring 3 is installed on the master disc 2 and the master disc holder 1, it is firmly fixed with the upper cover 5. It is necessary that the electroforming liquid does not mix between the conductive ring 3 and the master 2. A cathode 11 consisting of a master disc holder 1 on which a master disc 2 and a conductive ring 3 are installed is placed in an electroforming bath 13 at a position opposite to an anode 12. The cathode 11 is rotated about a shaft by a motor 14 while facing downward. The effect of the bent portion 4 of the conductive ring 3 differs somewhat depending on the rotation speed. For this reason, the preferred rotation speed is 20 to 15
It is 0 rpm. The current value can be selected within a range that does not cause warping or stress in the electroformed film. The effect of the bent portion 4 of the conductive ring 3 differs somewhat depending on the current value. Generally 200-2000A/m2, preferably 3
It can be used in the range of 00 to 800 A/m2.

【0009】[0009]

【作用】本発明の電鋳スタンパ−は、所定の角度、長さ
の、折り曲げ部を持つ導電リングを用いて、電鋳を行な
うため、折り曲げ部の下側の電鋳膜の膜厚を薄くするこ
とができ、それによって、導電リングに電鋳膜が付くこ
とを防ぎ、電鋳膜と原盤の剥がれのない電鋳スタンパ−
を提供するものである。また導電リングが導電性を持つ
ために、折り曲げ部の先端に電鋳膜が付着することによ
って、導電リングの折り曲げ部の外側の、原盤上の電鋳
膜の盛り上がりを防ぎ、厚さの均一な電鋳スタンパ−を
提供するものである。
[Function] The electroforming stamper of the present invention performs electroforming using a conductive ring having a bent portion at a predetermined angle and length, so that the thickness of the electroformed film below the bent portion is thinned. This prevents the electroformed film from adhering to the conductive ring and allows the electroformed stamper to be created without peeling of the electroformed film from the master.
It provides: In addition, since the conductive ring is conductive, the electroformed film adheres to the tip of the folded part, which prevents the electroformed film from swelling on the master outside the folded part of the conductive ring, resulting in a uniform thickness. An electroforming stamper is provided.

【0010】0010

【実施例】以下、実施例を示し、本発明をさらに具体的
に説明するが、本発明がこれらに限定されるものではな
い。
[Examples] Hereinafter, the present invention will be explained in more detail with reference to Examples, but the present invention is not limited thereto.

【0011】実施例1 厚さ10mm、φ355mmのガラス板(旭硝子(株)
製)上にフォトレジスト(AZ1300,ヘキストジャ
パン)を0.11μmの厚さに塗布して、レ−ザ−露光
機(松下電器(株)製)でパタ−ンを露光、現像して、
ピッチ1.6μm、幅0.7μm、深さ1100Åの同
心円の凹凸パタ−ンを形成した。その後で、ニッケルを
1000Åの厚さにスパッタ−して導電化処理してガラ
ス原盤を得た。厚さ0.5mmの銅を、外形φ400m
m、内径φ325mmのド−ナツ形に切断して、その両
面を紙ヤスリで鏡面になるまで研磨した。この導電リン
グの内側10mmを35度に折り曲げて、折り曲げ部を
形成した。前記凹凸パタ−ンの形成されたガラス原盤を
、外形φ40.0mmの原盤ホ−ルダ−に設置した。 それから前記導電リングを原盤の外周5mmで接するよ
うにして、外形φ400mm、内径φ345mmの蓋を
して、しっかりと固定した。陽極としてはニッケル球を
チタンの籠に入れて、綿布で覆ってごみの流失を抑えた
ものをもちいた。電鋳液としては下記の組成に混合した
液を500l用いて、電鋳槽150l、予備槽350l
の電鋳槽に入れて、液温度45℃で、液全体を10回/
時間のサイクルで循環させた。
Example 1 Glass plate with a thickness of 10 mm and a diameter of 355 mm (Asahi Glass Co., Ltd.)
A photoresist (AZ1300, Hoechst Japan) was applied to a thickness of 0.11 μm on a photoresist (manufactured by Matsushita Electric Co., Ltd.), and a pattern was exposed and developed using a laser exposure machine (manufactured by Matsushita Electric Co., Ltd.).
A concentric concavo-convex pattern with a pitch of 1.6 μm, a width of 0.7 μm, and a depth of 1100 Å was formed. Thereafter, nickel was sputtered to a thickness of 1000 Å to make it conductive, thereby obtaining a glass master disk. Copper with a thickness of 0.5 mm and an outer diameter of 400 m
It was cut into a donut shape with an inner diameter of 325 mm, and both sides were polished with sandpaper until it became a mirror surface. The inner 10 mm of this conductive ring was bent at 35 degrees to form a bent portion. The glass master disk on which the uneven pattern was formed was placed in a master disk holder having an outer diameter of 40.0 mm. Then, the conductive ring was brought into contact with the master at an outer circumference of 5 mm, and a lid having an outer diameter of 400 mm and an inner diameter of 345 mm was placed and firmly fixed. The anode used was a nickel ball placed in a titanium cage and covered with cotton cloth to prevent waste from washing away. As the electroforming solution, use 500 liters of a solution mixed with the following composition, and prepare an electroforming tank of 150 liters and a preliminary tank of 350 liters.
Place the entire liquid in an electroforming tank and heat it 10 times at a liquid temperature of 45°C.
circulated through the cycle of time.

【0012】 スルファミン酸ニッケル(4水和物)  450g/l
ホウ酸                      
          30g/lピット防止剤    
                      5ml
/l電流条件は最初は3Aで30分間流してから、50
Aまで電流を上げて(電流密度530A/m2)、13
000Aの積算電流値になるまで電鋳を行なって、30
0μmの厚さの電鋳スタンパ−を得た。電鋳終了後、観
察をしてみると、導電リングと電鋳膜のくっつきはなか
った。そのため、導電膜と原盤の剥がれはなかった。電
鋳膜の厚さを測定してみると(マイクロメ−タ−、ミツ
トヨ)、導電リングの折り曲げ部の内側のφ300mm
において膜厚は300±5μmであり、十分に膜厚分布
は良かった。
Nickel sulfamate (tetrahydrate) 450g/l
Boric acid
30g/l anti-pitting agent
5ml
/l current condition is to first flow 3A for 30 minutes, then 50
Raise the current to A (current density 530A/m2), 13
Perform electroforming until the cumulative current value reaches 000A, and then
An electroformed stamper with a thickness of 0 μm was obtained. After the electroforming was completed, we observed that there was no adhesion between the conductive ring and the electroformed film. Therefore, there was no separation between the conductive film and the master. When we measured the thickness of the electroformed film (micrometer, Mitutoyo), we found that it was φ300 mm inside the bent part of the conductive ring.
The film thickness was 300±5 μm, and the film thickness distribution was sufficiently good.

【0013】実施例2 厚さ10mm、300×340mmのガラス板(旭硝子
(株)製)と、同じ大きさで表面にピッチ12μm、幅
3.0μm、深さ3000Aの凹凸パタ−ンが形成され
たフォトマスクとの間に50μmの厚さに紫外線硬化樹
脂(日本化薬(株)製、INC118)を挟んで硬化さ
せた。硬化後にフォトマスクを外してガラス原盤を得た
。実施例1と同じ厚さ、材質の外形500ミリの導電リ
ングの中心に、270×310mmの穴を開けて、穴の
周囲を全周にわたって、長さ10mmで25度の折り曲
げ部を、曲げ加工して作った。この原盤を外形φ500
mmの原盤ホ−ルダ−に設置した。その後で、実施例1
と同様に原盤の外周5mm、で導電リングと接するよう
に導電リングを設置した。外形φ500mmで、内側に
290×330の穴を開けた蓋で、実施例1と同様にし
っかりと固定した。実施例1と同じ電鋳液、陽極と電鋳
槽を用いて、電流値は1Aで30分流してから、30A
まで電流値を上げて(電流密度290A/m2)、積算
電流値が9600A分になるまで電鋳を行なって、20
0μmの電鋳スタンパ−を得た。実施例1と同じ様に観
察したところ、原盤と電鋳膜との間に剥がれはなかった
。電鋳膜の厚さを、実施例1と同じ用に測定してみると
、250×300mmの範囲において200±4μmで
分布は良かった。
Example 2 A glass plate (manufactured by Asahi Glass Co., Ltd.) with a thickness of 10 mm and a size of 300 x 340 mm was used, and an uneven pattern of the same size with a pitch of 12 μm, a width of 3.0 μm, and a depth of 3000 A was formed on the surface. An ultraviolet curing resin (manufactured by Nippon Kayaku Co., Ltd., INC118) was sandwiched between the photomask and the photomask to a thickness of 50 μm and cured. After curing, the photomask was removed to obtain a glass master disk. A 270 x 310 mm hole was drilled in the center of a conductive ring with an outer diameter of 500 mm and the same thickness and material as in Example 1, and a 25 degree bend with a length of 10 mm was formed around the entire circumference of the hole. I made it. This master has an external diameter of φ500
It was installed in a mm master holder. After that, Example 1
Similarly, a conductive ring was placed in contact with the conductive ring at a distance of 5 mm from the outer circumference of the master. As in Example 1, it was firmly fixed using a lid with an outer diameter of 500 mm and a hole of 290 x 330 mm inside. Using the same electroforming solution, anode, and electroforming tank as in Example 1, the current value was 1A for 30 minutes, and then 30A.
(current density 290A/m2), electroforming was performed until the cumulative current value reached 9600A, and 20
An electroformed stamper of 0 μm was obtained. When observed in the same manner as in Example 1, there was no peeling between the master and the electroformed film. When the thickness of the electroformed film was measured in the same manner as in Example 1, it was found to have a good distribution of 200±4 μm in a range of 250×300 mm.

【0014】実施例3 実施例1と同じ材質、厚さの板を、外形φ400mm、
内径φ315mmのド−ナツ形に切断して、この導電リ
ングの内側15mmを45度に折り曲げて、折り曲げ部
を形成した。実施例1と同じガラス原盤を用いて、実施
例1と同じ原盤ホ−ルダ−、実施例1と同じ陽極、電鋳
液、電鋳槽を用いた。実施例1と同じ様に原盤、導電リ
ング、蓋を設置した。実施例1と同じ電流条件を用いて
実施例1と同じ積算電流値まで電鋳した。実施例1と同
様にできた電鋳スタンパ−を観察したところ、原盤と電
鋳膜の間に剥がれはなかった。膜厚を測定したところ、
300±5μmで十分に分布は良かった。
Example 3 A plate made of the same material and thickness as in Example 1 was made with an outer diameter of 400 mm.
The conductive ring was cut into a donut shape with an inner diameter of 315 mm, and the inner 15 mm of the conductive ring was bent at 45 degrees to form a bent portion. The same glass master disc as in Example 1 was used, the same master disc holder as in Example 1, the same anode, electroforming liquid, and electroforming tank as in Example 1. A master disc, a conductive ring, and a lid were installed in the same manner as in Example 1. Electroforming was performed using the same current conditions as in Example 1 to the same integrated current value as in Example 1. When the electroformed stamper produced in the same manner as in Example 1 was observed, there was no peeling between the master and the electroformed film. When the film thickness was measured,
The distribution was sufficiently good at 300±5 μm.

【0015】比較例1 実施例1と同じガラス原盤を用いて、実施例1と同じ原
盤ホ−ルダ−、実施例1と同じ材質、厚さの導電リング
を中心穴φ345mmで、折り曲げを行なわずに作製し
た。陽極、電鋳液、電鋳槽は、実施例1と同じものを用
いた。実施例1と同じ電流条件を用いて実施例1と同じ
積算電流値まで電鋳した。実施例1と同様に電鋳された
スタンパ−を観察したところ、電鋳膜が導電リングとく
っついて電鋳されていて導電リングを剥がしたときに、
電鋳膜と原盤の間に剥がれが生じていた。電鋳膜の厚さ
を測定してみると、300±10μmで分布は良かった
Comparative Example 1 Using the same glass master as in Example 1, the same master holder as in Example 1, and a conductive ring of the same material and thickness as in Example 1 with a center hole of φ345 mm, without bending. It was created in The same anode, electroforming solution, and electroforming tank as in Example 1 were used. Electroforming was performed using the same current conditions as in Example 1 to the same integrated current value as in Example 1. When we observed the electroformed stamper in the same manner as in Example 1, we found that the electroformed film adhered to the conductive ring during electroforming, and when the conductive ring was peeled off,
Peeling occurred between the electroformed film and the master disc. When the thickness of the electroformed film was measured, it was found to be 300±10 μm with good distribution.

【0016】[0016]

【発明の効果】本発明の電鋳方法を用いると、所定の角
度、長さの、折り曲げ部を持つ導電リングを用いて、電
鋳を行なうため、折り曲げ部の下側の電鋳膜の膜厚を薄
くすることができ、それによって、導電リングに電鋳膜
が付くことを防ぎ、電鋳膜と原盤の剥がれなく電鋳スタ
ンパ−を得ることができる。また導電リングが導電性を
持つために、折り曲げ部の先端に電鋳膜が付着すること
によって、導電リングの折り曲げ部の外側の、原盤上の
電鋳膜の盛り上がりを防ぎ、厚さの均一な電鋳スタンパ
−を得ることができる。
[Effects of the Invention] When the electroforming method of the present invention is used, electroforming is performed using a conductive ring having a bent portion at a predetermined angle and length, so that the electroformed film below the bent portion is The thickness can be reduced, thereby preventing the electroformed film from adhering to the conductive ring, and making it possible to obtain an electroformed stamper without peeling off the electroformed film from the master. In addition, since the conductive ring is conductive, the electroformed film adheres to the tip of the folded part, which prevents the electroformed film from swelling on the master outside the folded part of the conductive ring, resulting in a uniform thickness. An electroformed stamper can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明のスタンパ−の製造に用いる導電リング
の概略断面図である
FIG. 1 is a schematic cross-sectional view of a conductive ring used in manufacturing the stamper of the present invention.

【図2】従来のスタンパ−の製造に用いる導電リングの
概略断面図である。
FIG. 2 is a schematic cross-sectional view of a conductive ring used in manufacturing a conventional stamper.

【図3】従来のスタンパ−の製造に用いる電鋳装置の概
略断面図である。
FIG. 3 is a schematic cross-sectional view of an electroforming device used for manufacturing a conventional stamper.

【図4】一般的な光記録媒体の一般的な断面図である。 (a)光ディスク、(b)光カ−ドFIG. 4 is a general cross-sectional view of a general optical recording medium. (a) Optical disk, (b) Optical card

【図5】従来のスタンパ−の製造方法を示す概略断面図
である。
FIG. 5 is a schematic cross-sectional view showing a conventional stamper manufacturing method.

【符号の説明】[Explanation of symbols]

1  原盤ホ−ルダ− 2  原盤 3  導電リング 4  折り曲げ部 5  上蓋 6  電鋳膜 7  原盤押さえ部 11  陰極 12  陽極 13  電鋳槽 14  モ−タ− 15  電鋳槽蓋 16  邪魔板 21  透明基板 22  トラック溝部 23  光記録層 24  スペ−サ− 25  接着剤層 26  保護基板 27  中心穴 31  ガラス基板 32  レジスト層 33  トラック溝 34  導電膜 35  電鋳膜 1 Master disc holder 2 Original recording 3 Conductive ring 4 Bending part 5 Top lid 6 Electroformed film 7 Master holding part 11 Cathode 12 Anode 13 Electroforming tank 14 Motor 15 Electroforming tank lid 16 Baffle board 21 Transparent substrate 22 Track groove part 23 Optical recording layer 24 Spacer 25 Adhesive layer 26 Protective board 27 Center hole 31 Glass substrate 32 Resist layer 33 Track groove 34 Conductive film 35 Electroformed film

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】  光記録媒体に予め記録する情報に対応
した凹凸パタ−ンが形成された原盤に電鋳を行なうこと
によって、光記録媒体を成形するためのスタンパ−を製
造する方法において、陰極を形成する原盤と該原盤を保
持する原盤ホルダ−との間に、所定の長さ、所定の角度
で、電鋳液中に突き出している導電リングを設置して、
原盤の外周部から該導電リングで通電を取って電鋳を行
なうことを特徴とする光記録媒体製造用スタンパ−の電
鋳方法。
Claim 1. A method for manufacturing a stamper for molding an optical recording medium by electroforming a master disk on which a concavo-convex pattern corresponding to information to be recorded in advance on the optical recording medium is formed, comprising: a cathode; A conductive ring protruding into the electroforming liquid is installed at a predetermined length and at a predetermined angle between the master disc forming the master disc and the master disc holder that holds the master disc,
A method for electroforming a stamper for manufacturing an optical recording medium, characterized in that electroforming is carried out by applying current through the conductive ring from the outer periphery of the master.
JP1209191A 1991-02-01 1991-02-01 Method for electroforming stamper for forming optical recording medium Pending JPH04246188A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1209191A JPH04246188A (en) 1991-02-01 1991-02-01 Method for electroforming stamper for forming optical recording medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1209191A JPH04246188A (en) 1991-02-01 1991-02-01 Method for electroforming stamper for forming optical recording medium

Publications (1)

Publication Number Publication Date
JPH04246188A true JPH04246188A (en) 1992-09-02

Family

ID=11795903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1209191A Pending JPH04246188A (en) 1991-02-01 1991-02-01 Method for electroforming stamper for forming optical recording medium

Country Status (1)

Country Link
JP (1) JPH04246188A (en)

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