JPH0525676A - Holder of master disk for producing stamper and delectroforming method with the same used therefor - Google Patents
Holder of master disk for producing stamper and delectroforming method with the same used thereforInfo
- Publication number
- JPH0525676A JPH0525676A JP15317291A JP15317291A JPH0525676A JP H0525676 A JPH0525676 A JP H0525676A JP 15317291 A JP15317291 A JP 15317291A JP 15317291 A JP15317291 A JP 15317291A JP H0525676 A JPH0525676 A JP H0525676A
- Authority
- JP
- Japan
- Prior art keywords
- master
- electroforming
- cathode
- holder
- master disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は光学的に情報の記録・再
生が行われる光記録媒体を製造するために行われる電鋳
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroforming method carried out for manufacturing an optical recording medium in which information is optically recorded / reproduced.
【0002】[0002]
【従来の技術】従来より各種情報の記録には、磁気テー
プや磁気ディスク等の磁気材料や各種半導体メモリ等が
主に用いられてきた。このような磁気材料や半導体メモ
リは情報の書込みおよび読みだしを容易に行えるという
利点があるが、この反面、情報内容の改竄も容易に行わ
れてしまい、また高密度記録ができないという問題点を
有するものであった。2. Description of the Related Art Conventionally, magnetic materials such as magnetic tapes and magnetic disks and various semiconductor memories have been mainly used for recording various information. Such magnetic materials and semiconductor memories have the advantage that information can be easily written and read, but on the other hand, the contents of information can be easily tampered with, and high-density recording cannot be performed. I had one.
【0003】かかる問題点を解決するための多種多様の
情報を効率良く取り扱う手段として、光記録媒体を用い
た光学的情報記録方法が提案され、そのための光学的情
報記録坦体、記録再生方法および記録再生装置が提案さ
れている。An optical information recording method using an optical recording medium has been proposed as a means for efficiently handling a wide variety of information for solving such problems, and an optical information recording carrier, a recording / reproducing method and A recording / reproducing device has been proposed.
【0004】情報記録坦体としての光記録媒体への記録
方法は、一般にレーザ光を用いて情報記録坦体上の光記
録層の一部を揮散させるか、反射率に変化を生じさせる
か、あるいは変形を生じさせて、光学的な反射率や透過
率の差によって情報を記録し、再生を行うものである。
この場合、光記録層に対しては、情報の書込み後に現像
処理等を施す必要がなく、「書いた後に直読する」こと
のできる、いわゆるDRAW(ダイレクト リード ア
フター ライト)媒体であり、高密度記録が可能であ
り、また、追加書込みも可能であることから情報の記録
・保存媒体として極めて有効である。The recording method on an optical recording medium as an information recording carrier is generally carried out by using a laser beam to volatilize a part of the optical recording layer on the information recording carrier or to change the reflectance. Alternatively, by deforming, information is recorded and reproduced by a difference in optical reflectance or transmittance.
In this case, the optical recording layer is a so-called DRAW (direct read after write) medium that can be "read directly after writing" without the need for development processing after writing the information, and high density recording. Since it is possible to write and additionally write, it is extremely effective as a recording / storing medium of information.
【0005】図4は、上記のような特徴を有する光記録
媒体を製造するためのスタンパの一般的な製造工程を示
す図である。FIG. 4 is a diagram showing a general manufacturing process of a stamper for manufacturing an optical recording medium having the above characteristics.
【0006】図4(a)に示すように平面性良く研磨さ
れたガラス等の板401の上に、レジストや感光性樹脂
を用いて所定深さの凹凸パターン402が形成された原
盤を作製する。次に、図4(b)に示すように凹凸パタ
ーン402上に導電膜403を形成し、これを導電化処
理し、図4(c)に示すように電鋳を行って所定厚さの
スタンパ404を形成させる。As shown in FIG. 4 (a), a master having a concave / convex pattern 402 of a predetermined depth formed on a plate 401 made of glass or the like having a good flatness by using a resist or a photosensitive resin is prepared. . Next, as shown in FIG. 4B, a conductive film 403 is formed on the concave-convex pattern 402, the conductive film 403 is made conductive, and electroforming is performed as shown in FIG. 404 is formed.
【0007】このようなスタンパの製造方法について、
以下に記すような様々な提案がなされている。特開昭5
9−177388号公報、特開昭60−017089号
公報および特開昭61−279699号公報のそれぞれ
には電鋳を行うときに、電鋳槽の陽極と陰極との間に邪
魔板を挿入して板厚分布をよくすることが記載されてい
る。実開昭58−141435号公報にはピンホールの
発生を防止するために電鋳槽に生成する不溶解性酸化物
スライムやスマット等の異物を予備槽に取り除くことが
記載されている。また、特開昭62−209746号公
報には電鋳したときの通電治具跡を紫外線硬化樹脂でシ
ールして研磨時の研磨剤等のしみ込みを防止することが
記載されている。Regarding the manufacturing method of such a stamper,
Various proposals have been made as described below. JP-A-5
In each of JP-A-9-177388, JP-A-60-017089 and JP-A-61-279699, a baffle plate is inserted between an anode and a cathode of an electroforming tank when performing electroforming. To improve the plate thickness distribution. Japanese Utility Model Application Laid-Open No. 58-141435 describes that foreign matter such as insoluble oxide slime and smut generated in an electroforming tank is removed in a preliminary tank in order to prevent the generation of pinholes. Further, Japanese Patent Application Laid-Open No. 62-209746 discloses that the traces of a current carrying jig at the time of electroforming are sealed with an ultraviolet curable resin to prevent penetration of an abrasive or the like during polishing.
【0008】[0008]
【発明が解決しようとする課題】電鋳によって形成され
る電鋳膜は、電気力線が集中する原盤の外側が中心部よ
りも厚くなる。このため、電鋳したスタンパの裏面を研
磨するときには、外周部の電鋳膜の厚い部分を中央部と
同じ膜厚になるまで粗研磨してからスタンパ全面を精密
研磨するという2工程の研磨が必要とされ、処理工程が
煩雑であるという問題点がある。In the electroformed film formed by electroforming, the outer side of the master on which electric lines of force concentrate is thicker than the central part. For this reason, when polishing the back surface of an electroformed stamper, a two-step polishing process is performed, in which the thick portion of the electroformed film on the outer peripheral portion is roughly polished to the same thickness as the central portion and then the entire surface of the stamper is precisely polished. There is a problem that it is required and the processing steps are complicated.
【0009】また、電鋳膜の応力の強さは膜厚に比例す
るため、外周部には強い応力が加わることになる。この
ため、原盤から電鋳膜を剥すときに、電鋳膜が捲くれる
ように剥がれてしまうという問題点がある。Since the stress strength of the electroformed film is proportional to the film thickness, a strong stress is applied to the outer peripheral portion. Therefore, when peeling the electroformed film from the master, there is a problem that the electroformed film is peeled off so as to be rolled up.
【0010】この電鋳膜厚の不均一は、円形状以外の、
例えば、四角い原盤を用いたときに特に顕著に現れる。The non-uniformity of the electroformed film thickness is caused by other than circular shape.
For example, it becomes particularly noticeable when a square master is used.
【0011】本発明は上記のような従来技術が有する問
題点に鑑みてなされたものであって、原盤面内の電鋳膜
の厚みの差の小さなスタンパを製造することを目的とす
る。The present invention has been made in view of the above problems of the prior art, and an object of the present invention is to manufacture a stamper having a small difference in the thickness of the electroformed film in the master surface.
【課題を解決するための手段】本発明のスタンパ製造用
原盤のホルダは、スタンパ製造時の電鋳を行う際に、陰
極として用いられる凹凸が形成された原盤を保持するス
タンパ製造用原盤のホルダであって、中央部にて保持す
る前記原盤の外周部には、少なくとも1以上の疑似陰極
が設けられている。A holder for a stamper manufacturing master according to the present invention is a holder for a stamper manufacturing master which holds a master having an unevenness to be used as a cathode when performing electroforming during stamper manufacturing. Further, at least one or more pseudo cathodes are provided on the outer peripheral portion of the master held at the central portion.
【0012】また、本発明の電鋳方法は上記のスタンパ
製造用原盤のホルダを用いた電鋳方法であって、電鋳を
行う際の陰極として、原盤とともに疑似陰極を用いる。Also, the electroforming method of the present invention is an electroforming method using the above-mentioned holder of the stamper manufacturing master, and a pseudo cathode is used together with the master as a cathode when performing electroforming.
【0013】[0013]
【作用】電鋳を行う際の陰極として、原盤とともに該原
盤の外周部に設けられた疑似陰極を用いることができる
ので、電鋳時に外周部に電気力線が集中することが防止
することが可能となり、原盤面内の電鋳膜の厚みの差を
小さなものとすることができる。Since the pseudo cathode provided on the outer peripheral portion of the master together with the master can be used as the cathode during electroforming, it is possible to prevent electric lines of force from concentrating on the outer peripheral portion during electroforming. This makes it possible to reduce the difference in the thickness of the electroformed film on the master surface.
【0014】[0014]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【0015】図1は本発明の一実施例の構成を示す図で
あり、(a)は断面図、(b)は上面図である。1A and 1B are views showing the configuration of an embodiment of the present invention. FIG. 1A is a sectional view and FIG. 1B is a top view.
【0016】円盤状の原盤ホルダ103は中央部にて原
盤101を支持しており、その外周部上面には疑似陰極
102が設けられている。A disk-shaped master holder 103 supports the master 101 at its central portion, and a pseudo cathode 102 is provided on the upper surface of its outer peripheral portion.
【0017】図2は図1に示した原盤ホルダ103を用
いて電鋳処理を行う状態を示す図である。FIG. 2 is a diagram showing a state in which electroforming processing is performed using the master holder 103 shown in FIG.
【0018】図示されるように陰極201は、原盤10
1と疑似陰極102とが設置された原盤ホルダ103に
よって構成され、電鋳槽203中では邪魔板206を挟
んで陽極202と対向するように設けられている。陰極
201は電鋳槽203の外部に設けられたモータ204
によって回転され、電鋳槽203は電鋳槽蓋205によ
って閉空間とされる。また、原盤101と陽極202と
の間には電位差V1が生じ、疑似陰極102と陽極20
2との間には電位差V2が生じるように電源207、2
08がそれぞれ設けられている。As shown in the drawing, the cathode 201 is a master disc 10.
1 and the pseudo-cathode 102 are arranged on the master disk holder 103, and are provided in the electroforming tank 203 so as to face the anode 202 with the baffle plate 206 interposed therebetween. The cathode 201 is a motor 204 provided outside the electroforming tank 203.
The electrocasting tank 203 is closed by the electrocasting tank lid 205. Further, a potential difference V1 is generated between the master 101 and the anode 202, and the pseudo cathode 102 and the anode 20
2, so that a potential difference V2 is generated between
08 are provided respectively.
【0019】本実施例においては、上記のように原盤1
01だけではなく、その外周面に設けられた疑似電極1
02にも電圧が印加されるため、電気力線が平均化され
た状態にて状態にて電鋳が行われ、形成される電鋳膜厚
も平均化されたものとなる。この結果、スタンパ裏面の
研磨については全面を鏡面とする精密研磨を一度行えば
よく、従来に比べて処理工程を少なくすることができ
た。In this embodiment, as described above, the master 1
01, not only the pseudo electrode 1 provided on the outer peripheral surface thereof
Since a voltage is also applied to 02, electroforming is performed in a state where the lines of electric force are averaged, and the electroformed film thickness formed is also averaged. As a result, for the polishing of the back surface of the stamper, it suffices to perform precision polishing once with the entire surface as a mirror surface, and the number of processing steps can be reduced compared to the conventional case.
【0020】本発明における疑似陰極102は、原盤1
01と直接的な接触による電気的な接触がない位置であ
り、原盤101の外周部を囲んで外周部に電気力線が集
中することを緩和できるのであればいずれの位置および
形状でも自由に選択することができる。原盤101と疑
似陰極102とは1mm以上離れた位置に設けられるこ
とが好ましい。The pseudo cathode 102 in the present invention is the master 1.
01 is a position where there is no electrical contact due to direct contact, and any position and shape can be freely selected as long as it can alleviate the concentration of electric lines of force around the outer periphery of the master 101. can do. The master 101 and the pseudo cathode 102 are preferably provided at positions separated by 1 mm or more.
【0021】図3は本発明の第2の実施例の構成を示す
図である。FIG. 3 is a diagram showing the configuration of the second embodiment of the present invention.
【0022】図1に示した第1の実施例が疑似陰極10
2が原盤101の外周全部を連続的に囲む形状出会った
のに対し、本実施例の原盤ホルダ303は、原盤301
の外周部を複数の疑似陰極302によって不連続的に囲
んだものである。複数の疑似陰極302は、原盤301
と同じ面に配置されることが好ましいが、必要に応じて
このうちのいくつかを原盤ホルダ303の側面に配置し
てもよい。The first embodiment shown in FIG. 1 is a pseudo cathode 10.
2 encountered a shape that continuously surrounds the entire outer periphery of the master 101, while the master holder 303 of this embodiment has a master 301
The outer peripheral portion of is surrounded by a plurality of pseudo cathodes 302 in a discontinuous manner. The plurality of pseudo cathodes 302 are the master 301
However, some of them may be arranged on the side surface of the master holder 303 if necessary.
【0023】図1および図3のいずれに示した実施例に
おいても、疑似陰極の面積は、大きすぎると原盤に析出
する効率が下がってしまい、小さすぎると原盤の外周部
に電気力線が集中することを防げなくなってしまう。大
きさとしては、原盤の面積の1/1000〜1/10の
範囲であることが好ましい。In any of the embodiments shown in FIGS. 1 and 3, if the area of the pseudo cathode is too large, the efficiency of deposition on the master decreases, and if it is too small, electric lines of force concentrate on the outer periphery of the master. You can't prevent what you do. The size is preferably within the range of 1/1000 to 1/10 of the area of the master.
【0024】次に、2つの電位差V1とV2について述
べると、V1がV2よりも大きいと原盤101の外周部
に電気力線が集中することを防ぐことができなくなり、
V2がV1よりも著しく大きな場合には原盤101への
析出が生じなくなってしまう。電位さV1とV2との好
ましい関係は、V2がV1よりもやや大きいかもしくは
等しいものであって、かつ、V2がV1の1.5倍より
も小さなことである。電鋳するときの電流密度について
は、電鋳膜に反りや応力が発生しない範囲を選択すれば
よく、1〜30A/dm2を選択することができ、好ま
しくは3〜10A/dm2の範囲を用いればよい。Next, regarding the two potential differences V1 and V2, if V1 is larger than V2, it becomes impossible to prevent electric lines of force from concentrating on the outer peripheral portion of the master 101.
If V2 is significantly larger than V1, deposition on the master 101 will not occur. A preferable relationship between the potentials V1 and V2 is that V2 is slightly larger than or equal to V1 and V2 is smaller than 1.5 times V1. Regarding the current density at the time of electroforming, it is sufficient to select a range in which no warp or stress occurs in the electroformed film, 1 to 30 A / dm 2 can be selected, and a range of 3 to 10 A / dm 2 is preferable. Can be used.
【0025】疑似陰極102の材料としては、使用され
る電鋳液で、溶解やエッチング、腐食が生じない材料で
あればいずれの材料をも用いることができるもので、好
ましくは電鋳する金属よりもイオン化傾向の小さな金属
で導電化処理が施されたガラス、セラミクスまたは鉄、
クロム、ニッケル等の金属または金属化合物材料であ
り、より好ましくは、金、銅、ステンレス等の金属材料
である。疑似陰極102の表面は平坦であっても粗面で
あってもよい。As the material of the pseudo cathode 102, any material can be used as long as it is an electroforming liquid used and does not cause dissolution, etching or corrosion. It is preferable to use a metal to be electroformed. Glass, ceramics or iron, which has been subjected to a conductive treatment with a metal with a low ionization tendency,
It is a metal or metal compound material such as chromium or nickel, and more preferably a metal material such as gold, copper or stainless steel. The surface of the pseudo cathode 102 may be flat or rough.
【0026】以下に具体的な実施例を示し、本発明につ
いてさらに詳細に説明するが、本発明はこれらに限定さ
れるものではない。The present invention is described in more detail below by showing specific examples, but the present invention is not limited to these.
【0027】「実施例1」厚さ10mmである300×
340mmのガラス板と、該ガラス板と同じ大きさで表
面にピッチ12μm、幅3.0μm、深さ3000Åの
凹凸パターンが形成されたフォトマスクとの間に50μ
mの厚さの紫外線硬化樹脂を挟んだ状態で紫外線を照射
して樹脂を硬化させた。樹脂硬化後に、フォトマスクを
外してガラス原盤を得た。この原盤に、スパッターでニ
ッケルを1000Å付着させて導電化させた後に、29
0×330mmの四角い開口部を持つ外径φ550mm
の丸形状の原盤ホルダに設置した。この原盤ホルダには
図1に示したもののように厚さ0.5mmの外径φ45
0mmの丸形状であって、内側に300×340mmの
四角い開口が設けられた疑似陰極(SUS304製)が
原盤ホルダの上蓋の原盤と同じ面に設置されている。[Example 1] 300 × with a thickness of 10 mm
50 μ between a 340 mm glass plate and a photomask having the same size as the glass plate and an uneven pattern with a pitch of 12 μm, a width of 3.0 μm and a depth of 3000 Å on the surface.
The resin was cured by irradiating it with ultraviolet rays while sandwiching the ultraviolet curable resin having a thickness of m. After curing the resin, the photomask was removed to obtain a glass master. After making nickel 1000 Å by sputtering to make this conductive,
Outer diameter φ550mm with square opening of 0 × 330mm
It was installed on the circular master holder. As shown in FIG. 1, the master holder has an outer diameter of φ45 with a thickness of 0.5 mm.
A pseudo cathode (made of SUS304) having a 0 mm round shape and a square opening of 300 × 340 mm provided inside is installed on the same surface as the master of the upper lid of the master holder.
【0028】陽極としてはニッケル球をチタンの籠に入
れて、綿布で覆ってごみの流出を抑えたものを用いた。
電鋳液としては下記の組成に混合した液を500l用い
て、電鋳槽150l、予備槽350lの電鋳槽に入れ
て、液温度45℃で液全体を10回/時間のサイクルで
循環させた。As the anode, a nickel ball was placed in a titanium basket and covered with a cotton cloth to prevent the outflow of dust.
As an electroforming liquid, 500 liters of a liquid mixed with the following composition was put into an electroforming bath of an electroforming bath of 150 liters and a preliminary bath of 350 liters, and the whole liquid was circulated at a cycle of 10 times / hour at a liquid temperature of 45 ° C. It was
【0029】
スルファミン酸ニッケル(4水和物) 450g/l
ホウ酸 30g/l
ピット防止剤 5ml/l
原盤と陽極間の電流密度は、最初は0.1A/dm2で
30分間流してから、5A/dm2まで電流密度を上げ
て積算電流値が10000A・分になるまで電鋳を行
い、300μmの厚さの電鋳スタンパを得た。なお、こ
の電鋳処理において、疑似陰極と原盤とは常に同じ電位
となるようにした。Nickel sulfamate (tetrahydrate) 450 g / l Boric acid 30 g / l Pit inhibitor 5 ml / l The current density between the master and the anode was 0.1 A / dm 2 for 30 minutes, then, The current density was increased to 5 A / dm 2 and electroforming was performed until the integrated current value reached 10000 A · min, and an electroformed stamper with a thickness of 300 μm was obtained. In this electroforming process, the pseudo cathode and the master were always kept at the same potential.
【0030】電鋳終了後、原盤の膜厚を測定してみたと
ころ、中央部での膜厚は200±5μmの範囲であり、
該周部での膜厚は200±10μmの範囲であって十分
に均一なものであった。After the electroforming was completed, the film thickness of the master was measured, and the film thickness in the central portion was in the range of 200 ± 5 μm.
The film thickness at the peripheral portion was in the range of 200 ± 10 μm and was sufficiently uniform.
【0031】「実施例2」実施例1と同じ原盤、同じ原
盤ホルダを用いた。原盤ホルダの上蓋の原盤と同じ面に
原盤の中心から470mmの位置に、厚さ0.5mmで
φ50mmの円形をした疑似陰極を原盤の各辺について
3個づつ均等配列となるように配置した。電鋳装置およ
び電鋳液についても実施例1と同じものを用い、原盤へ
の電流密度についても実施例1と同じとした。また、原
盤、疑似陰極のそれぞれと陽極との間の電位差について
も実施例1と同様にこれらが同電位に保たれるものとし
た。実施例1とおなじようにして電鋳膜の厚さを測定し
てみると、中央部、外周部ともに200±10μmの範
囲であって膜厚は十分に均一なものであった。[Example 2] The same master and the same master holder as in Example 1 were used. On the same surface of the master of the master holder as the master, at a position of 470 mm from the center of the master, circular pseudo cathodes having a thickness of 0.5 mm and a diameter of φ50 mm were arranged so that three pseudo cathodes were arranged on each side of the master evenly. The same electroforming apparatus and electroforming solution as in Example 1 were used, and the current density to the master was also the same as in Example 1. Further, regarding the potential difference between each of the master and the pseudo cathode and the anode, they were kept at the same potential as in Example 1. When the thickness of the electroformed film was measured in the same manner as in Example 1, both the central portion and the outer peripheral portion were in the range of 200 ± 10 μm, and the film thickness was sufficiently uniform.
【0032】「実施例3」実施例1と同じ原盤、同じ原
盤ホルダを用いた。原盤ホルダの原盤ホルダの上蓋の原
盤と同じ面に原盤の中心から470mmの位置に、厚さ
0.500でφ2mmの5角形の疑似陰極を原盤の各辺
について3個づつ、均等配列となるように配置した。電
鋳装置および電鋳液についても実施例1と同じものを用
い、原盤への電流密度についても実施例1と同じとし
た。疑似陰極と陽極との間の電位差は原盤と陽極との間
の電位差の1.2倍となるものとした。[Example 3] The same master and the same master holder as in Example 1 were used. On the same surface as the master of the master lid of the master holder, at the position of 470 mm from the center of the master, pentagonal pseudo cathodes with a thickness of 0.500 and a diameter of 2 mm, three pentagonal cathodes are arranged evenly on each side of the master. Placed in. The same electroforming apparatus and electroforming solution as in Example 1 were used, and the current density to the master was also the same as in Example 1. The potential difference between the pseudo cathode and the anode was 1.2 times the potential difference between the master and the anode.
【0033】実施例1とおなじようにして電鋳膜の厚さ
を測定してみると、中央部、外周部ともに200±10
μmの範囲であって膜厚は十分に均一なものであった。When the thickness of the electroformed film was measured in the same manner as in Example 1, both the central portion and the outer peripheral portion were 200 ± 10.
The thickness was in the range of μm and the film thickness was sufficiently uniform.
【0034】「比較例1」実施例1と同じ原盤、同じ原
盤ホルダを用いた。疑似陰極は設けなかった。電鋳装置
および電鋳液についても実施例1と同じものを用い、原
盤への電流密度についても実施例1と同じとした。Comparative Example 1 The same master and the same master holder as in Example 1 were used. No pseudo cathode was provided. The same electroforming apparatus and electroforming solution as in Example 1 were used, and the current density to the master was also the same as in Example 1.
【0035】実施例1とおなじようにして電鋳膜の厚さ
を測定してみると、中央部が200±10μm、外周部
が300±10μmの範囲であって外周部の膜厚が厚く
なってしまった。When the thickness of the electroformed film was measured in the same manner as in Example 1, the central portion was in the range of 200 ± 10 μm and the outer peripheral portion was in the range of 300 ± 10 μm, and the outer peripheral portion was thick. I got it.
【0036】[0036]
【発明の効果】本発明は以上説明したように構成されて
いるので、以下に記載するような効果を奏する。Since the present invention is constructed as described above, it has the following effects.
【0037】請求項1に記載のものにおいては、原盤と
疑似陰極とを電鋳時の陰極として用いることにより、外
周部に電気力線が集中することを防ぐことができる効果
がある。According to the first aspect of the present invention, by using the master and the pseudo cathode as the cathode during electroforming, it is possible to prevent the lines of electric force from being concentrated on the outer peripheral portion.
【0038】請求項2に記載のものにおいては、原盤へ
の析出効率を低下させることなく、上記効果を生じさせ
ることができる。According to the second aspect, the above effect can be produced without lowering the deposition efficiency on the master.
【0039】請求項3に記載の方法においては、電鋳時
に、外周部に電気力線が集中することを防ぐことがで
き、原盤面内の電鋳膜の厚みの差が小さな電鋳スタンパ
を作製することができる効果がある。In the method according to the third aspect, it is possible to prevent the electric lines of force from concentrating on the outer peripheral portion during electroforming, and to provide an electroformed stamper having a small difference in the thickness of the electroformed film in the master surface. There is an effect that can be produced.
【0040】請求項4に記載の方法においては、原盤面
内の膜厚が均一な電鋳スタンパを作製することを、原盤
への析出効率を低下させることなく行うことができる効
果がある。In the method according to the fourth aspect, there is an effect that an electroformed stamper having a uniform film thickness in the master surface can be manufactured without lowering the deposition efficiency on the master disk.
【0041】請求項5に記載の方法においては、原盤面
内の膜厚が均一な電鋳スタンパを作製することを、電鋳
膜に反りや応力が発生することなく行うことができる効
果がある。In the method according to the fifth aspect, there is an effect that an electroformed stamper having a uniform film thickness within the surface of the master can be manufactured without causing warping or stress in the electroformed film. .
【図1】本発明の一実施例の構成を示す図であり、
(a)は断面図、(b)は上面図である。FIG. 1 is a diagram showing a configuration of an embodiment of the present invention,
(A) is sectional drawing, (b) is a top view.
【図2】図1に示した原盤ホルダ103を用いて電鋳処
理を行う状態を示す図である。FIG. 2 is a diagram showing a state where an electroforming process is performed using the master holder 103 shown in FIG.
【図3】本発明の第2の実施例の構成を示す図である。FIG. 3 is a diagram showing a configuration of a second exemplary embodiment of the present invention.
【図4】(a)〜(c)のそれぞれは、光記録媒体を製
造するためのスタンパの一般的な製造工程を示す図であ
る。4A to 4C are diagrams showing a general manufacturing process of a stamper for manufacturing an optical recording medium.
101,301 原盤 102,302 疑似陰極 103,303 原盤ホルダ 201 陰極 202 陽極 203 電鋳槽 204 モータ 205 電鋳槽蓋 206 邪魔板 207,208 電源 101,301 Master 102,302 pseudo cathode 103,303 Master holder 201 cathode 202 anode 203 Electroforming tank 204 motor 205 Electroforming tank lid 206 Baffle 207, 208 power supply
───────────────────────────────────────────────────── フロントページの続き (72)発明者 湯浅 俊哉 東京都大田区下丸子3丁目30番2号 キヤ ノン株式会社内 (72)発明者 甲斐 丘 東京都大田区下丸子3丁目30番2号 キヤ ノン株式会社内 (72)発明者 鹿目 修 東京都大田区下丸子3丁目30番2号 キヤ ノン株式会社内 (72)発明者 串田 直樹 東京都大田区下丸子3丁目30番2号 キヤ ノン株式会社内 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Toshiya Yuasa 3-30-2 Shimomaruko, Ota-ku, Tokyo Non non corporation (72) Inventor Kai Hill 3-30-2 Shimomaruko, Ota-ku, Tokyo Non non corporation (72) Inventor Osamu Kaname 3-30-2 Shimomaruko, Ota-ku, Tokyo Non non corporation (72) Inventor Naoki Kushida 3-30-2 Shimomaruko, Ota-ku, Tokyo Non non corporation
Claims (5)
として用いられる凹凸が形成された原盤を保持するスタ
ンパ製造用原盤のホルダであって、 中央部にて保持する前記原盤の外周部には、少なくとも
1以上の疑似陰極が設けられていることを特徴とするス
タンパ製造用原盤のホルダ。1. A holder for a stamper manufacturing master, which holds a master having concaves and convexes used as a cathode during electroforming during stamper manufacturing, the outer peripheral portion of the master being held at a central portion. Is provided with at least one or more pseudo cathodes.
ルダにおいて、 疑似陰極の面積が原盤の面積の1/1000〜1/10
の範囲であることを特徴とするスタンパ製造用原盤のホ
ルダ。2. The stamper manufacturing master holder according to claim 1, wherein the area of the pseudo cathode is 1/1000 to 1/10 of the master area.
Master holder for stamper manufacturing, characterized in that
ルダを用いた電鋳方法であって、 電鋳を行う際の陰極として、原盤とともに疑似陰極を用
いることを特徴とする電鋳方法。3. An electroforming method using a holder for a stamper manufacturing master according to claim 1, wherein a pseudo cathode is used together with the master as a cathode when performing electroforming.
と原盤との間の電位差の1〜1.5倍とすることを特徴
とする電鋳方法。4. The electroforming method according to claim 3, wherein the potential difference between the anode and the pseudo cathode during electroforming is 1 to 1.5 times the potential difference between the anode and the master. An electroforming method characterized by:
とを特徴とする電鋳方法。5. The electroforming method according to claim 3, wherein the current density when performing electroforming is 1 to 30 A / dm 2 .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15317291A JPH0525676A (en) | 1991-06-25 | 1991-06-25 | Holder of master disk for producing stamper and delectroforming method with the same used therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15317291A JPH0525676A (en) | 1991-06-25 | 1991-06-25 | Holder of master disk for producing stamper and delectroforming method with the same used therefor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0525676A true JPH0525676A (en) | 1993-02-02 |
Family
ID=15556631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15317291A Pending JPH0525676A (en) | 1991-06-25 | 1991-06-25 | Holder of master disk for producing stamper and delectroforming method with the same used therefor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0525676A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006082631A1 (en) * | 2005-02-01 | 2006-08-10 | Novel Technology Co., Ltd. | Method for producing square electrocast product |
-
1991
- 1991-06-25 JP JP15317291A patent/JPH0525676A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006082631A1 (en) * | 2005-02-01 | 2006-08-10 | Novel Technology Co., Ltd. | Method for producing square electrocast product |
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