JPH0424578Y2 - - Google Patents
Info
- Publication number
- JPH0424578Y2 JPH0424578Y2 JP1981142012U JP14201281U JPH0424578Y2 JP H0424578 Y2 JPH0424578 Y2 JP H0424578Y2 JP 1981142012 U JP1981142012 U JP 1981142012U JP 14201281 U JP14201281 U JP 14201281U JP H0424578 Y2 JPH0424578 Y2 JP H0424578Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- conductor
- circuit board
- plastic film
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 31
- 239000002985 plastic film Substances 0.000 claims description 16
- 229920006255 plastic film Polymers 0.000 claims description 16
- 125000006850 spacer group Chemical group 0.000 claims description 14
- 238000004049 embossing Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003856 thermoforming Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14201281U JPS5852729U (ja) | 1981-09-25 | 1981-09-25 | 面スイツチ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14201281U JPS5852729U (ja) | 1981-09-25 | 1981-09-25 | 面スイツチ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5852729U JPS5852729U (ja) | 1983-04-09 |
| JPH0424578Y2 true JPH0424578Y2 (US07579456-20090825-P00002.png) | 1992-06-10 |
Family
ID=29935061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14201281U Granted JPS5852729U (ja) | 1981-09-25 | 1981-09-25 | 面スイツチ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5852729U (US07579456-20090825-P00002.png) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5225272B2 (US07579456-20090825-P00002.png) * | 1973-02-28 | 1977-07-06 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5137275U (US07579456-20090825-P00002.png) * | 1974-09-12 | 1976-03-19 | ||
| JPS5225272U (US07579456-20090825-P00002.png) * | 1975-08-13 | 1977-02-22 |
-
1981
- 1981-09-25 JP JP14201281U patent/JPS5852729U/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5225272B2 (US07579456-20090825-P00002.png) * | 1973-02-28 | 1977-07-06 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5852729U (ja) | 1983-04-09 |
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